CN103842305A - Device for laser-machining glass substrate - Google Patents

Device for laser-machining glass substrate Download PDF

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Publication number
CN103842305A
CN103842305A CN 201280049102 CN201280049102A CN103842305A CN 103842305 A CN103842305 A CN 103842305A CN 201280049102 CN201280049102 CN 201280049102 CN 201280049102 A CN201280049102 A CN 201280049102A CN 103842305 A CN103842305 A CN 103842305A
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CN
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glass substrate
laser
laser light
cylindrical lens
direction
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CN 201280049102
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Chinese (zh)
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CN103842305B (en )
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水村通伸
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株式会社V技术
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0734Shaping the laser spot into an annular shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Abstract

Laser light emitted from a laser light source is concentrated in accordance with a planned glass substrate cutting line by a cylindrical lens provided in a circular form. The position in which the laser light is irradiated with respect to the cylindrical lens is moved in a first direction by a drive device. Within a plane orthogonal to the optical axis, the width (W5) of the laser light in a second direction perpendicular to the first direction is greater than the width (W7) of the cylindrical lens. In a process for moving the irradiation position of the laser light in the first direction using a drive device, a machining mark corresponding to the planned cutting line is formed through a plurality of emissions of the laser light from the laser light source. Consequently, an endless closed-shape machining mark is easily formed on the glass substrate, and the processing time for splitting the glass substrate can be reduced.

Description

玻璃基板的激光加工装置 The laser processing apparatus of the glass substrate

技术领域 FIELD

[0001] 本发明涉及一种对表面强化玻璃基板进行切割的玻璃基板的激光加工装置,尤其涉及适于在玻璃基板上形成环状的加工痕的玻璃基板的激光加工装置。 [0001] The present invention relates to a laser processing apparatus for cutting a surface strengthened glass substrate, a glass substrate, and particularly to a laser processing apparatus processing a glass substrate suitable for forming annular marks on the glass substrate.

背景技术 Background technique

[0002] 在制造液晶显示面板之际,在玻璃基板上重复进行曝光以及显影,形成由规定的像素以及回路构成的图案。 [0002] In the occasion of manufacturing a liquid crystal display panel, exposure and development are repeated on a glass substrate, forming a pattern composed of a predetermined pixel and circuit. 在这种情况下,相对于一张玻璃基板同时形状多张面板量的图案,之后,通过分割玻璃基板,制造出各个面板。 In this case, with respect to the shape of a plurality of panels while the amount of a pattern of a glass substrate, then, by dividing the glass substrate, each panel manufactured. 以往,该玻璃基板的分割是通过用旋转刀线状地磨削出切断预定线的机械的切割加工进行(专利文献I)。 Conventionally, segmentation is carried out of the glass substrate (Patent Document I) by grinding the cutting line to cut mechanically using a rotating blade linearly.

[0003] 但是,在该机械的切割加工中,必须使切割刀片以低速度沿着切断预定线移动,存在每一个玻璃基板的处理时间长、制造生产节拍差的问题。 [0003] However, in the cutting machine, the cutting blade must be moved at a low speed along the line, there is a long processing time for each of a glass substrate, a problem of poor manufacturing tact. 而且,还存在切割工序的中途玻璃基板容易破裂、成品率低,并且在旋转刀进行切削之际发生切削屑的问题。 Further, there is also the middle of the glass substrate is easily broken cutting process, low yield, and for problems on the occasion of cutting chips in the rotating blade. 尤其是在表面强化玻璃的情况下,上述问题更为显著。 Especially in the case where the surface of the tempered glass, the above problem is more significant.

[0004] 因此,提出了例如通过激光加工在玻璃上形成加工痕的技术。 [0004] Thus, the proposed techniques such as machining marks are formed by laser processing on the glass. 即、通过将激光点状或线状地聚光在玻璃的表面或者深度方向的内部,对玻璃照射能量密度高的激光,沿着玻璃的切断预定线形成加工痕,通过沿着加工痕机械地加力,能够容易地将玻璃在切断预定线处切断。 That is, the laser spot or linear or collect light in the depth direction of the interior surface of the glass, the glass of high irradiation energy density of laser, machining marks are formed along the line of the glass, along the processing marks by mechanically urging, in the glass can be easily cut at the planned cutting line. 激光对玻璃基板的加工与机械的切割加工相比,不仅能够缩短制造生产节拍,由于玻璃基板在加工的中途不易破裂,也不易发生切削屑,所以特别适于表面强化玻璃的加工。 Laser cutting and mechanical machining of the glass substrate compared to only manufacturing tact can be shortened, since the glass substrate is easily broken in the middle of machining, the chips hardly occurs, it is particularly suitable for surface hardening processing of the glass.

[0005] 例如,在专利文献2中公开了如下的技术:在通过YAG激光振荡装置对玻璃基板照射了激光后,用齿轮刀具扫描玻璃基板表面上被激光照射的位置,例如使夹层玻璃等的表面发生裂纹。 [0005] For example, discloses a technique in Patent Document 2: After passing through the YAG laser oscillator of the glass substrate is irradiated with laser light, gear cutting tools scan the upper surface of the laser irradiated glass substrate position, for example a laminated glass or the like surface cracks.

[0006] 在专利文献3中,使对玻璃照射的电子束光点形状为具有30mm以上的最大尺寸的细长的形状,通过在玻璃上线状地对其扫描,使玻璃局部产生裂纹。 [0006] In Patent Document 3, so that the spot shape of the electron beam irradiation having the glass elongated shape than the maximum size of 30mm, by linearly scans it in the glass, the glass cracks locally.

[0007] 在专利文献4中公开了如下的技术:在激光加工装置中,为了提高对玻璃等切断对象物的加工速度,以在切断对象物的厚度方向以及与厚度方向正交的方向上延伸的方式形成一对线状焦点,对玻璃等切断对象物的内部进行改性。 [0007] Patent Document 4 discloses a technique: laser processing apparatus in order to increase the processing speed of the object cut glass, cut to extend in the thickness direction of the object and the direction perpendicular to the thickness direction manner forming a pair of line focus, the object of the interior glass cutting modified.

