JP2022063595A - Control device of laser processing machine, laser processing machine, and laser processing method - Google Patents

Abstract

To provide a control device of a laser processing machine which can make pulse energy of a pulse laser beam during laser processing close to a target value.SOLUTION: A control device determines a statistic of a repeating frequency of a pulse of a pulse laser beam used in processing. A pulse laser beam is output from a laser output device with the repeating frequency based on the determined statistic, the pulse laser beam is made to be incident on a measuring instrument, and energy information of the pulse laser beam is acquired from the measuring instrument. An irradiation condition is adjusted based on the acquired energy information, the laser output device is operated on the adjusted irradiation condition, and laser processing is performed.SELECTED DRAWING: Figure 4

Description

The present invention relates to a control device for a laser processing machine, a laser processing machine, and a laser processing method.

A laser processing machine is known in which laser light is reflected by a galvano mirror, condensed by a condenser lens, and incident on a processing object such as a substrate for processing (Patent Document 1). For example, this laser processing machine is used for drilling holes in a printed circuit board. In the laser processing machine disclosed in Patent Document 1, the galvano mirror is positioned at a target rotation angle, and the laser beam is incident on the object to be processed after the positioning of the galvano mirror is completed. As a laser light source, a carbon dioxide laser oscillator that outputs a pulsed laser beam is used.

Japanese Unexamined Patent Publication No. 2004-66300

The shape of the hole formed by laser machining depends on the pulse energy of the pulsed laser beam used for machining. In order to form a hole with a target shape, it is necessary to set the pulse energy of the pulsed laser beam to the target size. In order to set the pulse energy to the target value, the pulse laser beam may be output from the laser oscillator at a constant repetition frequency before the actual machining, and the pulse energy of the pulsed laser beam incident on the machining object may be measured. If the difference between the measured value of the pulse energy and the target value is large, the irradiation conditions are adjusted to bring the pulse energy closer to the target value. However, it has been found that even if this adjustment is performed, a situation may occur in which the actual pulse energy deviates from the target value.

An object of the present invention is to provide a control device for a laser processing machine, a laser processing machine, and a laser processing method capable of bringing the pulse energy of a pulsed laser beam during laser processing close to a target value.

According to one aspect of the invention
Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from a laser output device at a repetition frequency based on the obtained statistic and incident on a measuring instrument, and energy information of the pulsed laser beam is acquired from the measuring instrument.
Provided is a control device for a laser processing machine that adjusts irradiation conditions based on the acquired energy information and operates the laser output device under the adjusted irradiation conditions to perform laser processing.

According to another aspect of the invention
A laser output device that outputs a pulsed laser beam and
A beam scanner that scans the pulsed laser beam output from the laser output device and positions the incident position of the pulsed laser beam on the surface of the workpiece.
A measuring instrument that measures the energy of a pulsed laser beam incident on an object to be machined,
The laser output device and the control device for controlling the beam scanner are provided.
The control device is
Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from the laser output device at a repetition frequency based on the obtained statistic, and energy information of the pulsed laser beam is acquired from the measuring instrument.
Provided is a laser processing machine that controls the laser output device based on the acquired energy information to perform laser processing of an object to be processed.

According to yet another aspect of the invention.
A laser processing method in which a pulsed laser beam is scanned by a beam scanner to sequentially position the incident positions of the pulsed laser beam at a plurality of work points on the surface of the object to be processed and perform laser processing.
Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from the laser output device at a repetition frequency based on the obtained statistics, and energy information of the pulsed laser beam incident on the object to be machined is acquired.
Provided is a laser processing method in which the laser output device is controlled based on the acquired energy information and the beam scanner is operated to perform laser processing.

The repetition frequency of a plurality of virtual laser pulses is approximately equal to the repetition frequency of the pulsed laser beam when the object to be machined is actually machined. By outputting the pulsed laser beam at the repeating frequency based on the obtained statistics of the repeating frequency, it is possible to acquire the energy information of the pulsed laser beam under the condition that the repeating frequency is substantially the same as that at the time of processing. By adjusting the irradiation conditions based on the acquired energy information and operating the laser processing machine under the adjusted irradiation conditions, the laser processing can be performed under the target irradiation conditions.

