CN110091080A - Laser control apparatus and laser processing - Google Patents
Laser control apparatus and laser processing Download PDFInfo
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- CN110091080A CN110091080A CN201811621013.5A CN201811621013A CN110091080A CN 110091080 A CN110091080 A CN 110091080A CN 201811621013 A CN201811621013 A CN 201811621013A CN 110091080 A CN110091080 A CN 110091080A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10007—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers
- H01S3/1001—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by controlling the optical pumping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser control apparatus, is also able to carry out the feedback control for making pulse energy maintain target value when carrying out cyclic process.Laser control apparatus is assembled in laser processing device, which repeats multiple circulations to multiple processed points as a circulation using the step of exporting pulse laser beam from laser oscillator and successively irradiate pulsatile once laser beam to multiple processed points of workpiece to laser machine.Laser control apparatus controls laser oscillator in the way of the target value (that is, energy target values) of the pulse energy of each circulation setting so that the measured value (that is, energometry value) of the pulse energy of pulse laser beam is maintained.
Description
This application claims the priority based on Japanese patent application filed on January 31st, 2018 the 2018-014916th.
The entire content of this Japanese application is incorporated by reference in this manual.
Technical field
The present invention relates to a kind of laser control apparatus and laser processings.
Background technique
It has been known that there is it is a kind of make laser beam be incident on the upper surface and bottom surface of resin layer configured with metal film substrate from
And the metal film and resin layer to upper surface carry out the laser processing technology (patent document 1) of drilling processing.In patent document 1
In disclosed laser processing, the relatively high part of luminous intensity is cut and right from the laser pulse that laser oscillator exports
The metal film of upper surface carries out drilling processing, and cut after starting decaying, the lower part of luminous intensity and to resin layer
Carry out drilling processing.In this way, what the drilling processing for being processed point to one processed next processed point after terminating
Processing is referred to as processing of bursting.
Relative to processing of bursting, referred to as cyclic process will be processed as follows: successively to multiple processed points of workpiece
The step of irradiating pulsatile once laser beam repeats multiple circulations to identical multiple processed points as a circulation.?
In cyclic process, the time interval being incident between multiple laser pulses that one is processed point is elongated, therefore exists following excellent
Point: it is difficult to the influence of accumulation of heat caused by the incidence by laser pulse.
It in cyclic process, drills in the 1st circulation to metal film, to tree in the 2nd circulation and subsequent circulation
Rouge layer drills.Global cycle number depends on the requirement specification of processing quality, thickness of resin layer etc..
Patent document 1: Japanese Unexamined Patent Publication 2017-47471 bulletin
In the processing carried out using pulse laser beam, selection is most suitable for the pulse energy of processing.Metal film is bored
Pulse energy when hole is greater than pulse energy when drilling to resin layer.In the case where carrying out cyclic process, the 1st circulation
Pulse energy be greater than the 2nd circulation after pulse energy.In general, adjusting pulse energy by changing pulse width.
When being laser machined, feedback control is carried out so that pulse energy maintains target value to laser oscillator.But
It is that, in the case where carrying out cyclic process, the target value of pulse energy is different in each cycle.Therefore, in the past, followed
Ring not can be carried out feedback control when processing.
Summary of the invention
The purpose of the present invention is to provide a kind of laser control apparatus, and being also able to carry out when carrying out cyclic process makes arteries and veins
Rush the feedback control that energy maintains target value.Another object of the present invention is to provide a kind of laser processings, can
It carries out carrying out cyclic process while the feedback control for making pulse energy maintain target value.
A kind of viewpoint according to the present invention, provides a kind of laser control apparatus, is assembled in laser processing device, described to swash
Optical machining device will export pulse laser beam from laser oscillator and successively irradiate one to multiple processed points of workpiece
The step of subpulse laser beam, repeats multiple circulations to multiple processed points and adds to carry out laser as a circulation
Work,
The laser control apparatus is so that the measured value (that is, energometry value) of the pulse energy of pulse laser beam maintains
The laser oscillator is controlled in the way of the target value (that is, energy target values) of the pulse energy of each circulation setting.
Another viewpoint according to the present invention, provides a kind of laser processing, will be added to the multiple of workpiece
The step of work point successively irradiates pulsatile once laser beam repeats multiple circulations as a circulation and to multiple processed points
To be laser machined, in the method,
So that the mode that pulse energy maintains the target value (that is, energy target values) of pulse energy swashs output pulse
When the laser oscillator of light beam carries out executing multiple circulations while feedback control, using not at least in two different circulations
Same value is as the energy target values.
