JP2018094582A - Laser processing device and laser processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing device which suppresses laser power, shortens a tact time, and can enhance productivity.SOLUTION: A laser processing device 1 which pulse oscillates a laser beam L and intermittently irradiates a resin film 2 with the pulse-oscillated laser beam L, and cuts the resin film 2 includes: a multilaser injection section 3 which injects the multiple laser beams L at predetermined intervals; an optical system 4 which focuses the multiple laser beams L injected from the multilaser injection section 3 into a predetermined beam shape, and guides the laser beams L onto the resin film 2; a transport device 5 which moves the resin film to any one direction out of two directions perpendicular to each other in the same plane with a predetermined movement speed; and a control section 6 which sets a line for cutting the resin film 2 in the resin film 2, and controls the irradiation position and the movement speed of the laser beam L having the beam shape so as to sequentially irradiate the respective focused laser beam L having the beam shape according to the line.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus that efficiently cuts and processes a resin film with a laser beam and a laser processing method that is performed by the laser processing apparatus.

  Conventionally, a technique of cutting a polyimide resin film used in a display panel such as an organic EL (Electroluminescence) with a laser beam has been disclosed (for example, see Patent Document 1). In this disclosed technique, the resin film is cut by laser ablation.

JP 2014-048619 A

  However, since the resin film for display panels has lower heat resistance than the glass substrate for display panels, when the laser power is increased, the areas other than the part to be cut of the resin film are dissolved or the cut surface is carbonized. It is difficult to obtain a good cut surface. Therefore, in order to obtain a good cut surface, it is necessary to irradiate while suppressing the laser power. Then, for example, even if a process of moving the resin film and irradiating a laser from the front end to the rear end of the line for cutting the resin film (hereinafter simply referred to as “scan”), it is cut in one scan. It may not be possible, and it may occur that scanning must be performed many times depending on the film thickness. For this reason, the tact time from the start to the end of cutting becomes longer in proportion to the number of scans, resulting in a problem that productivity is lowered.

  In view of the heat resistance of the resin film, the problem to be solved by addressing such problems is to reduce the tact time while reducing the laser power when cutting the resin film. An object of the present invention is to provide a laser processing apparatus and a laser processing method capable of improving the performance.

  In order to achieve the above object, a laser processing apparatus according to the present invention is a laser processing apparatus that oscillates a laser beam intermittently and irradiates the resin film, and cuts the resin film in advance. The same as the multi-laser emitting section that emits a plurality of light beams at a predetermined interval and the optical system that focuses the laser beams emitted from the multi-laser emitting section into a predetermined beam shape and guides them onto the resin film. A conveying device for moving the resin film in one direction at a predetermined moving speed with respect to two directions orthogonal to each other in a plane, and a line for cutting the resin film are set in the resin film. The irradiation position of the laser beam having the beam shape and the moving speed so as to sequentially irradiate the focused laser beam having the beam shape so as to match the line. And a control unit for controlling.

  Further, the laser processing method according to the present invention is a laser processing method in which laser light is oscillated in a pulsed manner to intermittently irradiate the resin film, and the resin film is cut. A process for injecting, a process for converging a plurality of emitted laser beams into a predetermined beam shape, respectively, and leading to the resin film, and a line for cutting the resin film are set in the resin film, While moving the resin film in either one direction at a predetermined moving speed with respect to two directions orthogonal to each other in the same plane, the focused laser beams having the beam shapes are aligned with the lines. A process of controlling the irradiation position of the laser beam having the beam shape and the moving speed is performed so as to sequentially irradiate.

  According to the laser processing apparatus and the laser processing method of the present invention, the resin film is efficiently cut by sequentially irradiating the focused laser beams having the above-mentioned beam shapes so as to match the above lines, so that the laser power is suppressed. Also, the tact time can be shortened to increase productivity.