FIG. 1 is a schematic view of a laser processing machine according to an embodiment. FIG. 2A is a diagram showing an example of the distribution of a plurality of workpieces defined on the surface of the substrate, and FIG. 2B is a diagram showing an example of the machining order of the plurality of workpieces. FIG. 3 is a timing chart showing the temporal relationship between the control and operation of the beam scanner and the output of the pulsed laser beam. FIG. 4 is a flowchart showing a procedure of a laser processing method for performing laser processing using a laser processing machine according to an embodiment. FIG. 5 is a timing chart showing the relationship between the control by the control device during idle operation in step S1 and the operation of the beam scanner. FIG. 6 is a schematic diagram showing a path through which the pulsed laser beam propagates during the execution of step S2. FIG. 7 is a timing chart showing the relationship between the control by the control device and the operation of the laser oscillator during the execution of step S2. 8A and 8B are graphs showing the relationship between the repetition frequency and the pulse energy before and after adjusting the irradiation conditions by the methods according to the comparative examples and the examples, respectively.

A laser beam machine according to an embodiment and a control device thereof will be described with reference to FIGS. 1 to 8B.

FIG. 1 is a schematic view of a laser processing machine according to an embodiment. The laser output device 10 includes a laser oscillator 11, a variable attenuator 12, a beam shaping optical system 13, and an aperture 14. The laser oscillator 11 is, for example, a carbon dioxide laser oscillator, and outputs a pulsed laser beam according to a command from the control device 50. The variable attenuator 12 attenuates the pulsed laser beam output from the laser oscillator 11. The damping factor by the variable attenuator 12 is controlled by the control device 50.

The beam shaping optical system 13 is, for example, a beam expander or the like, and adjusts the beam diameter of the pulsed laser beam whose attenuation amount is adjusted by the variable attenuator 12. A pulsed laser beam whose beam diameter is adjusted by the beam shaping optical system 13 is incident on the aperture 14. The pulsed laser beam that has passed through the aperture 14 becomes the output beam of the laser output device 10.

The pulsed laser beam output from the laser output device 10 is incident on the acoustic optical element (AOD) 20. The acoustic optical element 20 directs the incident pulsed laser beam to any one of the first path 40A, the second path 40B, and the path toward the beam damper 21 by a command from the control device 50. The pulsed laser beam directed to the first path 40A passes through the beam scanner 23A and the condenser lens 24A and is incident on the substrate 60 which is the object to be processed. The pulsed laser beam directed to the second path 40B is reflected by the folded mirror 22, passes through the beam scanner 23B and the condenser lens 24B, and is incident on another substrate 60 to be processed. Drilling is performed by incident a pulsed laser beam on each of the two substrates 60. The board 60 is, for example, a printed wiring board.

As the beam scanners 23A and 23B, for example, a galvano scanner including a pair of swing mirrors is used. The beam scanners 23A and 23B scan the pulsed laser beam in response to a command from the control device 50, and move the incident position of the pulsed laser beam to the commanded position on the surface of the substrate 60 for positioning. As the condenser lenses 24A and 24B, for example, an fθ lens is used.

The two substrates 60 are supported by the horizontal support surface of the movable stage 25. The movable stage 25 moves the two substrates 60 in two directions parallel to the support surface by a command from the control device 50.

Two measuring instruments 30A and 30B are attached to the movable stage 25. The measuring instruments 30A and 30B measure the energy of the incident pulsed laser beam, for example, the energy per pulse (hereinafter referred to as pulse energy). The measured values of the measuring instruments 30A and 30B are input to the control device 50. At the time of measuring the pulse energy, the swing mirrors of the beam scanners 23A and 23B are stationary at a neutral position, the movable stage 25 is moved, and the measuring instruments 30A and 30B are arranged at the incident position of the pulse laser beam. The pulse energy of the pulsed laser beam incident on the measuring instruments 30A and 30B is equal to the pulse energy of the pulsed laser beam incident on the substrate 60, respectively.

An operation command for the laser machine and various data necessary for laser machining are input from the input device 51 to the control device 50. Various data required for laser machining include, for example, position information of a plurality of workpieces on the surface of the substrate 60, target values of pulse energy of a pulsed laser beam used for machining, and the like.

