KR20200052032A - Laser system for baking an object using laser beam and processing method using the same - Google Patents

Abstract

The present invention provides a laser forming system with a characteristic profile feedback of a laser beam, which comprises: a laser controller (100) for outputting a laser beam; a four-axes stage (200) in which an object (10) to be processed, which is irradiated with the laser beam output from the laser controller (100), is placed and moved on x, y, z, and θ axes; a beam monitor unit (300) provided between the laser controller (100) and the four-axes stage (200) to measure the characteristics of the beam scanned from the laser controller (100) to the object (10) to be processed; a stage control device (400) for controlling the driving of the four-axes stage (200); and a control unit (500) for controlling the driving of the laser controller (100).

Description

Laser system for baking an object to be processed using a laser beam and a processing method using the same {Laser system for baking an object using laser beam and processing method using the same}

The present invention relates to a laser system for baking an object to be processed using a laser beam and a processing method using the same, and more specifically, to monitor various characteristics of the laser beam in real time during the process, and to feedback the laser It relates to a laser system having a characteristic profile feedback of a laser beam capable of stopping the process in the event of a beam abnormality and a processing method using the same.

2. Description of the Related Art Recently, laser devices have been widely used for modification of a substrate surface, via hole machining, or formation of a specific pattern in micro processes such as semiconductors and displays.

To this end, a number of techniques for processing a laser beam into a special shape have been developed, and a technique for processing into a special shape for a new laser application process is still required.

Accordingly, a technique for forming a spatial shape of the laser into lines, faces, etc., that is, a technique of maintaining the spatial intensity of the beam in a specific shape or minimizing the transition width of the edge portion has been developed.

However, this precisely shaped laser beam may be deformed due to environmental factors or the like, unlike an initial recipe setting before being scanned onto an imaging surface, that is, a target.

Therefore, there is a problem that an abnormality is continuously generated in the processed article according to the abnormality of the laser beam.

Accordingly, there is a need for a system and a monitoring method capable of stopping the process in the event of an abnormal laser beam by monitoring various characteristics of the laser beam in real time during the process.

Republic of Korea Patent Publication No. 10-2013-0115887 Republic of Korea Registered Patent Publication No. 10-0967072

The present invention is to solve the above-mentioned problems, and it monitors the characteristics of the laser beam in real time during the process, and feeds it back, and has a characteristic profile feedback of the laser beam that can stop the process when the laser beam is abnormal. It is intended to provide a processing laser system and a processing method using the same.

However, the object of the present invention is not limited to the above-mentioned object, another object not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention includes a laser controller 100 for outputting the shape and size of the laser beam according to the processing requirements, and the object 10 to which the laser beam output from the laser controller 100 is irradiated. It is disposed between the x, y, z, and θ axes and is provided between the four-axis stage 200 and the laser controller 100 and the four-axis stage 200 from the laser controller 100 to the object 10 to be processed. A beam monitor unit 300 for measuring the characteristics of the scanned beam, a stage control device 400 for controlling the driving of the four-axis stage 200, and a control unit 500 for controlling the driving of the laser controller 100 It characterized in that it comprises a).

In addition, the control unit 500 acquires characteristic information of the laser beam measured by the beam monitor unit 300 during processing, analyzes the acquired characteristic information, and references the analyzed characteristic information to a preset laser beam. Compared with the range, when the analyzed characteristic information is out of the error range compared to the reference range of the preset laser beam, it is characterized in that the irradiation of the laser beam is stopped or an action is taken according to the line environment.

At this time, the beam characteristic information is characterized in that the uniformity (uniformity), shape, size, brightness and amount of light of the laser beam.

Here, the beam size is a cross-sectional area of the beam in a direction perpendicular to the straight direction of the laser beam, the beam brightness and beam intensity are characteristics of the laser beam in each time period of interest, and the average of the beam brightness and beam intensity is laser for a certain period of time. After irradiating the beam, the average value can be obtained. In addition, the uniformity of the beam can be confirmed by the distribution of the difference value with respect to the average value of the beam irradiated for a certain period of time, and the smaller the difference value, the better the uniformity.

In addition, the range of these characteristic values can be determined according to the processing state.