Due to being set with the target value of pulse energy, the mesh of pulse energy in each cycle according to each circulation
In the case that scale value is different, it is also able to carry out feedback control.
Detailed description of the invention
Fig. 1 is the skeleton diagram for being assembled with the laser processing device of the laser control apparatus based on embodiment.
Fig. 2A and Fig. 2 B is the top view and cross-sectional view of workpiece respectively, and the left hand view of Fig. 2 C~Fig. 2 E is table respectively
Show the top view of the processing sequence of the 1st circulation in a subregion, the 2nd circulation and the processed point in the 3rd circulation, right part of flg point
It is not the cross-sectional view of the 1st circulation, the 2nd circulation and a 3rd processed point after circulation terminates.
Fig. 3 is the block diagram of the laser control apparatus based on the present embodiment.
Fig. 4 is the chart for indicating an example of oscillating condition parameter.
Fig. 5 is deviation (energy deviation) and the voltage instruction value indicated until from energy target values Er to energometry value Em
The chart of relationship between the increase and decrease amount of Vc.
Fig. 6 is the flow chart for the processing that laser control apparatus is carried out.
Fig. 7 is when indicating to be processed using the laser processing device for being equipped with the laser control apparatus based on embodiment
The ongoing change for vibrating command signal S0, recycling specified signal S3, energy target values Er, energometry value Em and feedback oscillator G
An example chart.
Fig. 8 is when indicating to be processed using the laser processing device for being equipped with the laser control apparatus based on variation
The ongoing change for vibrating command signal S0, recycling specified signal S3, energy target values Er, energometry value Em and feedback oscillator G
An example chart.
In figure: 10- laser oscillator, 11- optical system, 12- refracting telescope, 13- aperture, 15- branch optical system, 16A,
16B- optical beam scanner, 17A, 17B- lens, 18- workbench, 19- photodetector, 20,20A, 20B- workpiece, 21- points
Area, 22- are processed point, 23- resin layer, the metal film of the upper surface 24-, the metal film of the lower surface 25-, and 26- the 1st time circulation swashs
Light pulse, the laser pulse of 27- the 2nd time circulation, the laser pulse of 28- the 3rd time circulation, the hole 29-, 30- laser control apparatus,
31- driving signal transmission unit, 32- feedback control section, 33- parameter setting portion, 34- recycle specify information configuration part, 35- pulse energy
Measure calculation part, 40- host control device.
Specific embodiment
In the following, with reference to FIG. 1 to FIG. 7, to based on embodiment laser control apparatus and laser processing be illustrated.
Fig. 1 is the skeleton diagram for being assembled with the laser processing device of the laser control apparatus based on embodiment.Laser oscillator
10 are excited the control of light control device 30 and export pulse laser beam.As laser oscillator 10, output pulse can be used and swash
The gas laser oscillators such as carbon dioxide laser oscillator can be used for example in the laser oscillator of light beam.Laser oscillator 10
Including laser gas medium, excitation discharge electrode, to power supply of discharge electrode supply high frequency electric power etc..
After the pulse laser beam exported from laser oscillator 10 is by the optical system 11 including including optical beam expander etc.
It is refracted the reflection of mirror 12, and branch's optical system 15 is incident on by aperture 13.Branch's optical system 15 swashs incident
Light beam branches into two paths.As branch's optical system 15, semi-transparent semi-reflecting lens, polarization beam splitter, acousto-optic can be used
Element (AOM) etc..
It is branched 15 branch of optical system and along the pulse laser beam of one of propagated via optical beam scanner 16A
And lens 17A is incident in workpiece 20A.Pulse laser beam along another propagated is then via optical beam scanner 16B
And lens 17B and be incident in workpiece 20B.Optical beam scanner 16A, 16B have for example including a pair of of jar (unit of capacitance) watt promise mirror
There is the function along two-dimensional directional scanning pulse laser beam.Lens 17A, 17B make pulse laser beam be concentrated on workpiece respectively
The surface of 20A, 20B.Alternatively, it is also possible to use the structure on the surface for making aperture 13 image in workpiece 20A, 20B.
