JPH11320155A - Laser beam machining method, machining equipment, and work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a machined hole of high quality at a high yield by completing the laser beam machining when it is judged that the work reaches the desired machine state even if the number of laser beam machining times does not reach the set number of laser beam outputs or by carrying out laser-beam machining to the set number of laser outputs except for under the above condition. SOLUTION: A laser beam is inputted to an incident light detector 16 and a reflected light detector 26, and signals from each detector are transmitted to amplifiers 27 and 28, amplified, and sent to an arithmetic processor 29. The arithmetic processor 29 divides the reflected light signal by the incident light signal and generates a normalized signal. With the first and second completion reference value setters 30 and 31, a judging reference and a machining completion reference are preset. If the normalized signal exceeds the judging reference value, the machining is judged as completed. When the number of laser beam machining reaches the laser output set value, the machining is judged as completed if the normalized signal exceeds the machining completion reference. If the work reaches the desired machine state, the hole machining is completed even when the number of laser beam machining is less than the set value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to laser processing, and more particularly, to a processing method and a processing apparatus suitable for forming a hole in a circuit board formed by laminating an insulating layer and a conductive layer.

[0002]

2. Description of the Related Art In general, there is a so-called multilayer circuit board formed by alternately laminating insulating layers and conductive layers on a circuit board. Such a multilayer circuit board has a high mounting density. And is becoming widely used.

[0003] Specifically, in a multilayer circuit board, a hole is formed in an insulating layer, and the hole is filled with a solder, a conductive paste, or the like, thereby obtaining conduction between adjacent conductive layers.

[0004] As a processing technique for forming a hole in an insulating layer, a technique utilizing laser light has been widely used.

The wavelength of the laser beam used is
For the insulating layer, a wavelength that is easily absorbed and a wavelength that is easily reflected for the conductive layer is used.For example, when the insulating layer is a glass epoxy resin and the conductive layer is a copper foil, a carbon dioxide gas laser beam is used. With the use, only the insulating layer can be selectively removed.

Here, it is needless to say that a hole is formed so that conduction between adjacent conductive layers can be surely obtained.

As such a conventional example, see, for example,
-92482. According to this, when drilling a hole by irradiating the laser beam to the workpiece,
The transmitted light directly from the laser oscillator and the reflected light from the object to be processed are detected by separate sensors, the reflected light amount ratio is calculated from the light amounts of both, and the laser light is controlled by comparison with a reference value. ing.

More specifically, the oscillator is stopped when the reflected light amount ratio becomes larger than a preset reference value.

By performing such an operation, the conductive layer can be prevented from being damaged by the laser light, and the processing time can be shortened at the same time.

[0010]

However, the above-mentioned prior art has the following problems.

That is, when a workpiece is machined by increasing the number of laser output times until the reflected light amount ratio becomes larger than a preset reference value, the shape of the machined hole is not necessarily a desired one. The challenge is not to be shaped.

In view of the above points, the present invention sets in advance the conditions and the number of outputs for each output of a laser capable of reliably processing a workpiece, and sets the laser to a reference value until the laser reaches the output number. An object of the present invention is to provide a laser processing apparatus that realizes high-yield drilling with high yield by controlling a laser oscillator and an optical system based on comparison with the above.

[0013]

In order to achieve the above object, the present invention provides a laser output condition as a laser output condition for drilling a workpiece by laser output a plurality of times. Performing the laser processing after setting the number, detecting the processing state of the workpiece during the execution of the laser processing, and determining whether the laser processing has reached a desired processing state; When determining that the desired processing state has been reached, ending the laser processing even if the set laser output number has not been reached, otherwise performing the laser processing up to the set laser output number And a laser processing method having the following.

As set forth in claim 2, a step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole drilling on a workpiece with a plurality of laser outputs; Detecting the processing state of the workpiece during execution, determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached a first desired processing state, Even if the set number of laser outputs has not been reached, the laser processing is terminated, otherwise performing the laser processing up to the set number of laser outputs, and executing the laser processing up to the set number of laser outputs. In such a case, a laser processing method including a step of detecting a processing state of the workpiece and determining whether the laser processing has reached a second desired processing state is performed.

According to a third aspect of the present invention, the laser processing is performed after setting the number of laser outputs as a laser output condition for performing drilling on the workpiece by a plurality of laser outputs; Detecting the processing state of the workpiece during execution, determining whether the desired processing state has been reached by laser processing, and, if it is determined that the workpiece has reached the desired processing state, the set laser Terminates laser processing even if the number of outputs has not been reached, otherwise executing laser processing up to the set number of laser outputs, and performing laser processing up to the set number of laser outputs An object of the present invention is to perform a laser processing method including a step of performing error processing when it is determined that a workpiece has not reached a desired processing state.

According to a fourth aspect of the present invention, the step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on the workpiece by a plurality of laser outputs, Detecting the processing state of the workpiece during execution, determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached a first desired processing state, Even if the set number of laser outputs has not been reached, the laser processing is terminated, otherwise performing the laser processing up to the set number of laser outputs, and executing the laser processing up to the set number of laser outputs. In this case, detecting the processing state of the workpiece and determining whether the laser processing has reached the second desired processing state; and determining that the second desired processing state has not been reached. Laser processing method comprising the step of performing error processing if it is to perform.

As set forth in claim 5, a step of setting at least a first laser output number as a laser output condition for performing drilling on a workpiece by a plurality of laser outputs, and the first laser output. Setting the second number of laser outputs less than the number, performing the laser processing to the second number of laser outputs, and performing the laser processing from the second number of laser outputs to the first number of laser outputs Detecting the processing state of the workpiece to determine whether the laser processing has reached a desired processing state; and determining that the workpiece has reached the desired processing state, the first set A method of performing a laser processing method having a step of ending laser processing even when the number of laser outputs has not been reached, and otherwise performing laser processing up to the first laser output number. A.

According to a sixth aspect of the present invention, at least a first laser output number is set as a laser output condition for performing drilling of a workpiece with a plurality of laser outputs, and the first laser output is set. Setting the second number of laser outputs less than the number, performing the laser processing to the second number of laser outputs, and performing the laser processing from the second number of laser outputs to the first number of laser outputs Detecting the processing state of the workpiece and determining whether the laser processing has reached a desired processing state; and setting the above when the workpiece is determined to have reached the first desired processing state. Ending the laser processing even if the first laser output number has not been reached, otherwise executing the laser processing up to the first laser output number; If you run over The processing to detect the machining state of the workpiece, and performs laser processing method comprising the step of determining whether reached the second desired machining state by laser processing.

As set forth in claim 7, a step of setting at least a first laser output number as a laser output condition for performing drilling on a workpiece with a plurality of laser outputs, and the first laser output. Setting the second number of laser outputs less than the number, performing the laser processing to the second number of laser outputs, and performing the laser processing from the second number of laser outputs to the first number of laser outputs Detecting the processing state of the workpiece to determine whether the laser processing has reached a desired processing state; and determining that the workpiece has reached the desired processing state, the first set Ending the laser processing even if the number of laser outputs has not been reached, otherwise performing the laser processing up to the first laser output number; And performs laser processing method comprising the step of performing error processing when it is determined that the workpiece has not reached the desired machining state in the case of executing the factory.

As set forth in claim 8, a step of setting at least a first laser output number as a laser output condition for performing drilling on a workpiece by a plurality of laser outputs; Setting the second number of laser outputs less than the number, performing the laser processing to the second number of laser outputs, and performing the laser processing from the second number of laser outputs to the first number of laser outputs Detecting the processing state of the workpiece and determining whether the laser processing has reached a first desired processing state; and determining that the workpiece has reached the first desired processing state. If the set first laser output number has not been reached, the laser processing is terminated. Otherwise, the first laser output number is set.
Performing laser processing up to the number of laser outputs;
Detecting the processing state of the workpiece when performing laser processing up to the first laser output number, and determining whether the laser processing has reached a second desired processing state;
A laser processing method having a step of performing error processing when the desired processing state is not reached.

According to a ninth aspect of the present invention, the first number of laser outputs is set to a value that can be reliably processed, and the second number of laser outputs is set to a value that can be sufficiently processed in relation to the workpiece and the laser output. The laser processing method according to any one of claims 5 to 8 is performed.

According to a tenth aspect, the first desired processing state is closer to the desired processing state than the second desired processing state. The laser processing method described in (1) is performed.

According to the eleventh aspect, the step of detecting the processing state of the workpiece and judging whether or not the laser processing has reached a desired processing state includes the step of determining the laser output intensity and the intensity of the reflected light from the workpiece. A laser processing method according to any one of claims 1 to 10 using a ratio.

According to a twelfth aspect of the present invention, there is provided a laser processing method according to the eleventh aspect, wherein the reflected light intensity of the workpiece is corrected in accordance with a hole drilling position of the workpiece.

According to a thirteenth aspect of the present invention, a workpiece in which a material having a first reflectance and a material having a second reflectance different from the first reflectance are laminated is processed. The laser processing method according to any of the above is performed.

According to another aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece with a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, and the workpiece. Detecting means for detecting the processing state of the above, determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and control means for inputting a signal from the determining means and controlling the laser output means Prepared,
When it is determined that the workpiece has reached the desired processing state, the control means terminates the laser processing even if the set laser output number has not been reached, otherwise, the set laser output number It is intended to provide a laser processing apparatus that performs laser processing up to this point.

As described in claim 15, a laser output means for performing hole drilling on a workpiece by a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, and the workpiece. Detecting means for detecting the processing state of the above, determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and control means for inputting a signal from the determining means and controlling the laser output means Prepared,
When it is determined that the workpiece has reached the first desired processing state, the control means terminates the laser processing even if the laser output number has not reached the set number, otherwise, the control means terminates the laser processing. Laser processing is performed up to the number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, the determination unit provides a laser processing apparatus that determines whether a second desired processing state has been reached. .

A laser output means for drilling a workpiece with a laser output a plurality of times, a setting means for setting the number of laser outputs as a laser output condition, and the workpiece. Detecting means for detecting the processing state of the above, determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and control means for inputting a signal from the determining means and controlling the laser output means Prepared,
When it is determined that the workpiece has reached the desired processing state, the control means terminates the laser processing even if the set laser output number has not been reached, otherwise, the set laser output number A laser processing apparatus that performs laser processing up to a predetermined number of laser outputs, and performs an error process when it is determined that the workpiece has not reached a desired processing state when the laser processing is performed up to the set number of laser outputs. It is.

As set forth in claim 17, a laser output means for drilling a workpiece with laser output a plurality of times, a setting means for setting the number of laser outputs as a laser output condition, and the workpiece. Detecting means for detecting the processing state of the above, determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and control means for inputting a signal from the determining means and controlling the laser output means Prepared,
When it is determined that the workpiece has reached the first desired processing state, the control means terminates the laser processing even if the laser output number has not reached the set number, otherwise, the control means terminates the laser processing. The laser processing is performed up to the number of laser outputs, and when performing the laser processing up to the set number of laser outputs, the determination unit detects the processing state of the workpiece,
It is an object of the present invention to provide a laser processing apparatus which determines whether or not a laser processing has reached a second desired processing state and performs error processing when the second desired processing state has not been reached.

A laser output means for drilling a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number; detecting means for detecting a processing state of the workpiece; and performing laser processing from the second laser output number to the first laser output number. Determining means for determining whether a desired processing state has been reached by a signal from the detecting means,
A control means for inputting a signal from the determination means to control the laser output means, wherein when it is determined that the workpiece has reached a desired processing state during laser processing after the second laser output number, The control means terminates the laser processing even when the first laser output number has not been reached, and provides a laser processing apparatus that executes the laser processing up to the first laser output number otherwise. .

According to a nineteenth aspect of the present invention, there is provided a laser output means for performing drilling of a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number; detecting means for detecting a processing state of the workpiece; and performing laser processing from the second laser output number to the first laser output number. Determining means for determining whether a desired processing state has been reached by a signal from the detecting means,
A control unit for inputting a signal from the determination unit to control the laser output unit; and determining that the workpiece has reached the first desired processing state during the laser processing after the second laser output number. In such a case, the control means terminates the laser processing even if the first laser output number has not been reached, and otherwise executes the laser processing up to the first laser output number, and When the laser processing is performed up to the number of outputs, the determination means provides a laser processing apparatus that determines whether the laser processing has reached a second desired processing state.

