KR20160073785A - Laser processing system and laser processing method using the laser processing system - Google Patents

Laser processing system and laser processing method using the laser processing system Download PDF

Info

Publication number
KR20160073785A
KR20160073785A KR1020140182547A KR20140182547A KR20160073785A KR 20160073785 A KR20160073785 A KR 20160073785A KR 1020140182547 A KR1020140182547 A KR 1020140182547A KR 20140182547 A KR20140182547 A KR 20140182547A KR 20160073785 A KR20160073785 A KR 20160073785A
Authority
KR
South Korea
Prior art keywords
laser
processing
machining
defective
sensor unit
Prior art date
Application number
KR1020140182547A
Other languages
Korean (ko)
Inventor
김석규
김문섭
송기범
심혁진
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020140182547A priority Critical patent/KR20160073785A/en
Publication of KR20160073785A publication Critical patent/KR20160073785A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Disclosed are a laser processing system and a laser processing method using the same. The disclosed system comprises: a laser light source emitting a laser beam; a beam splitter splitting the laser beam, emitted from the laser light source, into a processing beam and a measurement beam; a scanner performing processing work by radiating the processing beam to a processing object; a sensor part detecting a measurement beam emitted from the beam splitter; and a control part controlling an operation of the scanner and the laser light source, measuring output characteristics of the processing beam from the measurement beam detected by the sensor part. As such, the present invention is capable of simplifying the laser processing system by excluding an extra control device.

Description

[0001] The present invention relates to a laser processing system and a laser processing method using the same,

The present invention relates to laser machining, and more particularly, to a laser machining system capable of detecting an output characteristic of a laser beam in real time and a laser machining method using the same.

The laser processing system irradiates an object to be processed with a laser beam emitted from a laser oscillator by using an optical system, and performs marking, exposure, etching, punching punching, scribing, dicing, and the like.

The quality of the object to be processed by the laser processing system is determined by the state of the laser beam used for laser processing. That is, in order to keep the quality of the object to be processed constant, it is essential to stably and continuously scan the workpiece with the laser beam having the target optical characteristics. If a laser beam deviating from the target optical characteristic is injected into the workpiece, the physical properties of the workpiece may change as desired due to the shape of the workpiece surface being shaped differently than expected, or due to the temperature or the photoreaction of the workpiece to be.

However, always matching the optical characteristic of the laser beam to the target value is a very difficult problem. The laser beam emitted by current laser beam emitting devices has a very incomplete reliability for its quality. Especially, the frequency draft phenomenon of the laser beam or the power density variable phenomenon greatly reduces the reliability of the emitted laser beam condition.

Due to the limitations of such a laser beam emitting apparatus, defective products are often produced in large quantities when mass-processing a workpiece. The mass production of such defective products causes a great loss to companies that perform laser machining processes. Therefore, there is a demand for a laser processing system capable of measuring the optical characteristics of a laser beam emitted from a laser oscillator in real time and providing the result.

Embodiments of the present invention provide a laser processing system capable of detecting output characteristics of a laser beam in real time and a laser processing method using the same.

In one aspect of the present invention,

A laser source emitting a laser beam;

A beam splitter for dividing the laser beam emitted into the laser light source into a working beam and a measuring beam;

A scanner for irradiating the processing object with the processing beam to perform a processing operation;

A sensor unit for detecting the measurement beam coming from the beam splitter; And

And a control unit for controlling the driving of the laser light source and the scanner and for measuring an output characteristic of the processing beam from the measuring beam detected by the sensor unit.

The sensor unit can detect the output of the measurement beam and the pulse waveform in real time. Such a sensor portion may include, for example, a photo diode.

The control unit may measure at least one of the output of the processing beam and the pulse waveform from the measuring beam detected by the sensor unit. The control unit may determine whether the machining beam is defective by measuring an output characteristic of the machining beam. The control unit may stop the laser machining operation if it determines that the output characteristics of the machining beam are defective. In addition, the controller may generate an alarm for notifying that the output characteristic of the machining beam is defective.