On the other hand, the beam monitor unit 300 is a beam measuring unit 310 for measuring the characteristics of the laser beam output from the laser controller 100, and a camera that acquires the image of the imaging surface of the object 10 in real time 320.

And the beam measuring unit 310 transmits and reflects the laser beam output from the laser controller 100, the first beam splitter 311 and the laser beam reflected from the first beam splitter 311. A second beam splitter 312 that transmits and reflects, a photo detector 313 that receives a laser beam transmitted from the second beam splitter 312 and measures the amount of light in the beam in real time; It comprises an image sensor (314) for receiving the laser beam reflected from the second beam splitter 312 to obtain an image of the beam and measure the shape and brightness of the beam.

Further, the start position signal and the end position signal generated by the stage control device 400 are synchronized with the motor control driving the four-axis stage 200, the laser controller 100, the image sensor 314 and the control unit (500).

Here, the laser controller turns on the laser by the start position signal and turns off the laser by the end position signal.

At this time, the control unit 500 is provided with a data collection (DAQ) board 510 for acquiring beam light amount data measured by the photo detector with a starting position signal generated by the stage control device 400 as a starting point, The average and scatter of the beam intensity is measured through the beam intensity data stored in the DAQ board 510.

In addition, the control unit 500 is provided with a grabber (grabber) 520 for obtaining the beam image data photographed by the image sensor from the start position signal generated by the stage control device 400 as a viewpoint, a grabber (grabber) The beam shape and size are checked through the beam image stored in) 520, and the average and the distribution of beam brightness for the beam shape are measured.

Accordingly, the baking processing method using the laser system includes: a, initializing the system (S101), and b, loading the object 10 to the 4-axis stage 200 (S102). W, c, acquiring z-axis height data at multiple points of the object 10 (S103), and d, warming up to stabilization by operating the laser through the laser controller 100. Step (S104), e, the step of measuring the characteristics of the laser beam output during the warm-up (warm-up) (S105), f, the characteristic value of the laser beam measured in step e and the preset reference value Comparing step (S106), g, when comparing the characteristic value of the laser beam measured in step f and a preset reference value, if it is out of the error range, stopping irradiation of the laser beam and operating an alarm (S107) It is made including.

In addition, when the normal state is compared by comparing a characteristic value of the laser beam measured in step h and step f with a preset reference value, the shape and size of the laser output from the laser controller 100 are shaped according to processing requirements. The step (S108) of irradiating to a predetermined area or all areas of the object 10 to be processed, and the control unit 500 as a starting point signal generated by the stage control device 400 during the laser beam irradiation in steps i and h. Acquiring the beam light amount data measured by the photo detector 313, and obtaining the beam image data taken by the image sensor 314 (S109), j, after processing the predetermined area, the control unit 500 is The step (S110) of measuring the characteristics of the laser beam through the beam light amount data and the beam image data obtained in step i, and k, the characteristic value of the laser beam measured in step j and the predetermined reference value In step (S111), when the characteristic values of the laser beam measured after processing the predetermined area in steps l and k are out of an error range compared to a preset reference value, the irradiation of the laser beam is stopped and an alarm is activated. It comprises a step (S112).

In addition, when the characteristic values of the laser beam measured after processing in step m and j are in a normal state compared to a preset reference value, determining whether processing is completed on the entire area of the imaging surface of the object 10 (S113) ) If it is further included, but the processing is not completed on the entire area of the imaging surface of the object 10 in step m, overlapping the processing area of the object 10 to the next line to repeatedly execute steps h to k. do.

In addition, in step e, the characteristics of the laser beam include beam shape, beam size, beam brightness, average beam brightness for beam shape, dispersion of beam brightness for beam shape, beam light amount, average light beam amount, and distribution of beam light amount. Measure.

In addition, in step j, the beam shape, the beam size, the beam brightness, the average of the beam brightness for the beam shape, the dispersion of the beam brightness for the beam shape, the beam light amount, the average of the beam light amount, and the dispersion of the beam light amount are measured.

In addition, the average of the beam intensity is measured by excluding the region of the rising time reaching the preset output value of the laser beam and the falling time reaching the output value 0 from the preset output value. It is characterized by.