A laser output means for drilling a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number; detecting means for detecting a processing state of the workpiece; and performing laser processing from the second laser output number to the first laser output number. Determining means for determining whether a desired processing state has been reached by a signal from the detecting means,
A control means for inputting a signal from the determination means to control the laser output means, wherein when it is determined that the workpiece has reached a desired processing state during laser processing after the second laser output number, The control means terminates the laser processing even when the first laser output number has not been reached, otherwise executes the laser processing up to the first laser output number, and performs the laser processing up to the first laser output number. An object of the present invention is to provide a laser processing apparatus that performs error processing when it is determined that a workpiece has not reached a desired processing state when laser processing is performed.

According to a twenty-first aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number; detecting means for detecting a processing state of the workpiece; and performing laser processing from the second laser output number to the first laser output number. Determining means for determining whether a desired processing state has been reached by a signal from the detecting means,
A control unit for inputting a signal from the determination unit to control the laser output unit; and determining that the workpiece has reached the first desired processing state during the laser processing after the second laser output number. In such a case, the control means terminates the laser processing even if the first laser output number has not been reached, and otherwise executes the laser processing up to the first laser output number, and When the laser processing is performed up to the number of outputs, the determination means detects the processing state of the workpiece, determines whether or not the laser processing has reached the second desired processing state, and reaches the second desired processing state. Another object of the present invention is to provide a laser processing device that performs an error process when it is not performed.

According to a twenty-second aspect, the first laser output number is set to a value that can be reliably processed, and the second laser output number is set to a numerical value that can be sufficiently processed in relation to the workpiece and the laser output. A laser processing apparatus according to any one of claims 18 to 21 is provided.

According to a twenty-third aspect, the first desired processing state is closer to the desired processing state than the second desired processing state. Is provided.

According to a twenty-fourth aspect of the present invention, the step of detecting the processing state of the workpiece and judging whether or not the laser beam has reached a desired processing state by laser processing includes the step of determining the laser output intensity and the intensity of the reflected light from the workpiece. 23. Use of ratios.
A laser processing device according to any one of the above.

According to a twenty-fifth aspect of the present invention, there is provided a laser processing apparatus according to the twenty-fourth aspect, wherein the reflected light intensity of the workpiece is corrected in accordance with a hole drilling position of the workpiece.

According to a twenty-sixth aspect, any one of the fourteenth to twenty-fifth aspects, wherein a workpiece in which a material having a first reflectance and a material having a second reflectance different from the first reflection are laminated is processed. And a laser processing apparatus according to any one of (1) to (4).

As set forth in claim 27, claims 1 to 1
According to a third aspect of the present invention, there is provided a workpiece processed by the laser processing method according to any one of the first to third aspects or the laser processing apparatus according to any one of the first to fourth aspects.

[0040]

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, laser processing is performed after setting the number of laser outputs as a laser output condition for drilling a workpiece by laser output a plurality of times. Performing the laser processing, detecting a processing state of the workpiece during execution of the laser processing, and determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached a desired processing state. In this case, the laser processing is terminated even if the set number of laser outputs has not been reached, and otherwise, the laser processing method having a step of performing the laser processing up to the set number of laser outputs is adopted. , Realizing a high-yield, high-quality hole drilling machine by accurately judging the hole drilling state of the workpiece during processing and controlling the laser output Rukoto can.

A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on a workpiece by a plurality of laser outputs as described in claim 2; A step of detecting a processing state of the workpiece during execution of the processing and determining whether a desired processing state has been reached by laser processing;
If it is determined that the desired processing state has been reached, the laser processing is terminated even if the set number of laser outputs has not been reached, and otherwise, the laser processing is performed up to the set number of laser outputs. A laser processing method comprising: detecting a processing state of a workpiece when laser processing is performed up to the set number of laser outputs; and determining whether the laser processing has reached a second desired processing state. By using the method described above, it is possible to realize a laser processing device that accurately determines a processing state of a hole in a workpiece during processing and controls a laser output, thereby achieving a high-yield high-quality hole processing. .

A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing a hole processing on a workpiece by a plurality of laser outputs; Detecting the processing state of the workpiece during execution of the processing, determining whether the laser processing has reached a desired processing state, and setting the processing when it is determined that the workpiece has reached the desired processing state Terminating laser processing even if the number of laser outputs has not reached the specified number of laser outputs, otherwise performing laser processing up to the set number of laser outputs, and performing laser processing up to the set number of laser outputs The laser processing method includes a step of performing an error process when it is determined that the workpiece has not reached a desired processing state. The machining state of the hole of the workpiece is accurately determined, by controlling the laser output, it is possible to realize a laser processing apparatus that achieve high-quality drilling high yield.

Further, as set forth in claim 4, a step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole drilling on the workpiece by a plurality of laser outputs; Detecting the processing state of the workpiece during execution of the processing and determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached the first desired processing state. Terminating laser processing even if the set number of laser outputs has not been reached, otherwise performing laser processing up to the set number of laser outputs, and performing laser processing up to the set number of laser outputs If executed, detecting the processing state of the workpiece and determining whether the laser processing has reached a second desired processing state; and By using a laser processing method having an error processing step when there is no processing, it is possible to accurately determine a processing state of a hole in a workpiece during processing, and control a laser output to obtain a high-yield high-quality hole. A laser processing apparatus that achieves processing can be realized.

According to a fifth aspect of the present invention, at least a first laser output number is set as a laser output condition for performing hole drilling on a workpiece by a plurality of laser outputs. Setting a second laser output number smaller than the laser output number, performing laser processing up to the second laser output number, and performing laser processing from the second laser output number to the first laser output number. Detecting the processing state of the workpiece during execution, determining whether the laser processing has reached the desired processing state, and, if it is determined that the workpiece has reached the desired processing state, A laser processing method having a step of terminating laser processing even when the number of laser outputs has not reached 1 and performing laser processing up to the first laser output number otherwise. It allows the machining state of the hole of the workpiece during machining is determined accurately, by controlling the laser output, it is possible to realize a laser processing apparatus that achieve high-quality drilling high yield.

Further, in accordance with a sixth aspect of the present invention, at least a first laser output number is set as a laser output condition for performing a hole drilling operation on a workpiece by a plurality of laser outputs; Setting a second laser output number smaller than the laser output number, performing laser processing up to the second laser output number, and performing laser processing from the second laser output number to the first laser output number. Detecting the processing state of the workpiece during execution, determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached a first desired processing state, If the set first laser output number is not reached, the laser processing is terminated.
Performing laser processing up to the number of laser outputs;
When performing laser processing up to the first laser output number, a laser processing method including a step of detecting a processing state of a workpiece and determining whether or not the laser processing has reached a second desired processing state. Accordingly, a laser processing device that achieves high-yield drilling with high yield can be realized by accurately determining the processing state of a hole in a workpiece during processing and controlling laser output.

Further, as set forth in claim 7, a step of setting at least a first laser output number as a laser output condition for performing hole drilling on a workpiece by a plurality of laser outputs, Second less than the number of laser outputs
Setting the number of laser outputs, performing the laser processing up to the second laser output number, and performing the laser processing from the second laser output number to the first laser output number. Detecting a processing state and determining whether the laser processing has reached a desired processing state; and determining that the workpiece has reached a desired processing state, the laser processing apparatus reaches the set first laser output number. Terminating the laser processing even if not performed, otherwise performing the laser processing up to the first laser output number;
When laser processing is performed up to the number of laser outputs, a laser processing method having a step of performing an error process when it is determined that the workpiece has not reached a desired processing state is employed. By accurately determining the machining state of the hole in the workpiece and controlling the laser output, it is possible to realize a laser machining apparatus that achieves high-yield drilling with high yield.

Further, as set forth in claim 8, a step of setting at least a first laser output number as a laser output condition for performing hole drilling on a workpiece by a plurality of laser outputs, Second less than the number of laser outputs
Setting the number of laser outputs, performing the laser processing up to the second laser output number, and performing the laser processing from the second laser output number to the first laser output number. Detecting the processing state and determining whether the laser processing has reached a first desired processing state; and determining that the workpiece has reached the first desired processing state, Ending laser processing even if the number of laser outputs has not been reached, otherwise performing laser processing up to the first laser output number, and executing laser processing up to the first laser output number In this case, a step of detecting the processing state of the workpiece and determining whether or not the laser processing has reached a second desired processing state, and a step of performing error processing if the second desired processing state has not been reached. Laser processing method that accurately determines the hole processing state of the hole of the workpiece during processing by controlling the laser output, and achieves high-yield high-quality hole processing by controlling the laser output. Can be realized.

According to a ninth aspect of the present invention, the first laser output number is set to a value that can be reliably processed, and the second laser output number is sufficiently processed in relation to the workpiece and the laser output. The laser processing method according to any one of claims 5 to 8, wherein the laser processing method is set to a numerical value that can be set, thereby accurately determining a processing state of a hole in a workpiece during processing, and controlling a laser output to increase a yield. And a laser processing apparatus that achieves high quality drilling with high quality.

As described in claim 10, the first desired processing state is closer to the desired processing state than the second desired processing state. The laser processing method according to any one of the above, to accurately determine the processing state of the hole of the workpiece during the processing, by controlling the laser output, to achieve a high-yield high-quality hole processing. A laser processing device can be realized.

Further, the step of detecting the processing state of the workpiece and determining whether or not a desired processing state has been achieved by the laser processing includes the step of detecting the laser output intensity and the reflection from the workpiece. By taking the laser processing method according to any one of claims 1 to 10 using the ratio of light intensity, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output, It is possible to realize a laser processing apparatus that achieves high-yield drilling with high yield.

According to a twelfth aspect of the present invention, there is provided a laser processing method according to the eleventh aspect, wherein the reflected light intensity of the workpiece is corrected in accordance with the hole drilling position of the workpiece.
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to a thirteenth aspect of the present invention, a workpiece is formed by laminating a material having a first reflectance and a material having a second reflectance different from the first reflectance. From 12
By taking the laser processing method according to any of the above, to accurately determine the processing state of the hole of the workpiece during processing,
By controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield drilling with high yield.

According to a fourteenth aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, Detecting means for detecting the processing state of the workpiece, determining means for determining whether a desired processing state has been reached based on a signal from the detecting means, and inputting a signal from the determining means to control the laser output means Control means, when it is determined that the workpiece has reached the desired processing state, the control means ends the laser processing even if the set laser output number has not reached, otherwise, the laser processing By performing laser processing up to the set number of laser outputs, it is possible to accurately determine the processing state of holes in the workpiece during processing, and control the laser output to achieve high yield and high quality It is possible to realize a laser processing apparatus that achieve the drilling.

According to a fifteenth aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, Detecting means for detecting the processing state of the workpiece, determining means for determining whether a desired processing state has been reached based on a signal from the detecting means, and inputting a signal from the determining means to control the laser output means Control means, when it is determined that the workpiece has reached the first desired processing state, the control means terminates the laser processing even if the set laser output number has not been reached, otherwise The laser processing is performed up to the set number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, the determination unit determines whether the second desired processing state has been reached. It allows the machining state of the hole of the workpiece during machining is determined accurately, by controlling the laser output, it is possible to realize a laser processing apparatus that achieve high-quality drilling high yield.

According to another aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, Detecting means for detecting the processing state of the workpiece, determining means for determining whether a desired processing state has been reached based on a signal from the detecting means, and inputting a signal from the determining means to control the laser output means Control means, when it is determined that the workpiece has reached the desired processing state, the control means ends the laser processing even if the set laser output number has not reached, otherwise, the laser processing Laser processing is performed up to the set number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, an error occurs when it is determined that the workpiece has not reached a desired processing state. By performing processing, it is possible to accurately determine the processing state of the hole in the workpiece during processing and control the laser output, thereby realizing a laser processing apparatus that achieves high yield and high quality hole processing. it can.

According to a seventeenth aspect of the present invention, there is provided a laser output means for performing hole drilling on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, Detecting means for detecting the processing state of the workpiece, determining means for determining whether a desired processing state has been reached based on a signal from the detecting means, and inputting a signal from the determining means to control the laser output means Control means, when it is determined that the workpiece has reached the first desired processing state, the control means terminates the laser processing even if the set laser output number has not been reached, otherwise The laser processing is performed up to the set number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, the determination unit detects the processing state of the workpiece, and performs the laser processing. By judging whether the second desired machining state has been reached, and performing error processing when the second desired machining state has not been reached, the machining state of the hole in the workpiece during machining can be accurately determined. However, by controlling the laser output, it is possible to realize a laser processing apparatus that achieves high yield and high quality hole drilling.