In another aspect,

Emitting a laser beam from a laser light source;

Dividing the laser beam into a processing beam and a measurement beam;

Performing a machining operation for irradiating an object to be processed with the machining beam using a scanner; And

And a controller for controlling driving of the laser light source and the scanner determines whether the machining beam is defective from the measurement beam.

The step of determining whether the machining beam is defective includes the steps of: detecting the measurement beam by a sensor unit; Measuring an output characteristic of the processing beam from the measuring beam detected by the sensor unit; And determining whether the machining beam is defective by the control unit.

The sensor unit can detect the output of the measurement beam and the pulse waveform in real time. The control unit may measure at least one of the output of the processing beam and the pulse waveform from the measuring beam. And stopping the laser machining operation when the controller determines that the output characteristic of the machining beam is defective. The control unit may further include an alarm signal generating unit for generating an alarm signal when the output characteristic of the machining beam is determined to be defective.

According to an embodiment of the present invention, a laser beam emitted from a laser light source is divided into a plurality of measurement beams, and then the laser beam is detected through a sensor unit, and the control unit grasps the output characteristics of the processing beam and determines whether the defect is in real time have. Accordingly, when it is determined that the machining beam is defective, the control unit controls the laser beam source to stop the laser machining operation or generate an alarm, thereby preventing defects from occurring due to subsequent machining operations. Further, since the control unit controls the laser light source and the scanner and also determines whether or not the machining beam is defective in real time, a separate control device for detecting the output characteristics of the machining beam and determining whether the machining beam is defective is unnecessary, Can be simplified.

1 schematically illustrates a laser machining system in accordance with an exemplary embodiment of the present invention.
2 is a flow chart illustrating a laser processing method according to another exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

1 schematically illustrates a laser machining system in accordance with an exemplary embodiment of the present invention.

Referring to FIG. 1, a laser processing system includes a laser source 110, a beam splitter 120, a sensor unit 160, and a controller unit 130. The laser light source 110 is a means for emitting a laser beam L. The laser light source 110 is classified into a gas, a liquid, a solid laser light source, or the like depending on the kind of material generating the laser beam L . On the other hand, in this embodiment, the laser light source 110 can emit, for example, a pulsed laser beam. However, the present invention is not limited thereto, and the laser light source 110 may emit a continuous wave laser beam in accordance with a machining operation.

The beam splitter 120 divides the laser beam L emitted from the laser light source 110 into the processing beam L1 and the measurement beam L2. Here, the processing beam L1 divided by the beam splitter 120 is used for a laser processing operation. The measurement beam L2 divided by the beam splitter 120 is used to detect the output characteristics of the processing beam L1, as described later. The measurement beam L2 is formed by dividing only a part of the laser beam L emitted from the laser beam source 110 (for example, 1% or less of the laser beam L emitted from the laser beam source 110) .

The beam splitter 120 may use various types of optical elements capable of dividing the incident light into two. For example, a semi-reflecting mirror can be used as the beam splitter 120, which has a thin silver or aluminum coating on its surface to allow a portion of the light incident at an angle of typically 45 degrees to pass through Some parts divide the beam by reflecting. As another example, a cubic beam splitter using a prism may be used for the beam splitter 120. [ Meanwhile, the above-described examples are merely illustrative examples for the purpose of facilitating the understanding of the invention. In addition, various types of optical elements can be used as the beam splitter 120.