It is a block diagram which shows an example of the laser processing apparatus by this invention. It is a side view of the resin film shown in FIG. It is a top view of the resin film shown in FIG. It is a top view which shows one structural example of the multi-beam optical system used with the laser processing apparatus by this invention. FIG. 5 is a cross-sectional view of the multi-beam optical system shown in FIG. 4 taken along line OO. It is explanatory drawing which shows an example of the order cut | disconnected by matching a laser beam with the line for cut | disconnecting a resin film. It is explanatory drawing which shows the other example of the order cut | disconnected by matching a laser beam with the line for cut | disconnecting a resin film. It is a flowchart which shows an example of the laser processing method by this invention. It is explanatory drawing which shows an example of the laser processing method by this invention. It is a block diagram which shows an example of the modification of the laser processing apparatus by this invention.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a block diagram showing an example of a laser processing apparatus according to the present invention. 2 is a side view of the resin film shown in FIG. 1, and FIG. 3 is a plan view of the resin film shown in FIG. A laser processing apparatus 1 shown in FIG. 1 cuts, for example, a resin film 2 for an organic EL display panel. As a configuration example, a multi-laser emitting section 3, a multi-beam optical system 4, and a transport apparatus 5 are used. And a control unit 6. The multi-laser emission unit 3, the multi-beam optical system 4, the transport device 5, and the control unit 6 are examples of the multi-laser emission unit, the optical system, the transport device, and the control unit according to the present invention, respectively. The resin film 2 for an organic EL display panel is an example of a resin film that is cut by the laser processing apparatus 1.

  Here, the resin film 2 shown in FIG. 2 is formed by laminating a PET (polyethylene terephthalate) film 21 and a polyimide film 22 in this order. As an example, the film thickness of the resin film 2 is 50 μm for the PET film 21, 10 μm for the polyimide film 22, and 60 μm in total. Moreover, the size of the resin film 2 shown in FIG. 3 is the same as the size G4.5 of the glass substrate before cutting out for liquid crystal display panels as an example, and is 730 × 920 mm. In addition, the size of the resin film 2 is not limited to G4.5, and may be appropriately changed depending on the application, such as G6 (1500 × 1850 mm).

  In FIG. 3, a broken line 23 shown in the resin film 2 is a line for cutting the resin film 2. However, the line is not actually attached to the resin film 2 as an example, but is a line set by the laser processing apparatus 1 for cutting the resin film 2, and in this embodiment, for convenience of explanation. A line is virtually attached to the resin film 2. In this embodiment, the line is partitioned in order to cut the resin film 2 into blocks (rectangular shapes), and in order to make the explanation easy to understand, (0, 0) to (12, 12) in xy coordinates, It represents that an area surrounded by four coordinate points is cut out.

  In this embodiment, for example, as the longitudinal line, the (1, 0) to (1, 12) lines in the xy coordinates are the first line, and the (2, 0) to (2, 12) lines are the same. The second line, (3, 0) to (3, 12) is the third line, and (4, 0) to (4, 12) is the fourth line. In the present embodiment, for example, as the line in the transverse direction, the lines (0, 1) to (5, 1) in the xy coordinates are changed to the fifth line, and the lines (0, 2) to (5, 2) are changed. The sixth line,... (0, 10) to (5, 10) is the 14th line, and (0, 11) to (5, 11) is the 15th line. Here, about the resin film 2 shown in FIG. 3, the laser processing apparatus 1 processes 60 sheets as a film for display panels of electronic devices, such as a smart phone, by cut | disconnecting the 1st-15th line, for example. Details will be described with reference to the flowchart of FIG.

  Returning to FIG. 1, the transport device 5 moves the resin film 2 in either one direction at a predetermined moving speed with respect to two directions orthogonal to each other in the same plane. Specifically, the transport device 5 places the resin film 2 on the stage 7 and moves the stage 7 in the x direction or the y direction shown in FIG. Therefore, the moving speed of the stage 7 becomes the moving speed of the resin film 2 as it is. Further, the transport device 5 further includes a rotation drive mechanism for changing the entire direction of the resin film 2, and rotates the stage 7 by, for example, 90 degrees according to an instruction from the control unit 6.

