TW201739130A - Laser processing apparatus and laser processing method using the same - Google Patents

Abstract

The present invention, which relates to a laser processing apparatus and a laser processing method, a problem in laser oscillation may be immediately detected and corrected, and an oscillation method for a plurality of lasers may be changed as necessary, and thus productivity of a laser processing process may be increased.

Description

Laser processing device and laser processing method using same

The present invention relates to a laser processing apparatus and a laser processing method using the same, and more particularly to a laser source capable of easily controlling a plurality of laser sources A laser processing apparatus and a laser processing method using the laser processing apparatus.

Research is actively being conducted to develop a flexible display as a next-generation display that is thin and light, and that is bendable or foldable but impact resistant. Some flexible displays have actually been developed, but they need further improvement.

A germanium transistor uses a glass substrate or a sapphire substrate as a substrate material substrate. It is difficult to apply a germanium transistor to a flexible display due to the low flexibility of the germanium transistor and the limitation of the substrate of the base material. Therefore, research is being conducted to develop a method of manufacturing a flexible semiconductor device by using a thin glass plate as a substrate, using a metal plate as a substrate, or using a plastic substrate.

As an example of implementing a flexible display, a TFT circuit and an OLED which is a light-emitting device are formed in a specific structure on a film. Here, since the film is not easily handled, the TFT molding process is performed with the film attached to the carrier glass.

Therefore, a process of separating a film from a carrier glass after forming a TFT on a film is performed, and this process is performed using a laser-lift-off (LLO) method. That is, energy can be applied to the adhesive by irradiating the laser to the adhesive between the carrier glass and the film to reduce the adhesive strength, and then the film can be separated and removed from the carrier glass.

In the laser stripping process, when the table speed is synchronized with the oscillation frequency of the laser, the laser beam is irradiated while moving the table up to the width of the laser beam, wherein the table speed is determined by the width of the laser beam and the Ray The firing frequency is determined.

According to the current commercial laser stripping process, when multiple laser sources are used, multiple laser sources are induced to oscillate simultaneously at a constant frequency to perform the process.

However, since a plurality of laser oscillators are simultaneously driven, the maintenance period of the laser oscillator and the replacement period of the consumable components are short. Furthermore, since it is not possible to individually drive and maintain the laser oscillator when it is necessary to maintain a single laser oscillator, the efficiency and productivity of the laser stripping process are reduced.

The present invention provides a laser processing apparatus capable of easily detecting an oscillation state of a plurality of laser sources and a laser processing method using the same.

The present invention provides a laser processing apparatus capable of individually using a plurality of laser sources and a laser processing method using the same.

The present invention provides a laser processing apparatus capable of improving the efficiency and productivity of a laser processing process by reducing the number of maintenance of the apparatus, and a laser processing method using the same.

According to an exemplary embodiment, a laser processing apparatus includes: a laser generating unit configured to generate an oscillating signal of a laser beam irradiated to a target for processing, and oscillate a plurality of laser beams; laser processing a unit disposed on a propagation path of the laser beam oscillated by the laser generating unit and configured to process the laser beam; and a laser observation unit coupled to the propagation path At least one of the laser generating unit and the laser processing unit determines an operational state of the laser generating unit by detecting an oscillation of the laser beam and processing and analyzing the detected data.

The laser observation unit may include: a detecting component coupled to at least one of the laser generating unit and the laser processing unit, and configured to measure an oscillation frequency of the laser beam and pulse data; a conversion component configured to convert analog data of the laser beam received from the detection component into digital data; and a determining component configured to determine by analyzing a digital signal converted by the conversion component Whether the oscillation signal is abnormal.

The laser observation unit may include a control component configured to control the oscillating signal based on a result of determining whether the oscillating signal is abnormal, the result having been received from the determining component.

The detecting member may be disposed at at least one of a position at a front portion of the laser generating unit in a propagation direction of the laser beam for directing the laser beam toward the processing The position of the target reflection, and the position used to control the length of the laser beam.

The laser generating unit may include: a laser control component configured to generate the oscillating signal of each of the plurality of laser beams; and a laser generating component coupled to the laser control The component oscillates each of the laser beams in accordance with the generated oscillating signal.

The laser processing apparatus may further include an adjustment unit configured to adjust the processing area for the processing target for the location of the work station on which the target for processing is placed The oscillation mode of the laser beam and the operating state of the table.

The adjustment unit may include: a position detecting member configured to measure the position of the table; an adjustment member coupled to the position detecting member and the laser generating unit to be in accordance with the table Measuring the oscillation mode of the laser beam and the moving speed of the table by measuring a position; and a motion control component coupled to the adjustment component to control the adjusted oscillation mode according to the laser beam The moving speed of the workbench.

