JP3666434B2 - Laser processing apparatus and processing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus and its processing method having a plurality machining axis.
[0002]
[Prior art]
In recent years, the mounting density of electronic components mounted on electronic devices such as mobile phones and personal computers has been increasing. Accordingly, the number of vias formed on the printed circuit board has been increasing, and it has been necessary to form vias on the printed circuit board at high speed and with high accuracy, coupled with the rapid spread of the electronic devices.
[0003]
Therefore, a laser processing machine was developed to form vias at high speed and high precision, but the original laser processing machine controlled the drilling position mechanically using a scanning unit, so the processing speed There were limits.
[0004]
Therefore, a processing machine having a plurality of processing axes has appeared in order to make a hole at a higher speed. As a result, although the processing speed has doubled, the construction area of the laser processing machine has been increased because of the configuration of one laser oscillator with respect to one processing axis. Therefore, a laser beam emitted from one laser oscillator was branched by a beam splitter or the like to form a plurality of machining axes, and the installation area of the laser drilling machine was reduced.
[0005]
[Problems to be solved by the invention]
However, even in the case of a laser drilling machine having a plurality of machining axes with a single laser oscillator, the following cases that require machining of only a single axis often occur. For example, when there are an odd number of workpieces for an even number of machining axes, or when position accuracy cannot be obtained due to a workpiece position recognition error, and it is unavoidable that machining must be performed with only a single axis. is there.
[0006]
When the above problems occur, a single laser oscillator constitutes multiple machining axes. Therefore, when machining is performed without any problems, it is necessary to machine the axis where the problem occurs or to perform machining. There arises a problem that the laser beam is irradiated even on an axis having no surface.
[0007]
That is, it was impossible to independently control irradiation of a plurality of machining axes.
[0008]
Therefore, an object of the present invention is to provide a laser processing machine capable of independently controlling irradiation of each processing axis.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention according to claim 1 is a laser oscillator that oscillates a laser beam, a machining table that positions a workpiece, and a branching unit that divides the laser beam into a plurality of optical axes. Provided with position detection means for detecting the position of the workpiece placed on the machining table, and based on the detection signal of the position detection means, the workpiece having a positional deviation between the branching means and the workpiece. A laser processing apparatus comprising: a laser beam blocking mechanism that blocks the laser beam from a workpiece and does not block the laser beam from a workpiece that is not displaced .
[0010]
According to a second aspect of the present invention, there is provided conveying means for conveying a plurality of workpieces to a machining table, and a workpiece detection mechanism provided on the conveying means, and the laser beam blocking mechanism is configured to detect the workpiece. 2. The laser processing apparatus according to claim 1 , wherein the laser beam detected by the mechanism when there is no workpiece is cut off .
[0011]
A third aspect of the present invention includes a laser oscillator that oscillates a laser beam, a processing table that positions a workpiece, and branching means that branches the laser beam into a plurality of optical axes. A means for detecting a workpiece by the workpiece detection mechanism between the branching means and the workpiece; This is a laser processing apparatus provided with a laser beam blocking mechanism for blocking the laser beam .
[0013]
According to a fourth aspect of the invention, by placing a single or a plurality of workpiece table, after a year workpiece was positioned during processing, after splitting the laser beam into a plurality of irradiating the workpiece In the laser processing method for processing, a laser processing method for blocking a laser beam to a part other than a desired workpiece to be processed.
[0014]
The present invention according to claim 5 detects the position of one or a plurality of workpieces and cuts off the laser beam to the workpiece that has been misaligned based on the misalignment detection signal of the position detecting means. The laser processing method according to claim 5, wherein
[0015]
According to a sixth aspect of the present invention, when the workpiece is conveyed, holding / non-holding of the workpiece is detected, and when the workpiece is not held, the laser beam is blocked. The laser processing method described.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention includes a laser oscillator that oscillates a laser beam, a machining table that positions a workpiece, and a branching unit that branches the laser beam into a plurality of optical axes. Position detecting means for detecting the position of the workpiece placed on the table is provided, and based on the detection signal of the position detecting means, the workpiece having a positional deviation between the branching means and the workpiece is detected. By providing a laser beam cutting mechanism , wherein a laser beam blocking mechanism is provided that blocks the laser beam and does not block the laser beam with respect to a workpiece that has not been displaced . Controls irradiation and non-irradiation, and has an effect of preventing erroneous processing on the workpiece at the time of displacement.
[0019]
According to a second aspect of the present invention, the laser according to the first aspect is provided with a conveying means for conveying a plurality of workpieces to a machining table, and a workpiece detection mechanism provided on the conveying means, and the laser. The beam blocking mechanism blocks the laser beam detected by the workpiece detection mechanism when there is no workpiece, and has an effect of preventing processing other than the workpiece.