According to another aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number and a laser output condition as laser output conditions. Setting means for setting a second laser output number smaller than the laser output number; detecting means for detecting a processing state of the workpiece; and laser processing from the second laser output number to the first laser output number. A determining means for determining whether or not a desired machining state has been reached by a signal from the detecting means during execution; a control means for inputting a signal from the determining means to control a laser output means; When it is determined that the workpiece has reached the desired processing state during the laser processing after the number of times, the control means terminates the laser processing even if the first laser output number is not reached, otherwise, Before By performing laser processing up to the first laser output number, it is possible to accurately determine the processing state of the hole in the workpiece during processing and control the laser output to achieve high yield and high quality hole processing. The laser processing device can be realized.

Further, as described in claim 19, a laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number as the laser output condition and the first laser output number, Setting means for setting a second laser output number smaller than the laser output number; detecting means for detecting a processing state of the workpiece; and laser processing from the second laser output number to the first laser output number. A determining means for determining whether or not a desired machining state has been reached by a signal from the detecting means during execution; a control means for inputting a signal from the determining means to control a laser output means; When it is determined that the workpiece has reached the first desired processing state during the subsequent laser processing, the control means terminates the laser processing even if the first laser output number has not been reached. Other than Performs the laser processing up to the first laser output number, and when the laser processing is performed up to the first laser output number, the determining unit determines whether or not a second desired processing state has been reached, By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to a twentieth aspect of the present invention, there is provided a laser output means for performing drilling of a workpiece with a plurality of laser outputs, a first laser output number and a laser output condition as laser output conditions. Setting means for setting a second laser output number smaller than the laser output number; detecting means for detecting a processing state of the workpiece; and laser processing from the second laser output number to the first laser output number. A determining means for determining whether or not a desired machining state has been reached by a signal from the detecting means during execution; a control means for inputting a signal from the determining means to control a laser output means; When it is determined that the workpiece has reached the desired processing state during the laser processing after the number of times, the control means terminates the laser processing even if the first laser output number is not reached, otherwise, Before Laser processing is performed up to the first laser output number, and error processing is performed when it is determined that the workpiece has not reached a desired processing state when the laser processing is performed up to the first laser output number. This makes it possible to realize a laser processing apparatus that achieves high-yield high-quality hole drilling by accurately judging the drilling state of the hole in the workpiece during the drilling and controlling the laser output.

According to a twenty-first aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a second laser output number smaller than the laser output number; detecting means for detecting a processing state of the workpiece; and laser processing from the second laser output number to the first laser output number. A determining means for determining whether or not a desired machining state has been reached by a signal from the detecting means during execution; a control means for inputting a signal from the determining means to control a laser output means; When it is determined that the workpiece has reached the first desired processing state during the subsequent laser processing, the control means terminates the laser processing even if the first laser output number has not been reached. Other than Performs the laser processing up to the first laser output number, and when the laser processing is performed up to the first laser output number, the determination unit detects the processing state of the workpiece, and performs the second processing by the laser processing. It is determined whether or not a desired processing state has been reached. If the second desired processing state has not been reached, error processing is performed, thereby accurately determining the processing state of the hole of the workpiece during processing, and using a laser. By controlling the output, it is possible to realize a laser processing device that achieves high-yield drilling with high yield.

According to a twenty-second aspect of the present invention, the first laser output number is set to a value that can be reliably processed, and the second laser output number is sufficiently processed in relation to the workpiece and the laser output. By configuring the laser processing apparatus according to any one of claims 18 to 21 to set a numerical value that can be set, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output, It is possible to realize a laser processing apparatus that achieves high-yield drilling with high yield.

According to a twenty-third aspect, the first desired processing state is closer to the desired processing state than the second desired processing state. By configuring the laser processing device described in crab, accurately determine the processing state of the hole of the workpiece during processing,
By controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield drilling with high yield.

The step of detecting the processing state of the workpiece and judging whether or not the laser processing has reached a desired processing state may include the step of detecting the laser output intensity and the reflection from the workpiece. 15. Use of a ratio of light intensities.
The laser processing device according to any one of to 22 is configured to accurately determine the processing state of the hole in the workpiece during processing, and by controlling the laser output, a high-yield high-quality hole processing. Can be realized.

According to a twenty-fifth aspect of the present invention, the laser processing apparatus according to the twenty-fourth aspect corrects the reflected light intensity of the workpiece in accordance with the hole drilling position of the workpiece. By accurately determining the machining state of the hole in the workpiece and controlling the laser output, it is possible to realize a laser machining apparatus that achieves high-yield drilling with high yield.

According to a twenty-sixth aspect of the present invention, a workpiece is formed by laminating a material having a first reflectance and a material having a second reflectance different from the first reflectance. From 2
5. By configuring the laser processing apparatus according to any one of (5) and (4), it is possible to accurately determine the processing state of the hole of the workpiece during processing and control the laser output to perform high-yield high-quality hole processing. The laser processing device to achieve can be realized.

Embodiment 1 Hereinafter, Embodiment 1 of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic view of a laser processing method according to the present embodiment. In FIG. 1, 1 is a method of setting the number of laser outputs, 2 is a method of setting the energy of each laser output,
3 is a method for setting the number of times of laser processing to 0, 4 is a laser processing method, 5 is a method for detecting the processing state of the workpiece, 6 is a method for counting the number of laser processing, and 7 is a method for counting the number of laser processing. A method for determining whether the first desired processing state has been reached, a method for determining whether the number of laser processings has reached the set number of laser outputs, and a method 9 for determining whether the workpiece has reached the second processing state Is a method for determining whether or not laser processing has been performed, 10 is a method for ending laser processing, and 11 is an error processing method.

First, before laser processing, the number of laser outputs and the energy at each laser output are set. Here, the setting is made in advance so that the workpiece can be reliably formed into a high-quality hole having a hole shape. For example, three outputs of 10 mJ energy per laser output,
Or, the energy of the first two outputs is 10 mJ and
The energy of the third output may be changed for each output such as 5 mJ.

Next, a counter for counting the number of times of laser processing is set to 0. Then, laser processing is performed. Then, the processing state of the workpiece is detected during the laser processing.

Next, a method for detecting the processing state of the workpiece will be described. FIG. 2 is a schematic diagram of a method for detecting a processing state of a workpiece.

In FIG. 2, reference numeral 12 denotes a laser oscillator;
Is a laser beam, 14 is a beam splitter, 15 is a condenser lens, 16 is an incident light detector, 17 is a thin film film polarizer (TFP), 18 is a λ / 4 wavelength plate, 19 is a substrate which is a workpiece, and 20 is Condensing lens, 21 is an insulating layer of the substrate, 2
2 is a copper foil which is a conductive portion of the substrate, 23 is laser reflected light, 2
4 is a beam splitter, 25 is a condenser lens, 26 is a reflected light detector, 27 and 28 are amplifiers, 29 is an arithmetic processing unit,
Reference numerals 30 and 31 denote a completion reference value setting unit, 32 denotes a processing completion determination unit, and 33 denotes a control device.

A detection operation method realized by the above configuration will be described in detail. The laser light 13 output from the laser oscillator 12 reaches the beam splitter 14, and most of the laser light 13 is reflected and used for processing, and some of the laser light passes through the beam splitter 14. The transmitted laser light is condensed by a condenser lens 15 and is incident on an incident light detector 16.
Is input to The laser beam reflected by the beam splitter 14 is deflected by the TFP 17. That is, for example, when the polarized light is in the vertical direction,
7 reflects the laser light 13 in the vertical direction. And λ /
The circularly polarized laser light 13 whose linearly polarized light is converted to circularly polarized light by the four plates 18 is condensed by the condensing lens 20, and the substrate is processed by the condensed laser light 13. During processing, the substrate 19
When the copper foil 22 of the substrate 1 is not exposed, the laser light is absorbed by the insulating layer 21 and the reflected light 23 is hardly reflected.
When the copper foil 22 of No. 9 is exposed, the laser light is reflected on the copper foil surface and returns to the optical path of the laser light to the TFP 17. The intensity of the reflected laser light increases as the exposed area of the copper foil 22 increases. When the laser light is reflected on the copper foil surface, the direction of the circularly polarized light of the laser light 13 is reversed. For this reason, the reflected laser light is converted into a linearly polarized light in the horizontal direction by the λ / 4 plate 18, the reflected laser light 23 is transmitted by the TFP 17, and the transmitted reflected laser light 23 is weakened in laser intensity by the beam splitter 24. . Then, the light is condensed by the condensing lens 25 and input to the reflected light detector 26. Here, the beam splitter 24 can be omitted depending on the intensity of the laser light passing through the TFP 17 and the intensity that can be input to the reflected light detector 26. When the laser light is input to the incident light detector 16 and the reflected light detector 26, a signal from each detector is transmitted to the amplifier 26,
The signal is sent to an arithmetic processing unit 29 which amplifies the signal. The arithmetic processing unit 29 generates a normalized signal by dividing the reflected light signal by the incident light signal from the incident light signal and the reflected light signal transmitted from the incident side. Here, the signal is corrected as needed for the reflected light intensity. When the amount of light reflected by the copper foil 22 of the substrate 19 does not return to the reflected light detector 26 by 100%, the correction means to be executed determines in advance the rate at which the reflected light 23 returns depending on the processing position of the substrate 19. Is prepared in a table, and the reflected light intensity is corrected for each coordinate to be processed. For example, when machining a hole at a certain coordinate, the percentage of reflected light from that coordinate also returns to 80%,
If the signal detected by the reflected light detector 26 is 8 V, the detected signal of the reflected light is corrected to 10 V from 8 / 0.8 by dividing 8 V by the return ratio of the reflected light.

The generated normalized signal is sent to the processing completion determination unit 3
2 is sent. The completion criterion value setting unit 30 previously sets a criterion for determining whether or not the processing has been completed based on the normalized signal, and determines that the processing has been completed when the normalized signal exceeds this reference value. When the number of laser processings reaches the set number of laser outputs, a separate processing completion reference 31 is set, and if the normalized signal exceeds this set value, it is determined that the processing is completed.

Next, the workpiece reaches a desired processing state,
That is, when the exposed area of the copper foil 22 under the insulating layer reaches a desired area, the processing of the hole is completed even if the number of laser processings does not reach the set value of the number of laser outputs. If the workpiece has not reached the desired machining state, the above method is executed until the set number of laser outputs is reached.

When the number of times of laser processing reaches the number of laser outputs, it is determined again whether the workpiece has reached a desired processing state. The desired processing state in this case may be based on the previous period. However, due to various variations as shown in FIG. 3, even if the exposed area of the copper foil 22 is equal, the completion reference value has a width. If the number of times has not reached the set number of laser outputs, the completion of processing is determined based on a large completion reference value. If the set number of laser outputs has been reached, it is determined that the processing has been completed with a small completion reference value.
If it is determined that the machining is completed, the next hole is machined. If it is determined that the processing is not completed, error processing is performed. The error processing here interrupts the processing of the substrate being processed,
The processing of the next substrate or the hole coordinates of the unprocessed hole may be stored, and the unprocessed substrate may be removed or reprocessed in a later process.

As described above, according to the present embodiment, when the workpiece reaches the desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in this embodiment, the amplifiers 27, 2
8 was used to amplify the signal, but the incident light detector 16,
If the magnitude of the signal sent from the reflected light detector 26 is large enough for the arithmetic processing unit 29 to perform signal detection, the amplifiers 27 and 28 are not necessarily required.

In this embodiment, the laser oscillator 1
Although 2 is a pulsed laser oscillator, a laser oscillator that emits laser light continuously may be used in some cases in relation to the workpiece.

Further, in this embodiment, the table on which the substrate is set is fixed, but the same effect can be obtained by using a movable table such as an XY table.

In this embodiment, a galvano mirror is used as a scanning mirror. However, a similar effect can be obtained by using a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like.

Further, in the present embodiment, the same effect can be obtained even if an optical system in which a plurality of fθ lenses, a single lens, and a Fresnel lens are combined is used as the processing condensing lens.

Further, the processing hole is formed by processing a laser beam continuously for one hole, or by processing a hole in a processing area by one laser output. The effect can be obtained.

(Embodiment 2) Hereinafter, Embodiment 2 of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a schematic view of a laser processing apparatus according to the present embodiment. In FIG. 3, 41 is a first laser output number setting method, 42 is a second laser output number setting method,
43 is an output energy setting method, 44 is an initialization method of the number of laser processings, 45 is a laser processing method, 46 is a method of updating the number of laser processings, 47 is a method of determining the second laser output number reaching, and 48 is processing of a workpiece. The state detection method 49 is a method for determining whether the workpiece has reached the first desired processing state.
0 is a method for determining whether the number of laser processing has reached the first laser output number, 51 is a method for determining whether the processing state of the workpiece has reached the second desired processing state, and 52 is a laser processing end method. , 53 are error handling methods.