[0008] 专利文献1:日本国特开2007 - 229831号公报, [0008] Patent Document 1: Japanese Laid-Open 2007-- Publication No. 229,831,

专利文献2:日本国特开2005 - 104819号公报, Patent Document 2: Japanese Laid-Open 2005-- Publication No. 104,819,

专利文献3:日本国特开2008 - 273837号公报, Patent Document 3: Japanese Laid-Open 2008-- Publication No. 273,837,

专利文献4:日本国特开2008 - 36641号公报。 Patent Document 4: Japanese Laid-Open 2008-- Publication No. 36,641.

[0009] 但是,专利文献2至4的技术均是在玻璃上形成连续的线状加工痕或者沿着线状的切断预定线的多个点状的加工痕。 [0009] However, in Patent Literature 2 to 4 are a continuous processing line or impression in the glass along the dotted lines to cut a plurality of linear machining marks. 因此,在玻璃基板上形成环形的封闭形状的加工痕的情况下,必须要沿着玻璃基板的切断预定线连续地扫描激光,或者一边使激光的照射位置沿着切断预定线移动一边多次照射激光,存在制造生产节拍长期化的问题。 Accordingly, when forming the shape of a closed loop processing of the mark on the glass substrate, the laser must be continuously scanned along the line of the glass substrate, or the side of the laser irradiation position is irradiated a plurality of times while moving along a predetermined cutting line laser, there is a manufacturing tact of long-term problems. 发明内容 SUMMARY

[0010] 本发明是鉴于这种问题而提出的,其目的在于提供一种玻璃基板的激光加工装置,能够容易地在玻璃基板上形成环形的封闭形状的加工痕,并缩短用于玻璃基板的分割的处理时间。 [0010] The present invention is proposed in view of such problems, and its object is to provide a laser processing apparatus of the glass substrate can be easily formed in an annular closed shape machining mark on a glass substrate, a glass substrate and shorten segmentation processing time.

[0011] 本发明所涉及的玻璃基板的激光加工装置是在将激光聚光在玻璃基板的环形的封闭形状的切断预定线上,在前述玻璃基板上形成加工痕的玻璃基板的激光加工装置,其特征在于,具有:激光光源,射出激光;环状的柱面透镜,将来自前述激光光源的激光相对于前述玻璃基板与前述切断预定线相对应地聚光;驱动装置,使来自前述激光光源的激光的照射区域相对于前述柱面透镜沿第I方向相对地移动;以及控制装置,控制前述激光光源和驱动装置,从前述激光光源射出的激光的照射区域在与其光轴正交的面内与前述第I方向正交的第2方向上的宽度比前述柱面透镜的前述第2方向上的宽度大,前述控制装置在通过前述驱动装置使前述激光的照射区域相对于前述柱面透镜沿前述第I方向移动的过程中,从前述激光光源多次射出激光。 [0011] The laser processing apparatus for a glass substrate according to the present invention is in focusing a laser beam at a predetermined cutting line a closed loop shape a glass substrate, a laser processing apparatus processing a glass substrate mark on the glass substrate, comprising: a laser light source for emitting laser light; annular cylindrical lens, the laser light from the laser light source with respect to the glass substrate with the predetermined cutting line corresponding to the condenser; drive means from said laser light source laser light irradiation region with respect to the relatively moving the cylindrical lens along the first direction I; and an inner surface of a control means for controlling the driving means and the laser light source, the irradiation region of the laser from the laser light source emitted from the optical axis in its width in the second direction orthogonal to the first direction greater than the width I on the second direction of the cylindrical lens, the laser beam control means cause the drive means through the irradiation region with respect to the cylindrical lens in the process I of the direction of movement, the laser beam from the laser light source emits a plurality of times.

[0012] 在上述的玻璃基板的激光加工装置中,例如是前述控制装置将前述照射区域控制成前述多次的激光的照射形成的前述玻璃基板上的照射区域在前述切断预定线上局部重合。 [0012] In the laser processing device of the glass substrate, for example, the control means controlling the irradiation region to the irradiation region on the glass substrate is irradiated with laser light a plurality of times for forming a predetermined cutting line partially overlap in the foregoing. 在这种情况下,前述控制装置例如将前述照射区域的重合控制成前述多次的激光的照射产生的前述切断预定线上的投入能量为一定。 In this case the input energy, for example, the control means coincide with the irradiation area of ​​the laser to control a plurality of times of the irradiation of the predetermined cutting line is constant.

[0013] 前述柱面透镜设定成前述激光的焦点位置在前述玻璃基板的厚度方向的内部,并且焦点深度比前述玻璃基板的厚度短,优选设定在前述玻璃基板的厚度的1/100以下。 [0013] The cylindrical lens is set to the focal position of the laser light in the thickness direction of the interior of the glass substrate, and the focal depth shorter than the thickness of the glass substrate, it is preferable to set the thickness of the glass substrate is below 1/100 . 这样一来,能够在玻璃基板的内部形成激光照射形成的加工痕。 Thus, processing is possible to form a laser irradiation mark formed inside the glass substrate. 因此,可靠地防止了因激光电子束的照射而在表面发生破裂。 Accordingly, reliably preventing breakage occurs due to laser irradiation of the electron beam on the surface.

