KR20170121944A - Laser processing apparatus and the method for laser processing by using it - Google Patents

Abstract

The present invention relates to a laser processing apparatus and a laser processing method. According to the present invention, the apparatus comprises: a laser generation unit to oscillate a plurality of laser beams; a laser processing unit disposed on a progress path of the laser beam and processing the laser beam; and a laser observation unit connected to either or both of the laser generation and processing units on the progress path. An oscillation state of the laser beam is determined by comparing detected data acquired by detecting the laser beam with set laser oscillation condition data, thus being able to easily check and control an oscillation state of a plurality of laser sources. Moreover, oscillation of each of the laser sources is easily controlled, thereby being able to easily mix and use an oscillation mode of the laser beam in accordance with a processing region of an object to be processed. As such, a solution of oscillation configuration of laser is able to be promptly checked and corrected, and an oscillation method of the laser sources is able to be modified as necessary, thereby being able to provide an effect of increasing productivity of a laser processing process.

Description

TECHNICAL FIELD The present invention relates to a laser processing apparatus and a laser processing method,

The present invention relates to a laser processing apparatus and a laser processing method using the same, and more particularly, to a laser processing apparatus capable of easily controlling a plurality of laser sources and a laser processing method using the same.

As a next-generation display, a flexible display capable of being manufactured in various shapes that are thin and light as well as being strong against impact and bending or bending can be widely studied. Some of them are currently being realized and many developments are required.

In the case of a silicon transistor using a glass substrate or a sapphire substrate as a base substrate of such a flexible display, there is a problem that it is difficult to apply to a flexible display due to low flexibility characteristics and limitation of a base substrate. Therefore, as a method of manufacturing a flexible semiconductor device, a method of using a thin glass plate as a substrate, a method of using a metal plate as a substrate, and a method of using a plastic substrate are being studied.

An example for implementing a flexible display will be described. A TFT circuit and an OLED, which is a light emitting device, have to be formed on a film in a specific structure. Since the film is not easy to handle, a film is adhered to a carrier glass The TFT forming process proceeds.

Therefore, a process of removing the film from the carrier glass after forming the TFT on the film is required, which is performed by a laser lift off (LLO) method. That is, energy is applied to the adhesive agent between the carrier glass and the film by irradiation of the laser to reduce the adhesive force, and the carrier glass and the film can be separated and removed.

In the laser lift-off process, when the stage speed and the oscillation frequency of the laser are synchronized, the stage is irradiated with the laser beam by the width of the beam, and the speed of the stage is determined by the width of the laser beam and the frequency of the laser.

In the current commercial laser lift-off process, when a plurality of laser sources are used, a plurality of laser sources are simultaneously oscillated at a constant frequency, and the process is proceeding.

Since the plurality of laser oscillators are driven at the same time, maintenance and maintenance of the laser oscillator and replacement cycle of consumable parts are short. In addition, when the maintenance of a single laser oscillator is required, the efficiency and productivity of the laser lift-off process are reduced because the operation and maintenance of the unit laser oscillator is not possible.

KR 1066656 B1 JP 5073796 B2

The present invention provides a laser processing apparatus capable of easily grasping an oscillation state of a plurality of laser sources and a laser processing method using the same.

The present invention provides a laser processing apparatus that can use a plurality of laser sources individually, and a laser processing method using the same.

The present invention provides a laser processing apparatus capable of improving the efficiency and productivity of a laser processing process by reducing the number of times of maintenance of the apparatus, and a laser processing method using the same.

A laser processing apparatus according to an embodiment of the present invention includes a laser generation unit generating an oscillation signal of a laser beam irradiated by an object to be processed and oscillating a plurality of laser beams; A laser processing unit disposed on a traveling path of the laser beam oscillated in the laser generation unit, for processing the laser beam; And a control unit connected to at least one of the laser generation unit and the laser processing unit on the progress path to detect whether or not the laser beam is oscillated and process and analyze the detected data to determine the operation state of the laser generation unit. Unit.

The laser observation unit being connected to at least one of the laser generation unit and the laser processing unit, the detection unit measuring an oscillation frequency and pulse data of the laser beam; A converter for converting the analog data of the laser beam transmitted from the detector into digital data; And a determination unit for determining whether the oscillation signal is abnormal by analyzing the digital signal converted by the conversion unit.

The laser observation unit may include a controller for controlling the oscillation signal according to a result of the determination whether the oscillation signal transmitted from the determination unit is abnormal.