Since baking scans while scanning the beam, the characteristics of the laser beam can be checked at regular intervals while scanning one line, so that you can see the scatter at regular intervals over the entire line and measure the average value for this. Can be.

At this time, the interval for measuring the characteristics of the laser beam may generate a trigger signal at regular time intervals or apply a signal generated according to the moving position of the stage to measure the characteristics of the laser beam.

Features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in the specification and claims should not be interpreted in a conventional and lexical sense, and the inventor can properly define the concept of terms in order to best describe his or her invention. Based on the principle of being present, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

As described above, according to the present invention, the laser beam is monitored in real time even during processing using a laser beam to stop the process in the event of an abnormality of the laser beam, thereby preventing a problem that continuously occurs in the object to be processed in advance. It works.

In addition, the laser beam monitoring method according to the present invention has an effect capable of monitoring various characteristics of the beam, such as shape, size, brightness, amount of light, etc. of the beam during the process without affecting the irradiation of the laser beam.

1 is a view schematically showing the configuration of a laser system according to an embodiment of the present invention,
2 is a process flow diagram schematically showing a baking process according to a preferred embodiment of the present invention,
Figure 3 is a process flow diagram schematically showing a baking (baking) process according to another embodiment of the present invention,
4 is a view schematically showing a processing path for an imaging surface according to a preferred embodiment of the present invention;
5 is a view schematically showing a change in the output value of the laser according to an embodiment of the present invention,
6 is a view schematically showing an interface according to a preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In this process, the thickness of the lines or the size of components shown in the drawings may be exaggerated for clarity and convenience.

In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to a user's or operator's intention or practice. Therefore, definitions of these terms should be made based on the contents throughout the present specification.

In addition, the following embodiments are not intended to limit the scope of the present invention, but are merely illustrative of the components presented in the claims of the present invention, and are included in the technical idea throughout the specification of the present invention and constitute the claims. Embodiments that include a substitutable component as an equivalent in the elements can be included in the scope of the present invention.

1 is a schematic view showing the configuration of a laser system according to an exemplary embodiment of the present invention, and FIG. 2 is a process flowchart schematically showing a baking process according to an exemplary embodiment of the present invention. 3 is a process flow diagram schematically showing a baking process according to another embodiment of the present invention, FIG. 4 is a schematic view showing a processing path for an imaging surface according to a preferred embodiment of the present invention, and FIG. 5 is A diagram schematically showing a change in the output value of the laser according to an exemplary embodiment of the present invention, and FIG. 6 is a diagram schematically showing an interface according to an exemplary embodiment of the present invention.

As shown in FIG. 1 or less, a laser shaping system having a characteristic profile feedback of a laser beam according to the present invention includes a laser controller 100, a four-axis stage 200, a beam monitor unit 300, and a stage control device 400 And a control unit 500 is provided.

The laser controller 100 outputs a laser beam, and the laser beam output from the laser controller 100 can adjust the shape and size of the beam cross section by a laser beam shaping optical module.

In addition, the four-axis stage 200 is moved in the x, y, z, θ axis, and the object 10 to which the laser beam output from the laser controller 100 is irradiated is placed.

In addition, the stage control device 400 controls the driving of the four-axis stage 200.

In addition, the beam monitor unit 300 is provided between the laser controller 100 and the four-axis stage 200 to measure the characteristics of the beam scanned from the laser controller 100 to the object 10 to be processed.

In addition, the control unit 500 controls the driving of the laser controller 100, and during processing, acquires characteristic information (characteristic values) of the laser beam measured by the beam monitor unit 300, and acquires the characteristics The information is analyzed, and the analyzed characteristic information is compared with a reference range of a preset laser beam.

In addition, the controller 500 monitors the laser beam in real time by stopping the irradiation of the laser beam or instructing a measure according to the line environment when the analyzed characteristic information is out of an error range compared to a reference range of a preset laser beam. By stopping the process in the event of an abnormality of the laser beam, it is possible to prevent a problem in which an abnormality continuously occurs in the object 10 to be processed in advance.

That is, the control unit 500 may measure uniformity, shape, size, brightness, and amount of light of a laser beam, which is a laser beam characteristic.