According to another exemplary embodiment, a laser processing method includes: setting a plurality of oscillation conditions for controlling oscillation of a plurality of laser beams according to processing conditions of a target for processing; by setting the set oscillation conditions Transmitting the plurality of laser beams to a laser generating component for oscillating the plurality of laser beams; detecting the plurality of laser beams that oscillate; and using the detected laser beam data And determining the oscillation state of the laser beam of the laser generating part.

The setting the plurality of oscillation conditions may include setting an oscillation mode such that the plurality of laser beams are driven simultaneously or alternately.

The determining the oscillation state of the laser beam may include: comparing the detected laser beam data with the data of the set oscillation condition; and the value of the detected laser beam data is different from the When the data of the oscillation condition is set, it is determined that the laser generating part requires correction.

During the detecting of the plurality of laser beams, an oscillation frequency of the plurality of laser beams and pulse data may be obtained.

The laser processing method may include: stopping oscillation of a laser beam that needs to be corrected between the plurality of laser beams; and reducing the target for processing during correcting the oscillation to stop the laser beam Processing speed, after determining that the laser generating component requires correction, the oscillation mode is alternately driven at this time.

The laser processing method may include: stopping oscillation of a laser beam that needs to be corrected between the plurality of laser beams; and increasing a laser beam other than the oscillation during the correction of the oscillation to stop the laser beam The energy of the laser beam other than the one is determined to be simultaneously driven after determining that the laser generating component needs to be corrected.

The laser processing method may include: detecting a position of the work table on which the target for processing is placed; and the detected position at the work station being the first area of the target for processing At the initial position, the moving speed of the table is reduced by simultaneously driving the plurality of laser beams, and at this time, during the setting of the plurality of oscillation conditions, the target for processing is divided into The first region including an edge in an oscillation direction of the plurality of laser beams and a second region not including the edge, and the first region requires a laser higher than the second region The laser beam energy of the beam energy is processed.

The laser processing method may include increasing a moving speed of the table when the detected position of the table is a position starting from a second region of the target for processing, while alternately Driving the plurality of laser beams.

According to still another exemplary embodiment, a laser processing method includes: detecting a position of a stage on which a target for processing is placed; and controlling a plurality of laser beams according to the detected position of the stage The oscillation condition and the processing speed of the target for processing.

The controlling the oscillation condition of the plurality of laser beams and the processing speed of the target for processing may be included in the detected position of the table corresponding to the processing for processing At the edge of the target, the plurality of laser beams are simultaneously driven and the processing speed of the target for processing is reduced.

The controlling the oscillation condition of the plurality of laser beams and the processing speed of the target for processing may include the target position of the table being deviated from the target for processing The edges of the plurality of laser beams are alternately driven and the processing speed of the target for processing is increased.

Exemplary embodiments will hereinafter be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the drawings, the size of the elements may be exaggerated for clarity of the description, and the same reference numerals refer to the same elements.

A laser processing apparatus according to an embodiment is intended to easily detect and control an oscillation state of a laser that is irradiated to a processed object, which can determine whether or not an oscillation condition for causing a plurality of laser oscillations to oscillate with an actual oscillation the same. Furthermore, the oscillation modes of the plurality of lasers can be easily used interchangeably depending on the oscillation state of the laser and the processing region of the object being processed. Here, in an embodiment, the laser processing apparatus may represent an apparatus for separating a thin film deposited on a substrate from a substrate by using a laser lift-off (LLO) method. In addition, the object to be processed may be a structure in which a flexible organic light-emitting diode (OLED) film is deposited on a glass substrate.

However, the laser processing apparatus is not limited to the embodiment, and thus can be applied to various apparatuses (for example, a laser heat treatment apparatus, a laser processing apparatus, and the like) that are required to irradiate a laser to an object to be processed. In various fields, it is determined whether the oscillating condition data set to cause the laser oscillation is the same as the detected data of the actual oscillating laser and controls the laser oscillation.

In the following, an oscillating laser is referred to as a laser beam, and the term "oscillation laser" is used interchangeably with the term "laser beam" and has the same meaning.

A laser processing apparatus according to an embodiment will be described with reference to FIGS. 1 through 4. FIG. 1 is a diagram illustrating a laser processing apparatus in accordance with an embodiment. FIG. 2 is a view for explaining a detailed configuration of the laser generating unit and the laser observation unit of FIG. 1. FIG. 3a and 3b are diagrams illustrating an oscillation mode of a laser according to an embodiment. 4 is a diagram illustrating a laser processing apparatus including an adjustment unit, in accordance with an embodiment.