The detection unit may be provided at least one of a front end of the laser generation unit in the traveling direction of the laser beam, a position to reflect the laser beam to the object to be processed, and a position to control the length of the laser beam .

Wherein the laser generation unit comprises: a laser control unit for generating an oscillation signal of each of the plurality of laser beams; And a laser generation unit connected to the laser control unit, for oscillating each laser beam in accordance with the generated oscillation signal.

And a control unit for adjusting the oscillation mode of the laser beam and the operation state of the stage for each processing region of the object to be processed according to the position of the stage on which the object to be processed is placed.

Wherein the adjusting unit comprises: a position detecting unit for measuring a position of the stage; An adjusting unit connected to the position detecting unit and the laser generating unit to adjust an oscillation mode of the laser beam and a moving speed of the stage according to a position of the measured stage; And a motion control unit connected to the control unit and controlling the speed of the stage in accordance with the oscillation mode of the adjusted laser beam.

A laser processing method according to an embodiment of the present invention includes the steps of setting a plurality of oscillation conditions for controlling oscillation of a plurality of laser beams according to processing conditions of an object to be processed; Generating a plurality of laser beams by oscillating the plurality of laser beams; Detecting a plurality of oscillated laser beams; And determining a laser beam oscillation state of the laser generation unit using the detected laser beam data.

The step of setting the plurality of oscillation conditions may set the plurality of laser beams to be simultaneously or alternately driven.

Wherein the step of determining the laser beam oscillation state comprises the steps of: comparing the detected laser beam data with data of a set oscillation condition; And determining that correction of the laser generation unit is required if the detected laser beam data and data of the set oscillation condition are different from each other.

In the process of detecting the laser beam, the oscillation frequency and pulse data of the laser beam can be obtained.

Stopping the oscillation of the laser beam requiring correction among the plurality of laser beams after determining that the correction of the laser generator is required when the oscillation mode is an alternating drive; And reducing the processing speed of the object to be processed during the correction of the laser beam whose oscillation is stopped.

Stopping the oscillation of the laser beam requiring correction among the plurality of laser beams after determining that correction of the laser generator is required when the oscillation mode is simultaneous driving; And increasing the energy of the remaining laser beam during the correction of the oscillated laser beam.

The object to be processed is divided into a first region including an edge in the oscillation direction of the laser beam and a second region not including the edge in the course of setting the plurality of laser beam oscillation conditions, Detecting a position of the stage on which the object to be processed is placed when processing is required with a laser beam energy higher than that of the second region; And a step of simultaneously driving the plurality of laser beams and decreasing a moving speed of the stage when the detected position of the stage is the position at which the first area starts.

And a step of cross-driving the plurality of laser beams and increasing a moving speed of the stage when the detected position of the stage is the position where the second area starts.

A laser processing method according to an embodiment of the present invention includes the steps of detecting a position of a stage on which an object to be processed is placed; And controlling the oscillation conditions of the plurality of laser beams and the process speed of the object to be processed according to the position of the detected stage.

Wherein the step of controlling the oscillation conditions of the plurality of laser beams and the processing speed of the object to be processed simultaneously drives the plurality of laser beams when the position of the detected stage corresponds to the edge of the object to be processed, The process speed of water can be reduced.

Wherein the step of controlling the oscillation conditions of the plurality of laser beams and the processing speed of the object to be processed includes a step of cross-driving the plurality of laser beams when the position of the detected stage is at a position deviating from the edge of the object to be processed, The speed can be increased.

According to the embodiment of the present invention, it is possible to easily grasp and control the oscillation state of a plurality of laser sources in the laser processing process of the object to be processed. That is, it is possible to determine whether or not the laser oscillation condition is abnormal by comparing the laser oscillation condition data set in accordance with the processing conditions with the detection data of the oscillation laser. Further, the oscillation control of each of the plurality of lasers can be easily performed, and a method of simultaneously oscillating a plurality of lasers and a method of performing a cross oscillation can be easily mixed according to the abnormality of the laser generating portion and the processing region of the object to be processed.

As described above, the problem resolution of the laser oscillation configuration can be immediately confirmed and corrected, and the oscillation method of the plurality of laser oscillators can be changed as needed, thereby increasing the productivity of the laser processing process.

In addition, since a plurality of lasers can be selectively used as needed to shorten the use time of the laser generating portion, an increase in the number of times of maintenance of the laser generating portion can be prevented.