[0014] 而且,本发明的玻璃基板的激光加工装置若适于表面强化玻璃基板上则更有益。 [0014] Further, the glass substrate of the laser processing apparatus of the present invention is even more advantageous if the surface hardening adapted on a glass substrate. 表面强化玻璃基板由于表面的性质硬,所以在使用切割刀的机械的切割中破裂,即使是激光切割,在其焦点位置在玻璃基板的表面的情况下,加工中也破裂。 Due to the nature of the surface of the tempered glass substrate of a hard surface, it is broken in cutting machines using a cutting blade, even if the laser-cut, in which the focal position in the case where the surface of the glass substrate processing are also broken. 本发明是激光的波长为250至400nm,将柱面透镜形成的激光的焦点位置设定在前述表面强化玻璃基板的厚度方向的内部、比前述表面强化玻璃基板的表面强化层更深的位置,所以即使是表面强化玻璃基板,也防止了加工中破裂。 The present invention is a wavelength of the laser is 250 to 400 nm, the focal position of the laser on the cylindrical lens is formed is set to the thickness direction of the inner surface strengthening the glass substrate, the surface of the tempered glass substrate reinforcing layer position deeper than the surface, even tempered glass substrate surface, but also to prevent the breakdown processing.

[0015] 本发明的玻璃基板的激光加工装置具有使来自激光光源的激光相对于玻璃基板与切断预定线相对应地聚光的环状的柱面透镜,通过移动装置,激光相对于柱面透镜的照射区域沿第I方向移动。 [0015] The laser processing apparatus according to the present invention, a glass substrate having a laser beam from the laser light source with respect to the cylindrical lens and the glass substrate corresponding to the line to cut condensed cyclic, through a mobile device, a laser with respect to the cylindrical lens irradiation region is moved along the first direction I. 从激光光源射出激光的照射区域在与其光轴正交的面内与第I方向正交的第2方向上的宽度比柱面透镜的第2方向上的宽度大,控制装置在通过驱动装置使激光的照射区域相对于柱面透镜沿第I方向相对地移动的过程中,从激光光源多次射出激光。 Width in the direction of the second laser beam emitted from the laser light source region orthogonal to the first direction I in its plane orthogonal to the optical axis is larger than the width in the second direction of the cylindrical lens, the control means by the driving means process with respect to the cylindrical lens in the direction I of relatively moving in the irradiation area of ​​the laser, laser light emitted from the laser light source a plurality of times. 这样一来,与激光相对于柱面透镜的照射区域相对应,在玻璃基板上与玻璃基板的环形的封闭形状的切断预定线相对应地形成线状的加工痕,通过多次的激光的照射,该线状加工痕连续而成为环形的封闭形状。 Thus, with respect to the laser irradiation area of ​​the cylindrical lens corresponds to the glass substrate and the line to cut an annular closed shape corresponding to the glass substrate is formed of linear processing marks, laser light irradiation a plurality of times the continuous and linear machining mark becomes a closed annular shape. 因此,根据本发明,与沿着玻璃基板的环状的切断预定线照射激光的情况相比,加工痕的形成时间短,能够缩短用于玻璃基板的分割的处理时间。 Thus, according to the present invention, as compared with the case of cutting along a predetermined annular laser beam irradiation of the glass substrate, the processing time is short mark is formed, it is possible to shorten the processing time for dividing a glass substrate.

[0016] 而且,在本发明中,由于控制装置在通过驱动装置使激光的照射区域沿第I方向相对于柱面透镜移动的过程中,从激光光源多次射出激光,所以不需要对柱面透镜整体照射激光那样大的激光光源,而且,即使在将柱面透镜与玻璃基板的切断预定线的形状相对应地更换成其它的柱面透镜的情况下,也无需更换激光光源。 [0016] Further, in the present invention, the control means of the laser irradiation region by the driving means in a first direction I relative movement during the cylindrical lens, the laser beam emitted from the laser light source a plurality of times, it is not necessary for the cylinder as large as the entire lens laser light source irradiating laser, and, even in the case where the shape of a line to cut the cylindrical lens and the glass substrate corresponding to the replaced other cylindrical lenses, there is no need to replace a laser light source.

附图说明 BRIEF DESCRIPTION

[0017] 图1 (a)是在本发明的实施方式所涉及的玻璃基板的激光加工装置中,表示激光的照射区域和形成在玻璃基板上的加工痕的俯视图,图1 (b)是同样的立体图、是表示柱面透镜的截面形状的图; [0017] FIG. 1 (a) is in the laser processing apparatus for a glass substrate according to an embodiment of the present invention in a plan view showing the irradiation region of the laser and is formed on the glass substrate machining marks, and FIG. 1 (b) is the same as a perspective view showing the sectional shape is a cylindrical lens of FIG;

图2是在本发明的实施方式所涉及的玻璃基板的激光加工装置中,表示柱面透镜的立体图; FIG 2 is a glass substrate in the laser processing apparatus according to an embodiment of the present invention in a perspective view showing a cylindrical lens;

图3是表示本发明的实施方式所涉及的玻璃基板的激光加工装置的立体图; 3 is a perspective view of a laser machining apparatus according to an embodiment of the glass substrate of the present invention relates;

图4 (a)至图4 (c)是在本发明的实施方式所涉及的玻璃基板的激光加工装置中,以时序表示随着激光的照射区域的移动而形成在玻璃基板上的加工痕的图; FIG. 4 (a) to 4 (c) is a glass substrate in the laser processing apparatus according to an embodiment of the present invention, the timing to a machining mark with movement of the laser irradiation region is formed on a glass substrate Figure;

图5是表示表面强化玻璃基板的透过特性的曲线图。 FIG 5 is a graph showing the transmission characteristics of the surface of the reinforced glass substrate.

[0018] 附图标记说明: [0018] REFERENCE NUMERALS:

1:载物台,2:玻璃基板,20、20a、20b:加工痕,3:移动部材,4:支撑部材,5:(脉冲)激光,6:脉冲激光振荡器,7:柱面透镜。 1: stage 2: a glass substrate, 20,20a, 20b: processing marks, 3: moving member, 4: a support member, the pulse :( 5) laser beam, 6: a pulse laser oscillator, 7: cylindrical lens.