Meanwhile, the beam monitor unit 300 includes a beam measuring unit 310 that measures characteristics of a laser beam output from the laser controller 100, and a camera 320 that acquires an image of an imaging surface of the object to be processed 10 ).

At this time, the camera 320 is mainly used to inspect the alignment mark for alignment work, or to acquire and review an image of a required area, and the beam measurement unit 310 is used to measure the characteristics of the beam in real time. do.

In addition, the beam measuring unit 310 includes a first beam splitter 311, a second beam splitter 312, a photo detector (photo detector) 313, an image sensor (image sensor) 314, Is done.

The first beam splitter 311 transmits and reflects the laser beam output from the laser controller 100.

And the second beam splitter 312 transmits and reflects the laser beam reflected from the first beam splitter 311.

At this time, the laser beam transmitted by the first beam splitter 311 is irradiated to the imaging surface of the object 10 to be processed.

Further, the photo detector 313 receives the laser beam transmitted from the second beam splitter 312 and measures the amount of light in the beam in real time.

In addition, the image sensor 314 receives the laser beam reflected from the second beam splitter 312 to acquire an image of the beam to measure the shape and brightness of the beam.

In addition, the start position signal generated by the stage control device 400 is synchronized with the motor control driving the four-axis stage 200 to the laser controller 100, the image sensor 314 and the control unit 500 Is entered.

In addition, the control unit 500 is provided with a data collection (DAQ) board 510 for acquiring beam light amount data measured by the photo detector by a trigger signal generated by the stage control device 400.

Therefore, the control unit 500 measures the average and distribution of the beam intensity through the beam intensity data stored in the DAQ board 510.

In addition, the controller 500 is provided with a grabber 520 that acquires the beam image data captured by the image sensor 314 from the start position signal generated by the stage control device 400 as a starting point.

Therefore, the control unit 500 checks the beam shape and size through the beam image stored in the grabber 520, and measures the average and distribution of beam brightness for the beam shape.

That is, the DAQ board 510 acquires the beam light quantity value (PD value) being measured in real time by using the start position signal as a starting point, and the image sensor 314 acquires an image of the beam to transmit and receive video data. It is transmitted to the control unit 500 through.

Therefore, the control unit 500 obtains information on the characteristics of the beam measured by the photo detector 313 and the image sensor 314 to average and spread the beam light amount and average and spread the beam brightness, beam shape, size, and beam After measuring the average brightness and scattering of the center region of the shape, it may be analyzed whether the characteristic information of the beam is out of an error range by comparing with a preset reference range.

In addition, the control unit 500 may stop the laser beam irradiation according to the analysis result or instruct the system to take measures according to the line environment.

On the other hand, the laser baking process according to the present invention is a laser beam irradiated with respect to the entire surface area of the imaging surface of the object 10 to be modified, and a laser beam having any shape is continuously applied to the entire area of the imaging surface of the object 10 Is investigated.

That is, as shown in FIG. 4, the laser controller 100 or the 4-axis stage 200 is moved in the x-axis direction from the initial point to continuously irradiate the laser beam to a certain area (one line), and a constant area After the processing is completed, the laser controller 100 or the 4-axis stage 200 is moved in the y-axis direction to process the next area (2 lines), and then is moved while laser irradiation is performed in the -x-axis direction. As described above, the above process is repeated for the entire area of the imaging surface to complete processing.

In other words, a certain area of the imaging surface of the object 10 is divided into n lines {n = (1,2, ..., m)} with respect to the entire area to be processed.

At this time, as an example of the present invention, the laser beam uses a line beam, and in some cases, a square beam or a rectangular beam may also be used.

Accordingly, the laser beam is turned on according to the start position signal, turned off according to the end position signal, and the start position and the end position are determined for each line to generate a start position signal and an end position signal at each position.

At this time, the start position signal of the laser beam is generated from the outside of the workpiece, and the laser power must reach the target power before the laser beam is scanned into the workpiece.

That is, when the laser power reaches a target value after a certain period of time after the laser is turned on from the outside of the workpiece by the start position signal, the laser beam enters the outside of the workpiece thereafter. Here, since the 4-axis stage is continuously scanned, the start position signal and the rising time of the laser power reach the target value are well checked and controlled so that normal baking is performed on the workpiece.