1 is a view showing a laser processing apparatus according to an embodiment of the present invention.
Fig. 2 is a view showing a detailed configuration of the laser generating unit and the laser observing unit of Fig. 1; Fig.
3 is a diagram illustrating an oscillation mode of a laser according to an embodiment of the present invention.
4 shows a laser processing apparatus comprising a conditioning unit according to an embodiment of the invention.
5 is a flowchart showing a laser processing method according to an embodiment of the present invention.
6 is a flowchart showing a laser processing method according to whether or not a laser generation unit is corrected according to an embodiment of the present invention.
7 is a flowchart showing a laser processing method according to an object to be processed according to an embodiment of the present invention.
8 is a view for explaining an example of Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. To illustrate the invention in detail, the drawings may be exaggerated and the same reference numbers refer to the same elements in the figures.

A laser processing apparatus according to an embodiment of the present invention is for easily grasping and controlling an oscillation state of a laser irradiated by an object to be processed, and has a condition that oscillation conditions for oscillating a plurality of lasers and an actually oscillated laser are the same . In addition, the oscillation modes of the plurality of lasers can be easily mixed according to the oscillation state of the laser and the processing region of the object to be processed. In this case, in the present invention, the laser processing apparatus is an apparatus for applying energy to separate the thin film deposited on the substrate from the substrate, and may be a laser lift off (LLO). Further, the object to be processed may be a flexible OLED thin film deposited on a glass substrate.

However, the laser processing apparatus is not limited to the implementation of the present invention, and can be applied to various apparatuses such as a laser heat treatment apparatus and a laser processing apparatus for irradiating laser on a workpiece, It is possible to confirm that the detection data of the laser oscillation is the same and apply it to a place where control of the laser oscillation is required.

Hereinafter, the oscillated laser will be described as a laser beam, and the meaning is the same even if the oscillated laser and the laser beam are used in combination.

Hereinafter, a laser processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a view showing a laser processing apparatus according to an embodiment of the present invention. Fig. 2 is a view showing a detailed configuration of the laser generating unit and the laser observing unit of Fig. 1; 3 is a view illustrating an oscillation mode of a laser according to an embodiment of the present invention. 4 is a diagram of a laser processing apparatus including a conditioning unit according to an embodiment of the present invention.

The laser processing apparatus 1 according to the embodiment of the present invention is an apparatus for irradiating a laser beam L to an object S to determine and control the oscillation state of the laser beam L. The laser processing apparatus 1 includes a laser generating unit 100 for generating an oscillation signal of a laser beam L to be irradiated onto an object to be processed S and oscillating a plurality of laser beams in accordance with the oscillation signal, L and a laser processing unit 300 for processing the laser beam L and at least one of the laser generation unit 100 and the laser processing unit 300 on the progress path of the laser beam L. [ And a laser observation unit 400 connected to one of the first and second light sources to detect the oscillation of the laser beam L and to process and analyze the detected data to determine the operating state of the laser generation unit 100.

The laser generating unit 100 is configured to generate a laser beam L and includes a laser control unit 110 for generating an oscillation signal of each of the plurality of laser beams L, And a laser generation unit 130 that oscillates each laser beam L according to the generated oscillation signal. The laser generation unit 100 may include a shutter unit 150 provided at a front end of the laser generation unit 130 in a number corresponding to the laser generation unit 130.

The laser generating unit 100 may include a plurality of laser generating units 130 and a shutter unit 150 provided at the front ends of the plurality of laser generating units 130 according to the number of laser beams to be oscillated. have. That is, the laser generating unit 130 of the present invention may include the first laser generating unit 130 and the second laser generating unit 130 according to the use of two lasers. The shutter unit 150 may include a first shutter unit 150 and a second shutter unit 150 provided at the front ends of the first laser generation unit 130 and the second laser generation unit 130, have. Hereinafter, a single laser generating unit 130 and a shutter unit 150 will be described, which are applied to both the plurality of laser generating units 130 and the shutter unit 150.

The laser generating unit 130 is a device for oscillating a laser, and may be referred to as an oscillator. The laser generating unit 130 is a well-known structure for generating the laser beam L, and various types of laser beams, such as a KrF excimer laser and an ArF excimer laser, may be employed depending on the wavelength of the laser beam to be used. At this time, the kind of the laser beam (L) light source can be determined according to the binding energy between the substrate and the thin film constituting the object to be processed (S).