With the above configuration, this operation will be described in more detail. First, a first laser output number is set. Here the laser output number, the reliably set the output number n ₁ of the substrate can be reliably processed as the workpiece. Next, the second laser output number n ₂ is set. Here, the number of laser outputs sets the number of laser outputs at which holes of the substrate, which is a workpiece, start to reach a desired processing state. Then, output energies for the first and second laser outputs are set. The setting method is
This is the same as in the first embodiment.

Next, a counter for counting the number of times of laser processing is set to zero. Then, laser processing is performed. The number of times of laser processing is updated each time laser processing is performed. The first half of the laser output, that is, the second laser output number n ₂
Until then, only laser processing is performed. Then, based on the second laser output number n ₂ , the processing state of the workpiece is detected during laser processing. The method of detecting the processing state is the same as in the first embodiment. If it is determined that the processing state of the workpiece is a desired processing state, that is, the exposed area of the copper foil under the insulating layer of the substrate has exceeded the desired area, the first laser output number n ₁ has been reached. If not, end the laser processing. If the processing state of the workpiece has not reached the desired processing state, that is, if the area of the copper foil under the insulating layer of the substrate is smaller than the desired area, the number of laser processing is reduced to the first laser output. Processing is continued until the number n ↓ 1 is reached. When the number of times of laser processing reaches the first number of laser outputs, it is the same as the first embodiment below.

As described above, according to this embodiment, when the workpiece reaches a desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed, thereby achieving high quality. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in the present embodiment, the signal is amplified by using the amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector depends on whether the arithmetic processing unit performs signal detection. An amplifier is not always needed if it is large enough.

In this embodiment, the laser oscillator is a pulsed laser oscillator. However, a laser oscillator that emits laser light continuously may be used in some cases in relation to the workpiece.

Further, in this embodiment, the table on which the substrate is placed is fixed, but the same effect can be obtained by using a movable table such as an XY table.

In this embodiment, a galvano mirror is used as a scanning mirror. However, a similar effect can be obtained by using a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like.

Further, in the present embodiment, the same effect can be obtained even if an optical system in which a plurality of fθ lenses, a single lens, and a Fresnel lens are combined is used as the processing condenser lens.

[0093] Further, the processing hole can be formed by continuously processing one hole with a laser output or by processing a certain processing region with one laser output per hole. The effect can be obtained.

(Embodiment 3) Hereinafter, Embodiment 3 of the present invention will be described in detail with reference to the drawings.

FIG. 4 is a schematic view of a laser processing apparatus according to the present embodiment. 4, reference numeral 101 denotes a laser output number setting unit, 102 denotes a control unit, 103 denotes a laser output unit, 104 denotes a substrate as a workpiece, 105 denotes an insulating layer of the substrate, 106 denotes a copper foil of the substrate, and 107 denotes a laser output. Laser light output from the means, 108 is an optical system, 109 is reflected laser light, 110 is laser light detecting means, 111 is an amplifier,
112 is a processing state detecting means, 113 is a processing state determining means, 114 is a first processing reference value setting means, and 115 is a second processing reference value setting means.
The processing reference value setting means 116 has a configuration which is a configuration of the error processing means.

With the above configuration, this operation will be described in more detail. First, the number of laser outputs, which is a laser processing condition, is set in the first setting unit 101. The number of laser outputs set here is a condition for reliably processing the workpiece. Next, as for this processing condition, the energy of each output is transmitted to the control means 102. The control means outputs the laser beam 107 from the laser output means 103 based on the processing conditions of the setting means. The laser beam 107 is guided by the optical system 108 to the substrate 104, which is a workpiece,
The laser beam 107 is guided to the laser beam detector 110. The laser beam guided to the workpiece is applied to the insulating layer 105 of the substrate 104.
To process. When the copper foil 106 of the substrate 104 is not exposed, the laser beam 107 is absorbed by the insulating layer. As the processing proceeds, the copper foil 106 under the insulating layer is exposed, and at the same time, a part of the laser light applied to the substrate 104, that is, the laser light reaching the copper foil 106 is reflected to form a reflected laser light 109. The laser beam travels in the reverse direction, and the reflected laser beam 109 is separated by the separation optical system on the way, and guided to the laser beam detector 110. In the laser light detector 110,
Laser light, that is, incident laser light 107 and reflected laser light 1
09 is transmitted, and an incident light intensity signal and a reflected light intensity signal are transmitted to the amplifier 111, respectively. The amplifier 111 amplifies each signal and transmits each signal to the processing state detecting means 112. The processing state detection means 112 corrects the reflected light intensity signal as necessary, divides the signal by the incident light intensity signal, and generates a normalized signal.

Here, the correction means to be executed is the reflected light 1
If the amount of light reflected by the copper foil 106 of the substrate does not return to the laser beam detector 110 by 100%, the ratio of the return of the reflected light 109 according to the processing position of the substrate 104 is prepared in a table in advance, and the coordinates to be processed are set to 09. Correct the reflected light intensity for each time. For example, when machining a hole at a certain coordinate, the rate of return of the reflected light from that coordinate is 80%, and when the signal detected by the laser light detector is 8V, 8V is the rate of return of the reflected light. By dividing by 8 / 0.8, the detection signal of the reflected light is corrected to be 10V.

Then, the processing condition detecting means 112 transmits a normalized signal to the processing state determining means 113.

The machining state judging means 113 judges the machining state by comparing the reference value set in the machining reference value setting means 114 with the normalized signal transmitted from the machining state detecting means in advance.

From the relationship between the normalized value and the hole processed in the substrate, that is, the exposed copper foil area, the normalized value increases as the copper foil area increases. From this, a normalized value corresponding to a desired hole is set. If the normalized value is exceeded, it is determined that the desired hole has been exceeded, and if it is less than the reference value, it is determined that the desired hole has not been reached. The above judgment is transmitted to the control means 102.

When the desired hole is reached, the control means 102 ends the processing even if the number of laser processing has not reached the set value of the setting means 101. Conversely, if the desired hole has not been reached, the laser processing is continued.

When the number of laser processings reaches the number of laser outputs set in the setting means, the processing state determining means 113
If the control signal 102 reaches the desired hole as a result of the determination signal, the control means 102 terminates the laser processing. on the other hand,
If the desired hole has not been reached, the control means 102 executes the error processing means 116.

The error processing means 116 discards the substrate that has not reached the desired processing state and performs the next processing. Alternatively, the coordinates of the machining holes that have not reached the desired machining may be stored, and the location may be machined separately or discarded in a later step.

When the number of laser processings reaches the number of laser outputs set by the setting means, the number of laser processings is lower than the processing reference setting means when the number of laser processings does not reach the number of laser outputs of the setting means. The processing state determination means 113 may make the determination using the second processing reference setting means 115. The setting value of the second processing reference value setting means 115 is such that the larger the copper foil area is, the larger the normalized value becomes from the relationship between the normalized value and the hole processed in the substrate, that is, the exposed copper foil area. , Even for the same copper foil area, there is a range in the normalized value.
Set this minimum value.

As described above, according to the present embodiment, when the workpiece reaches a desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in the present embodiment, the signal is amplified using the amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector is determined when the arithmetic processing unit detects the signal. An amplifier is not always needed if it is large enough.

Further, the laser output means may be a pulse laser oscillator, or a laser oscillator which continuously emits laser light in relation to the object to be processed.

Further, in this embodiment, the table on which the substrate is placed is fixed, but the same effect can be obtained by using a movable table such as an XY table.

The same effect can be obtained by using a galvanometer mirror as a scanning mirror, a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like in the optical system.

Further, the same effect can be obtained by using an optical system in which a plurality of Fθ lenses, a single lens, and a Fresnel lens are combined as the processing condenser lens. The same effect can be obtained by processing a hole by continuously outputting a laser beam to one hole or by processing a hole in a certain processing region by outputting one laser beam. It is obtained.

(Embodiment 4) Hereinafter, Embodiment 4 of the present invention will be described in detail with reference to the drawings.

FIG. 5 is a schematic view of a laser processing apparatus according to the present embodiment. FIG. 5 shows a configuration in which second setting means 117 is added.

With the above configuration, this operation will be described in more detail. First, the number of laser outputs, which is a laser processing condition, is set in the first setting unit 101. The number of laser outputs set here is a condition for reliably processing the workpiece. Next, the number of laser outputs, which is a laser processing condition, is set in the second setting means 117. The number of laser outputs set here is set to the number of laser outputs at which the substrate is processed and a workpiece is processed in a desired state, that is, the exposed copper foil area under the insulating layer starts to reach a desired area.

Then, the control means 102 first controls the laser output means 103 by the second setting means 117. At this time, the processing state detecting means 112 and the processing state determining means 113 stop operating. Then, the second setting means 117
The processing state detection means 112 and the processing state determination means 113 are operated from the final laser output number. Hereinafter, the first
The operation of laser processing up to the setting means 101 is the same as that of the third embodiment.

As described above, according to the present embodiment, when the workpiece reaches a desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed, thereby achieving high quality. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in this embodiment, the signal is amplified using the amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector depends on the processing state detecting means 11.
If 2 is large enough to perform signal detection, an amplifier is not always required.

Further, as the laser output means, a pulse laser oscillator, a laser oscillator for continuously emitting laser light, or the like is used in relation to the object to be processed.

Further, in this embodiment, the table on which the substrate is placed is fixed, but the same effect can be obtained by using a movable table such as an XY table.

The same effect can be obtained by using a galvano mirror as a scanning mirror, a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like in the optical system.

Further, the same effect can be obtained by using an optical system in which a plurality of Fθ lenses, a single lens, and a Fresnel lens are combined as the processing condenser lens.

The same applies to the processing hole that is processed by continuously outputting laser light to one hole, or to processing a certain processing area by outputting one laser to each hole. The effect can be obtained.

[0122]

According to the present invention, there is provided a step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on a workpiece by a plurality of laser outputs, and performing the laser processing. Detecting the processing state of the workpiece, and determining whether the laser processing has reached a desired processing state; and, when determining that the workpiece has reached the desired processing state, the laser output number set as described above. The laser processing is terminated even if it has not reached, otherwise, by providing a laser processing method having a step of performing laser processing up to the set laser output number, and a laser processing apparatus having processing means When the workpiece reaches a desired processing state, the processing is terminated even in a state where the number of laser processings does not reach the set number of laser outputs. Quality machining hole can be secured in high yield, and it is possible to shorten the machining cycle time.

[Brief description of the drawings]

FIG. 1 is a schematic view of a laser processing method according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing determination of whether a workpiece has reached a desired processing state.

FIG. 3 is a schematic view of a laser processing method according to a second embodiment of the present invention.

FIG. 4 is a schematic view of a laser processing apparatus showing a third embodiment of the present invention.

FIG. 5 is a schematic view of a laser processing apparatus according to a fourth embodiment of the present invention.

[Explanation of symbols]

1 Method of setting the number of laser outputs 2 Method of setting the energy of each laser output 3 Method of setting the number of times of laser processing to 0 4 Laser processing method 5 Method of detecting the processing state of the workpiece 6 Counting the number of laser processing 7 A method for determining whether the workpiece has reached the first desired processing state 8 A method for determining whether the number of laser processings has reached the set number of laser outputs 9 The processing for the second processing Method for determining whether state has been reached 10 Method for ending laser processing 11 Error processing method 12 Laser oscillator 13 Laser beam 14 Beam splitter 15 Condenser lens 16 Incident light detector 17 Thin film polarizer (TFP) 18 λ / 4 Wave plate 19 Substrate 20 Condensing lens 21 Insulating layer 22 Copper foil 23 Laser reflected light 24 Beam splitter 25 Condensing lens 26 Photodetector 27 Amplifier 28 Amplifier 29 Arithmetic processing unit 30 First completion reference value setting unit 31 Second completion reference value setting unit 32 Processing completion determination unit 33 Control device 41 First laser output number setting method 42 Second Laser output number setting method 43 Output energy setting method 44 Laser processing number initialization method 45 Laser processing method 46 Laser processing number update method 47 Second laser output number reaching determination method 48 Workpiece processing state detection method 49 Workpiece processing A method for determining whether the object has reached the first desired processing state 50 A method for determining whether the number of laser processings has reached the first laser output number 51 The processing state of the workpiece is changed to the second desired processing state Method of judging whether it has reached 52 Method of finishing laser processing 53 Error processing method 101 Laser output number setting means 102 Control means 103 Laser output means 10 Substrate 105 Insulating layer 106 Copper foil 107 Laser light 108 Optical system 109 Reflected laser light 110 Laser light detecting means 111 Amplifier 112 Processing state detecting means 113 Processing state determining means 114 First processing reference value setting means 115 Second processing reference value Setting means 116 error processing means 117 second laser output setting means

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[Procedure amendment]

[Submission date] June 3, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

[Title of the Invention] Laser processing method and processing apparatus and workpiece

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to laser processing, and more particularly, to a processing method and a processing apparatus suitable for forming a hole in a circuit board formed by laminating an insulating layer and a conductive layer.