1, the processing beam L1 divided by the beam splitter 120 is progressed by the beam splitter 120 without changing its course, and the measurement beam L2 divided by the beam splitter 120, A beam splitter 120, and the like. However, it is also possible that the path of the processing beam L1 is changed by the beam splitter 120, and the path of the measuring beam L2 is changed by the beam splitter 120. [

The processing beam L1 divided by the beam splitter 120 performs a laser processing operation such as a marking operation or the like on the object W mounted on the processing stage S, for example. The processing beam L1 reaches the object W via a beam delivery system 170, a scanner 140, and a lens unit 150. On the other hand, a reflection mirror (not shown) or the like for changing the optical path of the processing beam L1 may be further provided on the traveling path of the processing beam L1. The beam transmission system 170 is for transmitting the processing beam L1 along a predetermined path. For example, the beam transmission system 170 may include a plurality of mirrors or may include an optical cable or the like.

The scanner 140 performs a predetermined machining operation on the object W by scanning the processing beam L1 on the object W. [ As such a scanner 140, for example, a 2D galvanometer which scans the processing beam L1 in the x and y directions which are perpendicular to each other and parallel to the plane of the object W can be used. The 2D galvanometer can improve the precision of the laser machining operation by finely controlling the scanning point of the processing beam (L1). On the other hand, when the scanning range of the 2D galvanometer is exceeded or when the scanning operation by the 2D galvanometer is completed, the object W can be moved by the processing stage S. The lens unit 150 functions to adjust the focus of the processing beam L1 so that it can be focused at a desired position on the object W of the processing beam L1 via the scanner 140. [

As described above, the processing beam L1 divided by the beam splitter 120 is irradiated onto the object W through a predetermined optical system, thereby performing the laser processing work. The operation of the laser beam source 110 for emitting the laser beam L and the scanner 140 for scanning the processing beam L1 may be controlled by a controller unit 130. The control unit 30 can also determine whether the machining beam L1 is defective by detecting the output characteristics of the machining beam L1 as described later.

The measurement beam L2 divided by the beam splitter 120 is detected by a sensor unit 160. [ The sensor unit 160 may include, for example, a sensor such as a photodiode or the like. However, the present invention is not limited thereto. The sensor unit 160 can detect the output of the measurement beam L2 and / or the pulse waveform. The sensor unit 160 can detect the output characteristic of the measurement beam L2 in real time. However, the present invention is not limited to this, and the sensor unit 160 may detect the output characteristics of the measurement beam L2 at regular time intervals or may detect the output characteristics of the measurement beam L2 at irregular time intervals.

The sensor unit 160 may further include a filter such as an ND filter (Neutral Density Filter) as a means for adjusting the light amount of the measurement beam L2. Meanwhile, the sensor unit may further include an aperture (not shown) as a means for adjusting the light amount of the measurement beam L2. Such an aperture can be placed in the path through which the measuring beam L2 passes and adjust the light quantity of the measuring beam L2 by adjusting the cross-sectional area through which the measuring beam L2 can pass. When the light amount of the measurement beam L2 is excessively small for measurement, the aperture can be increased by increasing the light amount of the measurement beam L2 by increasing the cross-sectional area of the passage. Conversely, if the light amount of the measuring beam (L2) is too large to cause damage to the sensor or excessive noise may be generated, it is possible to reduce the passing cross-sectional area and to reduce the light amount of the measuring beam (L2) You can give.

The sensor unit 160 may further include an optic unit (not shown) including at least one lens for adjusting the optical path of the measurement beam L2. The measurement beam L2 passing through the aperture may cause various noise due to reflection on the inner surface of the sensor unit 160 when light is emitted in the process of reaching the sensor of the sensor unit 160. [ Conversely, if the measurement beam (L2) is too concentrated on a part of the sensor during saturation and saturation occurs, the sensor may be damaged. So to improve this point. To this end, the optic portion may comprise at least one lens. Such an optic portion can appropriately change the optical path of the measurement beam L2 so that the measurement beam L2 can converge at a certain point or reach a larger area of the sensor. The lens of the optic portion may be a convex lens or a concave lens. Further, the position of the lens, the focal length, and the like can be set so that the measurement beam L2 passing through the optic part based on the lens manufacturer's formula can form an image of an appropriate size to the sensor. The lens of the optic part may be a variable lens whose position may be varied as needed in the sensor unit 160 and the focal distance may vary. In the case of a variable lens, it may be a liquid type lens whose surface shape changes due to a change in surface tension due to an electrical signal.