The shutter unit 150 is provided at the front end of the laser generating unit 130 to block the path of the laser beam L. That is, the shutter unit 150 is disposed in the direction parallel to the traveling direction of the laser beam L of the laser generating unit 130 to open the path of the laser beam L, or to cross the traveling direction of the laser beam L So that the path of the laser beam L can be cut off.

The laser processing unit 300 is disposed on the path of the laser beam L in front of the laser generation unit 100 to process the shape of the laser beam L into a line shape (line beam) In order to process the energy distribution. The laser processing unit 300 includes a lens system (not shown) for processing the shape of the laser beam, a reflection mirror 310 for changing the traveling path of the laser beam L by reflecting the laser beam L, And a beam cutter 350 for controlling the length of the beam L.

The laser observation unit 400 is connected to at least any one of the laser generation unit 100 and the laser processing unit 300 for determining and controlling the oscillation state of the laser beam L, A converting unit 430 connected to the detecting unit 410 and converting the data of the laser beam L transmitted from the detecting unit 410 into digital data, And a determination unit 450 for analyzing the digital signal to determine whether the laser beam L oscillation signal is abnormal. The laser observation unit 400 includes a control unit 470 for controlling the laser beam L oscillation signal in accordance with the determination result of the abnormality of the oscillation signal transmitted from the determination unit 450.

That is, the laser observation unit 400 measures the oscillation frequency and the pulse data of the laser beam L on the progress path of the laser beam L oscillated from the laser generation unit 100, and outputs it to the laser control unit 110 And a control unit for controlling the operation of the laser control unit 110 according to a result of the determination. The laser control unit 110 controls the operation of the laser control unit 110 according to the determination result.

The detection unit 410 is disposed on the path of the laser beam L to sense the laser beam L and may be connected to at least one of the laser generation unit 100 and the laser observation unit 400 have. That is, the detection unit 410 detects the position of the front end of the laser generation unit 100, the position at which the laser beam L is reflected to the object S and the length of the laser beam L And a position for controlling the operation of the apparatus.

The detecting unit 410 includes a first detector 412 disposed at the front end of the laser generating unit 100 and a reflecting mirror 310 for changing the traveling path of the laser beam L to the object S. [ A second detector 414 disposed at a position where the transmitted laser beam L reaches and a position where the residual laser beam L separated from the beam cutter 350 controlling the length of the laser beam L reaches And a third detector 416 disposed therein.

The reason why the first detector 412, the second detector 414 and the third detector 416 are disposed at the specific position will be described. The first detector 412 detects the position of the laser beam L, The laser beam L can be easily detected because the laser beam L is emitted at the earliest position to be irradiated with the laser beam L. [ Since the second detector 414 does not reflect all of the laser beam L on the material to be processed S and part of the laser beam L passes through the reflecting mirror 310 due to the material characteristic of the reflecting mirror 310, L, the laser beam L can be detected easily. The third detector 416 detects the residual laser beam L separated after the length adjusting process of the laser beam L due to the role of the beam cutter 350. Therefore, It is possible to easily detect the laser beam L even if it is not disposed in the laser beam L. That is, the detecting unit 410 of the present invention is disposed at a position where the laser beam L can be detected at a position that does not disturb the progress of the laser beam L to the object S to be processed.

The detection unit 410 may be configured to sense light such as the laser beam L. For example, a photodiode may be used. That is, the detecting unit 410 can obtain the oscillation frequency and the pulse data of the laser beam L in real time by using the light itself or a device that converts the information contained in the light into an electric signal and detects it.

The converting unit 430 converts the analog data of the laser beam L detected by the detecting unit 410 into a digital form. That is, the digitizer converts a signal measured by an optical signal detector for detecting a laser into a digital signal, and converts the signal so that the digital signal can be input to a control unit, which will be described later.

The determination unit 450 displays the digital data of the laser beam L transmitted from the conversion unit 430 and analyzes the digital data of the laser beam L transmitted to the conversion unit 430 to generate the laser beam L, And determines whether or not the oscillation signal of the oscillator is abnormal. That is, the judging unit 450 judges whether the laser beam L detected by the detecting unit 410 (hereinafter referred to as detection data) and the laser control unit 110 (Hereinafter referred to as " setting data ") transmitted to the laser generating unit 130. [ When the detection data and the setting data indicate the same value, it is determined that no abnormality occurs in the oscillation of the laser beam L. [ On the other hand, when the detection data and the setting data indicate different values, it is determined that an abnormality occurs in the oscillation of the laser beam L. [ Such detection data and setting data may be the oscillation frequency and the pulse data of the laser beam L, as described above.