The laser processing apparatus 1 according to an embodiment is for irradiating the laser beam L to the target S for processing and detecting and controlling the oscillation state of the laser beam L. The laser processing apparatus 1 includes: a laser generating unit 100 that generates an oscillation signal of a laser beam L that is irradiated to a target S for processing, and oscillates a plurality of laser beams in accordance with the oscillation signal; a laser processing unit 300, disposed on the propagation path of the laser beam L, and processing the laser beam L; and a laser observation unit 400 connected to the laser generating unit 100 and the laser processing unit on the propagation path of the laser beam L At least one of 300 determines whether the laser beam L oscillates, and determines an operational state of the laser generating unit 100 by processing and analyzing the detected data.

The laser generating unit 100 is an element for generating a laser beam L, comprising: a laser control unit 110 that generates respective oscillation signals of the plurality of laser beams L; and a laser generating unit 130 connected to the laser The control unit 110 oscillates each of the laser beams L in accordance with the generated oscillation signal. Further, the laser generating unit 100 may include a light valve member 150 disposed at a front portion of the laser generating member 130, the number of the light valve members 150 corresponding to the number of the laser generating members 130.

Here, depending on the number of lasers to be oscillated, the laser generating unit 100 may include a plurality of laser generating members 130 and a plurality of light valve members 150 respectively disposed at the front of the laser generating members 130. That is, since two lasers are used in one embodiment, the laser generating part 130 may include the first laser generating part 130 and the second laser generating part 130. Further, the light valve member 150 may include a first light valve member 150 and a second light valve member 150 that are disposed at the front portions of the first laser generating member 130 and the second laser generating member 130, respectively. Although the laser generating component 130 and the light valve component 150 are described below as a single component, the following description is also applicable to the plurality of laser generating components 130 and the plurality of light valve components 150.

The laser generating component 130 is a device for oscillating a laser, which may be referred to as an oscillator. Various known laser generators (e.g., KrF excimer laser generator, ArF excimer laser generator, etc.) can be employed as the laser generating component 130 depending on the wavelength of the laser beam to be used. Here, the type of the light source of the laser beam L can be determined according to the bonding energy between the substrate and the film contained in the object S for processing.

The light valve member 150 is disposed at the front of the laser generating member 130 to block the path of the laser beam L. That is, the light valve member 150 may be disposed in parallel with the propagation direction of the laser beam L of the laser generating member 130 to open the path of the laser beam L, or may be disposed in a direction intersecting the propagation direction of the laser beam L. Upper to block the path of the laser beam L.

The laser processing unit 300 is disposed on the propagation path of the laser beam L at the front of the laser generating unit 100 to process the laser beam L into a linear shape (straight line beam) and process the energy distribution of the straight line. The laser processing unit 300 includes a lens system (not shown) for processing the shape of the laser beam L, a mirror 310 for changing the propagation path of the laser beam L by reflecting the laser beam L, and for controlling A beam cutter 350 of the length of the laser beam L. In order to determine and control the oscillation state of the laser beam L, the laser observation unit 400 includes a detecting part 410 connected to at least one of the laser generating unit 100 and the laser processing unit 300 to measure the oscillation frequency of the laser beam L. And a pulse data; a conversion component 430 coupled to the detection component 410 to convert data of the laser beam L received from the detection component 410 from the digital data; and determining component 450, and determining the laser beam by analyzing the converted digital signal Whether the oscillation signal of L is abnormal. Furthermore, the laser observation unit 400 includes a control component 470 that controls the oscillating signal of the laser beam L based on the result of determining whether the oscillating signal is abnormal, the result having been received from the determining component 450.

That is, the laser observation unit 400 includes an oscillation frequency and a pulse data of the laser beam L on the propagation path of the laser beam L oscillated by the laser generating unit 100, comparison of the measured oscillation frequency, and pulse data. The oscillating signal data transmitted from the laser control section 110 to the laser generating section 130 determines whether the oscillation signal of the laser beam L is abnormal, and the configuration of controlling the operation of the laser control section 110 in accordance with the result of the determination.

The detecting part 410 is disposed on a propagation path of the laser beam L to sense the laser beam L, which may be connected to at least one of the laser generating unit 100 and the laser observation unit 400. That is, the detecting part 410 may be disposed at at least one of a position at the front of the laser generating unit 100, a position for reflecting the laser beam L to the target S for processing, and for The position of the length of the laser beam L on the propagation path of the laser beam L is controlled.

Here, the detecting component 410 may include a first detector 412 disposed at a front portion of the laser generating unit 100 and a second detector 414 disposed to be transmitted through the mirror 310 to change orientation toward processing. a position at which the laser beam L of the propagation path of the laser beam L of the target S arrives; and a third detector 416 disposed at a residual thunder separated by the beam cutter 350 to control the length of the laser beam L At the position where the beam L arrives.