The sensor unit 160 detects an output characteristic of the measuring beam L2 and transmits the detected output characteristic to the controller 130. [ The control unit 130 controls the operation of the laser light source 110 and the scattering unit 140 and detects the output characteristics of the processing beam L1 through the measurement beam L2 as described above. It is judged whether or not it is bad.

The beam splitter 120 divides the laser beam L emitted from the laser beam source 110 into a processing beam L1 and a measurement beam L2 at a constant rate. Accordingly, when the sensor unit 160 detects the output characteristic of the measurement beam L2 and transmits the output characteristic to the control unit 130, the controller 130 can grasp the output characteristics of the processing beam L1 from the measurement beam L2 do. For example, the control unit 130 may detect the output of the processing beam L1 and / or the pulse waveform. Then, the control unit 130 can determine whether the machining beam L1 thus detected is defective or not. That is, the output characteristic range of the previously set processing beam L1 is stored in the control unit 130 and the output characteristic range of the processing beam L1 measured through the sensor unit 160 It is possible to judge whether or not the machining beam L1 that performs the actual machining operation is defective by comparing the output characteristics.

In this way, the control unit 130 detects the output characteristics of the processing beam L1 and determines whether or not it is defective. If the control unit 130 determines that it is not defective, the processing beam L1 can continue the laser processing work. On the other hand, when the control unit 130 detects the output characteristic of the processing beam L1 and judges whether or not it is defective, it is necessary to stop the laser machining operation if it is judged to be defective. That is, even if the machining beam L1 is defective, if the machining operation continues, defective parts are continuously generated. Therefore, in order to prevent this, the control unit 130 detects the output characteristics of the machining beam L1 When it is determined that the processing beam L1 is defective, the laser beam source 110 can be controlled to stop the laser machining operation. In this case, when the control unit 130 detects the output characteristic of the processing beam L1 and determines that the processing beam L1 is defective, it may generate an alarm indicating that the processing beam L1 is defective in advance. The controller 130 can detect the output characteristics of the machining beam L1 in real time to determine whether or not it is defective. However, the present invention is not limited to this. In some cases, the controller 130 may detect an output characteristic of the machining beam L1 at a predetermined time interval to determine whether the machining beam L1 is defective or output the machining beam L1 in an irregular time interval It is possible to determine whether or not there is a defect.

2 is a flow chart illustrating a laser processing method according to another exemplary embodiment of the present invention. Fig. 2 shows a laser machining method using the laser machining system shown in Fig.

Referring to FIG. 2, a laser beam (L in FIG. 1) is emitted from a laser light source (110 in FIG. 1) (S201). Here, the laser beam L may be, for example, a pulsed laser beam, but is not limited thereto. Next, the laser beam L emitted from the laser light source 110 is divided into a machining beam (L1 in Fig. 1) and a measurement beam (L2 in Fig. 1). The beam splitter 120 splits the laser beam L into a processing beam L1 and a measurement beam L2 at a predetermined ratio. The beam splitter 120 splits the laser beam L, .

Next, the processing beam L1 divided by the beam splitter 120 is irradiated onto the object to be processed (W in Fig. 1) via a predetermined optical system and is subjected to a machining operation. The beam is split by the beam splitter 120 The measurement beam L2 is detected by the sensor unit 160 (Fig. 1). Here, the sensor unit 160 can detect the output characteristics of the measurement beam L2, for example, the output of the measurement beam L2 and / or the pulse waveform.