The control unit 470 controls the laser generation unit 100 according to the determination result of the determination unit 450. The control unit 470 controls the laser generation unit 100 based on the result of the abnormality of the laser beam L oscillation transmitted from the determination unit 450, And controls the oscillation operation of the laser beam (L) of the generating section (130). That is, when the determination unit 450 receives a determination result that the setting data and the measurement data are different from each other, the controller 470 transmits a correction signal to the laser control unit 110 so that the setting data and the measurement data become equal to each other It is a role to deliver.

On the other hand, in the above-described laser processing apparatus 1, the oscillation mode of the laser beam L and the oscillation mode of the stage (not shown) are determined for each processing region of the object S depending on the position of the stage 50, 50) for controlling the movement speed of the movable member (50).

The adjustment unit 500 is configured to easily change the processing conditions of the laser beam L in accordance with the position of the object S to be irradiated with the laser beam L and to measure the position of the stage 50 And a control unit connected to the position detection unit 510 and the position detection unit 510 and the laser generation unit 100 to adjust the oscillation mode of the laser beam L and the operation state of the stage 50 according to the position of the measured stage. And a motion control unit 550 connected to the control unit 530 and the control unit 530 to control the speed of the stage 50 according to the oscillation mode of the controlled laser beam L. [

The position detection unit 510 is configured to measure the position of the stage 50 as the stage 50 moves. For example, a position encoder may be used. That is, the position detecting unit 510 grasps the position of the stage 50 in real time, and transmits the position data of the stage 50 to the adjusting unit 530. More specifically, the position detecting section 510 may collect the position data of the stage 50, but may be a configuration for confirming the position of the object S to be placed on the stage 50. For example, the stage 50 is divided in the width direction from the first position to the tenth position, and generally the object to be processed S as wide as the width from the third position to the seventh position on the stage 50 It is assumed that it is seated. This confirms that the object S does not exist up to the second position of the stage but the object S exists from the third position of the stage 50. Therefore, The position of the object S to be processed in accordance with the position of the stage 50 can be determined by setting the positional relationship between the stage 50 and the object S in advance in advance, .

The controller 530 is configured to change the oscillation mode of the laser beam L or to control the movement of the stage 50 according to the position of the stage 50 transmitted from the position detector 510, A control signal for changing the oscillation mode of the laser beam L and a control signal for changing the moving speed of the stage 50 are transmitted to the control unit 110 and the motion control unit 550, respectively.

The motion control unit 550 receives the control signal for changing the moving speed of the stage 50 transmitted from the adjusting unit 530 and provides power to move the stage 50 according to the received signal.

The laser processing apparatus 1 formed as described above is capable of setting the set data having the oscillation signal for oscillating the laser beam L in the processing process S using the plurality of laser beams L, In real time, measurement data of the laser beam (L) measured after oscillation in accordance with the oscillation signal. Thus, it is possible to easily grasp whether or not an abnormal state occurs in the oscillating state of the laser beam (L).

It is also possible to easily grasp the position of the object S in accordance with the position of the stage 50 and determine the oscillation mode of the laser beam L and the movement of the stage 50 You can adjust the speed. Accordingly, different process conditions can be easily applied to each of the objects S, and the efficiency and productivity of the process can be increased.

Hereinafter, a laser processing method according to an embodiment of the present invention will be described with reference to FIGS. 5 to 9. FIG. Here, FIG. 5 is a flowchart showing a laser processing method according to an embodiment of the present invention. 6 is a flowchart illustrating a laser processing method according to an embodiment of the present invention. 7 is a flowchart showing a laser processing method according to an object to be processed according to an embodiment of the present invention. Figs. 8 and 9 are views for explaining an example of Fig.

The laser processing method according to the embodiment of the present invention includes the steps of setting a plurality of oscillation conditions for controlling the oscillation of a plurality of laser beams in accordance with processing conditions of the object to be processed S, A process of oscillating a plurality of laser beams L by transmitting an oscillation condition set by the laser generator 130 and a process of detecting a plurality of oscillated laser beams L and a process of detecting a laser beam L by using the detected laser beam L, And determining the oscillation state of the laser beam (L) of the generating unit (130).