  In this embodiment, when the cutting of the resin film 2 is started, the transfer device 5 moves the stage 7 to start cutting from the first line shown in FIG. , 0) is transported and positioned so that the coordinate position of (0) becomes the first irradiation position (hereinafter referred to as “irradiation start position”). In this case, the first line is positioned so as to be parallel to the scanning direction (arrow A direction). When the resin film 2 is cut by one scanning, the transport device 5 moves the stage 7 with the scanning direction indicated by the arrow A as the forward path and cuts the resin film 2 by two scannings. Moves the stage 7 with the scanning direction indicated by the arrow B as the return path.

  A multi-beam optical system 4 is disposed above the transport device 5, and a multi-laser emitting unit 3 is disposed above the multi-beam optical system 4. However, the multi-laser emitting section 3 does not necessarily have to be disposed above the multi-beam optical system 4 if the optical path of the laser is changed using, for example, a reflection mirror.

  The multi-laser emitting unit 3 oscillates the laser light L in a pulsed manner and emits a plurality of light at predetermined intervals. Specifically, the multi-laser emitting unit 3 includes, for example, a plurality of identical laser oscillators, and each laser oscillator emits ultraviolet laser light L from each emission port. These injection ports are arranged in a straight line at equal intervals. In this case, for example, the multi-laser emitting unit 3 emits a YAG (Yttrium Aluminum Garnet) laser having a wavelength of 355 nm (third harmonic). In the present embodiment, for convenience of explanation, the multi-laser emission unit 3 is configured to be able to output the laser light L from each of the seven emission ports. The laser to be used is not limited to the YAG laser, and for example, a pulse laser with another wavelength such as an excimer laser having a wavelength of 308 nm may be employed. However, it is preferable not to employ a continuous wave (CW) system in order to avoid the influence of heat accumulation and the like caused by laser irradiation. Therefore, in this embodiment, the pulse laser system is adopted.

  The multi-beam optical system 4 focuses the laser beams L emitted from the multi-laser emitting unit 3 into predetermined beam shapes and guides them onto the resin film 2. In the present embodiment, the multi-beam optical system 4 is composed of, for example, a microlens array.

  FIG. 4 is a plan view showing a configuration example of a multi-beam optical system used in the laser processing apparatus according to the present invention. FIG. 5 is a cross-sectional view of the multi-beam optical system shown in FIG. 4 taken along the line OO. Here, the multi-beam optical system 4 has a plurality of microlenses arranged in a straight line at equal intervals according to the arrangement pitch of the exits of the laser beams L emitted by the multi-laser emitting section 3. A microlens array that focuses L into beam shapes is provided.

  As an example, in the case where the multi-laser emitting section 3 has seven exit ports, the multi-beam optical system 4 is provided with seven microlenses 4a to 4g corresponding thereto. The multi-beam optical system 4 focuses the laser beams L emitted from the multi-laser emitting section 3 into predetermined beam shapes by the seven microlenses 4 a to 4 g and guides them onto the resin film 2. . In this case, the beam interval of the laser light L irradiated onto the line of the resin film 2 is 5 mm as an example.

  The control unit 6 sets a line for cutting the resin film 2 on the resin film 2, and sequentially irradiates the beam-shaped laser beams L that are focused on the lines so as to match the lines. L irradiation position and moving speed are controlled. The control unit 6 is connected to the multi-laser emitting unit 3 and the transfer device 5 via a communication cable, and can instruct commands for control.

  FIG. 6 is a block diagram illustrating a configuration example of a control unit of the laser processing apparatus according to the present invention. The control unit 6 includes a processor and a memory. The processor is, for example, a CPU (Central Processing Unit), and executes an overall control process for the multi-laser emitting unit 3 and the transfer device 5. In the memory, for example, user input data from an operator via an external input means is stored. The user input includes parameters such as the size and thickness of the resin film 2 and the size of one block processed by cutting.

  Moreover, the control part 6 sets a coordinate virtually to the resin film 2 as mentioned above based on the parameter of a user input, and calculates | requires the coordinate of a line among them by calculation. Thereby, the control unit 6 sets a line for cutting the resin film 2. Furthermore, the control unit 6 sets control parameters including laser power, focal spot size (spot diameter, etc.), moving speed of the resin film 2, the number of scans, and the scan order based on user input parameters. However, data input by the user by the operator may be set.