The reason why the first detector 412, the second detector 414, and the third detector 416 are placed at the above positions is described below. At the position where the first detector 412 is disposed, the laser beam L is initially oscillated to illuminate the target S for processing, and thus the first detector 412 can easily detect the laser beam L. Further, at the position where the second detector 414 is disposed, the second detector 414 can easily detect the laser beam L even if the second detector 414 is not disposed on the propagation path of the laser beam L, due to The material properties of mirror 310 are therefore that mirror 310 partially transmits laser beam L rather than reflecting all of the laser beam L toward the target S for processing. Finally, at the position where the third detector 416 is disposed, the third detector 416 can easily detect the laser beam L even if the third detector 416 is not disposed on the propagation path of the laser beam L because the beam The cutter 350 is used to adjust the length of the laser beam L, and the residual laser beam L separated after the length adjustment can be easily detected at the position. That is, the detecting part 410 of the embodiment is disposed at a position where the laser beam L can be detected without blocking the laser beam L from propagating toward the target S for processing.

An element capable of sensing light (for example, a laser beam L) (for example, a photodiode) can be used as the detecting part 410. That is, a means for detecting light by converting light itself or information contained in light into an electrical signal is used in the detecting unit 410, and thus the detecting unit 410 can obtain the laser in real time. The oscillation frequency of the beam L and the pulse data.

The conversion section 430 converts the analog data of the laser beam L detected by the detecting section 410 into a digital format. That is, a digitizer is used to convert a signal measured by an optical signal detector for detecting a laser into a digital signal, so that the converted signal can be input to a control section described below.

The determining unit 450 displays the digital data of the laser beam L transmitted from the converting unit 430, and analyzes the digital data of the laser beam L transmitted from the converting unit 430 to determine whether the oscillation signal of the laser beam L is abnormal. That is, the determination unit 450 compares the data of the laser beam L detected by the detecting section 410 (hereinafter referred to as detected data) with the data of the oscillation signal transmitted from the laser control section 110 to the laser generating section 130. The laser beam L in the laser generating unit 100 is oscillated (hereinafter referred to as setting data). When the detected data has the same value as the setting data, the determining section 450 determines that the abnormality of the oscillation of the laser beam L has not occurred. However, when the detected data has a different value from the setting data, the determining section 450 determines that the abnormality of the oscillation of the laser beam L has occurred. As described above, the detected data and the set data may be the frequency data and the pulse data of the laser beam L.

The control section 470 for controlling the laser generating unit 100 according to the determination result of the determining section 450 controls the oscillation operation of the laser generating section 130 based on the result of determining whether the abnormality of the oscillation of the laser beam L has occurred, the result has been The determining component 450 receives. That is, when the determination result received from the determination section 450 indicates that the setting material is different from the measurement material, the control section 470 transmits the correction signal to the laser control section 110 so that the setting data and the measurement data can be equal to each other.

The laser processing apparatus 1 may further comprise an adjustment unit 500 that adjusts the laser beam L for each processing region of the target S for processing in accordance with the position of the table 50 on which the target S for processing is placed. The oscillation mode and the moving speed of the table 50.

The adjustment unit 500 is an element for easily changing the processing condition of the laser beam L according to the position of the target S for processing irradiated by the laser beam L, and includes: a position detecting part 510 that measures the stage 50 Positioning unit 530 coupled to the position detecting unit 510 and the laser generating unit 100 to adjust an oscillation mode of the laser beam L and an operation state of the stage 50 according to the measured position of the stage 50; and the motion control unit 550 It is connected to the adjustment component 530 to control the speed of the table 50 in accordance with the adjusted oscillation mode of the laser beam L.

The position detecting member 510 is an element for measuring the position of the table 50 (because the table 50 is moved), which may use, for example, a position encoder. That is, the position detecting section 510 instantly detects the position of the table 50 and transmits the positional data of the table 50 to the adjusting section 530. In more detail, although the position detecting section 510 collects the positional material of the table 50, the position detecting section 510 can be used to detect the position of the target S for processing placed on the table 50. For example, it is assumed that the work table 50 is laterally divided into the first portion to the tenth portion, and the target S for processing is placed on the work table 50 and covers the third portion to the seventh portion. Therefore, the position detecting section 510 can recognize that the target S for processing does not exist on the first portion and the second portion, but exists on the third portion and the subsequent portion. That is, in order to detect the position of the target S for processing according to the position of the work table 50, the positional relationship between the work table 50 and the target S for processing is set in advance so that it can be detected according to the positional relationship The location of the target S for processing.

The adjusting unit 530 is configured to change the oscillation mode of the laser beam L or the movement of the control table 50 according to the position of the table 50 received from the position detecting unit 510, which will be used to change the control signal of the oscillation mode of the laser beam L. Control signals for changing the moving speed of the table 50 are transmitted to the laser control unit 110 and the motion control unit 550, respectively.

The motion control section 550 receives a control signal for changing the moving speed of the stage 50 from the adjusting section 530, and supplies power for moving the stage 50 in accordance with the received signal.