In addition, a baking process using a laser system having a characteristic profile feedback of the laser beam will be described with reference to FIG. 2.

First, a step (S101) of initializing the system, and a step (S102) of loading the object to be processed 10 onto the 4-axis stage 200, c, z at multiple points of the object to be processed 10 And obtaining the axial height data (S103).

At this time, the step S103 is a process of obtaining z-axis data for adjusting the z-axis to be positioned within a preset depth, and acquiring the z-axis distance data for the surface of the object 10 to be processed using a displacement sensor. do.

The more points for acquiring the z-axis distance data, the more advantageous, but usually 9 points in the form of a checkerboard shape are suitable, and the average distance value is determined for each measured point, and the calculated average distance value is located at an intermediate position of the depth. The four-axis stage 200 is driven to be positioned.

At this time, the depth of focus is the depth of focus of the lens. When the laser reaches the surface of the object 10 through the lens, the range of z-axis where energy can be concentrated and irradiated is the intermediate position of the depth. It means the middle position of the axis range.

After this process, if the calculated average distance value is located at an intermediate position of the depth, the depth of the normal lens in this process is several tens of μm and the driving precision of the stage is hundreds of nm, so the entire area of the workpiece is baked through scanning. When processing is performed, processing can be performed without difficulty.

On the other hand, after completing the setting of the object to be processed (10), the laser is operated through the laser controller 100 to warm up to stabilization (S104), and output during the warm-up It includes the step of measuring the characteristics of the laser beam (S105), and comparing the characteristic value of the laser beam measured in step S105 with a preset reference value (S106).

At this time, the on / off time information of the start position signal and the end position signal is input to the stage control device 400, and the preset trigger program is executed in the stage control device 400.

Here, in the trigger program, a start position signal and an end position signal necessary for scanning for each line are set, and a start position signal and an end position signal are set.

Accordingly, the laser controller 100, the image sensor 314, and the data acquisition (DAQ) board 510 are in parallel with the start position signal and the end position signal generated by the stage control device 400 by a trigger program. Is entered simultaneously.

In addition, the trigger program generates a trigger signal for collecting light-related data during scanning, and checks the laser shape based on the image grabbed by the grabber 520 at the location of the trigger signal. The average and distribution of PD values of the photodetector 313 acquired from the collection (DAQ) board 510 are calculated.

That is, the beam shape, the beam size, the beam brightness, the average of the beam brightness with respect to the beam shape, the dispersion of the beam brightness with respect to the beam shape, the beam light amount, the average of the beam light amount, and the distribution of the beam light amount are measured.

At this time, the average of the beam amount and the dispersion of the beam amount are the values excluding the region of the rising time reaching the preset output value of the laser beam and the falling time reaching the output value 0 from the preset output value. Measure the mean and scatter.

In addition, when comparing the characteristic value of the laser beam measured in step S106 with a preset reference value, and outside the error range, the step of stopping the irradiation of the laser beam and operating an alarm (S107).

That is, when a user designates a reference value for the characteristic value of the laser beam, and compares the characteristic value of the laser beam measured in step S106 with a preset reference value, and deviates from an error range, an interlock is generated.

Accordingly, it is possible to improve process reliability by pre-measuring the characteristics of the laser beam output during the warm-up of the laser beam, and confirming the laser output state, the operating state of the system, and whether the sensor is combined.

On the other hand, when comparing the characteristic value of the laser beam measured in step S106 with a preset reference value, and in a normal state, the shape and size of the laser output from the laser controller 100 are formed according to processing requirements to form the object to be processed. Further comprising the step of irradiating (S108) to a predetermined area of (10).

In addition, before irradiating a laser beam to a certain area of the object 10, a recipe setup and a job setup for a baking process are performed.

That is, a trigger signal generated at a position for acquiring a laser position value and an end position signal corresponding to a start position signal and an end position corresponding to a start position for setting a process data such as a process area and a process sequence and for scanning a machining area Is set in the control device 400.

In addition, after aligning the auto focus of the loaded object to be processed, alignment data of the object to be processed is generated based on an alignment mark.

Then, after the process reference position of the object to be processed is corrected with the alignment data correction value, the process object is completed by moving the object to a starting position for processing.