[0020]
A third aspect of the present invention includes a laser oscillator that oscillates a laser beam, a processing table that positions a workpiece, and a branching unit that branches the laser beam into a plurality of optical axes. If there is no workpiece by the workpiece detecting mechanism provided between the conveying means for conveying a plurality of workpieces to the table, the workpiece detecting mechanism provided in the conveying means, and the workpiece from the branching means. which is characterized in that a laser beam blocking mechanism for blocking the laser beam of the person who has been detected has the effect of preventing the processing other than the workpiece by the present invention.
[0022]
The invention according to claim 4 of the present invention is characterized in that one or a plurality of workpieces are placed on a table, the workpieces are positioned for machining, and then the workpiece is split into a plurality of laser beams. In a laser processing method for performing processing by irradiating a workpiece, the position of the workpiece is detected, the laser beam is blocked with respect to the workpiece that has been displaced, and the workpiece that has not been displaced is detected. wherein a laser processing method which does not block the laser beam machining method having a function of Ri arbitrarily selectably Na machining axis of the laser beam by the present invention, to prevent erroneous machining against the workpiece, characterized Te It is.
[0023]
According to a fifth aspect of the present invention, in the invention according to the fourth aspect, when conveying a plurality of workpieces, the holding / non-holding of the workpiece is detected, and when the workpiece is not held, the laser is detected. The processing method is characterized in that the beam is blocked, and processing other than the workpiece is prevented.
[0024]
According to a sixth aspect of the present invention, the workpiece is placed after placing the workpiece or workpieces on a table, positioning the workpiece during machining, and then branching the laser beam into a plurality of parts. In a laser processing method for performing processing by irradiating a workpiece, when a plurality of workpieces are conveyed, holding / non-holding of the workpieces is detected, and when the workpieces are not held, the laser beam is shut off. And a processing method having an action characterized by preventing processing other than the workpiece.
[0027]
FIG. 1 is a schematic configuration diagram of a laser drilling apparatus according to an embodiment of the present invention. An embodiment of the present invention will be described with reference to FIG.
[0028]
A laser beam 14 composed of a laser optical axis 14 a and a peripheral ray 14 b emitted from the laser oscillator 1 is focused on the image transfer mask 3 by the collimating lens group 2. The laser beam 14 that has passed through the image transfer mask 3 is branched by the beam splitter 4.
[0029]
The laser beam 15b on the transmission side is reflected by the total reflection mirror 5, passes through the scanning unit 6b, is condensed on the workpiece 10b by the fθ lens 9b, and is processed at a desired position. On the other hand, the laser beam 15a reflected by the beam splitter 4 passes through the scanning unit 6a, is condensed on the workpiece 10a by the fθ lens 9a, and is processed at a desired position.
[0030]
Here, the workpieces 10a and 10b are transported onto the processing table 11 by the workpiece transport device 13 equipped with the workpiece holding recognition device 12 before being processed, and are accurately positioned by the position recognition devices 8a and 8b. Recognition is performed, and drilling is performed at a desired position based on the position recognition signal.
[0031]
Then, in order to independently control the irradiation of the laser beams 15a and 15b obtained by branching the laser beam 14 from one laser oscillator 1, the laser beams are respectively formed on the optical axes of the beam splitter 4 and the laser beams 15a and 15b. Blocking mechanisms 7a and 7b were provided. The laser beam blocking mechanisms 7 a and 7 b are controlled by a laser beam blocking control device 18.
Next, the case where the laser beam blocking device 18 operates will be described with reference to FIG.
[0032]
For example, after the workpieces 10a and 10b are conveyed to the machining table 11 by the workpiece conveyance device 13, when the workpiece 10a is displaced, first, the position recognition device 8a detects the position of the workpiece 10a. To do. The position signal is determined by the workpiece position recognizing device 17 to determine the position shift, and the position shift detection signal output from the workpiece position recognizing device 17 is transmitted to the laser beam blocking control device 18 to control the laser beam blocking control. The laser beam blocking device 7a is inserted on the laser beam 15a by the beam blocking signal from the device 18. As a result, the processing on the workpiece 10a which has caused the position shift is stopped by the laser beam 15a being blocked by the laser beam blocking device 7a, but on the workpiece 10b which has not been shifted in position. All processing is performed normally.