FIG. 2A is a diagram showing an example of the distribution of a plurality of work points 63 defined on the surface of the substrate 60. FIG. 2A shows only a part of the plurality of work points 63. The distribution of the plurality of work points 63 defined on the two substrates 60 supported by the movable stage 25 (FIG. 1) is the same. The outer shape of the substrate 60 is, for example, a rectangle.

Alignment marks 61 are provided at the four corners of the rectangular substrate 60, respectively. A plurality of work points 63 are defined on the surface of the substrate 60. In FIG. 2A, the work point 63 is indicated by a circular symbol, but in reality, the surface of the substrate 60 is not marked in any way, and the positions of the plurality of work points 63 are defined. The data is stored in the control device 50.

A plurality of scan areas 62 are defined on the surface of the substrate 60. Each shape of the scan area 62 is square, and its size is substantially equal to the size of the range in which the beam scanners 23A and 23B (FIG. 1) can be operated to move the pulsed laser beam. The plurality of scan areas 62 are arranged so as to include all the machined points 63 on the substrate 60 within any of the scan areas 62. The plurality of scan areas 62 may partially overlap, and the scan areas 62 may not be arranged in the area where the work points 63 are not distributed.

When processing the two substrates 60, one scan area 62 of each of the two substrates 60 is moved directly under the condenser lenses 24A and 24B (FIG. 1). The scan area 62 is processed by sequentially positioning the incident positions of the pulsed laser beams at a plurality of processed points 63 in the scan area 62 arranged directly below the condenser lenses 24A and 24B. When the processing of one scan area 62 is completed, the movable stage 25 (FIG. 1) is operated to move the scan area 62 to be processed next to the two substrates 60 directly under the condenser lenses 24A and 24B, respectively. Let me. During the machining of one scan area 62, the movable stage 25 is stationary. In FIG. 2A, the machining order of the scan area 62 is indicated by an arrow.

FIG. 2B is a diagram showing an example of the machining order of the plurality of workpiece points 63. A serial number is attached to a plurality of work points 63. The beam scanners 23A and 23B (FIG. 1) are operated to inject a pulsed laser beam into a plurality of work points 63 in the order of serial numbers to process one scan area 62. In FIG. 2B, the machining order of the plurality of workpiece points 63 is indicated by arrows. The machining order of the work point 63 is determined so that, for example, the movement path of the incident position of the pulsed laser beam is the shortest.

An arbitrary set of a plurality of machined points 63 that exist in one scan area 62 and are machined under the same conditions is called a "block". The serial number is assigned to a plurality of work points 63 for each block. The process of injecting a laser pulse into all the work points 63 of one block in order under the same irradiation conditions is called "scan". The number of irradiation conditions when processing the work point 63 of one block is called "the number of cycles".

All of the plurality of machined points 63 to be machined under the same conditions may be included in one block, or some of the plurality of machined points 63 to be machined under the same conditions may be included in one block. May be good. When a part of the work point 63 is included in one block, an arbitrary set of a plurality of other work points 63 not included in the block may be included in the other block.

For example, in the processing of one scan per cycle, one scan is performed under one irradiation condition. In the processing of 1 cycle and 2 scans, two scans are performed under the same irradiation conditions. At this time, the laser pulse is incident on one machined point 63 twice in total. In the two-cycle processing, scanning under the first irradiation condition and scanning under the second irradiation condition different from the first irradiation condition are performed. The pulse width of the pulsed laser beam used differs between the first irradiation condition and the second irradiation condition. For example, in the processing of 2 scans in the 1st cycle and 1 scan in the 2nd cycle, two scans are performed under the first irradiation condition, and then one scan is performed under the second irradiation condition.

FIG. 3 is a timing chart showing the time relationship between the control and operation of the beam scanners 23A and 23B (FIG. 1) and the output of the pulsed laser beam. First, the control device 50 outputs the position command signal sig1 that commands the position of the work point 63 (FIG. 2A) on which the pulsed laser beam should be incident to the beam scanners 23A and 23B. The beam scanners 23A and 23B operate so that the incident position of the pulsed laser beam is positioned at the position commanded by the position command signal sig1. When the positioning is completed, the beam scanners 23A and 23B output the positioning completion signal sig2 notifying the control device 50 of the completion of the positioning.