具体实施方式 detailed description

[0019] 以下,参照附图对本发明的实施方式具体地进行说明。 [0019] Hereinafter, with reference to the drawings, embodiments of the present invention will be specifically described. 图1 (a)是在本发明的实施方式所涉及的激光加工装置中,表示激光的照射区域和形成在玻璃基板上的加工痕的俯视图,图1 (b)是同样的立体图、是表示柱面透镜的截面形状的图,图2是在本发明的实施方式所涉及的激光加工装置中,表示柱面透镜的立体图,图3是表示本发明的实施方式所涉及的玻璃基板的激光加工装置的立体图。 FIG 1 (a) is in the laser processing apparatus of the embodiment of the present invention in a plan view showing the irradiation region of the laser and is formed on the glass substrate machining marks, and FIG. 1 (b) is a similar perspective view shows the column FIG cross-sectional shape of the surface of the lens, FIG. 2 is a laser processing apparatus embodiment of the present invention in a perspective view showing a cylindrical lens, FIG. 3 is a diagram showing a laser processing apparatus for a glass substrate according to an embodiment of the present invention is FIG perspective. 如图3所示,在载物台I上载置有作为被加工物的曝光显影处理后的表面强化玻璃基板等玻璃基板2。 As shown in FIG. 3, on the stage I placed as a surface development processing after being exposed workpiece tempered glass substrate of the glass substrate 2 and the like. 横跨该载物台I的宽度方向整个区域的门型的移动部材3相对于该载物台I支撑,并能沿箭头a的方向往返移动。 The movement of the object across the gate-shaped member in the width direction of the entire area of ​​the stage I 3 relative to the support stage I, and can be moved back and forth in the direction of arrow a. 并且在该移动部材3上设置有支撑部4,该支撑部4能够沿载物台I的宽度方向(箭头b的方向)往返移动,在该支撑部4上支撑有脉冲激光振荡器6。 And provided on the moving member 3 has a support portion 4, the support portion 4 of the stage I can be along the width direction (arrow b direction) to reciprocate the support portion 4 in the pulsed laser oscillator 6 is supported. 在玻璃基板2的上方配置有环状设置的柱面透镜7,使来自脉冲激光振荡器6的脉冲激光5与玻璃基板2的切断预定线相对应地聚光。 In the upper glass substrate 2 disposed annularly cylindrical lens 7, a laser pulse from the pulsed laser oscillator 5 and 6 of the line to cut the glass substrate 2 corresponding to the condenser.

[0020] 在该激光加工装置中,在载物台I上载置有表面强化玻璃基板等玻璃基板2,移动部材3沿箭头a的方向移动,并且来自脉冲激光振荡器6的脉冲激光5间歇地射出,被柱面透镜7聚光后的脉冲激光5照射到玻璃基板2上。 [0020] In this laser processing apparatus, in the stage I is placed on the surface of the tempered glass substrate, a glass substrate 2, moving direction of the moving member 3 in the arrow a, and the pulses from the laser oscillator pulse laser 5 intermittently 6 It emits pulsed laser 5 is irradiated with the converging cylindrical lens 7 onto the glass substrate 2. 如图1 (a)所示,该脉冲激光5的照射区域在与其光轴正交的面内的形状例如为矩形,方向b上的宽度W5被调节成比相同的方向b上的柱面透镜7的宽度W7大。 Shape 1 (a), the pulsed laser irradiation region in FIG. 5 in its plane orthogonal to the optical axis, for example, a rectangular shape, the direction of the width W5 b is adjusted to the cylindrical lens b than the same direction 7. large width W7. 并且激光5的照射区域针对方向b被调节成包含全部柱面透镜7。 And the irradiation area of ​​the laser with respect to the direction 5 b is adjusted to 7 comprising the full cylindrical lens. 这样一来,相对于玻璃基板2,激光5线状地照射在切断预定线上。 Thus, with respect to the glass substrate 2, laser light 5 is irradiated linearly cutting a predetermined line. 在这种情况下,既可以在移动部材3移动的期间,从脉冲激光振荡器6照射激光5,也可以在使移动部材3移动后暂时停止的状态下从脉冲激光振荡器6照射激光5。 6 irradiating a laser pulse from the laser oscillator 5 under in this case, both during the movement of the moving member 3, the pulse laser beam 5 irradiating laser oscillator 6, may be the moving member 3 is temporarily stopped moving. 配置在玻璃基板2的上方的柱面透镜7能够更换成焦点距离不同的柱面透镜。 Disposed above the glass substrate 2 of a cylindrical lens 7 can be replaced with a different focal distance of the cylindrical lens. 这样一来,能够从柱面透镜7中与加工对象的玻璃基板2的表面性状等相对应地选择焦点深度最佳的柱面透镜来进行激光加工。 Thus, it is possible to select the depth of focus corresponding to the best cylindrical lens for laser processing from the cylindrical lens 7 and the surface properties of the object like a glass substrate 2.

[0021] 或者,柱面透镜7也可以更换成与切断预定线的形状相对应的柱面透镜。 [0021] Alternatively, the cylindrical lens 7 may be replaced with a cylindrical lens to a predetermined shape of the cutting line corresponds. 如图1以及图2所示,配置在玻璃基板2上方的柱面透镜7是上方凸出的具有均匀的截面形状的环状的透镜,在任一个截面上,其下方的焦点距离均为一定。 Shown in FIG. 1 and FIG. 2, the cylindrical lens 2 disposed on the upper glass substrate 7 is projected above the annular lens has a uniform cross-sectional shape, in a cross section of any of the focal distance thereunder are constant. 因此,柱面透镜7成为连接其焦点的线与环状的柱面透镜7相似的环状。 Thus, the cylindrical lens 7 has a similar ring 7 which is connected with an annular focal line of cylindrical lens. 在本发明中,选择切断预定线的形状与柱面透镜7的环状的焦点形状相同的柱面透镜7使用。 The cylindrical lens focus the same shape in the present invention, select a line to cut the shape of the annular cylindrical lens 7 7 use. 在本实施方式中,与圆形的切断预定线相对应,柱面透镜7使用其焦点形状为圆形的柱面透镜,其中心轴配置成与脉冲激光5的光轴平行。 In the present embodiment, the circular cutting line corresponding to a predetermined, its focal point using the cylindrical lens 7 having a circular cylindrical lens, the center axis thereof arranged parallel to the optical axis of the pulsed laser 5. 该柱面透镜7使从脉冲激光振荡器6射出的脉冲激光5在玻璃基板2上聚光。 The cylindrical converging lens 7 so that the two pulses from the pulse laser light emitted from the laser oscillator 56 on the glass substrate. 该脉冲激光5例如设定成波长为250〜400nm,通过柱面透镜7,其焦点位置处于玻璃基板2的厚度方向的内部,焦点深度比前述玻璃基板的厚度短,优选设定在玻璃基板2的厚度的1/100以下的范围内。 5, for example, the pulse laser is set to a wavelength of 250~400nm, by the cylindrical lens 7, which is inside the focal position of the thickness direction of the glass substrate 2, depth of focus is shorter than the thickness of the glass substrate, the glass substrate is preferably set at 2 1/100 or less within a range of thicknesses.