First, the processing conditions of the object S to be processed by the laser beam L are checked, and the laser beam L oscillation conditions are set according to the processing conditions of the object to be processed S (S110). The treatment condition of the object S to be treated may be the material and the binding energy with the thin film to be separated is the treatment condition of the object S to be treated. In addition, the processing conditions of the object S to be processed may include all conditions that can be influenced by the energy of the laser beam L in the processing using the laser beam L. [ The oscillation conditions of the plurality of laser beams L may be set such that the oscillations of the plurality of laser beams L are simultaneously driven to be mutually driven or alternately driven to cross each other. At this time, simultaneous driving of the plurality of laser beams L can be set when irradiation of a laser beam L of a large energy to the object to be processed S is required, and the cross driving can be performed with a small energy It can be set when irradiation of the laser beam L is required to the object S to be processed.

When the laser beam oscillation condition is set according to the processing condition of the object to be processed, the laser beam L is oscillated according to the set laser beam oscillation condition (S120). That is, when the set oscillation condition is the simultaneous drive oscillation mode of the plurality of laser beams L1 and L2 as shown in FIG. 3A, the laser generation unit (laser oscillator) for oscillating the plurality of laser beams L1 and L2 The laser control unit 110 transmits an oscillation signal to the laser generation unit 130 so that the laser beams L1 and L2 are simultaneously emitted to the laser generation units 130 and 130, respectively. On the other hand, when the set oscillation condition is an alternate driving oscillation mode of the plurality of laser beams L1 and L2 as shown in FIG. 3 (b), a laser generating unit (not shown) for oscillating a plurality of laser beams L1 and L2 The laser control unit 110 transmits an oscillation signal to the laser generation unit 130 so that the laser beams L1 and L2 are oscillated at different times.

At this time, in the process of setting the oscillation conditions of the plurality of laser beams L1 and L2, the object S does not include the first region including the edge in the oscillation direction of the laser beam L and the first region including the edge Detecting the position of the stage (50) on which the object (S) is placed when the first region is required to be processed with a higher laser beam energy than the second region; And a step of simultaneously driving a plurality of laser beams L1 and L2 and reducing the moving speed of the stage 50 when the position of the stage 50 is the position where the first area starts.

When the detected position of the stage 50 is the position at which the second region starts, the laser beam L1 and the laser beam L2 are cross-driven to increase the moving speed of the stage 50, Irradiation of the laser beam L can proceed.

When the laser beam L is oscillated by the oscillation signal of the laser control unit 110, the oscillated laser beam L is detected (S130). The detection of the laser beam L may be performed by measuring the oscillation frequency and pulse data of the laser beam L using a detector provided in the detector 410. [

As described above, by detecting the laser beam L, the oscillation state of the laser beam L can be determined. That is, the process of determining the oscillation state of the laser beam L by detecting the laser beam L comprises the steps of comparing the detected laser beam L data with the data of the set oscillation condition S140, L) data is different from the data of the set oscillation condition, it is determined that the correction of the laser generation unit 130 is required.

That is, it is checked whether the detected laser beam L data and the set oscillation condition data are identical or inconsistent (S150). If the detected laser beam L data and the set oscillation condition data are the same, the laser beam L oscillation state (S160). On the other hand, if the detected laser beam L data and the set oscillation condition data are not the same, it is determined that the oscillation state of the laser beam L is required to be corrected (S200).

As described above, the laser oscillation condition is set according to the processing condition of the object S (S110), the laser beam L is oscillated according to the set oscillation condition (S120), and the oscillated laser beam L is oscillated (S 130). The process of comparing the detected laser beam data with the set oscillation condition data (S 140 and S 150) is included in the process of observing the laser oscillation state (S 100).

The control unit 470 controls the laser oscillation mode of the laser beam L so that the laser generation unit 130 generates the laser beam L at step S200, (S210), and the process speed of the object to be processed S or the method of correcting the energy of the laser beam L is applied in accordance with the oscillation mode.

It is determined that the correction of the laser generation unit 130 is required at step S200 and if the oscillation mode of the laser beam L is simultaneous driving, correction among the plurality of laser beams L1 and L2 A process S220B of stopping the oscillation of the required laser beam L and a process S230B of increasing the energy of the remaining laser beam during the correction of the laser beam whose oscillation is stopped are performed.

That is, the oscillation of the laser beam L required to be corrected among the plurality of laser beams L1 and L2 is stopped (S220B), and the laser to be processed S to be transmitted by the laser beam L, The control unit 470 controls the laser control unit 110 so as to compensate the beam L for the remaining laser beam L, i.e., the laser beam L that is not required to be corrected, L) can oscillate with a larger value of energy than before.