[0002]

2. Description of the Related Art In general, there is a so-called multilayer circuit board formed by alternately laminating insulating layers and conductive layers on a circuit board. Such a multilayer circuit board has a high mounting density. And is becoming widely used.

[0003] Specifically, in a multilayer circuit board, a hole is formed in an insulating layer, and the hole is filled with a solder, a conductive paste, or the like, thereby obtaining conduction between adjacent conductive layers. As described above, as a processing technique for forming a hole in an insulating layer, a technique using laser light has been widely used.

The wavelength of the laser beam used is
For the insulating layer, a wavelength that is easily absorbed and a wavelength that is easily reflected for the conductive layer is used.For example, when the insulating layer is a glass epoxy resin and the conductive layer is a copper foil, a carbon dioxide gas laser beam is used. With the use, only the insulating layer can be selectively removed.

Here, it is needless to say that a hole must be formed so that conduction between adjacent conductive layers can be surely obtained. Such a conventional example is described in, for example, Japanese Patent Application Laid-Open No. 2-92482. According to this, when irradiating a processing object with laser light and drilling a hole, the direct transmitted light from the laser oscillator and the reflected light from the processing object are detected by separate sensors, and the amount of light of both is detected. The reflected light amount ratio is calculated, and the control of the laser light is performed by comparison with a reference value.

More specifically, the oscillator is stopped when the reflected light amount ratio becomes larger than a preset reference value. By performing such an operation, the conductive layer can be prevented from being damaged by the laser light, and at the same time, the processing time is shortened.

[0007]

However, the above-mentioned prior art has the following problems.

That is, when the workpiece is machined by increasing the number of laser outputs until the reflected light amount ratio becomes larger than a predetermined reference value, the shape of the machined hole is not always desired. The challenge is not to be shaped.

In view of the above, the present invention sets in advance the conditions and the number of outputs for each laser 1 that can reliably process a workpiece, and sets the laser to a reference value until the laser reaches the output number. An object of the present invention is to provide a laser processing apparatus that realizes high-yield drilling with high yield by controlling a laser oscillator and an optical system based on comparison with the above.

[0010]

According to the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
And set the number of laser outputs as the laser output condition .
A step that, performing a laser machining, laser
Counting the number of times of processing, detecting a processing state of the workpiece during execution of the laser processing, and determining whether the laser processing has reached a desired processing state; Exit laser processing even if it is determined to have reached the state has not reached the number of lasers output frequency of the laser processing is the setting, perform the laser machining up to the number of laser output was the set in other cases And a laser processing method having the steps of:

According to a second aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
And set the number of laser outputs as the laser output condition .
A step that, performing a laser machining, laser
Counting the number of times of the laser processing, detecting the processing state of the workpiece during the execution of the laser processing, and determining whether or not the laser processing has reached a desired processing state; desired when it is determined to have reached the machining state terminates the laser processing, even if not at the laser number output frequency of the laser processing is the setting, the laser until the laser output number and the set in other cases Performing the processing, and detecting the processing state of the workpiece when performing the laser processing up to the set number of laser outputs, and determining whether the laser processing has reached a second desired processing state. And a laser processing method having the same.

According to a third aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
And set the number of laser outputs as the laser output condition .
A step that, performing a laser machining, laser
Counting the number of times of processing, detecting a processing state of the workpiece during execution of the laser processing, and determining whether the laser processing has reached a desired processing state; Exit laser processing even if it is determined to have reached the state has not reached the number of lasers output frequency of the laser processing is the setting, perform the laser machining up to the number of laser output was the set in other cases Performing a laser processing method having a step of performing laser processing up to the set number of laser outputs, and performing an error process when it is determined that the workpiece does not reach a desired processing state. It is.

According to a fourth aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
And set the number of laser outputs as the laser output condition .
A step that, performing a laser machining, laser
Counting the number of times of the laser processing, detecting the processing state of the workpiece during the execution of the laser processing, and determining whether or not the laser processing has reached a desired processing state; desired when it is determined to have reached the machining state terminates the laser processing, even if not at the laser number output frequency of the laser processing is the setting, the laser until the laser output number and the set in other cases Performing the processing, and detecting the processing state of the workpiece when the laser processing is performed up to the set number of laser outputs, and determining whether the laser processing has reached a second desired processing state. And a laser processing method having a step of performing error processing when the second desired processing state is not reached.

According to a fifth aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
Setting at least a first laser output number as a laser output condition; setting a second laser output number smaller than the first laser output number; Performing the processing, counting the number of laser processing,
Detecting the processing state of the workpiece during execution of the laser processing from the second laser output number to the first laser output number, and determining whether a desired processing state has been reached by the laser processing; If it is determined that the laser processing has reached the desired processing state, the laser processing is terminated even if the number of laser processing has not reached the set first laser output number, otherwise the first processing is performed. A laser processing method having a step of performing laser processing up to the number of laser outputs is performed.

According to a sixth aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
Setting at least a first laser output number as a laser output condition; setting a second laser output number smaller than the first laser output number; Performing the processing, counting the number of laser processing,
Detecting the processing state of the workpiece during execution of the laser processing from the second laser output number to the first laser output number, and determining whether a desired processing state has been reached by the laser processing; If it is determined that the laser processing has reached the first desired processing state, the laser processing is terminated even if the number of laser processing does not reach the set first laser output number, otherwise, the laser processing is terminated. Performing the laser processing up to the first laser output number; detecting the processing state of the workpiece when performing the laser processing up to the first laser output number; and performing the second desired processing state by the laser processing. To perform a laser processing method having a step of determining whether or not the laser beam has arrived.

According to a seventh aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
Setting at least a first laser output number as a laser output condition; setting a second laser output number smaller than the first laser output number; Performing the processing, counting the number of laser processing,
Detecting the processing state of the workpiece during execution of the laser processing from the second laser output number to the first laser output number, and determining whether a desired processing state has been reached by the laser processing; If it is determined that the laser processing has reached the desired processing state, the laser processing is terminated even if the number of laser processing has not reached the set first laser output number, otherwise the first processing is performed. Performing laser processing up to the number of laser outputs, and performing error processing when determining that the workpiece has not reached a desired processing state when performing laser processing up to the first laser output number And a laser processing method having the following.

According to a eighth aspect of the present invention, there is provided a laser processing method for performing a hole processing on a workpiece by a plurality of laser outputs.
Setting at least a first laser output number as a laser output condition; setting a second laser output number smaller than the first laser output number; Performing the processing, counting the number of laser processing,
Detecting the processing state of the workpiece during execution of laser processing from the second laser output number to the first laser output number, and determining whether the laser processing has reached a first desired processing state; workpiece has finished laser processing even if it does not reach the first number laser output frequency of the laser processing is the setting when it is determined to have reached the first desired machining state, otherwise Executing the laser processing up to the first laser output number; detecting the processing state of the workpiece when performing the laser processing up to the first laser output number; A laser processing method having a step of judging whether the processing state has been reached and a step of performing error processing when the processing state has not reached the second desired processing state.

According to a ninth aspect of the present invention, the first laser output number is set to a value that can be reliably processed, and the second laser output number is set to a numerical value that can be sufficiently processed in relation to the workpiece and the laser output. The laser processing method according to any one of claims 5 to 8 is performed.

As set forth in claim 10, the first desired processing state is closer to the desired processing state than the second desired processing state. The laser processing method described in (1) is performed.

As a step of detecting the processing state of the workpiece and determining whether or not the laser processing has reached a desired processing state, the step of detecting the laser output intensity and the intensity of the reflected light from the workpiece is performed. A laser processing method according to any one of claims 1 to 10 using a ratio.

According to a twelfth aspect of the present invention, there is provided a laser processing method according to the eleventh aspect, wherein the reflected light intensity of the workpiece is corrected in accordance with a hole drilling position of the workpiece. Claim 1
The work according to any one of claims 1 to 12, wherein a workpiece is formed by laminating a material having a first reflectance and a material having a second reflectance different from the first reflectance. A laser processing method is performed.

According to a fourteenth aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece with a plurality of laser outputs, a setting means for setting the number of laser outputs as laser output conditions, and a number of times of laser processing. Counting means, a detecting means for detecting a processing state of the workpiece, a determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and a signal from the determining means. Control means for controlling the laser output means, and when it is determined that the workpiece has reached a desired processing state, the control means can control the laser even if the number of laser processing has not reached the set laser output number. Another object of the present invention is to provide a laser processing apparatus which terminates the processing, and otherwise executes the laser processing up to the set number of laser outputs.

According to a fifteenth aspect of the present invention, a laser output means for drilling a workpiece with a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, and the number of times of laser processing Counting means, a detecting means for detecting a processing state of the workpiece, a determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and a signal from the determining means. Control means for controlling the laser output means, and when it is determined that the workpiece has reached the first desired processing state, the control means determines that the number of laser processing has not reached the set number of laser outputs. In this case, the laser processing is terminated, otherwise, the laser processing is performed up to the set number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, Cross section is to provide a laser processing apparatus to determine whether reached the second desired machining state.

According to a sixteenth aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece with a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, and a number of times of laser processing. Counting means, a detecting means for detecting a processing state of the workpiece, a determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and a signal from the determining means. Control means for controlling the laser output means, and when it is determined that the workpiece has reached a desired processing state, the control means can control the laser even if the number of laser processing has not reached the set laser output number. Processing is completed, otherwise, laser processing is performed up to the set number of laser outputs, and when laser processing is performed up to the set number of laser outputs, the workpiece is When it is determined not to have reached the machining state of Nozomu there is provided a <br/> laser machining apparatus provided with error processing means for performing error processing.

According to a seventeenth aspect of the present invention, there is provided a laser output means for performing a hole processing on a workpiece by a plurality of laser outputs, a setting means for setting the number of laser outputs as a laser output condition, and a number of times of the laser processing. Counting means, a detecting means for detecting a processing state of the workpiece, a determining means for determining whether a desired processing state has been reached by a signal from the detecting means, and a signal from the determining means. Control means for controlling the laser output means, and when it is determined that the workpiece has reached the first desired processing state, the control means determines that the number of laser processing has not reached the set number of laser outputs. In this case, the laser processing is terminated, otherwise, the laser processing is performed up to the set number of laser outputs, and when the laser processing is performed up to the set number of laser outputs, Cross section detects a machining state of the workpiece, it is determined whether reached the second desired machining state by laser processing, error processing means for performing error processing if not reaching the second desired machining state The present invention provides a laser processing apparatus provided with the above.

A laser output means for drilling a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number, and means for counting the number of laser processings
If the detection means for detecting a machining state of the workpiece, reach the desired machining state by a signal from the detecting means during execution of laser machining from the second laser output speed to the first laser output number Determination means for determining whether or not the processing has been performed, and control means for controlling a laser output means by inputting a signal from the determination means, so that the workpiece is brought into a desired processing state during laser processing after the second laser output number. When it is determined that the laser processing has been reached, the control means terminates the laser processing even if the number of laser processing has not reached the first laser output number, otherwise the control means stops the laser processing up to the first laser output number. An object of the present invention is to provide a laser processing apparatus for performing processing.

[0027] As described in claim 19, a laser output means for drilling a workpiece with a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number, and means for counting the number of laser processings
If the detection means for detecting a machining state of the workpiece, reach the desired machining state by a signal from the detecting means during execution of laser machining from the second laser output speed to the first laser output number Determination means for determining whether or not the processing has been performed, and control means for controlling a laser output means by inputting a signal from the determination means, wherein the laser beam is processed by the first desired number during the laser processing after the second laser output number. It said control means when it is determined to have reached the machining state terminates the laser processing even if the number of laser machining has not reached the first number the laser output,
In other cases, the laser processing is performed up to the first laser output number, and when the laser processing is performed up to the first laser output number, the determination unit has reached a second desired processing state. It is intended to provide a laser processing device for determining.

According to a twentieth aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number, and means for counting the number of laser processings
If the detection means for detecting a machining state of the workpiece, reach the desired machining state by a signal from the detecting means during execution of laser machining from the second laser output speed to the first laser output number Determination means for determining whether or not the processing has been performed, and control means for controlling a laser output means by inputting a signal from the determination means, so that the workpiece is brought into a desired processing state during laser processing after the second laser output number. When it is determined that the laser processing has been reached, the control means terminates the laser processing even if the number of laser processing has not reached the first laser output number, otherwise the control means stops the laser processing up to the first laser output number. An error processing unit is provided for performing processing and performing error processing when it is determined that the workpiece has not reached a desired processing state when the laser processing is performed up to the first laser output number.
And a laser processing device.