Workpiece 20A, 20B are, for example, printed circuit board, are held in the retaining surface of workbench 18.By making arteries and veins
Laser beam is incident in printed circuit board to carry out drilling processing.The retaining surface of workbench 18 is for example set as horizontal.Workbench
18 can make workpiece 20A, 20B along the horizontal plane in both direction it is mobile.As workbench 18, XY can be used for example
Workbench.
The a part for being incident on the pulse laser beam of refracting telescope 12 is incident in photodetector 19 through refracting telescope 12.Light inspection
Survey the output of device 19 electric signal corresponding with the incident luminous intensity of pulse laser beam (detection signal S1).As photodetector 19
The infrared sensor that the response speed with the variation that can track laser pulse shape can be used, can be used for example
MCT sensor etc..Detection signal S1 is input to laser control apparatus 30.
Host control device 40 controls optical beam scanner 16A, 16B and workbench 18.Moreover, host control device 40 to swash
Light control device 30 sends the oscillation command signal S0 for starting to export and stop output of instruction laser pulse.If laser controlling fills
The 30 output sign ons for receiving laser pulse from host control device 40 are set, then start the excitation of laser oscillator 10, if
Output halt instruction is received, then stops the excitation of laser oscillator 10.
Fig. 2A is the top view of workpiece 20.The surface of workpiece 20 is divided into multiple subregions 21, each
A delimitation of subregion 21 has multiple processed points 22.Each subregion 21 is less than optical beam scanner 16A, 16B being capable of scanning pulse laser
The range of beam.It is therefore not necessary to using the mobile workpiece 20 of workbench 18, by driving optical beam scanner 16A, 16B
To being processed in a subregion 21.
Fig. 2 B is the cross-sectional view of workpiece 20.It is pasted with metal film respectively in the upper surface and the lower surface of resin layer 23
24 and metal film 25.Metal film 24,25 is for example using copper foil.In the present embodiment, pass through being processed to workpiece 20
22 (Fig. 2A) irradiated with pulse laser beams of point, drill to the metal film 24 and resin layer 23 of upper surface so that lower surface
Metal film 25 is exposed to the processing of the bottom in hole.
Cyclic process is used in the present embodiment.Pulse laser beam is exported from laser oscillator 10 (Fig. 1) and to one point
The step of all processed points 22 (Fig. 2A) in area 21 successively irradiate pulsatile once laser beam is set as a circulation.By to more
A processed point 22 repeats multiple circulations, to all processed points 22 in a subregion 21 irradiate multiple laser pulses with
Carry out drilling processing.In each circulation, multiple processed points 22 of irradiated with pulse laser beam are identical.That is, in the 2nd circulation
And subsequent in each circulation the incident multiple processed points 22 of pulse laser beam with the 1st circulation in pulse laser beam entered
The multiple processed points 22 penetrated are identical.In addition, being not necessarily to the sequence of the processed point 22 of pulse laser beam incidence in each circulation
Between must be identical.
Then, with reference to Fig. 2 C~Fig. 2 E, the step of drilling processing of workpiece 20, is illustrated.The left side of Fig. 2 C
Figure is the top view of the processing sequence of the processed point 22 in the 1st circulation indicated in a subregion 21, and right part of flg is the 1st circulation
After one be processed point 22 cross-sectional view.Fig. 2 D and Fig. 2 E are the identical vertical view in the 2nd circulation and the 3rd circulation respectively
Figure and cross-sectional view.
As shown in the left hand view of Fig. 2 C~Fig. 2 E, delimiting on the surface of subregion 21 has multiple processed points 22.1st follows
The processing sequence of ring, the 2nd circulation and multiple processed points 22 in the 3rd circulation is all the same.
As shown in the right part of flg of Fig. 2 C, in the 1st circulation, point 22 is processed to shape by being incident in laser pulse 26
Pore-forming 29.Indicate that the width of the figure of laser pulse 26 corresponds to beam sizes, area corresponds to pulse energy.In the 1st circulation
The hole 29 of middle formation through upper surface metal film 24 and to the midway on the thickness direction for reaching resin layer 23, but do not reach down
The metal film 25 on surface.
As shown in the right part of flg of Fig. 2 D, in the 2nd circulation, laser pulse 27, which is incident in, is processed point 22 to make hole 29 become
It is deep.As shown in the right part of flg of Fig. 2 E, in the 3rd circulation, laser pulse 28, which is incident in, is processed point 22 to make under the arrival of hole 29
The metal film 25 on surface.It carries out terminating laser processing after recycling three times.The laser that the laser pulse 27 and the 3rd of 2nd circulation recycles
Pulse energy of the pulse energy of pulse 28 less than the laser pulse 26 of the 1st circulation.