If it is determined in step S200 that the correction of the laser generation unit 130 is required, if the oscillation mode of the laser beam L is an alternating drive, correction of a plurality of laser beams L1 and L2 A process of stopping the oscillation of the required laser beam L and a process of reducing the process speed of the object S during the correction of the laser beam L stopped oscillation are performed. At this time, the processing speed of the object to be processed can be set to a value derived by the following relational expression (1).

[Relation 1]

_{V = V 0 (nx) /} n

(Wherein, V; draw the object to be treated in the process speed, V _0; laser generator number is required to be processed existing correction process speed, n;; laser generator number, x is used)

When the correction of the laser generation unit 130 is completed and the laser generation unit that is requested to be corrected is normalized (S240), the operation of the corrected laser generation unit 130 is started to start the oscillation of the laser beam L for which correction has been requested (S250). The laser beam L irradiation process can be completed by returning the energy of the laser beam L adjusted during the correction or the process speed of the object S to the value before correction (S260A, S260B) (S300) .

The laser processing method according to another embodiment of the present invention includes a step of detecting the position of the stage 50 on which the object S is placed, And controlling the oscillation conditions of the laser beams L1 and L2 and the process speed of the object S according to the position of the stage 50. [

When the position of the stage 50 detected in the course of controlling the oscillation conditions of the plurality of laser beams L and the processing speed of the object S corresponds to the edge of the object S, It is possible to simultaneously drive the beams L1 and L2 to reduce the process speed of the object S. [

On the other hand, when the position of the stage 50 detected in the process of controlling the oscillation conditions of the laser beams L1 and L2 and the process speed of the object S is a position deviating from the edge of the object S It is possible to cross-drive the laser beams L1 and L2 to increase the processing speed of the object S to be processed.

That is, when irradiation of the laser beam L is started (S410), the stage 50 starts at the first speed (S420). 9, the position of the stage 50 may be divided into three sections A, B, and C, and the section A is a section in which the object S does not exist on the stage 50 . The section B is a section in which the object S exists on the stage 50 and includes the edge of the object S in the moving direction of the stage 50. [ Finally, the section C is a section on the stage 50 where an area that does not include the edge of the object S exists. At this time, the section B includes a bonding area showing a bonding force that is greater than a bonding strength between the glass and the thin film constituting the material S to be processed.

At this time, if the position detector 510 detects the position of the stage 50 and confirms that the stage enters the bonding area of the object S (S430), the controller 530 controls A signal for converting a plurality of laser beams L1 and L2 into a simultaneous drive oscillation mode to irradiate a laser beam L having a higher energy than the laser beam L is transmitted to the laser control unit 110, To the motion control unit 550 so that the stage 50 is irradiated with a sufficient amount of light in the bonding region. The laser control unit 110 increases the energy of the laser beam L irradiated to the object S by causing the plurality of laser beams L 1 and L 2 to oscillate at the same oscillation frequency and pulse at the same time . In addition, the motion control unit 550 can move the stage 50 at a low speed so that the laser beam L can be irradiated to the object S in a generous manner.

On the other hand, when the position detector 510 detects the position of the stage and confirms that the stage 50 is out of the bonding area of the object S (S450), the controller 530 controls the irradiation of the laser beam A signal for converting a plurality of laser beams L1 and L2 into an alternating drive oscillation mode to irradiate the laser beam L with energy lower than the beam L is transmitted to the laser control unit 110, Thereby increasing the moving speed.

This is because the laser beam L is irradiated at the edge portion of the object S to facilitate the bonding removal by increasing the irradiation density, The oscillation mode of the oscillator is used in combination.

Although the present invention has been described in detail with reference to the specific embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be defined by the appended claims, as well as the appended claims.