Then, the control unit 130 of FIG. 1 grasps the output characteristics of the processing beam L1 from the measuring beam L2 detected by the sensor unit 160 to determine whether the processing beam L1 is defective or not. The output characteristic of the measurement beam L2 detected by the sensor unit 160 is transmitted to the control unit 130. The control unit 130 detects the output characteristic of the processing beam L1 from the output characteristic of the measurement beam L2 . For example, the control unit 130 detects the output of the processing beam L1 and / or the pulse waveform. Then, the control unit 130 can determine whether the machining beam L1 thus detected is defective or not. That is, the output characteristic range of the previously set processing beam L1 is stored in the control unit 130 and the output characteristic range of the processing beam L1 measured through the sensor unit 160 It is possible to judge whether or not the machining beam L1 is defective by comparing the output characteristics.

The control unit 130 detects the output characteristic of the processing beam L1 and determines whether or not it is defective. If it is determined that the processing characteristic is not defective, the processing beam L1 can continue the laser processing work. On the other hand, if the control unit 130 detects an output characteristic of the machining beam L1 and judges whether or not the machining beam L1 is defective, the control unit 130 stops the laser machining operation or generates an alarm indicating that the machining operation is defective.

As described above, according to the present embodiment, a part of the laser beam L1 emitted from the laser light source 100 is divided into the measurement beam L2, and then it is detected through the sensor unit 160, 130 can grasp the output characteristics of the processing beam L1 and judge whether or not it is defective. Accordingly, when it is determined that the machining beam L1 is defective, the control unit 130 controls the laser beam source 110 to stop the laser machining operation or generate an alarm, thereby causing a failure due to a subsequent machining operation Can be prevented. The controller 130 controls the laser beam source 110 and the scanner 140 and also determines whether the processing beam L1 is defective or not so that the output characteristic of the processing beam L1 is detected, A separate control device for judging is unnecessary, which can simplify the laser processing system.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

110 .. Laser light source 120 .. Beam splitter
130. Control unit 140. Scanner
150 .. Lens part 160 .. Sensor part
170 .. beam delivery system W .. object
S .. Processing stage

Claims (13)

A laser source emitting a laser beam;
A beam splitter for dividing the laser beam emitted into the laser light source into a working beam and a measuring beam;
A scanner for irradiating the processing object with the processing beam to perform a processing operation;
A sensor unit for detecting the measurement beam coming from the beam splitter; And
And a controller for controlling driving of the laser light source and the scanner and for measuring an output characteristic of the processing beam from the measuring beam detected by the sensor unit. The method according to claim 1,
Wherein the sensor unit detects the output of the measuring beam and the pulse waveform in real time. 3. The method of claim 2,
Wherein the sensor unit comprises a photo diode. 3. The method of claim 2,
Wherein the control unit measures at least one of an output of the processing beam and a pulse waveform from the measuring beam detected by the sensor unit. 5. The method of claim 4,
Wherein the control unit measures an output characteristic of the machining beam to determine whether the machining beam is defective or not. 6. The method of claim 5,
Wherein the controller stops the laser machining operation when it is determined that the output characteristic of the machining beam is defective. 6. The method of claim 5,
Wherein the control unit generates an alarm notifying that the output characteristic of the machining beam is defective. Emitting a laser beam from a laser light source;
Dividing the laser beam into a processing beam and a measurement beam;
Performing a machining operation for irradiating an object to be processed with the machining beam using a scanner; And
And a controller for controlling the driving of the laser light source and the scanner to determine whether the processing beam is defective from the measurement beam. 9. The method of claim 8,
Wherein the step of determining whether the machining beam is defective includes:
Detecting the measuring beam by a sensor unit;
Measuring an output characteristic of the processing beam from the measuring beam detected by the sensor unit; And
And determining whether the machining beam is defective by the control unit. 10. The method of claim 9,
Wherein the sensor unit detects the output of the measuring beam and the pulse waveform in real time. 11. The method of claim 10,
Wherein the control unit measures at least one of an output of the processing beam and a pulse waveform from the measuring beam. 12. The method of claim 11,
And stopping the laser machining operation when the controller determines that the output characteristic of the machining beam is defective. 13. The method of claim 12,
Wherein the control unit further comprises generating an alarm notifying that the output characteristic of the machining beam is defective.
KR1020140182547A 2014-12-17 2014-12-17 Laser processing system and laser processing method using the laser processing system KR20160073785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140182547A KR20160073785A (en) 2014-12-17 2014-12-17 Laser processing system and laser processing method using the laser processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140182547A KR20160073785A (en) 2014-12-17 2014-12-17 Laser processing system and laser processing method using the laser processing system