According to a twenty-first aspect of the present invention, there is provided a laser output means for performing drilling on a workpiece by a plurality of laser outputs, a first laser output number and a first laser output number as laser output conditions. Setting means for setting a smaller second laser output number, and means for counting the number of laser processings
If the detection means for detecting a machining state of the workpiece, reach the desired machining state by a signal from the detecting means during execution of laser machining from the second laser output speed to the first laser output number Determination means for determining whether or not the processing has been performed, and control means for controlling a laser output means by inputting a signal from the determination means, wherein the laser beam is processed by the first desired number during the laser processing after the second laser output number. It said control means when it is determined to have reached the machining state terminates the laser processing even if the number of laser machining has not reached the first number the laser output,
Otherwise, the laser processing is performed up to the first laser output number, and when the laser processing is performed up to the first laser output number, the determination unit detects the processing state of the workpiece, and It is an object of the present invention to provide a laser processing apparatus provided with an error processing means for determining whether a second desired processing state has been reached by processing and performing error processing when the second desired processing state has not been reached.

According to a twenty-second aspect, the first laser output number is set to a value that can be reliably processed, and the second laser output number is set to a numerical value that can be sufficiently processed in relation to the workpiece and the laser output. A laser processing apparatus according to any one of claims 18 to 21 is provided.

According to a twenty-third aspect, the first desired processing state is closer to the desired processing state than the second desired processing state. Is provided.

According to a twenty-fourth aspect, the step of detecting the processing state of the workpiece and judging whether or not the laser beam has reached a desired processing state by laser processing includes the step of determining the laser output intensity and the intensity of the reflected light from the workpiece. 23. Use of ratios.
A laser processing device according to any one of the above.

According to a twenty-fifth aspect of the present invention, there is provided a laser processing apparatus according to the twenty-fourth aspect, wherein the reflected light intensity of the workpiece is corrected in accordance with a hole drilling position of the workpiece. 26. The processing method according to claim 14, wherein a workpiece in which a material having a first reflectance and a material having a second reflectance different from the first reflection are laminated is processed. Is provided.

As described in claim 27, claims 1 to 1
According to a third aspect of the present invention, there is provided a workpiece processed by the laser processing method according to any one of the first to third aspects or the laser processing apparatus according to any one of the first to fourth aspects.

[0035]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
By using the laser processing method, it is possible to accurately determine the processing state of the hole of the workpiece during processing and control the laser output to achieve high yield and high quality hole processing.
Laser processing can be realized.

Alternatively, the laser processing as described in claim 2
By adopting the method, it is possible to realize a laser processing apparatus that accurately determines a processing state of a hole in a workpiece during processing and controls a laser output, thereby achieving a high-yield high-quality hole processing. it can.

A laser processing method according to a third aspect of the present invention.
By taking the method, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output,
Laser processing that achieves high yield and high quality drilling can be realized.

A laser processing method as described in claim 4
By taking the method, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output,
Laser processing that achieves high yield and high quality drilling can be realized.

A laser processing method according to claim 5
By taking the method, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output,
Laser processing that achieves high yield and high quality drilling can be realized.

A laser processing method according to claim 6
By taking the method, by accurately determining the processing state of the hole of the workpiece during processing, by controlling the laser output,
Laser processing that achieves high yield and high quality drilling can be realized.

Further, a laser processing as described in claim 7
By taking the method to accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further, a laser processing as described in claim 8
By taking the method to accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Also, a laser processing as described in claim 9
By taking the method to accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further, a laser processing device as described in claim 10 is provided.
By taking engineering methods, and accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further, a laser processing device as described in claim 11 is provided.
By taking engineering methods, and accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further, a laser processing device as described in claim 12 is provided.
By taking engineering methods, and accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further, a laser processing device as described in claim 13 is provided.
By taking engineering methods, and accurately determine the working status of the bore of the workpiece during machining, by controlling the laser output, laser pressurized to achieve the high yield of high quality drilling
Work can be realized.

Further , according to the structure of the fourteenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

Further , according to the structure of the fifteenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

Further , according to the structure of the sixteenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

Further , according to the structure of the seventeenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the eighteenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the nineteenth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the twentieth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

Further , according to the structure of the twenty-first aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the twenty-second aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the twenty-third aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the twenty-fourth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

According to the structure of the twenty-fifth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

Further , according to the structure of the twenty-sixth aspect,
By accurately determining the processing state of the hole in the workpiece during the processing and controlling the laser output, it is possible to realize a laser processing apparatus that achieves high-yield hole processing with high yield.

(Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram of a laser processing method according to the present embodiment.

In FIG. 1, 1 is a method for setting the number of laser outputs, 2 is a method for setting the energy of each laser output, 3 is a method for setting the number of times of laser processing to 0, 4 is a laser processing method, and 5 is a laser processing method. Method for detecting machining state of workpiece, 6
Is a method for counting the number of laser processing, 7 is a method for determining whether the workpiece has reached a first desired processing state, and 8 is a method for determining whether the number of laser processing has reached a laser output set number. The method 9 is a method for determining whether the workpiece has reached the second processing state, the method 10 is for terminating the laser processing, and the error processing method 11 is.

First, the number of laser outputs and the energy at each laser output are set before laser processing. Here, the setting is made in advance so that the workpiece can be reliably formed into a high-quality hole having a hole shape. For example, three outputs of 10 mJ energy per laser output,
Or, the energy of the first two outputs is 10 mJ and
The energy of the third output may be changed for each output such as 5 mJ.

Next, a counter for counting the number of times of laser processing is set to 0. Then, laser processing is performed. Then, the processing state of the workpiece is detected during the laser processing. Next, a method for detecting the processing state of the workpiece will be described below.

FIG. 2 is a schematic diagram of a method for detecting a processing state of a workpiece. In FIG. 2, reference numeral 12 denotes a laser oscillator;
Is a laser beam, 14 is a beam splitter, 15 is a condenser lens, 16 is an incident light detector, 17 is a thin film film polarizer (TFP), 18 is a λ / 4 wavelength plate, 19 is a substrate which is a workpiece, and 20 is Condensing lens, 21 is an insulating layer of the substrate, 2
2 is a copper foil which is a conductive portion of the substrate, 23 is laser reflected light, 2
4 is a beam splitter, 25 is a condenser lens, 26 is a reflected light detector, 27 and 28 are amplifiers, 29 is an arithmetic processing unit,
Reference numerals 30 and 31 denote a completion reference value setting unit, 32 denotes a processing completion determination unit, and 33 denotes a control device.

The operation method of detection realized by the above configuration will be described in detail. The laser light 13 output from the laser oscillator 12 reaches the beam splitter 14, and most of the laser light 13 is reflected and used for processing, and some of the laser light passes through the beam splitter 14. The transmitted laser light is condensed by a condenser lens 15 and is incident on an incident light detector 16.
Is input to The laser beam reflected by the beam splitter 14 is deflected by the TFP 17. That is, for example, when the polarized light is in the vertical direction,
7 reflects the laser light 13 in the vertical direction. And λ /
The circularly polarized laser light 13 whose linearly polarized light is converted to circularly polarized light by the four plates 18 is condensed by the condensing lens 20, and the substrate is processed by the condensed laser light 13. During processing, the substrate 19
When the copper foil 22 of the substrate 1 is not exposed, the laser light is absorbed by the insulating layer 21 and the reflected light 23 is hardly reflected.
When the copper foil 22 of No. 9 is exposed, the laser light is reflected on the copper foil surface and returns to the optical path of the laser light to the TFP 17. The intensity of the reflected laser light increases as the exposed area of the copper foil 22 increases. When the laser light is reflected on the copper foil surface, the direction of the circularly polarized light of the laser light 13 is reversed. For this reason, the reflected laser light is converted into a linearly polarized light in the horizontal direction by the λ / 4 plate 18, the reflected laser light 23 is transmitted by the TFP 17, and the transmitted reflected laser light 23 is weakened in laser intensity by the beam splitter 24. . Then, the light is condensed by the condensing lens 25 and input to the reflected light detector 26. Here, the beam splitter 24 can be omitted depending on the intensity of the laser light passing through the TFP 17 and the intensity that can be input to the reflected light detector 26. When the laser light is input to the incident light detector 16 and the reflected light detector 26, a signal from each detector is transmitted to the amplifier 26,
The signal is sent to an arithmetic processing unit 29 which amplifies the signal. The arithmetic processing unit 29 generates a normalized signal by dividing the reflected light signal by the incident light signal from the incident light signal and the reflected light signal transmitted from the incident side. Here, the signal is corrected as needed for the reflected light intensity. When the amount of light reflected by the copper foil 22 of the substrate 19 does not return to the reflected light detector 26 by 100%, the correction means to be executed determines in advance the rate at which the reflected light 23 returns depending on the processing position of the substrate 19. Is prepared in a table, and the reflected light intensity is corrected for each coordinate to be processed. For example, when machining a hole at a certain coordinate, the percentage of reflected light from that coordinate also returns to 80%,
If the signal detected by the reflected light detector 26 is 8 V, the detected signal of the reflected light is corrected to 10 V from 8 / 0.8 by dividing 8 V by the return ratio of the reflected light.

The generated normalized signal is sent to the machining completion judgment unit 3
2 is sent. The completion criterion value setting unit 30 previously sets a criterion for determining whether or not the processing has been completed based on the normalized signal, and determines that the processing has been completed when the normalized signal exceeds this reference value. When the number of laser processings reaches the set number of laser outputs, a separate processing completion reference 31 is set, and if the normalized signal exceeds this set value, it is determined that the processing is completed.

Next, the workpiece reaches a desired processing state,
That is, when the exposed area of the copper foil 22 under the insulating layer reaches a desired area, the processing of the hole is completed even if the number of laser processings does not reach the set value of the number of laser outputs. If the workpiece has not reached the desired machining state, the above method is executed until the set number of laser outputs is reached.

When the number of times of laser processing reaches the number of laser outputs, it is determined again whether or not the workpiece has reached a desired processing state. The desired processing state in this case may be based on the previous period. However, due to various variations as shown in FIG. 3, even if the exposed area of the copper foil 22 is equal, the completion reference value has a width. If the number of times has not reached the set number of laser outputs, the completion of processing is determined based on a large completion reference value. If the set number of laser outputs has been reached, it is determined that the processing has been completed with a small completion reference value.
If it is determined that the machining is completed, the next hole is machined. If it is determined that the processing is not completed, error processing is performed. The error processing here interrupts the processing of the substrate being processed,
The processing of the next substrate or the hole coordinates of the unprocessed hole may be stored, and the unprocessed substrate may be removed or reprocessed in a later process.

As described above, according to the present embodiment, when the workpiece reaches a desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in this embodiment, the amplifiers 27, 2
8 was used to amplify the signal, but the incident light detector 16,
If the magnitude of the signal sent from the reflected light detector 26 is large enough for the arithmetic processing unit 29 to perform signal detection, the amplifiers 27 and 28 are not necessarily required.

In the present embodiment, the laser oscillator 1
Although 2 is a pulsed laser oscillator, a laser oscillator that emits laser light continuously may be used in some cases in relation to the workpiece.

Further, in this embodiment, the table on which the substrate is placed is fixed, but the same effect can be obtained by using a movable table such as an XY table. In the present embodiment, a galvano mirror is used as a scanning mirror, but a polygon mirror, an acousto-optic device,
Similar effects can be obtained by using an electro-optical element, a hologram scanner, or the like.

Further, in this embodiment, the same effect can be obtained by using an optical system in which a plurality of fθ lenses, a single lens, and a Fresnel lens are combined as the processing condensing lens.

The same applies to the case where the processing hole is processed by continuously outputting a laser beam to one hole, or the processing of processing a certain processing region to the hole by one laser output. The effect can be obtained.

(Embodiment 2) Hereinafter, Embodiment 2 of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a schematic view of a laser processing apparatus according to the present embodiment. In FIG. 3, 41 is a first laser output number setting method, 42 is a second laser output number setting method,
43 is an output energy setting method, 44 is an initialization method of the number of laser processings, 45 is a laser processing method, 46 is a method of updating the number of laser processings, 47 is a method of determining the second laser output number reaching, and 48 is processing of a workpiece. The state detection method 49 is a method for determining whether the workpiece has reached the first desired processing state.
0 is a method for determining whether the number of laser processing has reached the first laser output number, 51 is a method for determining whether the processing state of the workpiece has reached the second desired processing state, and 52 is a laser processing end method. , 53 are error handling methods.