Next, an example of operation | movement of the laser processing apparatus 1 comprised in this way is demonstrated.
First, as an example, the control unit 6 of the laser processing apparatus 1 shown in FIG. 1 has a resin film 2 size (730 × 920 mm), a film thickness (66 μm), and a size of one block processed by cutting (77 × 146 mm). Are read from the memory. And the control part 6 sets said control parameter. In this case, as an example, the control unit 6 includes each laser power (about 1 W (watt)), a spot diameter (20 μm), a moving speed of the resin film 2 (100 mm / sec), and the number of scans of each line (twice). The control parameters including the scanning order (see FIGS. 6 and 7) are set.

  Specifically, in this embodiment, the repetition frequency of the pulse laser is 80 kHz, the laser power per irradiation is 12 μJ, and the laser power per second is 80 kHz × 12 μJ = 0.96 W (about 1 W). Yes.

  FIG. 6 is an explanatory diagram illustrating an example of an order of cutting by matching a laser beam with a line for cutting a resin film. FIG. 7 is an explanatory view showing another example of the order of cutting by matching the laser beam with the line for cutting the resin film. In this embodiment, since the resin film 2 is moved and cut, the laser processing apparatus 1 first cuts the resin film 2 in the order of the first to fourth lines in the longitudinal direction (see FIG. 6). Subsequently, after rotating the stage 7 by 90 degrees, the laser processing apparatus 1 cuts the resin film 2 in the order of the fifth to fifteenth lines in the transverse direction (see FIG. 7).

  6 and 7 exemplify a case where each line is cut by one scan. However, depending on the film thickness, there may be a case where cutting cannot be performed only by scanning the same line once in relation to control parameters such as laser power. Therefore, the laser processing apparatus 1 introduces means for cutting the resin film 2 by scanning the same line N times (for example, N = 2) as necessary. Therefore, in the case of scanning twice, the laser processing apparatus 1 cuts by reciprocating the same line of the resin film 2.

  Here, the multi-laser emission unit 3 of the laser processing apparatus 1 shown in FIG. 1 is in a ready state in which laser irradiation is possible, and shutters (not shown) of the respective emission ports provided in the multi-laser emission unit 3 are provided. When opened, laser irradiation is started. For example, when the control unit 6 receives a cutting start instruction input from an operator, the laser processing apparatus 1 starts the process of the flowchart shown in FIG. 8 and performs the cutting of the resin film 2. However, in this embodiment, a glass substrate (not shown) is provided between the stage 7 and the resin film 2, and means for adsorbing one side of the resin film 2 to the glass substrate is employed. Thereby, in this embodiment, even if each line of the resin film 2 is cut | disconnected, each block of the resin film 2 is made not to be dispersed. In the present embodiment, the present invention is not limited to the above means, and other means in which each block is not discrete may be employed.

FIG. 8 is a flowchart showing an example of a laser processing method according to the present invention.
In step S101, a process of emitting a plurality of laser beams L at a predetermined interval is executed. Specifically, the control unit 6 issues an instruction to open the shutter of the multi-laser emitting unit 3 and controls the multi-laser emitting unit 3 by emitting laser light L.

  In step S <b> 102, a process of focusing each beam in a predetermined beam shape and guiding it onto the resin film 2 is executed. Specifically, the multi-beam optical system 4 focuses each laser beam L emitted from the multi-laser emitting unit 3 into a laser beam having a spot diameter of 20 μm as an example.

  In step S103, the process which cut | disconnects the said nth line of the said cutting target of the resin film 2 by multi-laser irradiation is performed. Specifically, the control unit 6 sets n = 1 among the nth lines as the line number n (for example, a natural number from n = 1 to 15). First, the first line is shown in FIG. In order to cut time-sequentially in the direction of (1, 0) to (1, 12) in the xy coordinates, the resin is applied so as to sequentially irradiate each focused beam-shaped laser beam L in line with the first line. The irradiation position and moving speed of the laser beam L on the film 2 are controlled.