In addition, in step S108, the control unit 500 acquires beam light amount data measured by the photo detector 313 by a trigger signal generated by the stage control device 400 during laser beam irradiation, and the image sensor 314 ) Obtaining the image data of the beam (S109), and after processing the predetermined area, the controller 500 measures the characteristics of the laser beam through the beam amount data and the beam image data obtained in the step S109. It includes a step (S110), and comparing the characteristic value of the laser beam measured in the step S110 with a preset reference value (S111).

That is, after the preparation of the process is completed, a laser beam formed in a shape and size according to processing requirements is irradiated to a certain area of the object 10 to be processed, and the processing area on the recipe is based on the job of the recipe. 200) The process is performed while controlling the driving and the laser controller 100.

At this time, the beam position data is stored in the DAQ board 313 by a signal (for example, a trigger signal) for measuring a laser characteristic value as a starting point signal generated when the 4-axis stage 200 is driven, and a grabber The beam image data is stored in (grabber) 520.

In addition, after the processing of the predetermined area (1 line) is completed, waiting for the PD value to be completely filled in the buffer by the DAQ board 313 is performed before processing of the next processing area (2 lines).

In addition, after copying the buffer of the DAQ board 313 and storing the data, the average and spread are calculated through the data in the buffer of the DAQ board 313.

That is, in step S110, the beam shape, the beam size, the beam brightness, the average of the beam brightness for the beam shape, the dispersion of the beam brightness for the beam shape, the beam light amount, the average of the beam light amount, and the dispersion of the beam light amount are measured.

Therefore, it is possible to monitor various characteristics of the beam, such as the shape, size, brightness, and amount of light, during the process without affecting the irradiation of the laser beam.

Accordingly, when the characteristic value of the laser beam measured after processing the predetermined area in step S111 is out of an error range compared to a preset reference value, the step of stopping irradiation of the laser beam and operating an alarm (S112).

That is, when the characteristic value of the measured laser beam is out of an error range compared to a preset reference value, an interlock is generated, an alarm is activated, and the system is stopped.

Therefore, even when the laser beam is processed, the laser beam is monitored in real time to stop the process in the event of an abnormality of the laser beam, thereby preventing a problem in which an abnormality continuously occurs in the object to be processed in advance.

In addition, when the characteristic value of the laser beam measured after processing the predetermined area in the step S111 is in a normal state compared to a preset reference value, determining whether processing is completed on the entire area of the imaging surface of the object 10 ( S113).

Then, in the step S113, when the processing is not completed on the entire area of the imaging surface of the object 10, the steps S108 to S111 are repeatedly performed by overlapping the processing area of the object 10 with the next line.

In addition, in the step S113, when processing is completed on the entire area of the imaging surface of the object 10, the step of unloading the object 10 (S114) is performed to complete the baking process. .

In addition, a baking process according to another exemplary embodiment will be described with reference to FIG. 3, and overlapping descriptions described above will be omitted.

First, a step (S201) of initializing the system, a step (S202) of loading the object to be processed 10 onto the four-axis stage 200, and an alignment mark on the object to be processed 10 ), Obtaining z-axis height data (z-axis compensation data) at multiple points of the object 10 (S203) and aligning the object 10 (S204). It includes.

In addition, after completing the setting of the object to be processed (10), by operating the laser through the laser controller 100 to warm up to stabilization (S205), and during the warm-up (warm-up) And measuring the characteristics of the output laser beam (S206) and comparing the characteristic values of the laser beam measured in step S206 with a preset reference value (S207).

In addition, when comparing the characteristic value of the laser beam measured in step S207 with a preset reference value, and outside the error range, the step of stopping the irradiation of the laser beam and operating an alarm (S208).

On the other hand, when comparing the characteristic value of the laser beam measured in step S207 with a preset reference value, and in a normal state, the shape and size of the laser output from the laser controller 100 are formed according to processing requirements to form the object to be processed. Step (S209) of irradiating to a predetermined area of (10).

In addition, in step S209, the control unit 500 acquires beam light amount data measured by the photo detector 313 by a trigger signal generated by the stage control device 400 during laser beam irradiation, and the image sensor 314 ) Obtaining the beam image data taken in step (S210), and after processing the predetermined area, the control unit 500 measures the characteristics of the laser beam through the beam light amount data and the beam image data obtained in step S210. In step S211, a step S212 of comparing the characteristic value of the laser beam measured in step S211 with a preset reference value.

