JP3667136B2 - 高周波電力増幅器モジュール - Google Patents

高周波電力増幅器モジュール Download PDF

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Publication number
JP3667136B2
JP3667136B2 JP04104599A JP4104599A JP3667136B2 JP 3667136 B2 JP3667136 B2 JP 3667136B2 JP 04104599 A JP04104599 A JP 04104599A JP 4104599 A JP4104599 A JP 4104599A JP 3667136 B2 JP3667136 B2 JP 3667136B2
Authority
JP
Japan
Prior art keywords
transistor
input terminal
power amplifier
amplifier module
output terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04104599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000243779A5 (https=
JP2000243779A (ja
Inventor
修 加賀谷
健治 関根
英一 長谷
喜市 山下
静雄 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP04104599A priority Critical patent/JP3667136B2/ja
Priority to TW088110698A priority patent/TW473882B/zh
Priority to US09/345,505 priority patent/US6330165B1/en
Priority to DE69935182T priority patent/DE69935182T2/de
Priority to EP06027122A priority patent/EP1770777A3/en
Priority to EP99112588A priority patent/EP0971411B1/en
Publication of JP2000243779A publication Critical patent/JP2000243779A/ja
Priority to US09/970,668 priority patent/US6489680B2/en
Priority to US10/291,840 priority patent/US6943441B2/en
Publication of JP2000243779A5 publication Critical patent/JP2000243779A5/ja
Application granted granted Critical
Publication of JP3667136B2 publication Critical patent/JP3667136B2/ja
Priority to US11/194,701 priority patent/US7068521B2/en
Priority to US11/451,579 priority patent/US20070001300A1/en
Priority to US11/905,421 priority patent/US7525813B2/en
Priority to US12/394,421 priority patent/US7817437B2/en
Priority to US12/787,154 priority patent/US8295057B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP04104599A 1998-07-06 1999-02-19 高周波電力増幅器モジュール Expired - Fee Related JP3667136B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP04104599A JP3667136B2 (ja) 1999-02-19 1999-02-19 高周波電力増幅器モジュール
TW088110698A TW473882B (en) 1998-07-06 1999-06-25 Semiconductor device
DE69935182T DE69935182T2 (de) 1998-07-06 1999-07-01 Halbleiteranordnung
EP06027122A EP1770777A3 (en) 1998-07-06 1999-07-01 Semiconductor device with a shielding bond wire
EP99112588A EP0971411B1 (en) 1998-07-06 1999-07-01 Semiconductor device
US09/345,505 US6330165B1 (en) 1998-07-06 1999-07-01 Semiconductor device
US09/970,668 US6489680B2 (en) 1998-07-06 2001-10-05 Semiconductor device
US10/291,840 US6943441B2 (en) 1998-07-06 2002-11-12 Semiconductor device
US11/194,701 US7068521B2 (en) 1998-07-06 2005-08-02 Semiconductor device
US11/451,579 US20070001300A1 (en) 1998-07-06 2006-06-13 Semiconductor device
US11/905,421 US7525813B2 (en) 1998-07-06 2007-10-01 Semiconductor device
US12/394,421 US7817437B2 (en) 1998-07-06 2009-02-27 Semiconductor device
US12/787,154 US8295057B2 (en) 1998-07-06 2010-05-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04104599A JP3667136B2 (ja) 1999-02-19 1999-02-19 高周波電力増幅器モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004150427A Division JP4153898B2 (ja) 2004-05-20 2004-05-20 高周波電力増幅器モジュール

Publications (3)

Publication Number Publication Date
JP2000243779A JP2000243779A (ja) 2000-09-08
JP2000243779A5 JP2000243779A5 (https=) 2005-04-07
JP3667136B2 true JP3667136B2 (ja) 2005-07-06

Family

ID=12597443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04104599A Expired - Fee Related JP3667136B2 (ja) 1998-07-06 1999-02-19 高周波電力増幅器モジュール

Country Status (1)

Country Link
JP (1) JP3667136B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093419A (ja) * 2004-09-24 2006-04-06 Oki Electric Ind Co Ltd 半導体装置及びその実装方法

Also Published As

Publication number Publication date
JP2000243779A (ja) 2000-09-08

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