  Specifically, the control unit 6 issues an instruction to the transport device 5, so that the transport device 5 first lasers in the direction of (1, 12) from the position (1,0) in the xy coordinates shown in FIG. 3. The resin film 2 is moved as the light L is irradiated. Thereby, the first line is cut by laser ablation. When the control unit 6 detects completion of the first scan of the first line, the control unit 6 proceeds to the process of step S104. In addition, about various control of the conveying apparatus 5 of the method of detecting completion etc., since a well-known technique should just be employ | adopted suitably, description is abbreviate | omitted.

  In step S104, it is determined whether the number of scans has been reached for each line. For example, when the number of scans is 2, the control unit 6 returns to step S103 again because the first line has not reached the number of scans (step S104: No). And the control part 6 gives the instruction | indication to the conveying apparatus 5, moves the resin film 2 to the B direction shown in FIG. 1 as a return path, and performs the process which cut | disconnects a 1st line by multi-laser irradiation. Then, when the control unit 6 detects completion of the second scan of the first line, the control unit 6 proceeds to the process of step S104. In this case, since the first line has reached the number of scans (step S104: Yes), the process proceeds to step S105.

  In step S105, it is determined whether or not all lines have been cut. When all the lines are cut (step S105: Yes), the control unit 6 ends the process of this flowchart. On the other hand, when all the lines are not cut (step S105: No), the control unit 6 proceeds to the process of step S106.

  In step S106, a process of moving the irradiation position of the laser light L to the next line is executed. In this case, the control unit 6 increments the line number (n = n + 1) and determines the nth line to be cut next. That is, when the first line is cut, the control unit 6 determines the second line as a line to be cut next, and the second line is connected to the microlenses 4 a to 4 g of the multi-beam optical system 4 in the transport device 5. An instruction to move the stage 7 is issued so as to oppose each other. As a result, the transport device 5 moves the (2, 0) coordinate position of the second line to the irradiation start position. In other words, the transfer device 5 moves the stage 7 so that the coordinate position (2, 0) of the second line comes to the coordinate position (1, 0) of the first line when the laser irradiation is disclosed in FIG. Then, the control unit 6 returns to the process of step S103, and the laser beam L applied to the resin film 2 is sequentially irradiated toward the cut line with the focused laser beam L toward the second line. The irradiation position and moving speed of the head are controlled.

  Thereafter, the third to fourth lines are cut in the same manner. When the fourth line is cut and the fifth line is cut, the transport device 5 rotates the stage 7 by 90 degrees, and further moves the resin film 2 to the irradiation position of the fifth line. That is, for example, the transport device 5 moves the (5, 1) coordinate position of the fifth line to the irradiation start position. Thereafter, in the same manner as the first to fourth lines are cut, every time steps S103 to S106 are looped, the fifth to fifteenth lines are cut in order.

  During the process of moving the irradiation position of the laser beam L to the next line, the control unit 6 instructs to close the shutter of the multi-laser emitting unit 3 so as not to irradiate the resin film 2 with the laser beam L. The multi-laser emission unit 3 closes the shutter after receiving the instruction. Thereby, it is possible to prevent the laser light L from being irradiated other than the line.

From the above, in this embodiment, as an example, a multilaser of about 1 W is sequentially irradiated at a beam speed of 100 mm / sec at a repetition rate of 80 kHz with a beam interval of 5 mm. By optimizing the combination of control parameters including laser power, repetition frequency, beam interval, etc., it becomes possible to continuously cut the resin film 2 according to the line even if there is an interval at the irradiation position of the multilaser. .
FIG. 9 is an explanatory view showing an example of a laser processing method according to the present invention. FIGS. 9A to 9G illustrate a case where a fixed point observation is performed as to how the cutting position of the block coordinates (1, 0) of the first line to be cut first is cut. . However, in order to make the explanation easy to understand, it is assumed that the laser processing apparatus 1 cuts the resin film 2 in one scan for each line. Therefore, as an example, the film thickness of the resin film 2 is 25 μm for the PET film 21 and 5 μm for the polyimide film 22. In addition, it is assumed that the laser beams L1 to L7 are respectively irradiated from the seven emission ports of the multi-laser emission unit 3. In FIG. 9, for convenience of explanation, the laser beams L are distinguished as laser beams L1 to L7.