[0022] 激光5如图1 (a)中矩形的细线所示,针对方向b包含全部柱面透镜7地进行照射。 Thin line shown in (a), a rectangular [0022] 1 laser 5, for the direction of the cylindrical lens 7 (b) includes all manner irradiated. 来自脉冲激光振荡器(激光光源)6的激光5的照射时序、移动部材3的移动距离以及移动的时序由控制装置(未图示)控制。 Irradiating timing of the laser pulse from the laser oscillator 5 (a laser light source) 6, a moving distance and a timing member moving section 3 is controlled by a control means (not shown).

[0023] 脉冲激光5的波长例如为250〜400nm。 [0023] The wavelength of the pulsed laser beam, for example, 5 250~400nm. 图5是以横轴为波长、纵轴为激光的透过率来表示表面强化玻璃的透过特性的曲线图。 5 is a horizontal axis represents wavelength and the vertical axis represents the transmittance of the laser light to a graph illustrating transmission characteristics of the surface of the tempered glass. 在波长为532nm的激光的情况下,相对于玻璃基板的透过率高,即、玻璃基板上的能量的吸收率差,不易在玻璃基板上形成加工痕。 In the case where the laser having a wavelength of 532nm, relative to the glass substrate high transmittance, i.e., absorption of energy on the glass substrate include poor machining marks are formed on the glass substrate. 相对于此,在水银灯中称为i线(波长为365nm)的附近开始能量的吸收,能够形成加工痕。 In contrast, known as energy absorption begins near the i-line (wavelength of 365nm) of a mercury lamp, a processing mark can be formed. 而且,通过使用波长为266nm的激光,能够获得极高的能量吸收率。 Further, by using a laser wavelength of 266nm can be obtained a high rate of energy absorption. 因此,在本发明中,在250〜400nm的波长区域,在玻璃基板上形成加工痕。 Accordingly, in the present invention, in the wavelength region of 250~400nm, machining marks are formed on the glass substrate.

[0024] 在本实施方式中,控制装置将激光5的照射区域控制成通过多次的激光5的照射,玻璃基板2上的照射区域在切断预定线上局部重合。 [0024] In the present embodiment, the control means controls the irradiation area of ​​the laser 5 into a plurality of times by the irradiation of the laser beam 5, the irradiation area on the glass substrate 2 partially overlap the planned cutting line. 例如,控制装置构成为以激光5相对于柱面透镜7的照射区域与之前的激光5的照射区域局部重合的方式从激光光源6射出激光。 For example, the control device 5 is configured with respect to the laser irradiation area of ​​the laser beam 5 before irradiation area of ​​the cylindrical lens 7 partially overlap the laser light source 6 is emitted from the laser. 因此,激光5与向柱面透镜7的照射区域相对应地在玻璃基板2的圆形的切断预定线上聚光,在玻璃基板2上形成加工痕20 (20a、20b),通过多次的激光5的照射,该线状的加工痕20连续而形成圆形。 Accordingly, the laser 5 and corresponding to the predetermined cutting line in a circular condensing the glass substrate 2, to form a region of the cylindrical lens 7 is irradiated on the glass substrate 2 processing marks 20 (20a, 20b), through a plurality of times 5 is irradiated with laser light, the linear machining marks 20 are formed continuously circular.

[0025] 在本实施方式中,由于射出在与光轴正交的面内的形状为矩形的激光5,所以如图1 (a)所示,激光5相对于柱面透镜7的照射区域在与柱面透镜7的中心轴正交的面内产生从中心轴沿半径方向观察时照射到柱面透镜7的全体上的区域5a和照射到柱面透镜7的局部的区域5b。 [0025] In the present embodiment, since light emitted in a plane perpendicular to the optical axis of the laser beam 5 is rectangular in shape, so that as shown in FIG 1 (a), the laser beam 5 with respect to the cylindrical lens in the irradiation region 7 It is generated when viewed from the central axis in a radial direction on the entire area 5a of the cylindrical lens 7 is irradiated to the cylindrical lens and irradiated onto a local area 5B of the inner surface 7 perpendicular to the center axis of the cylindrical lens 7. 因此,投入到玻璃基板2上的激光的能量是区域5a上的能量比区域5b上的能量大,因此,在与区域5a相对应地形成在玻璃基板2上的加工痕20a和与区域5b相对应地形成在玻璃基板2上的加工痕20b处产生玻璃基板2变质程度的差异。 Thus, into the energy of the laser on the glass substrate 2 is the energy region 5a is larger than the energy on the area 5b, thus, in a region 5a formed corresponding machining marks 20a and a region on the glass substrate 2 5b phase generating degree of deterioration of the glass substrate 2 at a corresponding difference in machining marks 20b are formed on the glass substrate 2. 控制装置将玻璃基板2上的照射区域的重合控制成例如多次的激光5的照射产生的切断预定线上的投入能量为一定。 Control means overlap the irradiation region on the glass substrate 2 is controlled to a predetermined cutting line, for example, into a plurality of times laser irradiation energy produced 5 constant. 这样一来,能够消除前述玻璃基板2的变质程度的差异。 Thus, it is possible to eliminate the deterioration degree of the difference in the glass substrate 2. 另外,该激光5的照射产生的投入能量意味着投入到玻璃基板2上的热量。 Further, the irradiation of the laser input energy generating means 5 into the heat on the glass substrate 2.