When the control device 50 receives the positioning completion signal sig2 from both the beam scanners 23A and 23B, the control device 50 outputs the output command signal sig3 to the laser oscillator 11. The laser oscillator 11 starts the output of the laser pulse LP in synchronization with the input of the output command signal sig3. By controlling the acoustic optical element 20, the control device 50 cuts out the laser pulse LPA propagating along the first path 40A and the laser pulse LPB propagating along the second path 40B from the laser pulse LP. In FIG. 3, the laser pulses LPA and LPB are hatched.

The pulse widths of the two laser pulse LPAs and LPBs, and the pulse width PW of the laser pulse LPs are predetermined. After cutting out the two laser pulses LPA and LPB, the control device 50 outputs a stop command signal sig4 for stopping the output to the laser oscillator 11. As an example, the output command signal sig3 and the stop command signal sig4 are represented by the rising and falling edges of the pulse signal, respectively.

The control device 50 outputs the stop command signal sig4 to the laser oscillator 11, and then outputs the position command signal sig1 that commands the position of the machined point 63 (FIG. 2A) to which the laser pulse should be incident. Laser processing in the scan area 62 (FIG. 2A) is performed by repeating the positioning operation by the beam scanners 23A and 23B and the output of the laser pulse LP from the laser oscillator 11.

The time from when the positioning completion signal sig2 is input to the control device 50 until the control device 50 outputs the output command signal sig3 and the time from the output of the stop command signal sig4 to the output of the position command signal sig1 are It is sufficiently shorter than the operating time of the beam scanners 23A and 23B and the pulse width PW of the laser pulse LP. Therefore, the time difference between the positioning completion signal sig2 and the output command signal sig3 and the time difference between the stop command signal sig4 and the position command signal sig1 can be approximated to substantially zero.

When the processing in one scan area 62 (FIG. 2A) is completed, the control device 50 operates the movable stage 25 (FIG. 1), and the scan area 62 to be processed next is placed directly under the condenser lenses 24A and 24B. Move it. After that, by executing the same procedure, processing in the new scan area 62 is performed.

FIG. 4 is a flowchart showing a procedure of a laser processing method for performing laser processing using a laser processing machine according to an embodiment.

Before performing laser machining, idle operation is performed to calculate a statistic of the repetition frequency of the pulsed laser beam used for machining (step S1). In the idle operation, the beam scanners 23A and 23B are operated without operating the laser oscillator 11 (FIG. 1), and the incident position of the pulsed laser beam traces a plurality of processed points 63 (FIG. 2A) in order. As such, the incident position of the pulsed laser beam is positioned.

FIG. 5 is a timing chart showing the relationship between the control by the control device 50 (FIG. 1) during idle operation in step S1 and the operation of the beam scanners 23A and 23B (FIG. 1). The procedure in which the control device 50 outputs the position command signal sig1 to the beam scanners 23A and 23B and receives the positioning completion signal sig2 from the beam scanners 23A and 23B is the same as the procedure at the time of actual laser machining (FIG. 3). .. In the idle operation, the output command signal sig3 (FIG. 3) and the stop command signal sig4 (FIG. 3) are not transmitted to the laser oscillator 11. After receiving the positioning completion signal sig2, the control device 50 waits for a time corresponding to the pulse width PW of the laser pulse LP (FIG. 3), and after the standby, outputs the next position command signal sig1 to the beam scanners 23A and 23B. do. That is, after the time based on the pulse width PW has elapsed from the time when the positioning of the incident position of the pulse laser beam is completed, the positioning operation to the next work point 63 (FIGS. 2A and 2B) is started.

The control device 50 calculates a statistic of the repetition frequency of a plurality of virtual laser pulses when one laser pulse is virtually output in each of the standby periods. For example, an average value is adopted as a statistic. In addition to the average value, the median value, the mode value, and the like may be adopted as the statistic. The calculation of the repeat frequency statistic does not include the time to move the scan area (FIG. 2A). Scans the time required to position the incident position of the pulsed laser beam, that is, the time from the start of the positioning operation to the machined point 63 to be machined first to the completion of positioning to the machined point 63 to be machined last. It is obtained for each area 62, and the statistic is obtained based on the total value of this time and the number of work points 63.