The laser processing apparatus 1 configured as described above instantaneously compares setting data having an oscillation signal for oscillating the laser beam L with oscillating the laser beam L according to the set oscillation signal (by using a plurality of The laser beam L processes the measurement data of the laser beam L measured after the target S for processing. Therefore, it can be easily determined whether or not an abnormality of the oscillation state of the laser beam L has occurred.

Further, the position of the target S for processing can be easily detected based on the position of the stage 50, and the oscillation mode of the laser beam L and the table can be adjusted for each detected position of the target S for processing. 50 movement speed. Therefore, different process conditions can be easily applied to each position of the target S for processing, and thus processing efficiency and productivity can be increased.

A laser processing method according to an embodiment will be described with reference to FIGS. FIG. 5 is a flow chart illustrating a laser processing method in accordance with an embodiment. FIG. 6 is a flow chart illustrating a laser processing method based on whether to correct a laser generating component, according to an embodiment. 7 is a flow chart illustrating a laser processing method based on processing conditions of a target for processing, in accordance with an embodiment. FIG. 8 is a diagram illustrating an example of FIG. 7.

A laser processing method according to an embodiment includes: setting a plurality of oscillation conditions for controlling oscillation of a plurality of laser beams in accordance with processing conditions of a target S for processing; transmitting the set oscillation conditions to Detecting the plurality of laser beams by oscillating the plurality of laser beams L to oscillate the plurality of laser beams; detecting the plurality of laser beams L that oscillate; and using the detected laser beam data The laser beam oscillation state of the laser generating section 130 is determined.

First, the processing conditions of the target S for processing to be processed by the laser beam L are checked, and the oscillation condition of the laser beam L is set in accordance with the processing condition of the target S for processing (S110). The processing conditions of the target S for processing may include materials and binding energy to the film to be separated. Further, the processing conditions of the target S for processing may include any conditions that may be affected by the energy of the laser beam L when processed by using the laser beam L. In addition, the oscillation conditions of the plurality of laser beams L may be set to be simultaneously driven or alternately driven so that the plurality of laser beams L are simultaneously oscillated or alternately oscillated. Here, when a high-energy laser beam is required to be irradiated to the target S for processing, a plurality of laser beams L can be simultaneously driven, and a laser beam that is required to drive lower energy at the same time is irradiated to the processing for processing. When the target S is set, alternate driving can be set.

When the laser beam oscillation condition is set in accordance with the processing condition of the target S for processing, the laser beam L oscillates according to the set laser beam oscillation condition (hereinafter referred to as the set oscillation condition) (S120). That is, when the set oscillation condition indicates a plurality of laser beams (the laser beam L1 and the laser beam L2) while driving the oscillation mode (as shown in FIG. 3a), the laser control section 110 transmits the oscillation signal. Each of the laser generating members 130 is caused to cause the laser generating member 130 to oscillate the laser beam L1 and the laser beam L2 at the same time. Alternatively, when the set oscillation condition indicates an alternate drive oscillation mode (as shown in FIG. 3b) of the plurality of laser beams (the laser beam L1 and the laser beam L2), the laser control section 110 transmits the oscillation signal to each A laser generating part 130 is such that the laser generating part 130 oscillates the laser beam L1 and the laser beam L2 at different times.

Here, the target S for processing is divided into a first region including an edge in the oscillation direction of the laser beam L and a second region not including the edge and requires laser beam energy in comparison with the second region. In the case where the high laser beam energy processes the first region, the oscillation condition of setting the plurality of laser beams (the laser beam L1 and the laser beam L2) may include detecting the table 50 on which the target S for processing is placed. The position and the moving position of the table 50 are reduced when the detected position of the table 50 is the start position of the first area, while the plurality of laser beams (the laser beam L1 and the laser beam L2) are simultaneously driven.

Further, when the detected position of the table 50 is the start position of the second region, the moving speed of the table 50 can be increased while simultaneously driving a plurality of laser beams (the laser beam L1 and the laser beam L2) To irradiate the laser beam L.

When the laser beam L oscillates in response to the oscillation signal of the laser control section 110, the oscillated laser beam L is detected (S130). Here, the laser beam L can be detected by measuring the oscillation frequency of the laser beam L and the pulse data using the detector supplied to the detecting part 410.

As described above, the oscillation state of the laser beam L can be determined by detecting the laser beam L. Determining the oscillation state of the laser beam L by detecting the laser beam L includes comparing the detected laser beam data with the data of the set oscillation condition (S140), and the value of the detected laser beam data is different from the set value. When the data of the condition is oscillated, it is determined that the laser generating part 130 needs to be corrected.

