JP3647448B2 - 半導体装置及び半導体装置の製造方法 - Google Patents

半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
JP3647448B2
JP3647448B2 JP2004168845A JP2004168845A JP3647448B2 JP 3647448 B2 JP3647448 B2 JP 3647448B2 JP 2004168845 A JP2004168845 A JP 2004168845A JP 2004168845 A JP2004168845 A JP 2004168845A JP 3647448 B2 JP3647448 B2 JP 3647448B2
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JP
Japan
Prior art keywords
die pad
semiconductor element
semiconductor device
resin
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004168845A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004260216A (ja
JP2004260216A5 (enExample
Inventor
秀一 尾方
健一 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004168845A priority Critical patent/JP3647448B2/ja
Publication of JP2004260216A publication Critical patent/JP2004260216A/ja
Application granted granted Critical
Publication of JP3647448B2 publication Critical patent/JP3647448B2/ja
Publication of JP2004260216A5 publication Critical patent/JP2004260216A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2004168845A 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法 Expired - Fee Related JP3647448B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004168845A JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004168845A JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP35644699A Division JP3602997B2 (ja) 1999-12-15 1999-12-15 半導体装置及び半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005004182A Division JP4418373B2 (ja) 2005-01-11 2005-01-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2004260216A JP2004260216A (ja) 2004-09-16
JP3647448B2 true JP3647448B2 (ja) 2005-05-11
JP2004260216A5 JP2004260216A5 (enExample) 2005-06-02

Family

ID=33128737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004168845A Expired - Fee Related JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3647448B2 (enExample)

Also Published As

Publication number Publication date
JP2004260216A (ja) 2004-09-16

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