1: laser processing device S: object to be processed
50: stage 100: laser generating unit
110: laser control unit 130: laser generating unit
150: shutter unit 300: laser processing unit
310: reflective mirror 350: beam cutter
400: laser observation unit 410: detection unit
430: converting section 450:
470: Control unit 500: Control unit
510: position detector 530:
550: Motion control section

Claims (18)

A laser generating unit generating an oscillation signal of a laser beam irradiated with the object to be processed and oscillating a plurality of laser beams;
A laser processing unit disposed on a traveling path of the laser beam oscillated in the laser generation unit, for processing the laser beam;
And a control unit connected to at least one of the laser generation unit and the laser processing unit on the progress path to detect whether or not the laser beam is oscillated and process and analyze the detected data to determine the operation state of the laser generation unit. And a laser processing unit. The method according to claim 1,
The laser observation unit includes:
A detector connected to at least one of the laser generation unit and the laser processing unit, for measuring oscillation frequency and pulse data of the laser beam;
A converter for converting the analog data of the laser beam transmitted from the detector into digital data; And
And a determination unit for determining whether the oscillation signal is abnormal by analyzing the digital signal converted by the conversion unit. The method of claim 2,
The laser observation unit includes:
And a controller for controlling the oscillation signal according to a result of determining whether the oscillation signal transmitted from the determination unit is abnormal. The method of claim 2,
Wherein:
A position for controlling the length of the laser beam, a front end of the laser generation unit in the traveling direction of the laser beam, a position for reflecting the laser beam to the object to be processed, and a position for controlling the length of the laser beam. The method according to claim 1,
The laser generating unit includes:
A laser control unit for generating an oscillation signal of each of the plurality of laser beams; And
And a laser generation unit connected to the laser control unit to oscillate each laser beam in accordance with the generated oscillation signal. The method according to claim 1,
And an adjusting unit for adjusting an oscillation mode of the laser beam and an operation state of the stage for each processing region of the object to be processed according to a position of the stage on which the object to be processed is placed. The method of claim 6,
The adjustment unit includes:
A position detector for measuring a position of the stage;
An adjusting unit connected to the position detecting unit and the laser generating unit to adjust an oscillation mode of the laser beam and a moving speed of the stage according to a position of the measured stage;
And a motion control unit coupled to the controller to control a speed of the stage in accordance with an oscillation mode of the laser beam. Setting a plurality of oscillation conditions for controlling oscillation of a plurality of laser beams in accordance with processing conditions of the object to be processed;
Generating a plurality of laser beams by oscillating the plurality of laser beams;
Detecting a plurality of oscillated laser beams;
And determining a laser beam oscillation state of the laser generation unit using the detected laser beam data. The method of claim 8,
Wherein the step of setting the plurality of oscillation conditions sets the oscillation mode so that the plurality of laser beams are simultaneously or alternately driven. The method of claim 9,
Wherein the step of determining the laser beam oscillation state comprises:
Comparing the detected laser beam data with data of a set oscillation condition; And
And determining that correction of the laser generation unit is required if the detected laser beam data and data of the set oscillation condition are different from each other. The method of claim 10,
And acquiring an oscillation frequency and pulse data of the laser beam in the process of detecting the laser beam. The method of claim 10,
When the oscillation mode is the cross drive,
After the process of determining that correction of the laser generation unit is required,
Stopping oscillation of a laser beam requiring correction among the plurality of laser beams;
And reducing the processing speed of the object during correction of the laser beam whose oscillation has stopped. The method of claim 10,
When the oscillation mode is simultaneous driving,
After the process of determining that correction of the laser generation unit is required,
Stopping oscillation of a laser beam requiring correction among the plurality of laser beams;
And increasing the energy of the remaining laser beam during correction of the laser beam whose oscillation has stopped. The method of claim 8,
The object to be processed is divided into a first region including an edge in the oscillation direction of the laser beam and a second region not including the edge in the course of setting the plurality of laser beam oscillation conditions, Is required to be processed with a laser beam energy larger than that of the second region,
Detecting a position of the stage on which the object to be processed is placed;
And simultaneously driving the plurality of laser beams when the position of the detected stage is the position at which the first area starts, thereby reducing the moving speed of the stage. The method of claim 8,
And crossing the plurality of laser beams when the position of the detected stage is a position at which the second area starts, and increasing the moving speed of the stage. Detecting a position of the stage on which the object to be processed is placed;
And controlling the oscillation conditions of the plurality of laser beams and the process speed of the object to be processed according to the position of the detected stage. 18. The method of claim 16,
Controlling the oscillation conditions of the plurality of laser beams and the process speed of the object to be processed,
And when the detected position of the stage corresponds to the edge of the object to be processed, simultaneously driving the plurality of laser beams to reduce the processing speed of the object to be processed. 18. The method of claim 16,
Controlling the oscillation conditions of the plurality of laser beams and the process speed of the object to be processed,
And cross-drives the plurality of laser beams to increase a processing speed of the object to be processed when the detected position of the stage is a position deviating from an edge of the object to be processed.

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