Fig. 3 is the block diagram of the laser control apparatus 30 based on the present embodiment.Laser control apparatus 30 is sent out including driving signal
Send portion 31, feedback control section 32, parameter setting portion 33, circulation specify information configuration part 34 and pulse energy calculation part 35.These
The function in each portion can for example be realized by making computer for executing application programs.
Driving signal transmission unit 31 is since the reception instruction oscillation of host control device 40 and the oscillation of stopping instructs letter
Number S0, and driving signal S2 is sent to laser oscillator 10 according to oscillation command signal S0.For example, oscillation command signal S0's is upper
It rises and decline respectively indicates starting of oscillation and vibrates the instruction stopped.If driving signal transmission unit 31 receives the finger of starting of oscillation
It enables, then starts to send driving signal S2 to laser oscillator 10, if receiving the instruction that oscillation stops, stopping to laser generation
Device 10 sends driving signal S2.Laser oscillator 10 is during receiving driving signal S2 from driving signal transmission unit 31 to electric discharge
The discharge voltage of electrode application high frequency.By applying discharge voltage to discharge electrode, from 10 output laser pulse of laser oscillator.
Parameter setting portion 33 receives oscillating condition setting parameter signal S4 from host control device 40, and stores oscillation item
Part parameter.
Fig. 4 is the chart for indicating an example of oscillating condition parameter.At the beginning of oscillating condition parameter includes energy target values Er, voltage
Initial value Vo and feedback oscillator G.These oscillating condition parameters are set according to each circulation.For example, indicating specified with numbering cycle n
The information of n-th circulation.Oscillating condition parameter uses in the feedback control performed by feedback control section 32.
Circulation specify information configuration part 34 shown in Fig. 3 obtains the specified 1st from host control device 40 and is recycled to the 3rd circulation
In the circulation of a circulation specify signal S3, and store by recycling the specified circulation specify information Cy (example of specified signal S3
Such as, numbering cycle).Host control device 40 sends following for specified current circulation in execution to circulation specify information configuration part 34
Fourth finger determines signal S3.
Pulse energy calculation part 35 receives detection signal S1 from photodetector 19, and calculates arteries and veins according to detection signal S1
Rush energy.For example, being integrated by the impulse waveform to detection signal S1 to calculate pulse energy.Moreover, swashing multiple
The calculated value of the pulse energy of light pulse is averaged so as to find out energometry value Em.
Feedback control section 32 carries out feedback control to laser oscillator 10, so that the energy that pulse energy calculation part 35 is found out
Measured value Em maintains the energy target values Er being stored in parameter setting portion 33.For example, according to from energy target values Er to energy
Deviation and feedback oscillator G until measurement definite value Em make the voltage instruction value Vc increase and decrease for being applied to laser oscillator 10.Laser vibration
It swings device 10 and applies the voltage indicated by voltage instruction value Vc to discharge electrode to carry out pulsed laser action.
When carrying out the feedback control, feedback control section 32 uses the energy target values for corresponding to current circulation in execution
Er and feedback oscillator G.Current circulation in execution can be according to the specified letter of the circulation for being stored in circulation specify information configuration part 34
Cy is ceased to determine.
Then, with reference to Fig. 5, the feedback control carried out to feedback control section 32 is illustrated.
Fig. 5 is deviation (energy deviation) and the voltage instruction value indicated until from energy target values Er to energometry value Em
The chart of relationship between the increase and decrease amount of Vc.Relationship between energy deviation and the increase and decrease amount of voltage instruction value Vc is according to each anti-
Feedforward gain G and be defined.Regardless of feedback oscillator G, if deviation is 0, the increasing of voltage instruction value Vc is reduced to 0.In energy
When measured value Em is energy target values Er or more (energy deviation is timing), voltage instruction value Vc with becoming larger for energy deviation and
It is lower.When energometry value Em is energy target values Er or less (when energy deviation is negative), voltage instruction value Vc is with deviation
Becoming larger for absolute value and get higher.Feedback oscillator G refers to: ratio of the increase and decrease amount of voltage instruction value Vc relative to energy deviation
(slope of the chart of Fig. 5).Feedback oscillator G becomes bigger, and the slope of chart becomes bigger towards negative direction.