Publications (1)

Publication Number Publication Date
KR20160073785A true KR20160073785A (en) 2016-06-27

Family

ID=56344420

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140182547A KR20160073785A (en) 2014-12-17 2014-12-17 Laser processing system and laser processing method using the laser processing system

Country Status (1)

Country Link
KR (1) KR20160073785A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108311792A (en) * 2017-01-17 2018-07-24 宝山钢铁股份有限公司 Belt steel surface laser scoring apparati
CN111098026A (en) * 2019-12-19 2020-05-05 中国科学院西安光学精密机械研究所 Light beam deflection self-compensation system and method of laser double-pendulum-axis machining head
KR20200052032A (en) * 2018-11-06 2020-05-14 주식회사 이솔 Laser system for baking an object using laser beam and processing method using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108311792A (en) * 2017-01-17 2018-07-24 宝山钢铁股份有限公司 Belt steel surface laser scoring apparati
KR20200052032A (en) * 2018-11-06 2020-05-14 주식회사 이솔 Laser system for baking an object using laser beam and processing method using the same
CN111098026A (en) * 2019-12-19 2020-05-05 中国科学院西安光学精密机械研究所 Light beam deflection self-compensation system and method of laser double-pendulum-axis machining head

Similar Documents

Publication Publication Date Title
US9685355B2 (en) Laser dicing device and dicing method
US9776280B2 (en) Laser welding method
US20160202045A1 (en) Method of measuring the depth of penetration of a laser beam into a workpiece
TWI577482B (en) Laser processing device and laser processing method
CN110142503B (en) Defocusing compensation system for laser cutting and compensation method thereof
US10761037B2 (en) Laser processing device for determining the presence of contamination on a protective window
US9285211B2 (en) Height detecting apparatus
US11065721B2 (en) Method for determining the reference focal position of a laser beam
CN113348047A (en) Method for cutting a workpiece by means of a laser beam and laser processing system for carrying out the method
WO2013151451A1 (en) A method and a system for color marking of metals
KR20160073785A (en) Laser processing system and laser processing method using the laser processing system
KR101279578B1 (en) Auto focusing apparatus for laser processing and auto focusing method using the same
KR20160127461A (en) Laser apparatus and method of manufacturing the same
KR101540174B1 (en) Method of performing beam characterization in a laser scribing apparatus, and laser scribing apparatus capable of performing such a method
US11906388B2 (en) Laser processing machine and state detection method for optical component
WO2016147751A1 (en) Laser beam intensity distribution measurement device and laser beam intensity distribution measurement method
KR101554389B1 (en) Laser processing apparatus
CN107866639B (en) Laser processing device and laser processing method
KR20160059739A (en) Laser processing system and Laser processing method
JP6584053B2 (en) Laser processing apparatus and laser processing method
KR101659858B1 (en) Laser measuring apparatus, laser processing system and laser measuring method
KR20220149027A (en) Laser machining apparatus having laser power monitoring device
JP7121109B2 (en) Sensor system for direct calibration of high power density lasers used in direct metal laser melting
JP2016221545A (en) Laser processing device, and converging angle setting method for laser processing device
KR20120056605A (en) Laser Scanning Device Using Square Type Crossection Laser Beam

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application