Accordingly, when the characteristic value of the laser beam measured after processing the predetermined area in step S212 is out of an error range compared to a preset reference value, the step of stopping the irradiation of the laser beam and operating an alarm (S213).

In addition, if the characteristic value of the laser beam measured after processing the predetermined area in step S212 is normal compared to a preset reference value, determining whether processing is completed on the entire area of the imaging surface of the object 10 ( S214).

Then, in the step S214, when the processing is not completed on the entire area of the imaging surface of the object 10, the machining area of the object 10 is overlapped with the next line to repeat steps S209 to S212.

In addition, in the step S214, when processing is completed on the entire area of the imaging surface of the object 10, checking the position state of the object 10 through the alignment mark of the object 10 (S215). It includes.

In addition, in step S215, when the position state of the object to be processed 10 is out of an error range compared to the precision of a preset 4-axis stage 200, a step of stopping the system and operating an alarm (S216). .

In addition, in step S215, when the position state of the object 10 is in a normal state compared to the precision of a preset 4-axis stage 200, the step of unloading the object 10 (S216) ) To complete the baking process.

The step S215 is a step of checking whether there is an abnormality in the stability and precision of the stage. If the position state of the object 10 is within an error within the precision of the stage, the laser beam is scanned at the abnormal position even in the previously performed laser process. Can be inferred.

Accordingly, it is possible to check the process abnormality in advance and to check the abnormal condition before proceeding to the next process, and to prevent or prevent problems that may occur in the future by checking or preventing problems with the drive-related devices such as stages and control devices in advance.

That is, it is possible to indirectly check whether the laser beam is irradiated to the correct position without error in the position of the object to be processed after the process, and to improve the process reliability because the stage driving and the position state of the object to be processed are also checked after the processing is completed.

In addition, it is possible to check the position of the object to be processed 10 through the alignment mark of the object to be processed according to the operator's setting cycle.

Although the present invention has been described in detail through specific examples, the present invention is specifically for describing the present invention, and the present invention is not limited to this, and by those skilled in the art within the technical spirit of the present invention. It is clear that modification and improvement are possible.

All simple modifications or changes of the present invention belong to the scope of the present invention, and the specific protection scope of the present invention will be clarified by the appended claims.

100: laser controller 200: 4-axis stage
300: beam monitor 400: stage control device
500: control unit

Claims (14)