[0026] 接着,与控制装置的控制方式一同对本实施方式的动作进行说明。 [0026] Next, the control of the control device with the operation of the present embodiment will be described. 首先如图3所示,控制装置通过移动部材3,使脉冲激光振荡器6相对于配置在玻璃基板2的切断预定线上的柱面透镜7,向柱面透镜7的方向a上的一端部一侧的上方移动地配置,从脉冲激光振荡器6向玻璃基板2照射以矩形电子束形状射出的激光5。 First, as shown in FIG. 3, the control device 3 by moving the member, the pulsed laser oscillator 6 with 7, the upper end portion of the cylindrical lens 7 in the direction A with respect to a predetermined cutting line disposed on the glass substrate 2 of a cylindrical lens the upper side is movably disposed, the electron beam 6 in a rectangular shape is emitted from the pulse laser oscillator to the laser irradiating the glass substrate 5. 这样一来,如图4 (a)所不,通过该激光5的照射,在玻璃基板2上形成线状的加工痕20(20a、20b)。 Thus, in FIG. 4 (a) are not, by irradiation of the laser beam 5, 20 (20a, 20b) formed of linear machining marks on the glass substrate 2. 此时,与激光照射区域5b相对应地投入到玻璃基板2上的能量比与区域5a相对应地投入到玻璃基板2上的能量小。 In this case, the laser irradiation region 5b corresponding to the energy put into the glass substrate 2 should be smaller than the input region 5a opposed to the glass substrate 2 on the energy. 因此,与区域5b相对应地形成在玻璃基板2上的加工痕20b和与区域5a相对应地形成的加工痕20a相比,玻璃基板2的变质程度小。 Thus, corresponding to the region 5b formed on the glass substrate 2 in the processing trail marks 20a and 20b and the processing corresponding to the region 5a is formed as compared to a small degree of deterioration of the glass substrate 2.

[0027] 之后,控制装置使脉冲激光振荡器6沿箭头a的方向相对于玻璃基板2以及柱面透镜7相对地移动,如图4 (b)所示,以激光5相对于柱面透镜7的照射区域与第一次的激光5的照射区域的局部重合的方式进行第二次的激光5的照射。 After [0027], the pulsed laser oscillator control means 6 in the direction of arrow a relative to the glass substrate 2 and a cylindrical lens 7 is moved relative to FIG. 4 (b), the laser beam 5 with respect to the cylindrical lens 7 the second irradiation region is irradiated with the laser beam 5 of the first embodiment partially overlap the irradiation region of the laser beam 5. 此时,控制装置将激光5相对于柱面透镜7的照射区域的重合控制成例如最大能量投入到在第一次的激光5的照射下未投入最大能量的图4 (a)中的区域5b上。 At this time zone, the control unit 5 with respect to the laser irradiation area of ​​overlap of the cylindrical lens 7 is controlled to, for example, into the maximum energy at the first irradiation of laser beam 5 is not the maximum energy input of FIG. 4 (a) of 5b on. 因此,在玻璃基板2上形成了加工痕20b的部分上也形成与图4 (a)相同的加工痕20a。 Thus, on the glass substrate 2 are formed on processing portion 20b is also formed in the same marks in FIG. 4 (a) machining marks 20a. 并且通过第二次的激光5的发射,相对于第一次发射形成的加工痕20a连续地形成线状的加工痕20 (20a、20b)。 And, with respect to the first transmit processing marks 20a formed continuously formed by emitting a second laser beam 5 linear processing marks 20 (20a, 20b). 这样,通过控制激光5相对于柱面透镜7的照射区域的重合,切断预定线上的投入能量为一定,能够形成变质程度均匀的加工痕20a。 Thus, by controlling the laser irradiation area 5 with respect to the overlap of the cylindrical lens 7, a predetermined cutting line input energy is constant, 20a can be processed to form a uniform degree of deterioration marks.

[0028] 之后,控制装置同样地使脉冲激光振荡器6沿箭头a的方向相对于玻璃基板2以及柱面透镜7相对地移动,以激光5相对于柱面透镜7的照射区域与第二次的激光5的照射区域的局部重合的方式进行第三次的激光5的照射(图4(c))。 After [0028], similarly to the control device the direction of the pulsed laser oscillator 6 in the arrow a relative moving glass substrate 2 and a cylindrical lens 7, a laser irradiation area 5 with respect to the cylindrical lens 7 and the second irradiation (FIG. 4 (c)) of the partial laser beam 5 irradiation region of the laser light 5 overlap the third time. 这样一来,相对于第一次发射以及第二次发射形成的加工痕20a连续地形成线状的加工痕20 (20a、20b),通过第四次的激光5的照射,如图4 (d)所示,线状的加工痕20 (20a、20b)连续,形成环形的封闭形状的圆形加工痕20a。 Thus, with respect to the first and second emission transmitting processing marks 20a formed continuously formed linear machining marks 20 (20a, 20b), the fourth laser beam irradiation 5, FIG. 4 (d rounding mark), a linear machining marks 20 (20a, 20b) continuously formed in a closed annular shape 20a.