With the above configuration, this operation will be described in more detail. First, a first laser output number is set. Here the laser output number, the reliably set the output number n ₁ of the substrate can be reliably processed as the workpiece. Next, the second laser output number n ₂ is set. Here, the number of laser outputs sets the number of laser outputs at which holes of the substrate, which is a workpiece, start to reach a desired processing state. Then, output energies for the first and second laser outputs are set. The setting method is
This is the same as in the first embodiment.

Next, a counter for counting the number of times of laser processing is set to zero. Then, laser processing is performed. The number of times of laser processing is updated each time laser processing is performed. The first half of the laser output, that is, the second laser output number n ₂
Until then, only laser processing is performed. Then, based on the second laser output number n ₂ , the processing state of the workpiece is detected during laser processing. The method of detecting the processing state is the same as in the first embodiment. If it is determined that the processing state of the workpiece is a desired processing state, that is, the exposed area of the copper foil under the insulating layer of the substrate has exceeded the desired area, the first laser output number n ₁ has been reached. If not, end the laser processing.

If the processing state of the workpiece has not reached the desired processing state, that is, if the area of the copper foil under the insulating layer of the substrate is smaller than the desired area, the number of laser processing times is equal to the first. Processing is continued until the laser output number n ↓ 1 is reached. When the number of times of laser processing reaches the first number of laser outputs, it is the same as the first embodiment below.

As described above, according to the present embodiment, when the workpiece reaches the desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed, thereby achieving high quality. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in the present embodiment, the signal is amplified using the amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector may vary depending on whether the arithmetic processing unit performs signal detection. An amplifier is not always needed if it is large enough.

In this embodiment, the laser oscillator is a pulse laser oscillator. However, a laser oscillator that emits laser light continuously may be used in some cases in relation to an object to be processed.

Further, in this embodiment, the table on which the substrates are placed is fixed, but the same effect can be obtained by using a movable table such as an XY table. In the present embodiment, a galvano mirror is used as a scanning mirror, but a polygon mirror, an acousto-optic device,
Similar effects can be obtained by using an electro-optical element, a hologram scanner, or the like.

Further, in the present embodiment, the same effect can be obtained even if the processing condensing lens is an optical system in which a plurality of fθ lenses, a single lens, and a Fresnel lens are combined.

[0086] Further, the processing hole may be formed by continuously processing one hole with a laser output or by processing one hole with one laser output for a hole. The effect can be obtained.

(Embodiment 3) Hereinafter, Embodiment 3 of the present invention will be described in detail with reference to the drawings.

FIG. 4 is a schematic diagram of a laser processing apparatus according to the present embodiment. 4, reference numeral 101 denotes a laser output number setting unit, 102 denotes a control unit, 103 denotes a laser output unit, 104 denotes a substrate as a workpiece, 105 denotes an insulating layer of the substrate, 106 denotes a copper foil of the substrate, and 107 denotes a laser output. Laser light output from the means, 108 is an optical system, 109 is reflected laser light, 110 is laser light detecting means, 111 is an amplifier,
112 is a processing state detecting means, 113 is a processing state determining means, 114 is a first processing reference value setting means, and 115 is a second processing reference value setting means.
The processing reference value setting means 116 has a configuration which is a configuration of the error processing means.

With the above configuration, this operation will be described in more detail. First, the number of laser outputs, which is a laser processing condition, is set in the first setting unit 101. The number of laser outputs set here is a condition for reliably processing the workpiece. Next, as for this processing condition, the energy of each output is transmitted to the control means 102. The control means outputs the laser beam 107 from the laser output means 103 based on the processing conditions of the setting means. The laser beam 107 is guided by the optical system 108 to the substrate 104, which is a workpiece,
The laser beam 107 is guided to the laser beam detector 110. The laser beam guided to the workpiece is applied to the insulating layer 105 of the substrate 104.
To process. When the copper foil 106 of the substrate 104 is not exposed, the laser beam 107 is absorbed by the insulating layer. As the processing proceeds, the copper foil 106 under the insulating layer is exposed, and at the same time, a part of the laser light applied to the substrate 104, that is, the laser light reaching the copper foil 106 is reflected to form a reflected laser light 109. The laser beam travels in the reverse direction, and the reflected laser beam 109 is separated by the separation optical system on the way, and guided to the laser beam detector 110. In the laser light detector 110,
Laser light, that is, incident laser light 107 and reflected laser light 1
09 is transmitted, and an incident light intensity signal and a reflected light intensity signal are transmitted to the amplifier 111, respectively. The amplifier 111 amplifies each signal and transmits each signal to the processing state detecting means 112. The processing state detection means 112 corrects the reflected light intensity signal as necessary, divides the signal by the incident light intensity signal, and generates a normalized signal.

Here, the correction means to be executed is the reflected light 1
If the amount of light reflected by the copper foil 106 of the substrate does not return to the laser beam detector 110 by 100%, the ratio of the return of the reflected light 109 according to the processing position of the substrate 104 is prepared in a table in advance, and the coordinates to be processed are set to 09. Correct the reflected light intensity for each time. For example, when machining a hole at a certain coordinate, the rate of return of the reflected light from that coordinate is 80%, and when the signal detected by the laser light detector is 8V, 8V is the rate of return of the reflected light. By dividing by 8 / 0.8, the detection signal of the reflected light is corrected to be 10V.

Then, the processing condition detecting means 112 transmits a normalized signal to the processing state determining means 113. The processing state determination means 113 compares the reference value set in the processing reference value setting means 114 with the normalized signal transmitted from the processing state detection means in advance to determine the processing state.

The processing reference value becomes larger as the copper foil area becomes larger from the relationship between the normalized value and the hole processed in the substrate, that is, the exposed copper foil area. From this, a normalized value corresponding to a desired hole is set. If the normalized value is exceeded, it is determined that the desired hole has been exceeded, and if it is less than the reference value, it is determined that the desired hole has not been reached. The above judgment is transmitted to the control means 102.

If the desired hole is reached, the control means 102 ends the processing even if the number of laser processing has not reached the set value of the setting means 101. Conversely, if the desired hole has not been reached, the laser processing is continued.

When the number of laser processings reaches the number of laser outputs set in the setting means, the processing state determining means 113
If the control signal 102 reaches the desired hole as a result of the determination signal, the control means 102 terminates the laser processing. on the other hand,
If the desired hole has not been reached, the control means 102 executes the error processing means 116.

The error processing means 116 discards the substrate that has not reached the desired processing state and performs the next processing. Alternatively, the coordinates of the machining holes that have not reached the desired machining may be stored, and the location may be machined separately or discarded in a later step.

When the number of laser processings reaches the number of laser outputs set in the setting means, the number of laser processings is lower than the processing reference setting means when the number of laser processings does not reach the number of laser outputs of the setting means. The processing state determination means 113 may make the determination using the second processing reference setting means 115. The setting value of the second processing reference value setting means 115 is such that the larger the copper foil area is, the larger the normalized value becomes from the relationship between the normalized value and the hole processed in the substrate, that is, the exposed copper foil area. , Even for the same copper foil area, there is a range in the normalized value.
Set this minimum value.

As described above, according to the present embodiment, when the workpiece reaches the desired machining state before the number of laser machining reaches the laser output number, the machining is completed, thereby achieving high quality. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in the present embodiment, the signal is amplified by using the amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector depends on whether the arithmetic processing unit detects the signal. An amplifier is not always needed if it is large enough.

The laser output means may be a pulsed laser oscillator, or a laser oscillator that emits laser light continuously in relation to the workpiece. Furthermore, in the present embodiment, the table on which the substrate is placed is fixed, but XY
Similar effects can be obtained by using a movable table such as a table.

The same effect can be obtained by using a galvanometer mirror as a scanning mirror, a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like in the optical system.

Further, the same effect can be obtained by using an optical system in which a plurality of Fθ lenses, a single lens, and a Fresnel lens are combined as the processing condenser lens. The same effect can be obtained by processing a hole by continuously outputting a laser beam to one hole or by processing a hole in a certain processing region by outputting one laser beam. It is obtained.

Embodiment 4 Hereinafter, Embodiment 4 of the present invention will be described in detail with reference to the drawings.

FIG. 5 is a schematic view of a laser processing apparatus according to the present embodiment. In FIG. 5, the difference from FIG.
This is a configuration in which 17 second setting means is added. With the above configuration, this operation will be described in more detail.

First, the number of laser outputs as laser processing conditions is set in the first setting means 101. The number of laser outputs set here is a condition for reliably processing the workpiece. Next, the number of laser outputs, which is a laser processing condition, is set in the second setting means 117. The number of laser outputs set here is set to the number of laser outputs at which the substrate is processed and a workpiece is processed in a desired state, that is, the exposed copper foil area under the insulating layer starts to reach a desired area.

The control means 102 first controls the laser output means 103 by the second setting means 117. At this time, the processing state detecting means 112 and the processing state determining means 113 stop operating. Then, the second setting means 117
The processing state detection means 112 and the processing state determination means 113 are operated from the final laser output number. Hereinafter, the first
The operation of laser processing up to the setting means 101 is the same as that of the third embodiment.

As described above, according to the present embodiment, when the workpiece reaches a desired machining state before the number of laser machining reaches the number of laser outputs, the machining is completed, thereby achieving high quality. A large processing hole can be secured at a high yield, and the processing tact time can be shortened.

Further, in the present embodiment, the signal is amplified using an amplifier. However, the magnitude of the signal sent from the incident light detector and the reflected light detector depends on the processing state detecting means 11.
If 2 is large enough to perform signal detection, an amplifier is not always required.

Further, as the laser output means, a pulse laser oscillator, a laser oscillator for continuously emitting laser light, or the like is used in relation to the object to be processed. Furthermore, in the present embodiment, the table on which the substrate is placed is fixed, but the same effect can be obtained by using a movable table such as an XY table.

The same effect can be obtained by using a galvanometer mirror as a scanning mirror, a polygon mirror, an acousto-optic device, an electro-optic device, a hologram scanner, or the like in the optical system.

Further, the same effect can be obtained by using an optical system in which a plurality of Fθ lenses, a single lens, and a Fresnel lens are combined as the processing condenser lens. The same effect can be obtained by processing a hole by continuously outputting a laser beam to one hole or by processing a hole in a certain processing region by outputting one laser beam. It is obtained.

[0111]

According to the present invention, there is provided a step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on a workpiece by a plurality of laser outputs, and performing the laser processing. Detecting the processing state of the workpiece, and determining whether the laser processing has reached a desired processing state; and, when determining that the workpiece has reached the desired processing state, the laser output number set as described above. The laser processing is terminated even if it has not reached, otherwise, by providing a laser processing method having a step of performing laser processing up to the set laser output number, and a laser processing apparatus having processing means When the workpiece reaches a desired processing state, the processing is terminated even in a state where the number of laser processings does not reach the set number of laser outputs. Quality machining hole can be secured in high yield, and it is possible to shorten the machining cycle time.

[Brief description of the drawings]

FIG. 1 is a schematic view of a laser processing method according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing determination of whether a workpiece has reached a desired processing state.

FIG. 3 is a schematic view of a laser processing method according to a second embodiment of the present invention.

FIG. 4 is a schematic view of a laser processing apparatus showing a third embodiment of the present invention.

FIG. 5 is a schematic view of a laser processing apparatus according to a fourth embodiment of the present invention.

[Description of Signs] 1 Method of setting the number of laser outputs 2 Method of setting energy of each laser output 3 Method of setting the number of times of laser processing to 0 4 Laser processing method 5 Method of detecting processing state of workpiece 6 Laser A method for counting the number of times of processing 7 A method for determining whether a workpiece has reached a first desired processing state 8 A method for determining whether the number of laser processing has reached a set number of laser outputs 9 A workpiece For determining whether the laser beam has reached the second processing state 10 Method for ending laser processing 11 Error processing method 12 Laser oscillator 13 Laser beam 14 Beam splitter 15 Condensing lens 16 Incident light detector 17 Thin film polarizer (TFP) ) 18 λ / 4 wavelength plate 19 substrate 20 condensing lens 21 insulating layer 22 copper foil 23 laser reflected light 24 beam splitter 25 condensing Lens 26 Reflected light detector 27 Amplifier 28 Amplifier 29 Arithmetic processing unit 30 First completion reference value setting unit 31 Second completion reference value setting unit 32 Processing completion determination unit 33 Control device 41 First laser output number setting method 42 Second laser output number setting method 43 Output energy setting method 44 Laser processing number initialization method 45 Laser processing method 46 Laser processing number updating method 47 Second laser output number reaching determination method 48 Workpiece processing state detection method 49 A method for determining whether a workpiece has reached a first desired processing state 50 A method for determining whether the number of laser processings has reached a first laser output number 51 A processing state for a workpiece is a second desired state Method for determining whether or not the processing state has been reached 52 Laser processing end method 53 Error processing method 101 Laser output number setting means 102 Control means 103 Ray Output means 104 Substrate 105 Insulating layer 106 Copper foil 107 Laser light 108 Optical system 109 Reflected laser light 110 Laser light detecting means 111 Amplifier 112 Processing state detecting means 113 Processing state determining means 114 First processing reference value setting means 115 Second Processing reference value setting means 116 Error processing means 117 Second laser output setting means

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Makoto Kato 3-10-1 Higashi-Mita, Tama-ku, Kawasaki-shi, Kanagawa Prefecture Matsushita Giken Co., Ltd.