Relationship between the energy deviation according to shown in Fig. 5 of feedback control section 32 and the increase and decrease amount of voltage instruction value Vc come
Determine the increase and decrease amount of voltage instruction value Vc.The feedback control of voltage instruction value Vc is for example carried out to a subregion 21 (Fig. 2A)
It is executed during processing every predetermined irradiation number (for example, being irradiated every 1000 times).
Fig. 6 is the flow chart of the laser processing carried out using the laser processing device equipped with laser control apparatus 30.It is first
First, laser control apparatus 30 receives oscillating condition setting parameter signal S4 (Fig. 3) from host control device 40, and stores oscillation item
Part parameter (Fig. 4) (step ST0).Moreover, laser control apparatus 30 is received from host control device 40 recycles specified signal S3.Most
Just, specified signal S3 designated cycle number 1 is recycled, numbering cycle is initialized (step ST1).
The feedback control section 32 of laser control apparatus 30 obtains circulation specify information Cy from circulation specify information configuration part 34.
Moreover, obtaining energy target values Er and feedback oscillator the G (figure of circulation specified by circulation specify information Cy from parameter setting portion 33
4) (step ST2).
Laser control apparatus 30 is according to the same circulation laser energy in execution of the subregion 21 (Fig. 2A) just processed
The measurement result of amount updates feedback oscillator G (step ST3).If next subregion 21 that start processing is initial subregion,
Then use the value obtained from parameter setting portion 33 as feedback oscillator G.For example, if the same of subregion 21 just processed follows
Energometry value Em in ring is excessive relative to energy target values, then is preferably directed towards the direction update feedback for reducing feedback oscillator G
Gain G.In this way, it is preferred that increasing and decreasing feedback oscillator G according to the difference of energometry value Em and energy target values.
Maintain the mode of energy target values Er to enable definite value Em is measured, periodically (every defined irradiation number) more
The processing (step ST4) of a circulation is executed while new voltage instruction value Vc.The initial value of voltage instruction value Vc uses storage
Initial Voltage Value Vo (Fig. 4) in parameter setting portion 33.
Until the process finishing to a subregion 21 (Fig. 2A), updates numbering cycle (step ST6) and repeated afterwards from step
Processing (step ST5) until rapid ST2 to step ST4.Whether the processing of one subregion terminates to be carried out by host control device 40
Judgement.The update of numbering cycle is sent out by host control device 40 to the circulation specify information configuration part 34 of laser control apparatus 30
The specified signal S3 of circulation is sent to carry out.
If the process finishing of a subregion 21, determine whether the processing of all subregions 21 terminates (step ST7).The judgement
It is executed by host control device 40.In the case where unprocessed subregion 21 remains, host control device 40 makes next to add
In the range of the subregion 21 of work is moved to laser and can scan (step ST8), and numbering cycle is made to initialize (step ST9).It
Afterwards, the processing until from step ST2 to step ST5 is repeated.If the processing of all subregions 21 terminates, terminate to processing object
The laser processing of object 20 is handled.
Fig. 7 is to indicate oscillation command signal S0, recycle specified signal S3, energy target values Er, energometry value Em and anti-
The chart of an example of the ongoing change of feedforward gain G.During moment t0 to moment t5, a subregion 21 (Fig. 2A) is added
Work processes next subregion 21 during moment t6 to moment t11.During moment t0 to moment t1 in time
During carving t6 to moment t7, the processing of the 1st circulation is carried out, during moment t2 to moment t3 and moment t8 is to moment t9's
Period carries out the processing of the 2nd circulation, during moment t4 to t5 and during moment t10 to moment t11, carries out the 3rd circulation
Processing.
During carrying out the processing of the 1st circulation, the specified 1st is sent from host control device 40 to laser control apparatus 30
The circulation of circulation specifies signal S3.During carrying out the processing of the 2nd circulation, from host control device 40 to laser control apparatus
30 circulations for sending specified 2nd circulation specify signal S3.During carrying out the processing of the 3rd circulation, from host control device 40
The circulation for sending specified 3rd circulation to laser control apparatus 30 specifies signal S3.