After step S1 (FIG. 4), the control device 50 operates the laser oscillator at a constant repetition frequency based on the obtained statistics to acquire energy information of the pulsed laser beam incident on the substrate 60 (step S2). ).

FIG. 6 is a schematic diagram showing a path through which the pulsed laser beam propagates during the execution of step S2. In FIG. 6, the propagation path of the pulsed laser beam is shown by a thick broken line. The swing mirrors of the beam scanners 23A and 23B are kept stationary in a neutral position. The movable stage 25 is operated to move the measuring instruments 30A and 30B to the incident position of the pulsed laser beam. In this state, the pulse laser beam is output from the laser oscillator 11.

FIG. 7 is a timing chart showing the relationship between the control by the control device 50 (FIG. 1) and the operation of the laser oscillator 11 (FIG. 1) during the execution of step S2. The statistic calculated in step S1, for example, the average value of the repetition frequency is expressed as Fpr. The control device 50 alternately transmits the output command signal sig3 and the stop command signal sig4 to the laser oscillator 11 to output a pulsed laser beam having a repeating frequency Fpr and a pulse width PW. The elapsed time (cycle) from the rise of the laser pulse to the rise of the next laser pulse is equal to 1 / Fpr.

The control device 50 controls the acoustic optical element 20 to propagate the laser pulse LPA propagating along the first path 40A (FIG. 6) from the laser pulse having the pulse width PW, and the laser pulse LPA along the second path 40B (FIG. 6). The laser pulse LPB propagating is cut out. The pulse widths of the laser pulse LPA and the laser pulse LPB are preset as initial values. The laser pulses LPA and LPB are incident on the measuring instruments 30A and 30B (FIG. 6), respectively.

The control device 50 acquires the measured value of the pulse energy from the measuring instruments 30A and 30B, and obtains the average value of the pulse energy. The number of shots for obtaining the average value of the pulse energy shall be such that the average value can be obtained with sufficient accuracy. For example, when the repetition frequency Fpr is 3 kHz, the measurement time is about 30 seconds.

After step S2 (FIG. 4), the control device 50 adjusts the irradiation conditions so that the pulse energy of the pulsed laser beam incident on the substrate 60 approaches the target value based on the energy information acquired in step S2. The adjusted irradiation conditions are stored (step S3). Examples of the irradiation conditions include a laser pulse LPA, a pulse width of LPB (FIG. 3), an attenuation rate of the variable attenuator 12 (FIG. 1), and the like.

For example, when the average of the measured values of the pulse energies acquired in step S2 is larger than the target value, the pulse widths of the laser pulses LPA and LPB (FIG. 3) are made shorter than the initial values. On the contrary, when the average of the measured values of the pulse energies acquired in step S2 is smaller than the target value, the pulse widths of the laser pulses LPA and LPB (FIG. 3) are made longer than the initial values. By adjusting the pulse widths of the laser pulses LPA and LPB in this way, the pulse energy of the pulsed laser beam actually incident on the substrate 60 can be brought close to the target value.

Instead of adjusting the pulse width, the attenuation rate of the pulsed laser beam by the variable attenuator 12 (FIG. 1) may be adjusted. For example, when the average of the measured values of the pulse energies acquired in step S2 is larger than the target value, the attenuation rate by the variable attenuator 12 may be made larger than the attenuation rate at the time of execution of step S2. On the contrary, when the average of the measured values of the pulse energies acquired in step S2 is smaller than the target value, the attenuation rate by the variable attenuator 12 may be smaller than the attenuation rate at the time of execution of step S2.

After step S3 (FIG. 4), the control device 50 performs laser processing of the substrate 60 based on the irradiation conditions stored in step S3 (step S4). For the substrate 60 having the same distribution of the work points 63 (FIG. 2A), only step S4 may be executed based on the already adjusted irradiation conditions without repeating steps S1 to S3.