[0029] 在激光5的第一次发射中,激光5相对于柱面透镜7的照射区域在与柱面透镜7的中心轴正交的面内产生从中心轴沿半径方向观察时照射到柱面透镜7整体上的区域5a与照射到柱面透镜7的局部的区域5b,由于在玻璃基板2上聚光的激光5的能量密度的差异,在加工痕20a和加工痕20b处产生玻璃基板2变质程度的差异。 [0029] In the laser emission time of 5, 5 with respect to the laser irradiation area of ​​the cylindrical lens 7 is irradiated to produce the central axis when viewed in a radial direction from the column in the plane perpendicular to the central axis of the cylindrical lens 7 5a and the irradiation region on the entire surface of the lens 7 into the cylindrical lens 7 in partial areas 5B, due to the difference in the glass substrate 2 on the condensed laser energy density of 5, produced in the processing of the glass substrate marks 20a and 20b at the processing marks differences 2 metamorphic grade. 但是,通过控制装置使激光从脉冲激光振荡器(激光光源)6以激光5相对于柱面透镜7的照射区域与之前的激光5的照射区域的局部重合的方式射出,能够消除前述玻璃基板2的变质程度的差异。 However, the control device of the laser pulse from the laser oscillator (laser light source) 5 6 relative to the local laser irradiation area of ​​the laser irradiation region of the cylindrical lens 5 and 7 overlap the previous injection, the glass substrate 2 can be eliminated differences in the degree of metamorphism. 在这种情况下,优选控制装置将玻璃基板2上的照射区域的重合控制成多次的激光5的照射产生的切断预定线上的投入能量为一定,在玻璃基板2上形成的加工痕20的全周范围,其变质的程度均匀。 In this case, the control means preferably overlapped irradiation area on the glass substrate 2 is controlled to a predetermined cutting lines into a plurality of times of irradiation energy of laser light 5 is constant, the processing marks are formed on a glass substrate 220 the entire circumference, a uniform degree of deterioration. 形成加工痕20后,例如通过用手外加弯曲应力,能够以切断预定线将玻璃基板2割断成圆形。 After forming the processing marks 20, bending stress applied for example by hand, it is possible to cut the line will cut a circular glass substrate 2.

[0030] 在本实施方式中,通过多次的激光5的照射,能够形成与切断预定线的环形的封闭形状相同的加工痕20,与沿着玻璃基板2的环状的切断预定线照射激光5的以往的激光加工方法相比,环状的加工痕20的形成时间短,能够缩短用于玻璃基板2的分割的处理时间。 [0030] In the present embodiment, by repeatedly irradiating a laser 5 can be formed with a closed annular shape of the cutting line to the same processing marks 20, and the annular glass substrate 2 along the line to cut is irradiated laser 5 conventional laser processing method compared to the short form annular processing time mark 20, it is possible to shorten the processing time for segmentation of the glass substrate 2.

[0031] 而且,由于分多次向玻璃基板照射激光5,所以不需要向柱面透镜7的全体照射激光5那样大的脉冲激光振荡器(激光光源)6。 [0031] Further, since the laser beam is irradiated a plurality of times to the glass substrate 5, it is not necessary to all the cylindrical lens 7 is irradiated with laser light as large as five-pulse laser oscillator (laser light source) 6.

[0032] 例如,在使用波长为532nm的激光5,使脉冲宽度大约为7nsec,照射能量密度为25J/cm2,向表面强化玻璃基板2的内部照射激光5的情况下,在玻璃基板2上裂纹加剧,玻璃基板全体被杂乱地分割。 [0032] For example, the wavelength of laser 5 532nm, and the pulse width is about 7nsec, the irradiation energy density of 25J / cm2, strengthen internal irradiating laser glass substrate 2 to the surface of the lower case 5, a crack in the glass substrate 2 increased, all the glass substrate is intricately divided. 相对于此,在使用波长为355nm的激光5,使脉冲宽度大约为7nsec,照射能量密度为lOJ/cm2,向表面强化玻璃基板5的内部照射激光5的情况下,在玻璃基板2的内部形成加工痕20,若用手在玻璃基板2上外加弯曲应力,则能够以该加工痕20为基准而漂亮地由圆形的切断线割断。 In contrast, in the case of a wavelength of 355nm 5 laser 5, the pulse width is about 7nsec, the irradiation energy density of lOJ / cm2, strengthen internal laser irradiation to the surface of the glass substrate 5, is formed inside the glass substrate 2 machining mark 20, when the hand 2 in a bending stress applied on the glass substrate, it is possible to process the reference mark 20 is cut neatly and a circular cutting line. [0033] 而且,虽然激光5的焦点位置也可以在玻璃基板的表面,但通过使该激光5的焦点位置在玻璃基板2的内部,能够可靠地防止在玻璃基板2上发生破裂。 [0033] Moreover, although the breaking of the focal position of the laser 5 may be the surface of the glass substrate, but by passing the laser beam focus position 5 in the inside of the glass substrate 2 can be reliably prevented from occurring on the glass substrate 2. 即、通过使激光5的焦点位置在玻璃基板2的厚度方向的内部,将焦点深度设定成比玻璃基板2的厚度短,优选设定在玻璃基板2的厚度的1/100以下,即使是表面强化玻璃基板,也能够避开其表面的改性部,将激光5的能量集中在其内部。 That is, the laser focal position 5 in the thickness direction of the interior of the glass substrate 2, depth of focus is set to be shorter than the thickness of the glass substrate 2, the thickness is preferably set at 1/100 or less of the glass substrate 2, even tempered glass substrate surface, it is possible to avoid the surface-modified portion of the energy of the laser 5 is concentrated in the interior thereof. 在玻璃基板2是表面强化玻璃基板的情况下,若激光5的焦点位置不在玻璃基板2的内部,激光能量集中在表面强化玻璃基板的表面的改性部,则在玻璃基板2上发生杂乱的裂纹而容易杂乱地破裂。 In the case where the surface of the glass substrate is a tempered glass substrate 2, if the focus position of laser 5 is not inside the glass substrate, the laser energy is concentrated on the surface 2 strengthened surface modification of the glass substrate, the clutter occurs on the glass substrate 2 crack and break easily haphazardly. 而且,若该激光5的焦点深度为玻璃基板2的厚度以上,则激光5将到达玻璃基板2的背面而玻璃基板2破裂。 Further, if the depth of focus of the laser 5 is greater than the thickness of the glass substrate 2, the laser beam 5 will reach the back glass substrate 2 and the glass substrate 2 is broken. 因此,激光5的焦点深度比玻璃基板2的厚度短,优选为玻璃基板2的厚度的1/100以下的范围。 Accordingly, the laser focal depth is shorter than the thickness of 5 glass substrate 2, preferably in the range of 1/100 or less of the thickness of the glass substrate 2.