That is, it is determined whether the detected laser beam data matches the data of the set oscillation condition (S150), and when the detected laser beam data is equal to the data of the set oscillation condition, the oscillation state of the laser beam L is determined. Satisfactory (S160). However, when the detected laser beam data is not equal to the data of the set oscillation condition, it is determined that the oscillation state of the laser beam L needs to be corrected (S200).

As described above, the laser oscillation condition is set according to the processing condition of the target S for processing (S110), the laser beam L is oscillated according to the set oscillation condition (S120), the oscillated laser beam L is detected (S130), and The data of the detected laser beam data and the set oscillation condition (S140, S150) are included in the observed laser oscillation state (S100).

After the laser oscillation state is observed (S100), when it is determined that the laser generating part 130 for generating the laser beam L needs to be corrected (S200), the control section 470 checks the oscillation mode of the laser beam L (S210), and A method of adjusting the processing speed of the target S for processing or the energy of the laser beam L according to the oscillation mode is applied.

In the case where it is determined that the laser generating section 130 needs to be corrected (S200) and the oscillation mode of the laser beam L is simultaneously driven, the stop of the plurality of laser beams (the laser beam L1 and the laser beam L2) is performed after the determination. The oscillation of the laser beam L to be corrected is required between (S220B), and the energy of the laser beam other than the oscillation stop laser beam L is increased during the correction of the oscillation stop laser beam L (S230B).

That is, the oscillation of the laser beam L that needs correction between the plurality of laser beams (the laser beam L1 and the laser beam L2) is stopped (S220B), and the control unit 470 transmits the control signal to the laser control unit. 110, such that the laser beam L that does not require correction oscillates at a higher energy in order to compensate for the laser beam energy that should be delivered by the laser beam L that needs to be corrected to the target S for processing.

In contrast, in the case where it is determined that the laser generating section 130 requires correction (S200) and the oscillation mode of the laser beam L is alternately driven, the stop of the plurality of laser beams (the laser beam L1 and the laser are performed after the determination) The oscillation of the corrected laser beam L is required between the light beams L2) (S220A), and the processing speed of the target S for processing is reduced during the correction of the oscillation stop laser beam L (S230A). Here, the processing speed of the target S for processing can be set to a value calculated by the following Equation 1.

[Equation 1]

V = V0(n-x)/n

(where V represents the calculated processing speed of the target for processing, V0 represents the current processing speed of the target for processing, n represents the number of laser generating components used, and x represents the laser generating component that needs to be corrected number)

Upon completion of the correction of the laser generating part 130, and thus the laser generating part requiring correction is normalized (S240), the operation of the corrected laser generating part 130 is initiated to initiate oscillation of the laser beam L to be corrected. (S250). Further, the laser beam energy adjusted during the correction or the processing speed of the target S for processing may be restored to the previous value (S260A, S260B) before the correction to complete the irradiation of the laser beam L.

Meanwhile, the laser processing method according to another embodiment is a method for applying different processing conditions according to the position of the substrate, including: detecting a position of the stage 50 on which the target S for processing is placed; and according to the work table 50 The detected position controls the oscillation conditions of the plurality of laser beams (the laser beam L1 and the laser beam L2) and the processing speed of the target S for processing.

During the control of the oscillation conditions of the plurality of laser beams (the laser beam L1 and the laser beam L2) and the processing speed of the target S for processing, the detected position at the table 50 corresponds to the target S for processing. At the edge of the plurality of laser beams (the laser beam L1 and the laser beam L2) can be simultaneously driven, and the processing speed of the target S for processing can be reduced.

However, during the control of the oscillation conditions of the plurality of laser beams (the laser beam L1 and the laser beam L2) and the processing speed of the target S for processing, the detected position at the table 50 deviates from the target for processing. At the edge of S, a plurality of laser beams (laser beam L1 and laser beam L2) can be alternately driven, and the processing speed of the target S for processing can be increased.

That is, when the irradiation of the laser beam L is started (S410), the stage 50 starts moving at the first speed (S420). Here, referring to FIG. 8, the position of the workbench 50 can be divided into three sections, that is, section A, section B, and section C, wherein in section A, the target S for processing is not It exists on the work table 50. The section B indicates a section in which the target S for processing exists on the stage 50, and includes an edge of the target S for processing in the moving direction of the stage 50. Section C represents a section of the target S for processing that does not include an edge, which exists on the workbench 50. Here, the segment B contains a bonding region where the bonding strength between the glass and the film of the target S for processing is higher than that of the other regions.