  In FIG. 9A, the resin film 2 is irradiated with the laser light L1 from the microlens 4a of the multi-beam optical system 4, and is cut by a certain depth by laser ablation. Here, it is preferable that the fixed depth corresponds to the film thickness of the resin film 2 / the number of the exits of the multi-laser exit part 3 (or the number of microlenses), which is also adopted in this embodiment.

  Next, in FIG.9 (b), the resin film 2 receives the irradiation of the laser beam L2 from the micro lens 4b, and is shaved only by the fixed depth. Subsequently, in FIG. 9C, the resin film 2 is shaved by a certain depth upon receiving the laser light L3 from the microlens 4c. Subsequently, in FIG. 9D, the resin film 2 is shaved by a certain depth upon receiving the laser light L4 from the microlens 4d. Subsequently, in FIG. 9E, the resin film 2 is shaved by a certain depth upon receiving the laser light L5 from the microlens 4e.

  Furthermore, in FIG.9 (f), the resin film 2 receives the irradiation of the laser beam L6 from the micro lens 4f, and is shaved only by the fixed depth. Subsequently, in FIG. 9G, the resin film 2 receives the laser light L7 from the microlens 4g, is cut by a certain depth, and is finally cut.

  Here, in this embodiment, when the film thickness of the resin film 2 is set to 60 μm as described above, the number of scans of each line is two because the laser irradiation is performed by reciprocating each line. That is, the resin film 2 could be cut by scanning twice per line. The tact time was 292 sec (4.9 minutes), and the throughput per hour was 12.2 sheets / hour.

  Next, a comparative example will be described. In the comparative example, cutting was performed with a single laser irradiation instead of a multi-laser. In this case, the laser processing apparatus 1 can compare by emitting only one of the lasers of the multi-laser emitting unit 3. Other conditions are the same. That is, as other conditions, the resin film 2 having the same size (730 × 920 mm) and the same film thickness (60 μm) is used, the wavelength of the pulse laser (355 nm), the beam spot diameter (20 μm), and the scanning speed as the moving speed ( 100 mm / sec), laser power (1 W), and the like.

  As a result, in the comparative example, the number of scans that can be cut was 14 times. That is, in the comparative example, the resin film 2 could be cut by scanning 14 times per line. The tact time was 2044 sec (34.1 minutes), and the throughput per hour was 1.8 sheets / hour.

  Therefore, when executed in this embodiment, the productivity is improved by about 6.8 times in throughput compared to the comparative example. In the comparative example, if the laser power is set to 14 W, for example, all the lines can be cut by one scan, but as described above, a problem occurs. Therefore, when the laser power is 1 W, 14 scans are required for each line. On the other hand, in this embodiment, since each line needs to be scanned twice, the advantage is also maintained from this point.

  As described above, according to this embodiment, not only can a resin film applied to an organic EL display panel such as a flexible display be cut well, but also the number of scans can be reduced, which significantly improves productivity. Effects can be obtained.

Next, a modified example will be described.
FIG. 10 is a block diagram showing an example of a modification of the laser processing apparatus according to the present invention. In addition, the same code | symbol is attached | subjected about the same component as the said embodiment, description is abbreviate | omitted, and a difference is mainly explained in full detail. In the above embodiment, the multi-beam optical system 4 is adopted as the optical system of the present invention, but the present invention is not limited to this. A laser processing apparatus 10 shown in FIG. 10 includes, instead of the multi-beam optical system 4 shown in FIG. 1, a plurality of optical fibers 9 that respectively transmit a plurality of laser beams emitted from the multi-laser emitting section 3, and each optical fiber. And an optical device 8 including an optical lens that focuses the laser beam transmitted to the output end 9 into a predetermined beam shape. The optical fiber 9 and the optical device 8 are examples of the optical system according to the present invention.
Note that a technique for transmitting and focusing laser light from a YAG laser or the like through an optical fiber is a known technique, and thus a detailed description of the optical device 8 is omitted. Also in the laser processing apparatus 10 shown in FIG. 10, the effect similar to the laser processing apparatus 1 shown in FIG. 1 can be acquired. In FIG. 10, three optical fibers 9 and three optical devices 8 are depicted, but in reality, the laser processing device 10 includes seven optical fibers 9 and seven optical devices 8 each. .