During the processing of the 1st circulation, energy target values Er and feedback oscillator G are respectively set as the 1st energy recycled
Target value Er (1) and feedback oscillator G (1).During the processing of the 2nd circulation, energy target values Er and feedback oscillator G are set respectively
It is set to the energy target values Er (2) and feedback oscillator G (2) of the 2nd circulation.During the processing of the 3rd circulation, energy target values Er
And feedback oscillator G is respectively set as the energy target values Er (3) and feedback oscillator G (3) of the 3rd circulation.
In each circulation, according to the deviation between energometry value Em and energy target values Er, it is updated periodically electricity
(the step ST4 of Fig. 6) is processed while pressing instruction value Vc.
In the processing of the 1st circulation for carrying out moment t6 to moment t7, the same of subregion 21 just processed is followed
(moment t0 to moment t1) feeds back to feedback oscillator G to energometry value Em in ring.Similarly, moment t8 to moment t9 is being carried out
The 2nd circulation and moment t10 to moment t11 the 3rd circulation processing when, respectively by the energometry value of moment t2 to moment t3
The energometry value Em of Em and moment t4 to moment t5 feeds back to feedback oscillator G.For example, according to the variation of energometry value Em
Size increases and decreases feedback oscillator G.
Then, it is equipped on laser processing device to by laser control apparatus 30 (Fig. 1 and Fig. 3) based on the above embodiment
The excellent effect that can be obtained is illustrated.
In the above-described embodiments, different energy target values Er (Fig. 4) can be set according to each circulation.Moreover, passing through
Specified signal S3 is recycled, notifies that current processing in execution is which is followed from host control device 40 to laser control apparatus 30
Ring.Therefore, even if laser control apparatus 30, which is also able to carry out, to be made in the case where target impulse energy is different in each cycle
Energometry value Em maintains the feedback control of energy target values Er.
In particular, in the gas lasers such as carbon dioxide laser, the indoor gas temperature of chamber if changing pulse width
Etc. can change, therefore output stable in order to obtain, preferably change discharge voltage or feedback oscillator according to pulse width
G.In the above-described embodiments, Initial Voltage Value Vo and feedback oscillator G (Fig. 4) is set for each circulation, therefore can obtained
Stable output.
When executing a certain circulation to a subregion, the same circulation based on the subregion 21 just processed (is not
The circulation just carried out) in energometry value Em feed back the feedback oscillator G of the next circulation to be processed.For example, in Fig. 7 institute
In the example shown, for the processing of the circulation of moment t6 to moment t7, the measurement result in third time circulation forward is fed back.Such as
This is able to carry out appropriate feedback control by feeding back the measurement result in same circulation.
Then, the various modifications example of above-described embodiment is illustrated.
In the above-described embodiments, it performs when being processed to a subregion 21 (Fig. 2A) and recycles three times, but it is also possible to
Execute the circulation of other numbers.For example, it is also possible to run through the metal film 24 (Fig. 2 B) of upper surface using the 1st circulation, and to tree
One cycle or circulation more than three times are executed when rouge layer 23 (Fig. 2 B) is processed.In the 2nd circulation and subsequent multiple circulations
In, energy target values Er can be set as identical, also can be set to difference.For example, in order to reduce the metal film 25 to lower surface
The energy target values Er of the circulation executed later is preferably set as being less than the energy mesh of the circulation previously executed by the damage of (Fig. 2 B)
Scale value Er.
Moreover, in the above-described embodiments, the oscillating condition parameter of each circulation is stored in laser control apparatus 30, therefore nothing
Oscillating condition parameter need to be notified from host control device 40 to laser control apparatus 30 in each switching circulation.As long as switching
Numbering cycle is notified when circulation from host control device 40 to laser control apparatus 30.Therefore, it can be realized cutting for circulation
Change the high speed of processing.
In addition, if the time needed for transferring various information between host control device 40 and laser control apparatus 30 it is enough
It is short, then oscillating condition parameter can also be sent from host control device 40 to laser control apparatus 30 in each switching circulation.
In the above-described embodiments, drilling processing has been carried out to printed circuit board, still, in addition to this, based on embodiment
Laser control apparatus 30 (Fig. 1) can be applied to the laser processing device that cyclic process is carried out using pulse laser beam.
Then, with reference to Fig. 8, another variation is illustrated.
Fig. 8 is to indicate to be processed using the laser processing device for the laser control apparatus 30 being equipped with based on this variation
When oscillation command signal S0, recycle specified signal S3, energy target values Er, energometry value Em and feedback oscillator G through when
The chart of an example of variation.