Claims (27)

[Claims] A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on a workpiece by a plurality of laser outputs; and performing the laser processing while the laser processing is being performed. Detecting the processing state of the laser beam, and determining whether the desired processing state has been reached by laser processing. If it is determined that the workpiece has reached the desired processing state, the set number of laser outputs has not been reached. A laser processing method comprising the step of terminating the laser processing even in such a case, and otherwise performing the laser processing up to the set number of laser outputs. 2. A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing a hole processing on a workpiece by laser output a plurality of times; and performing the workpiece during the execution of the laser processing. Detecting the processing state of the laser beam and determining whether or not the laser processing has reached a desired processing state; and, when determining that the workpiece has reached the first desired processing state, the laser output number is set to Terminating the laser processing even if it has not reached, otherwise performing the laser processing up to the set number of laser outputs, and the work piece if performing the laser processing up to the set number of laser outputs A laser processing method comprising the steps of: detecting a processing state of the laser beam; and determining whether the laser processing has reached a second desired processing state. 3. A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole processing on the workpiece by laser output a plurality of times; and performing the laser processing during the execution of the laser processing. Detecting the processing state of the laser beam, and determining whether the desired processing state has been reached by laser processing. If it is determined that the workpiece has reached the desired processing state, the set number of laser outputs has not been reached. In this case, the laser processing is terminated, otherwise, the laser processing is performed up to the set number of laser outputs, and if the laser processing is performed up to the set number of laser outputs, A laser processing method including a step of performing an error process when it is determined that a processing state has not been reached. 4. A step of performing laser processing after setting the number of laser outputs as a laser output condition for performing hole drilling on the workpiece by a plurality of laser outputs, and performing the laser processing during the execution of the laser processing. Detecting the processing state of the laser beam and determining whether or not the laser processing has reached a desired processing state; and, when determining that the workpiece has reached the first desired processing state, the laser output number is set to Terminating the laser processing even if it has not reached, otherwise performing the laser processing up to the set number of laser outputs, and the work piece if performing the laser processing up to the set number of laser outputs Detecting the processing state of the laser beam and determining whether the laser processing has reached a second desired processing state; and performing error processing if the second desired processing state has not been reached. Laser processing method having the cormorants step. 5. A laser output condition for performing hole drilling on a workpiece by a plurality of laser outputs is at least a first laser output condition.
Setting a second laser output number smaller than the first laser output number; performing laser processing up to the second laser output number; and setting a second laser output number. Detecting the processing state of the workpiece during execution of the laser processing from the number of outputs to the first laser output number, and determining whether the laser processing has reached a desired processing state; When it is determined that the state has been reached, the laser processing is terminated even when the set first laser output number has not been reached, and otherwise, the first laser output number is set.
A laser processing method having a step of performing laser processing up to the number of laser outputs. 6. A laser output condition for drilling a workpiece by laser output a plurality of times is at least a first laser output condition.
Setting a second laser output number smaller than the first laser output number; performing laser processing up to the second laser output number; and setting a second laser output number. Detecting the processing state of the workpiece during the execution of the laser processing from the number of outputs to the first laser output number, and determining whether or not the laser processing has reached a desired processing state; If it is determined that the desired processing state has been reached, the laser processing is terminated even if the set first laser output number has not been reached, otherwise the laser processing is performed up to the first laser output number. And when performing laser processing up to the first laser output number, detecting the processing state of the workpiece and determining whether the laser processing has reached the second desired processing state. Laser processing method with a flop. 7. A laser output condition for performing drilling on a workpiece by laser output a plurality of times is at least a first output condition.
Setting a second laser output number smaller than the first laser output number; performing laser processing up to the second laser output number; and setting a second laser output number. Detecting the processing state of the workpiece during execution of the laser processing from the number of outputs to the first laser output number, and determining whether the laser processing has reached a desired processing state; When it is determined that the state has been reached, the laser processing is terminated even when the set first laser output number has not been reached, and otherwise, the first laser output number is set.
Performing laser processing up to the first laser output number, and performing error processing when determining that the workpiece has not reached the desired processing state when performing laser processing up to the first laser output number A laser processing method having steps. 8. A laser output condition for drilling a workpiece by laser output a plurality of times is at least a first laser output condition.
Setting a second laser output number smaller than the first laser output number; performing laser processing up to the second laser output number; and setting a second laser output number. Detecting the processing state of the workpiece during execution of laser processing from the number of outputs to the first laser output number, and determining whether the laser processing has reached a first desired processing state; When it is determined that the first desired processing state has been reached, the laser processing is terminated even if the set first laser output number has not been reached, and otherwise, the first laser output number has been reached. Performing the laser processing up to the first laser output number, and detecting the processing state of the workpiece when performing the laser processing up to the first laser output number, and determining whether the laser processing has reached the second desired processing state. Step a laser processing method comprising the steps of performing error processing if not reached the second desired machining state. 9. The relationship between the workpiece and the laser output, the first number of laser outputs is set to a value that can be reliably processed, and the second number of laser outputs is set to a value that can be sufficiently processed. 9. The laser processing method according to any one of items 8. 10. The method according to claim 2, wherein the first desired processing state is closer to the desired processing state than the second desired processing state.
The laser processing method according to any one of 4, 6, 8, and 9. 11. The step of detecting a processing state of a workpiece and determining whether a desired processing state has been reached by laser processing, using a ratio of a laser output intensity and a reflected light intensity from the workpiece. 11. The laser processing method according to any one of items 1 to 10. 12. The laser processing method according to claim 11, wherein the intensity of the reflected light from the workpiece is corrected according to a hole drilling position of the workpiece. 13. The laser according to claim 1, wherein a workpiece is formed by laminating a material having a first reflectance and a material having a second reflectance different from the first reflectance. Processing method. 14. A laser output means for performing hole machining on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, and detecting a processing state of the workpiece. Detecting means; determining means for determining whether a desired machining state has been reached based on a signal from the detecting means; and control means for inputting a signal from the determining means to control a laser output means, wherein the workpiece is When it is determined that the desired processing state has been reached, the control means terminates the laser processing even when the set laser output number has not been reached, and otherwise performs the laser processing up to the set laser output number. Laser processing equipment to perform. 15. A laser output means for performing hole drilling on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, and detecting a processing state of the workpiece. Detecting means; determining means for determining whether a desired machining state has been reached based on a signal from the detecting means; and control means for inputting a signal from the determining means to control a laser output means, wherein the workpiece is When it is determined that the first desired processing state has been reached, the control means terminates the laser processing even when the set laser output number has not been reached, otherwise, the control means ends up to the set laser output number. A laser processing apparatus that performs laser processing and determines whether the laser processing has reached a second desired processing state when the laser processing is performed up to the set number of laser outputs. 16. A laser output means for performing hole machining on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, and detecting a processing state of the workpiece. Detecting means; determining means for determining whether a desired machining state has been reached based on a signal from the detecting means; and control means for inputting a signal from the determining means to control a laser output means, wherein the workpiece is When it is determined that the desired processing state has been reached, the control means terminates the laser processing even when the set laser output number has not been reached, and otherwise performs the laser processing up to the set laser output number. A laser processing apparatus for performing an error process when it is determined that the workpiece has not reached a desired processing state when the laser processing is performed up to the set number of laser outputs. . 17. A laser output means for performing hole machining on a workpiece by a plurality of laser outputs, a setting means for setting a laser output number as a laser output condition, and detecting a machining state of the workpiece. Detecting means; determining means for determining whether a desired machining state has been reached based on a signal from the detecting means; and control means for inputting a signal from the determining means to control a laser output means, wherein the workpiece is When it is determined that the first desired processing state has been reached, the control means terminates the laser processing even when the set laser output number has not been reached, otherwise, the control means ends up to the set laser output number. When the laser processing is performed, and the laser processing is performed up to the set number of laser outputs, the determination unit detects a processing state of the workpiece, and performs the second desired processing state by the laser processing. A laser processing apparatus that determines whether the second processing state has been reached and performs error processing when the second desired processing state has not been reached. 18. A laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number as a laser output condition, and a second laser less than the first laser output number. Setting means for setting the number of outputs; detecting means for detecting a processing state of the workpiece; and a signal from the detecting means during execution of laser processing from a second laser output number to a first laser output number. Determining means for determining whether a desired processing state has been reached, and control means for controlling a laser output means by inputting a signal from the determining means. When it is determined that the object has reached the desired processing state, the control means terminates the laser processing even if the first laser output number has not been reached, and otherwise, the first laser output number Until Laser processing apparatus for performing the The processing. 19. A laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number and a second laser less than the first laser output number as laser output conditions. Setting means for setting the number of outputs; detecting means for detecting a processing state of the workpiece; and a signal from the detecting means during execution of laser processing from a second laser output number to a first laser output number. Determining means for determining whether a desired processing state has been reached, and control means for controlling a laser output means by inputting a signal from the determining means. When it is determined that the object has reached the first desired processing state, the control means terminates the laser processing even if the first laser output number has not been reached, otherwise the control means ends the first laser processing. Number of laser outputs In the laser processing device to perform a laser processing, the first of said determination means in the case of executing the laser processing to the laser output number to determine whether reached the second desired machining state. 20. A laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number and a second laser less than the first laser output number as laser output conditions. Setting means for setting the number of outputs; detecting means for detecting a processing state of the workpiece; and a signal from the detecting means during execution of laser processing from a second laser output number to a first laser output number. Determining means for determining whether a desired processing state has been reached, and control means for controlling a laser output means by inputting a signal from the determining means. When it is determined that the object has reached the desired processing state, the control means terminates the laser processing even if the first laser output number has not been reached, and otherwise, the first laser output number Until Perform The machining, laser machining apparatus for performing error processing when a workpiece in the case of executing the laser processing to said first laser output number is determined not to reach the desired machining state. 21. A laser output means for performing drilling on a workpiece by laser output a plurality of times, a first laser output number as a laser output condition, and a second laser smaller than the first laser output number. Setting means for setting the number of outputs; detecting means for detecting a processing state of the workpiece; and a signal from the detecting means during execution of laser processing from a second laser output number to a first laser output number. Determining means for determining whether a desired processing state has been reached, and control means for controlling a laser output means by inputting a signal from the determining means. When it is determined that the object has reached the first desired processing state, the control means terminates the laser processing even if the first laser output number has not been reached, otherwise the control means ends the first laser processing. Number of laser outputs When the laser processing is performed up to the first laser output number, the determination unit detects the processing state of the workpiece, and determines whether the laser processing has reached the second desired processing state. A laser processing apparatus that determines and performs error processing when the second desired processing state is not reached. 22. A relationship between the workpiece and the laser output,
The laser output number is set to a value that can be reliably processed.
22. The laser processing apparatus according to claim 18, wherein the number of laser outputs is set to a numerical value capable of sufficiently processing. 23. The first desired processing state is closer to the desired processing state than the second desired processing state.
22. The laser processing apparatus according to any one of 5, 17, 19, and 21. 24. The step of detecting a processing state of a workpiece and determining whether a desired processing state has been reached by laser processing, using a ratio of a laser output intensity and a reflected light intensity from the workpiece. 23. The laser processing apparatus according to any one of claims to 22. 25. The laser processing apparatus according to claim 24, wherein the intensity of the reflected light from the workpiece is corrected according to a hole drilling position in the workpiece. 26. The laser according to claim 14, wherein a workpiece is formed by laminating a material having a first reflectance and a material having a second reflectance different from the first reflectance. Processing equipment. 27. A workpiece processed by the laser processing method according to any one of claims 1 to 13 or the laser processing apparatus according to any one of claims 14 to 26.