Next, the excellent effect of the above embodiment will be described with reference to FIGS. 8A and 8B.
8A and 8B are graphs showing the relationship between the repetition frequency and the pulse energy before and after adjusting the irradiation conditions by the methods according to the comparative examples and the examples, respectively. The horizontal axis represents the repetition frequency, and the vertical axis represents the pulse energy. The broken line and the solid line in the graphs of FIGS. 8A and 8B show the relationship between the repetition frequency and the pulse energy before and after the irradiation condition adjustment, respectively. In general, the pulse energy depends on the repetition frequency, and the pulse energy tends to decrease as the repetition frequency increases.

In the comparative example, the pulse energy is actually measured by outputting the pulsed laser beam at a predetermined repetition frequency Fpr2 determined in advance under the irradiation conditions before adjustment in step S2 without executing step S1 of FIG. As a result, the measured value Epm (FIG. 8A) can be obtained. The target value Ept of the pulse energy (FIG. 8A) is compared with the actually measured value Epm, and the irradiation conditions are adjusted so that the pulse energy of the pulsed laser beam incident on the substrate 60 approaches the target value Ept. The relationship between the repetition frequency and the pulse energy under the adjusted irradiation conditions is shown by a solid line (FIG. 8A). Under the adjusted irradiation conditions, the pulse energy matches the target value Ept when the repetition frequency is Fpr2.

The average repetition frequency when the actual laser machining is performed in step S4 is expressed as Fpr1. The average repetition frequency Fpr1 is different from a predetermined repetition frequency Fpr2. Therefore, when laser machining is performed under the adjusted irradiation conditions, the pulse energy Epw (FIG. 8A) at the repetition frequency Fpr1 at the time of machining deviates from the target value Ept.

On the other hand, in the embodiment, as shown in FIG. 8B, the statistics of the repetition frequency of the pulsed laser beam used for laser processing, for example, the average repetition frequency Fpr1 and the repetition frequency Fpr2 of the pulse laser beam used in step S2. Are equal. Therefore, when laser machining is performed under the adjusted irradiation conditions, the pulse energy Epw at the repetition frequency Fpr1 at the time of machining matches the target value Ept. As a result, laser machining can be performed with pulse energy substantially equal to the target value Ept. As a result, the processing quality, for example, the quality of the hole shape can be improved.

Next, a modification of the above embodiment will be described.
In the above embodiment, the statistic of the repetition frequency is obtained for each substrate 60 having the same distribution of the machined points 63. That is, one irradiation condition is stored for the substrate 60 having the same distribution of the processing points 63. In step S4 (FIG. 4), for the substrate 60 having the same distribution of the workpiece points 63, laser machining is performed in all the scan areas 62 (FIG. 2A) in the substrate 60 under the same irradiation conditions.

On the other hand, the statistic of the repetition frequency may be calculated for each scan area 62 (FIG. 2A), and the irradiation conditions may be obtained for each scan area 62. In this case, laser processing is performed by changing the irradiation conditions for each scan area 62. For example, when the average value of the repetition frequency is significantly different among the plurality of scan areas 62, it is preferable to set the irradiation conditions for each scan area. Thereby, the processing quality can be improved in all the scan areas 62.

In the above embodiment, the laser beam is branched into the first path 40A and the second path 40B (FIG. 1) by the acoustic optical element 20, but the laser beam is branched into two by using an optical component other than the acoustic optical element 20. You may let me. For example, a half mirror may be used to split the laser beam into two. Further, in the above embodiment, the laser processing is performed on two paths, the first path 40A and the second path 40B (FIG. 1), but the laser processing may be performed on one path. In this case, the acoustic optical element 20 may be branched into a first path 40A and a path toward the beam damper 21.

In the above embodiment, the measuring instruments 30A and 30B used are measuring instruments that measure pulse energy, but in addition, measuring instruments that can measure physical quantities that fluctuate according to pulse energy may be used. For example, as measuring instruments 30A and 30B, sensors capable of measuring the average power of the pulsed laser beam may be used. The pulse energy can be obtained by multiplying the measured value of the average power by the repetition frequency.

In the laser processing of one scan area 62 (FIG. 2A), when a plurality of cycles are executed under different irradiation conditions, the procedures from step S1 to step S3 are executed for each irradiation condition corresponding to the cycles, and different irradiations are performed. It is advisable to adjust the irradiation conditions for each condition.