In the embodiment shown in fig. 7, by the measurement knot in the same circulation for the subregion 21 (Fig. 2A) just processed
Fruit feedback has arrived feedback oscillator G.In contrast, in the processing of the 1st circulation, will just be carried out in variation shown in Fig. 8
Measurement result in 1st circulation of the subregion 21 (Fig. 2A) of processing feeds back to feedback oscillator G.In the 2nd circulation and subsequent circulation
In, when feeding back to feedback oscillator G, use condition identical with the feedback condition of the 1st circulation.
The variation of correlativity between the increase and decrease amount of voltage instruction value Vc and the increase and decrease amount of energometry value Em is any
Identical tendency is shown in circulation.Therefore, in variation shown in Fig. 8, also it is able to carry out effective feedback control.
Above-mentioned each embodiment is only example, and naturally, the structure shown in various embodiments can carry out portion
Divide replacement or is applied in combination.About multiple embodiments based on mutually isostructural identical function and effect, not in each embodiment
In be illustrated one by one.Moreover, the present invention is not limited to above-described embodiments.For example, various modifications may be made, improvement by the present invention
And combination etc., this is apparent to those skilled in the art.
Claims (6)
1. a kind of laser control apparatus, is assembled in laser processing device, the laser processing device will be defeated from laser oscillator
Out pulse laser beam and the step of successively irradiate pulsatile once laser beam to multiple processed points of workpiece as one
It recycles and recycles to laser machine to multiple processed point repetitions are multiple,
The laser control apparatus is characterized in that,
So that the measured value of the pulse energy of pulse laser beam can measure definite value and maintain the pulse set according to each circulation
Target value, that is, energy target values mode of energy controls the laser oscillator.
2. laser control apparatus according to claim 1, which is characterized in that
The laser oscillator has the discharge electrode for motivating laser medium, also, the energometry value is maintained
It include changing the control for the discharge voltage for being applied to the discharge electrode in the control of the energy target values.
3. laser control apparatus according to claim 2, which is characterized in that
The control for changing the discharge voltage includes according to the deviation until from the energy target values to the energometry value
And make the instruction value i.e. control of voltage instruction value increase and decrease for the discharge voltage for being applied to the laser oscillator, also, press
According to it is each recycle set the increase and decrease amount of the voltage instruction value relative to from the energy target values to the energometry value as
Ratio, that is, feedback oscillator of deviation only.
4. laser control apparatus according to claim 3, which is characterized in that
The surface of the workpiece is divided into multiple subregions, and delimiting on each subregion has multiple processed points,
The laser processing device repeats multiple circulations to each subregion and laser machines,
Also, according to the energometry value in the same circulation for the subregion just processed, update the feedback oscillator.
5. laser control apparatus according to claim 1 or 2, which is characterized in that
The laser control apparatus is stored with the energy target values according further to each circulation,
If receiving the signal recycled specified in multiple circulations from the host control device of the laser processing device,
The laser oscillator is controlled using the energy target values for corresponding to specified circulation.
6. a kind of laser processing will successively irradiate pulsatile once laser beam to multiple processed points of workpiece
Step repeats multiple circulations to laser machine, the spy of the method as a circulation and to multiple processed points
Sign is,
In a manner of making pulse energy maintain the target value i.e. energy target values of pulse energy to output pulse laser beam
When laser oscillator carries out executing multiple circulations while feedback control, different values is used at least in two different circulations
As the energy target values.
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| JP2018014916A JP7043128B2 (en) | 2018-01-31 | 2018-01-31 | Laser control device and laser processing method |
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| JP2022063595A (en) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | Control device of laser processing machine, laser processing machine, and laser processing method |
| JP2022105463A (en) * | 2021-01-02 | 2022-07-14 | 大船企業日本株式会社 | Laser processing method for printed circuit board and laser processing machine for printed circuit board |
| JP2022164579A (en) | 2021-04-16 | 2022-10-27 | 信越化学工業株式会社 | Bio-electrode composition, bio-electrode and manufacturing method of bio-electrode |
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| TWI691374B (en) | 2020-04-21 |
| JP2019130564A (en) | 2019-08-08 |
| TW201934236A (en) | 2019-09-01 |
| KR20190093118A (en) | 2019-08-08 |
| KR102518883B1 (en) | 2023-04-05 |
| JP7043128B2 (en) | 2022-03-29 |
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