[0034] 另外,激光5的电子束形状并不是如上述实施方式那样仅限于矩形,例如也能够使用圆形以及椭圆形等各种形状。 [0034] Further, the electron beam shape of the laser 5 as the above-described embodiment is not limited to the rectangular shape, various shapes can be used, for example, circular and elliptical shape.

[0035] 而且,在本实施方式中,对柱面透镜7与圆形的切断预定线相对应地使用了其焦点形状为圆形的柱面透镜的情况进行了说明,但作为柱面透镜7,只要是环状,则也能够使用其它形状的柱面透镜。 [0035] Further, in the present embodiment, a cylindrical lens 7 and a circular cutting line to be used relative to its focus has been described for the case where the shape of a circular cylindrical lens, a cylindrical lens 7 but , as long as the cyclic, it is also possible to use other shapes of the cylindrical lens. 例如能够使用平面形状为椭圆形或者矩形的柱面透镜。 The cylindrical lens may be used, for example, the planar shape is elliptical or rectangular.

[0036] 进而,在本实施方式中,对通过四次发射激光5而形成环形的封闭形状的加工痕20a的情况进行了说明,但激光5的发射次数例如既可以是两次或者三次,也可以是五次以上。 [0036] Further, in the present embodiment, the case where a closed annular shape is formed by four 5-emitting laser machining mark 20a has been described, but the number of emitted laser light 5, for example, may be a two or three times, but also It may be more than five times.

[0037] 本发明由于能够容易地在玻璃基板上形成环形的封闭形状的加工痕,缩短用于玻璃基板的分割的处理时间,所以对液晶显示面板的制造工序等中玻璃基板的分割技术作出了贡献。 [0037] Since the present invention can be easily formed in an annular closed shape machining mark on a glass substrate, to shorten the processing time for dividing a glass substrate, the glass substrate of the segmentation process of manufacturing the liquid crystal display panel and the like made of contribution.

Claims (5)

  1. 1.一种玻璃基板的激光加工装置,将激光聚光在玻璃基板的环形的封闭形状的切断预定线上,在前述玻璃基板上形成加工痕,其特征在于, 具有:激光光源,射出激光;环状的柱面透镜,将来自前述激光光源的激光相对于前述玻璃基板与前述切断预定线相对应地聚光;驱动装置,使来自前述激光光源的激光的照射区域相对于前述柱面透镜沿第I方向相对地移动;以及控制装置,控制前述激光光源和驱动装置, 从前述激光光源射出的激光的照射区域在与其光轴正交的面内与前述第I方向正交的第2方向上的宽度比前述柱面透镜的前述第2方向上的宽度大, 前述控制装置在通过前述驱动装置使前述激光的照射区域相对于前述柱面透镜沿前述第I方向移动的过程中,从前述激光光源多次射出激光。 The laser processing apparatus 1. A glass substrate, a laser light at a predetermined cutting line a closed loop shape of the glass substrate, machining marks formed on the glass substrate, comprising: a laser light source for emitting laser light; an annular cylindrical lens, the laser light from the laser light source with respect to the glass substrate with the predetermined cutting line corresponding to the condenser; drive means, the irradiation area of ​​the laser light from the laser light source with respect to the cylindrical lens in the I moved the direction opposite the first; and control means for controlling the laser light source and drive means, the second direction from the irradiation region of the laser emitted from the laser light source in a plane perpendicular to the optical axis thereof and the direction perpendicular to the first I a width larger than the width on the second direction of the cylindrical lens, the cylindrical lens control apparatus along the direction of movement I of the process, the laser beam from the laser beam with respect to the making of irradiated regions by the drive means a laser light source emits a plurality of times.
  2. 2.如权利要求1所述的玻璃基板的激光加工装置,其特征在于,前述控制装置将前述照射区域控制成前述多次的激光的照射形成的前述玻璃基板上的照射区域在前述切断预定线上局部重合。 2. The laser processing apparatus according to claim 1 of the glass substrate, wherein the control means controls the irradiation region to the irradiation region on the glass substrate a plurality of times of the irradiation with laser light is formed in the planned cutting line the partially overlap.
  3. 3.如权利要求2所述的玻璃基板的激光加工装置,其特征在于,前述控制装置将前述照射区域的重合控制成前述多次的激光的照射产生的前述切断预定线上的投入能量为一定。 3. The laser processing apparatus for a glass substrate according to claim 2, characterized in that the control device is overlapped with the irradiation area of ​​the irradiation is controlled to the laser light energy into a predetermined plurality of times cutting line is constant .
  4. 4.如权利要求1至3中任一项所述的玻璃基板的激光加工装置,其特征在于,前述柱面透镜设定成前述激光的焦点位置在前述玻璃基板的厚度方向的内部,并且焦点深度比前述玻璃基板的厚度短。 4. The laser processing apparatus 1 to the glass substrate according to any one of claim 3, wherein the cylindrical lens is set to be the focal position of the laser inside the thickness direction of the glass substrate, and the focus depth shorter than the thickness of the glass substrate.
  5. 5.如权利要求4所述的玻璃基板的激光加工装置,其特征在于,前述玻璃基板是表面强化玻璃基板,前述柱面透镜将前述激光的焦点位置设定在前述表面强化玻璃基板的厚度方向的内部、比前述表面强化玻璃基板的表面强化层更深的位置。 A laser processing apparatus according to Claim glass substrate, wherein the surface of the glass substrate is a tempered glass substrate, the focal position of the cylindrical lens of the laser is set to the thickness direction of the surface of the reinforced glass substrate the interior surface of the tempered glass substrate of the reinforcing layer position deeper than the surface.
CN 201280049102 2011-10-07 2012-09-25 The laser processing apparatus of the glass substrate CN103842305B (en)

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