JP3664124B2 - 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板 - Google Patents

難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板 Download PDF

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Publication number
JP3664124B2
JP3664124B2 JP2001313375A JP2001313375A JP3664124B2 JP 3664124 B2 JP3664124 B2 JP 3664124B2 JP 2001313375 A JP2001313375 A JP 2001313375A JP 2001313375 A JP2001313375 A JP 2001313375A JP 3664124 B2 JP3664124 B2 JP 3664124B2
Authority
JP
Japan
Prior art keywords
silicone polymer
prepreg
metal
metal hydrate
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001313375A
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English (en)
Japanese (ja)
Other versions
JP2002194213A (ja
JP2002194213A5 (enExample
Inventor
希 高野
富男 福田
正人 宮武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2001313375A priority Critical patent/JP3664124B2/ja
Publication of JP2002194213A publication Critical patent/JP2002194213A/ja
Application granted granted Critical
Publication of JP3664124B2 publication Critical patent/JP3664124B2/ja
Publication of JP2002194213A5 publication Critical patent/JP2002194213A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2001313375A 2000-10-13 2001-10-11 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板 Expired - Lifetime JP3664124B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001313375A JP3664124B2 (ja) 2000-10-13 2001-10-11 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13
JP2000-313720 2000-10-13
JP2001313375A JP3664124B2 (ja) 2000-10-13 2001-10-11 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004295821A Division JP4619084B2 (ja) 2000-10-13 2004-10-08 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Publications (3)

Publication Number Publication Date
JP2002194213A JP2002194213A (ja) 2002-07-10
JP3664124B2 true JP3664124B2 (ja) 2005-06-22
JP2002194213A5 JP2002194213A5 (enExample) 2005-06-30

Family

ID=26602068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001313375A Expired - Lifetime JP3664124B2 (ja) 2000-10-13 2001-10-11 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Country Status (1)

Country Link
JP (1) JP3664124B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179819A (ja) * 2000-10-13 2008-08-07 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP4821059B2 (ja) * 2001-06-29 2011-11-24 日立化成工業株式会社 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板
JP4572661B2 (ja) * 2004-11-05 2010-11-04 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
JP4961677B2 (ja) * 2005-03-28 2012-06-27 富士ゼロックス株式会社 難燃性エポキシ樹脂組成物並びにそれを用いた電子部品装置、積層基板、多層回路基板及びプリント配線基板
JP4706332B2 (ja) * 2005-05-26 2011-06-22 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
JP5604789B2 (ja) * 2009-01-29 2014-10-15 株式会社オートネットワーク技術研究所 難燃剤、難燃性樹脂組成物及び絶縁電線
JP5407973B2 (ja) * 2010-03-23 2014-02-05 日立化成株式会社 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
JP2012116891A (ja) * 2010-11-29 2012-06-21 Hitachi Chemical Co Ltd 難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2014230437A (ja) * 2013-05-24 2014-12-08 シンフォニアテクノロジー株式会社 リニアモータ及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008179819A (ja) * 2000-10-13 2008-08-07 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板
JP2011099113A (ja) * 2000-10-13 2011-05-19 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

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JP2002194213A (ja) 2002-07-10

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