In the above embodiment, the statistic of the pulse repetition frequency of the pulsed laser beam used for processing is calculated by performing idle operation (step S1), but the statistic of the pulse repetition frequency is obtained by another method. You may. For example, the movement distance of the incident position is obtained from the distribution and the processing order of the plurality of work points 63 (FIGS. 2A and 2B), and the time required for positioning is obtained from the movement distance. The time required for processing is obtained from the total time required for this positioning and the pulse width of the pulsed laser beam. It is possible to calculate the statistic of the pulse repetition frequency from the time required for machining and the number of machining points.

The above-mentioned examples are examples, and the present invention is not limited to the above-mentioned examples. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

10 Laser output device 11 Laser oscillator 12 Variable attenuator 13 Beam shaping optical system 14 Aperture 20 Acoustic optical element (AOD)
21 Beam damper 22 Folded mirror 23A, 23B Beam scanner 24A, 24B Condensing lens 25 Movable stage 30A, 30B Measuring instrument 40A 1st path 40B 2nd path 50 Control device 51 Input device 60 Board 61 Alignment mark 62 Scan area 63 Processed point

Claims (7)

Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from a laser output device at a repetition frequency based on the obtained statistic and incident on a measuring instrument, and energy information of the pulsed laser beam is acquired from the measuring instrument.
A control device for a laser processing machine that adjusts irradiation conditions based on the acquired energy information and operates the laser output device under the adjusted irradiation conditions to perform laser processing. The control device for a laser processing machine according to claim 1, wherein the statistic of the repetition frequency of the laser pulse is an average value. The energy information is the average value of the pulse energy of the pulsed laser beam.
Adjust the pulse width of the pulsed laser beam so that the pulse energy of the pulsed laser beam incident on the object to be machined approaches the target value.
The control device for a laser machining machine according to claim 1 or 2, wherein laser machining is performed with the adjusted pulse width. The energy information is the average value of the pulse energy of the pulsed laser beam.
Adjust the attenuation of the pulsed laser beam incident on the workpiece so that the pulse energy of the pulsed laser beam incident on the workpiece approaches the target value.
The control device for a laser machining machine according to claim 1 or 2, wherein laser machining is performed with an adjusted attenuation amount. In the procedure for obtaining the statistic,
The procedure for operating the beam scanner to position the incident position of the pulsed laser beam at one work point on the surface of the workpiece, and
A procedure for starting the positioning operation by the beam scanner to the next work point after a lapse of time based on the pulse width of the pulsed laser beam used for machining from the time when the positioning of the incident position to the work point is completed. repetition,
The order in which the incident positions of the pulsed laser beams are positioned at multiple workpieces is the same as the order at the time of machining, from the start of the positioning operation to the workpiece to be machined first to the workpiece to be machined last. The control device for a laser machine according to any one of claims 1 to 4, wherein the statistic is obtained based on the time until the positioning is completed and the number of points to be machined. A laser output device that outputs a pulsed laser beam and
A beam scanner that scans the pulsed laser beam output from the laser output device and positions the incident position of the pulsed laser beam on the surface of the workpiece.
A measuring instrument that measures the energy of a pulsed laser beam incident on an object to be machined,
The laser output device and the control device for controlling the beam scanner are provided.
The control device is
Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from the laser output device at a repetition frequency based on the obtained statistic, and energy information of the pulsed laser beam is acquired from the measuring instrument.
A laser processing machine that controls the laser output device and the beam scanner based on the acquired energy information to perform laser processing of an object to be processed. A laser processing method in which a pulsed laser beam is scanned by a beam scanner to sequentially position the incident positions of the pulsed laser beam at a plurality of work points on the surface of the object to be processed and perform laser processing.
Obtain the statistic of the repetition frequency of the pulse of the pulse laser beam used for processing.
A pulsed laser beam is output from the laser output device at a repetition frequency based on the obtained statistics, and energy information of the pulsed laser beam incident on the object to be machined is acquired.
A laser processing method in which the laser output device is controlled based on the acquired energy information and the beam scanner is operated to perform laser processing.

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