A laser controller 100 for outputting a laser beam,
A four-axis stage 200 in which the object 10 to be irradiated with the laser beam output from the laser controller 100 is placed and moved in the x, y, z, and θ axes;
A beam monitor unit 300 provided between the laser controller 100 and the four-axis stage 200 to measure the characteristics of the beam scanned from the laser controller 100 to the object 10,
A stage control device 400 for controlling the driving of the four-axis stage 200,
A laser system for baking an object to be processed using a laser beam, comprising a control unit (500) for controlling the driving of the laser controller (100).
According to claim 1,
During processing, the control unit 500 acquires characteristic information of the laser beam measured by the beam monitor unit 300, analyzes the acquired characteristic information, and analyzes the analyzed characteristic information with a reference range of a preset laser beam. In comparison, when the analyzed characteristic information is out of an error range compared to a reference range of a preset laser beam, processing with a laser beam is characterized in that the irradiation of the laser beam is stopped or an action is taken according to the line environment. Laser system for baking the object.
According to claim 1,
The beam characteristic is a laser system for baking a workpiece using a laser beam, characterized in that the uniformity, shape, size, brightness and amount of light of the laser beam.
The method of claim 1, wherein the beam monitor unit 300,
A beam measuring unit 310 for measuring the characteristics of the laser beam output from the laser controller 100,
A laser system for baking an object to be processed using a laser beam, comprising a camera (320) for acquiring an image of the imaging surface of the object (10).
According to claim 4, The beam measuring unit 310,
A first beam splitter 311 for transmitting and reflecting the laser beam output from the laser controller 100,
A second beam splitter 312 for transmitting and reflecting the laser beam reflected from the first beam splitter 311,
A photo detector 313 for receiving the laser beam transmitted from the second beam splitter 312 and measuring the amount of light in the beam in real time,
A laser beam comprising an image sensor (314) that receives the laser beam reflected from the second beam splitter (312) and acquires an image of the beam to measure the shape and brightness of the beam. Laser system for baking the object to be processed.
The method of claim 5,
The start position signal and the trigger signal generated by the stage control device 400 are Baking the object to be processed using a laser beam characterized in that it is input to the laser controller 100, the image sensor 314 and the control unit 500 to be synchronized with the motor control driving the four-axis stage 200. Laser system.
The method of claim 6, wherein the control unit 500,
A data collection (DAQ) board 510 for acquiring beam light amount data measured by the photo detector 313 using a start position signal generated by the stage control device 400 as a starting point is provided, and the DAQ board 510 ) A laser system for baking an object to be processed using a laser beam, characterized by measuring the average and scatter of the beam intensity through the beam intensity data stored in.
The method of claim 7, wherein the control unit 500,
A grabber 520 for acquiring beam image data photographed by the image sensor 314 using a starting position signal generated by the stage control device 400 as a starting point is provided, and a grabber 520 A laser system for baking a workpiece using a laser beam, characterized in that the beam shape and size are inspected through the stored beam image, and the average and dispersion of beam brightness for the beam shape is measured.
In the baking (baking) processing method using the laser system of any one of claims 1 to 8,
a, initializing the system (S101),
b, step (S102) of loading the object to be processed (10) on the four-axis stage (200),
c, obtaining z-axis height data at a plurality of points of the object to be processed (S103),
d, warming up to stabilization by starting the laser through the laser controller 100 (S104),
e, measuring the characteristics of the laser beam output during the warm-up (S105),
f, comparing the characteristic value of the laser beam measured in step e with a preset reference value (S106);
g, characterized in that it comprises a step (S107) of stopping the irradiation of the laser beam and activating an alarm when it is out of an error range by comparing the characteristic value of the laser beam measured in step f with a preset reference value. Baking processing method using a laser beam.
The method of claim 9,
h, comparing the characteristic value of the laser beam measured in step f with a preset reference value, and in the normal state, shape and size of the laser output from the laser controller 100 according to processing requirements to form the object to be processed Step (S108) of irradiating to a certain area or all areas of (10),
i, the control unit 500 acquires the beam light amount data measured by the photo detector 313 by the start position signal generated by the stage control device 400 during the laser beam irradiation in step h, and the image sensor 314 Acquiring the captured beam image data (S109),
j, after processing the predetermined area, the control unit 500 measures the characteristics of the laser beam through beam light amount data and beam image data obtained in step i (S110),
k, comparing the characteristic value of the laser beam measured in step j with a preset reference value (S111),
l, including the step (S112) of stopping the irradiation of the laser beam and operating an alarm when the characteristic value of the laser beam measured after processing the predetermined area in step k is out of an error range compared to a preset reference value (S112). Baking processing method using a laser beam, characterized in that made.
The method of claim 10,
m, if the characteristic value of the laser beam measured after processing in step j is normal compared to a preset reference value, determining whether processing is complete for the entire area of the imaging surface of the object 10 (S113) Including,
In the step m, when processing is not completed on the entire area of the imaging surface of the object to be processed 10, it is characterized in that the steps h to k are repeatedly performed by overlapping the processing area of the object to be processed with the next line. Baking processing method using a laser beam.
The method of claim 11,
n, in the step m, when processing is completed for the entire area of the imaging surface of the object 10, unloading the object 10 (S114). Baking processing method used.
The method of claim 9,
In step e, the characteristics of the laser beam measure beam shape, beam size, beam brightness, average beam brightness with respect to beam shape, dispersion of beam brightness with respect to beam shape, beam light amount, average of beam light amount, and dispersion of beam light amount. Baking processing method using a laser beam, characterized in that.
The method of claim 10,
In step j, the beam shape, the beam size, the beam brightness, the average of the beam brightness with respect to the beam shape, the dispersion of the beam brightness with respect to the beam shape, the beam intensity, the average of the beam intensity, and the distribution of the beam intensity are measured. Baking processing method using a laser beam.

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