When the position detecting section 510 recognizes that the table 50 enters the joint area of the target S for processing by detecting the position of the stage 50 (S430), the adjusting part 530 is used to apply a plurality of laser beams (laser beam L1) A signal that changes to an oscillation mode of the laser beam L2) to simultaneously drive the oscillation mode is transmitted to the laser control section 110 to irradiate the laser beam L having a higher energy than the energy of the current laser beam L to the junction area, and The signal for slowly moving the stage 50 is transmitted to the motion control section 550 so that the laser beam L is sufficiently irradiated to the joint area. Therefore, the laser control section 110 can control a plurality of laser beams (the laser beam L1 and the laser beam L2) such that the plurality of laser beams (the laser beam L1 and the laser beam L2) have the same oscillation frequency and the same The pulses simultaneously oscillate to increase the energy of the laser beam L that is irradiated to the target S for processing. Further, the motion control section 550 can allow the laser beam L to be sufficiently irradiated to the target S for processing by slowing the movement of the table 50 (S440).

Meanwhile, when the position detecting section 510 recognizes that the table 50 exits the joint area of the target S for processing by detecting the position of the table 50 (S450), the adjusting section 530 is used to apply a plurality of laser beams (laser) A signal in which the oscillation mode of the light beam L1 and the laser beam L2) is changed to alternately drive the oscillation mode is transmitted to the laser control section 110 to irradiate the laser beam L having a lower energy than the energy of the current laser beam L to the junction region, and The moving speed of the table 50 is increased (S460).

That is, the oscillation mode of the laser beam L is used interchangeably to easily remove the bonding by increasing the irradiation density of the laser beam L for the edge portion of the target S for processing and to quickly perform the de-edge portion Processing of the other parts.

According to an embodiment, the oscillation states of the plurality of laser sources can be easily detected and controlled during the laser processing process of the target for processing. That is to say, whether or not the laser oscillation state is abnormal can be determined by comparing the detected data of the oscillating laser with the laser oscillation condition data set according to the processing condition of the target for processing. Further, the oscillation of each of the plurality of lasers can be easily controlled, and thus the plurality of lasers can be simultaneously oscillated easily according to the processing region of the target for processing and whether the laser generating member is abnormal or not. The method is a method of oscillating a plurality of lasers alternately.

Therefore, the problem in the laser oscillation can be detected and corrected immediately, and the oscillation method for the plurality of lasers can be changed as needed, and thus the productivity of the laser processing process can be increased.

In addition, the use time of the laser generating member may be reduced because a plurality of lasers are selectively used as needed, and thus it is possible to prevent an increase in the number of maintenance of the laser generating member.

Although the laser processing apparatus and the laser processing method using the laser processing apparatus have been described with reference to specific embodiments, they are not limited thereto. Accordingly, it will be readily understood by those skilled in the art that

1‧‧ ‧ laser processing equipment
50‧‧‧Workbench
100‧‧‧Laser generating unit
110‧‧‧Road control unit
130, 130a, 130b‧‧‧ laser generating parts
150, 150a, 150b‧‧‧ light valve parts
300‧‧‧Laser processing unit
310‧‧‧Mirror
350‧‧‧beam cutter
400‧‧‧Surface Observation Unit
410‧‧‧Detection parts
412‧‧‧First detector
414‧‧‧Second detector
416‧‧‧ third detector
430‧‧‧ conversion parts
450‧‧‧Determining parts
470‧‧‧Control components
500‧‧‧Adjustment unit
510‧‧‧ position detection unit
530‧‧‧Adjustment parts
550‧‧‧Motion control unit
Sections A, B, C‧‧‧
L, L1, L2‧‧‧ laser beam
S‧‧‧ Targets for processing
S100～S300, S410～S470‧‧‧ steps

The exemplary embodiments may be understood in more detail in the following description in conjunction with the drawings, in which: FIG. 1 is a diagram illustrating a laser processing apparatus in accordance with an embodiment. FIG. 2 is a view for explaining a detailed configuration of the laser generating unit and the laser observation unit of FIG. 1. FIG. 3a and 3b are diagrams illustrating an oscillation mode of a laser according to an embodiment. 4 is a diagram illustrating a laser processing apparatus including an adjustment unit, in accordance with an embodiment. FIG. 5 is a flow chart illustrating a laser processing method in accordance with an embodiment. FIG. 6 is a flow chart illustrating a laser processing method based on whether to correct a laser generating component, according to an embodiment. 7 is a flow chart illustrating a laser processing method based on processing conditions of a target for processing, in accordance with an embodiment. FIG. 8 is a diagram illustrating an example of FIG. 7.