  In the above embodiment, the multi-laser emitting unit 3 is configured to include a plurality of laser oscillators. However, by combining a half mirror and a total reflection mirror, one laser beam emitted from one oscillator is converted into a plurality of lasers. A configuration in which the light is dispersed into light and guided to the optical fiber 9 may be used. In order to make the explanation easy to understand, for example, in the case of generating by splitting from one laser beam to three laser beams, the first half mirror, the second half mirror, and the total reflection mirror are linearly formed. They are arranged at predetermined distance intervals. Thereby, one laser beam emitted from one oscillator is split into a reflected laser beam and a transmitted laser beam by being incident on the first half mirror. Then, the laser light transmitted through the first half mirror is split into reflected laser light and transmitted laser light by entering the second half mirror. Furthermore, the laser beam that has passed through the second half mirror is reflected by the total reflection mirror. With the above configuration, the multi-laser emitting unit 3 can emit three multi-lasers from one oscillator.

  Moreover, in the said embodiment, although the laser beam L was focused on the spot diameter of 20 micrometers with the micro lens array, the shape of a laser beam is not limited to this. For example, a cylindrical lens may be disposed, and a plurality of emitted laser beams L may be formed into a beam shape that is converged in a line shape with respect to the scanning direction via the cylindrical lens.

DESCRIPTION OF SYMBOLS 1, 10 ... Laser processing apparatus 2 ... Resin film 3 ... Multi laser emission part 4 ... Multi-beam optical system 5 ... Conveyance apparatus 6 ... Control part 7 ... Stage 8 ... Optical apparatus 9 ... Optical fiber L ... Laser beam

Claims (4)

A laser processing apparatus that intermittently irradiates a resin film with pulsed laser light and cuts the resin film,
A multi-laser emitting section for emitting a plurality of the laser beams at predetermined intervals;
An optical system that focuses the laser beams emitted from the multi-laser emitting section into a predetermined beam shape and guides them onto the resin film;
A transporting device that moves the resin film in any one direction at a predetermined moving speed with respect to two directions orthogonal to each other in the same plane;
A line for cutting the resin film is set on the resin film, and the beam-shaped laser light irradiation position is set so as to sequentially irradiate each focused laser beam with the line. A control unit for controlling the moving speed;
A laser processing apparatus comprising:   2. The optical system according to claim 1, wherein the optical system is a microlens array in which a plurality of microlenses are linearly arranged at equal intervals, and the plurality of emitted laser beams are respectively focused on the beam shape. Laser processing equipment. The optical system includes a plurality of optical fibers that respectively transmit a plurality of laser beams emitted from the multi-laser emitting unit;
An optical device including an optical lens that focuses the laser beam transmitted to the output end of each optical fiber into the beam shape;
The laser processing apparatus according to claim 1, comprising: A laser processing method of intermittently irradiating a resin film with pulsed laser light, and cutting the resin film,
A process of emitting a plurality of the laser beams at predetermined intervals;
A process of focusing a plurality of emitted laser beams into a predetermined beam shape and guiding them onto the resin film;
A line for cutting the resin film is set in the resin film, and the resin film is moved at a predetermined moving speed in any one direction with respect to two directions orthogonal to each other in the same plane, A process for controlling the irradiation position and the moving speed of the laser beam having the beam shape so as to sequentially irradiate each focused laser beam with the beam shape so as to match the line;
The laser processing method characterized by performing.