JP3688440B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3688440B2
JP3688440B2 JP21809897A JP21809897A JP3688440B2 JP 3688440 B2 JP3688440 B2 JP 3688440B2 JP 21809897 A JP21809897 A JP 21809897A JP 21809897 A JP21809897 A JP 21809897A JP 3688440 B2 JP3688440 B2 JP 3688440B2
Authority
JP
Japan
Prior art keywords
resin
lead
chip
sealing body
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21809897A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1154685A5 (https=
JPH1154685A (ja
Inventor
昭彦 岩谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP21809897A priority Critical patent/JP3688440B2/ja
Publication of JPH1154685A publication Critical patent/JPH1154685A/ja
Publication of JPH1154685A5 publication Critical patent/JPH1154685A5/ja
Application granted granted Critical
Publication of JP3688440B2 publication Critical patent/JP3688440B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21809897A 1997-07-29 1997-07-29 半導体装置 Expired - Fee Related JP3688440B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21809897A JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21809897A JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005127878A Division JP4049782B2 (ja) 2005-04-26 2005-04-26 半導体装置

Publications (3)

Publication Number Publication Date
JPH1154685A JPH1154685A (ja) 1999-02-26
JPH1154685A5 JPH1154685A5 (https=) 2005-01-20
JP3688440B2 true JP3688440B2 (ja) 2005-08-31

Family

ID=16714608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21809897A Expired - Fee Related JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Country Status (1)

Country Link
JP (1) JP3688440B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
JP5619128B2 (ja) * 2005-05-11 2014-11-05 株式会社東芝 半導体装置
JP2007129182A (ja) 2005-05-11 2007-05-24 Toshiba Corp 半導体装置
TWI273636B (en) 2005-08-02 2007-02-11 Chipmos Technologies Inc Chip package having asymmetric molding

Also Published As

Publication number Publication date
JPH1154685A (ja) 1999-02-26

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