1‧‧ ‧ laser processing equipment

50‧‧‧Workbench

100‧‧‧Laser generating unit

300‧‧‧Laser processing unit

310‧‧‧Mirror

350‧‧‧beam cutter

400‧‧‧Surface Observation Unit

L‧‧‧Laser beam

S‧‧‧ Targets for processing

Claims (18)

A laser processing apparatus comprising: a laser generating unit configured to generate an oscillating signal of a laser beam illuminating a target for processing, and oscillating a plurality of laser beams; a laser processing unit disposed on a propagation path of the laser beam oscillated by the laser generating unit and configured to process the laser beam; and a laser observation unit coupled to the laser on the propagation path At least one of the unit and the laser processing unit determines an operational state of the laser generating unit by detecting an oscillation of the laser beam and by processing and analyzing the detected data. The laser processing apparatus of claim 1, wherein the laser observation unit comprises: a detecting component connected to at least one of the laser generating unit and the laser processing unit, and Configuring to measure an oscillating frequency of the laser beam and pulse data; a conversion component configured to convert analog data of the laser beam received from the detecting component into digital data; and a determining component configured Whether the oscillation signal is abnormal is determined by analyzing a digital signal converted by the conversion section. The laser processing apparatus of claim 2, wherein the laser observation unit includes a control unit configured to control the oscillation signal according to a result of determining whether the oscillation signal is abnormal, The result has been received from the determining component. A laser processing apparatus according to claim 2, wherein the detecting means is disposed at at least one of a position at a front portion of the laser generating unit in a propagation direction of the laser beam a position for reflecting the laser beam toward the target for processing, and a position for controlling the length of the laser beam. The laser processing apparatus of claim 1, wherein the laser generating unit comprises: a laser control component configured to generate the oscillating signal of each of the plurality of laser beams And a laser generating component coupled to the laser control component to oscillate each of the laser beams in accordance with the generated oscillating signal. The laser processing apparatus of claim 1, further comprising an adjustment unit configured to be for the processing according to a position of the work table on which the target for processing is placed Each processing region of the target adjusts an oscillation mode of the laser beam and an operational state of the table. The laser processing apparatus of claim 6, wherein the adjustment unit comprises: a position detecting component configured to measure the position of the table; and an adjustment component connected to the position detection a component and the laser generating unit to adjust the oscillation mode of the laser beam and a moving speed of the table according to a measurement position of the table; and a motion control component connected to the adjustment component The moving speed of the table is controlled in accordance with an adjusted oscillation mode of the laser beam. A laser processing method, comprising: setting a plurality of oscillation conditions for controlling oscillation of a plurality of laser beams according to processing conditions of a target for processing; transmitting the set oscillation condition to a plurality of laser beam oscillating laser generating components to oscillate the plurality of laser beams; detecting the oscillated plurality of laser beams; and determining the laser generation by using the detected laser beam data The laser beam oscillating state of the component. The laser processing method of claim 8, wherein the setting the plurality of oscillation conditions comprises setting an oscillation mode such that the plurality of laser beams are simultaneously driven or alternately driven. The laser processing method of claim 9, wherein the determining the oscillation state of the laser beam comprises: comparing the detected laser beam data with the data of the set oscillation condition; When the value of the detected laser beam data is different from the data of the set oscillation condition, it is determined that the laser generating component requires correction. The laser processing method of claim 10, wherein during the detecting the plurality of laser beams, an oscillation frequency of the plurality of laser beams and pulse data are obtained. The laser processing method of claim 10, comprising: stopping oscillation of a laser beam that needs to be corrected between the plurality of laser beams; and reducing during the correction of the oscillation to stop the laser beam The processing speed of the target for processing is determined to be alternately driven after determining that the laser generating component requires correction. The laser processing method of claim 10, comprising: stopping oscillation of a laser beam that needs to be corrected between the plurality of laser beams; and increasing during the correction of the oscillation to stop the laser beam The energy of the laser beam other than the oscillating stop laser beam is determined to be simultaneously driven after determining that the laser generating component requires correction. The laser processing method of claim 8, comprising: detecting a position of the work table on which the target for processing is placed; and the detected position at the work station is the use Decreasing the moving speed of the table by simultaneously driving the plurality of laser beams at a position where the first region of the processed target starts, at which time, during the setting of the plurality of oscillation conditions, The object for processing is divided into the first region including edges at the oscillation directions of the plurality of laser beams and the second region not including the edges, and the first region needs to be higher than The laser beam energy of the laser beam energy of the second region is processed. The laser processing method of claim 8, comprising: increasing the position when the detected position of the workbench is a position of the second region of the target for processing The moving speed of the table simultaneously drives the plurality of laser beams alternately. A laser processing method comprising: detecting a position of a stage on which a target for processing is placed; and controlling an oscillation condition of the plurality of laser beams according to the detected position of the stage and the The processing speed of the processed target. The laser processing method of claim 16, wherein the controlling the oscillation condition of the plurality of laser beams and the processing speed of the target for processing are included in the workbench The detected position corresponds to the edge of the target for processing, simultaneously driving the plurality of laser beams and reducing the processing speed of the target for processing. The laser processing method of claim 16, wherein the controlling the oscillation condition of the plurality of laser beams and the processing speed of the target for processing are included in the workbench The detected position is offset from the edge of the target for processing, alternately driving the plurality of laser beams and increasing the processing speed of the target for processing.