[0033]
On the other hand, when the number of workpieces to be processed is an odd number and the processing axis is an even axis, it is necessary to block one of the processing axes. In this case, one of the laser beam blocking devices 7b and 7a corresponds to the non-holding detection signal of one of the workpiece holding recognition devices 12a and 12b in the workpiece conveying device 13. A desired processing is realized by being inserted into the laser beams 15b and 15a by the cutoff signal from the laser beam cutoff control device 18 and blocking the irradiation of the laser beam.
Hereinafter, a processing method according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
[0034]
First, after step 19 in which the workpiece holding mechanism holds the workpiece, the process moves to step 20 in which the holding is confirmed. In step 20 for confirming the holding, the holding is confirmed. Here, if neither of the workpieces can be held, the process returns to step 19 again. If only one workpiece is held, the process proceeds to step 28 where the laser beam blocking device on the machining axis is closed. On the other hand, if one or two workpieces are held, the process moves to step 21 where the workpiece is transferred to the machining table and placed on the machining table. After step 21 where the workpiece is placed on the processing table, the process proceeds to position recognition step 22 where the position recognition device recognizes the position of the workpiece. In the position recognition step 22, if the position of one or two workpieces can be recognized, the process proceeds to step 23 where the laser beam blocking device on the machining axis is opened. In the position recognition step 22, when it is impossible to recognize the position of only one workpiece, the process proceeds to step 27 where the laser beam blocking device on the machining axis is closed. Further, in the position recognition step 22, when it is impossible to recognize the position of both of the two workpieces, the workpiece is not processed and the process proceeds to the workpiece unloading step 28. After the step 23 of opening the laser beam blocking device, the position is moved to the laser irradiation step 25 through the position setting step 24 by the scanning system. Then, the process moves to a workpiece unloading step 28 after completing the process 26.
[0035]
【The invention's effect】
As described above, according to the present invention, in a laser processing machine in which a laser beam from a single laser oscillator is branched into a plurality of axes, erroneous processing due to misalignment of a workpiece can be prevented .
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing a laser processing method according to an embodiment of the present invention.
DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 Collimator lens group 3 Image transfer mask 4 Beam splitter 5 Total reflection mirrors 6a and 6b Scanning devices 7a and 7b Laser beam blocking devices 8a and 8b Position recognition devices 9a and 9b fθ lenses 10a and 10b Workpiece 11 XY Tables 12a and 12b Workpiece holding recognition device 13 Workpiece conveying device 14 Laser 14a Laser main optical axis 14b Laser peripheral ray 15a Transmission side laser beam 15b Reflection side laser beam 16 Workpiece holding recognition processing device 17 Workpiece position Recognition processing device 18 Laser beam cutoff control device

Claims (6)

A laser oscillator that oscillates a laser beam, a processing table that positions a workpiece, and a branching unit that branches the laser beam into a plurality of optical axes, and detects the position of the workpiece placed on the processing table Position detecting means is provided, and based on a detection signal of the position detecting means, the laser beam is blocked with respect to the work piece that has caused a position deviation between the branching means and the work piece, thereby causing the position deviation. A laser processing apparatus provided with a laser beam blocking mechanism that does not block the laser beam with respect to an unprocessed workpiece. A conveying means for conveying a plurality of workpieces to a machining table and a workpiece detection mechanism provided on the conveying means are provided, and the laser beam blocking mechanism detects that there is no workpiece by the workpiece detection mechanism. The laser processing apparatus according to claim 1 , wherein the laser beam is cut off . Conveying means for conveying a plurality of workpieces to a machining table, comprising: a laser oscillator for oscillating a laser beam; a machining table for positioning a workpiece; and a branching means for branching the laser beam into a plurality of optical axes. And a workpiece detection mechanism provided on the conveying means, and a laser beam cutoff that cuts off a laser beam detected by the workpiece detection mechanism between the branching means and the workpiece by the workpiece detection mechanism. Laser processing equipment with a mechanism . In a laser processing method of placing a workpiece or workpieces on a table, positioning the workpiece upon processing, branching a laser beam into a plurality of pieces, and then irradiating the workpiece to perform processing. A laser processing method for detecting a position of a workpiece, blocking the laser beam with respect to the workpiece having a positional deviation, and not blocking the laser beam with respect to a workpiece having no positional deviation . 5. The laser processing method according to claim 4, wherein when a plurality of workpieces are conveyed, holding / non-holding of the workpiece is detected, and when the workpieces are not held, the laser beam is interrupted . In a laser processing method of placing a workpiece or workpieces on a table, positioning the workpiece upon processing, branching a laser beam into a plurality of pieces, and then irradiating the workpiece to perform processing. A laser processing method , wherein when a plurality of workpieces are conveyed, holding / non-holding of the workpiece is detected, and when the workpieces are not held, the laser beam is interrupted .

Images