JP3645674B2 - ヒートパイプ式ヒートシンク、集積回路パッケージ及びそれを用いた中央処理装置 - Google Patents
ヒートパイプ式ヒートシンク、集積回路パッケージ及びそれを用いた中央処理装置 Download PDFInfo
- Publication number
- JP3645674B2 JP3645674B2 JP31541596A JP31541596A JP3645674B2 JP 3645674 B2 JP3645674 B2 JP 3645674B2 JP 31541596 A JP31541596 A JP 31541596A JP 31541596 A JP31541596 A JP 31541596A JP 3645674 B2 JP3645674 B2 JP 3645674B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- heat sink
- base
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims description 41
- 230000005855 radiation Effects 0.000 claims description 19
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005219 brazing Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
- F28F1/28—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element the element being built-up from finned sections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31541596A JP3645674B2 (ja) | 1996-11-12 | 1996-11-12 | ヒートパイプ式ヒートシンク、集積回路パッケージ及びそれを用いた中央処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31541596A JP3645674B2 (ja) | 1996-11-12 | 1996-11-12 | ヒートパイプ式ヒートシンク、集積回路パッケージ及びそれを用いた中央処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10144831A JPH10144831A (ja) | 1998-05-29 |
| JPH10144831A5 JPH10144831A5 (enExample) | 2004-11-04 |
| JP3645674B2 true JP3645674B2 (ja) | 2005-05-11 |
Family
ID=18065114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31541596A Expired - Fee Related JP3645674B2 (ja) | 1996-11-12 | 1996-11-12 | ヒートパイプ式ヒートシンク、集積回路パッケージ及びそれを用いた中央処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3645674B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3665583B2 (ja) * | 2001-03-22 | 2005-06-29 | 日立電線株式会社 | 箱型ヒートパイプ |
| AU2002367182A1 (en) | 2001-12-27 | 2003-07-15 | Showa Denko K.K. | Ebullition cooling device for heat generating component |
| JP4391366B2 (ja) | 2003-09-12 | 2009-12-24 | 古河電気工業株式会社 | ヒートパイプを備えたヒートシンクおよびその製造方法 |
| US7677299B2 (en) * | 2004-11-10 | 2010-03-16 | Wen-Chun Zheng | Nearly isothermal heat pipe heat sink |
| CN202092481U (zh) * | 2010-05-21 | 2011-12-28 | 戴佩裕 | 多层薄腔式热交换器 |
| CN102818467B (zh) * | 2012-09-12 | 2014-06-18 | 锘威科技(深圳)有限公司 | 平板热管及其制作方法 |
| JPWO2014049805A1 (ja) * | 2012-09-28 | 2016-08-22 | 株式会社日立製作所 | 冷却システム、及びそれを用いた電気機器 |
| CN116110863B (zh) * | 2023-04-13 | 2023-06-16 | 深圳辰达行电子有限公司 | 一种低压大电流沟槽型mos器件 |
| WO2025216286A1 (ja) * | 2024-04-12 | 2025-10-16 | 株式会社フジクラ | 熱輸送素子および熱輸送素子の製造方法 |
-
1996
- 1996-11-12 JP JP31541596A patent/JP3645674B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10144831A (ja) | 1998-05-29 |
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