JP3514682B2 - Resin molding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a resin molding apparatus and a release film for adhering a pressure-sensitive adhesive film to the surface of a molded product opposite to the resin-molded surface and resin-molding one surface of the molded product. The present invention relates to a resin molding device.

There is a semiconductor device in which only one surface of a molded product is resin-molded, and the other surface of the molded product is exposed by leaving the outer surface of the molded product as it is. As a method of manufacturing such a product, the applicant has a method of clamping a molded product with a mold and resin-molding the molded product, which holds the surface of the molded product exposed to the outside with a release film. A resin molding method has been proposed (Japanese Patent Laid-Open No. 11-77734). In this resin molding method, the resin is prevented from wrapping around the exposed surface of the molded product by clamping the outer surface of the molded product through a flexible release film during resin molding. .

Further, as a method of resin-molding one surface of a molded product, as shown in FIG. 8A, an adhesive film 12 is adhered to the exposed surface side of the molded product (lead frame) 10 for resin molding. Then, there is also a method of peeling the adhesive film 12 after resin molding as shown in FIG. 8B (JP-A-7-29927). In FIG. 8, 14 is a semiconductor element, 1
6 is a mold resin. As described above, according to the method of adhering the adhesive film 12 to the exposed surface of the molding target 10 and resin-molding, it is not necessary to resin-mold using the release film, and there is an advantage that a normal resin-molding apparatus can be used. is there.

[0004]

As described above, when the resin molding is performed so that one surface of the molded product is sealed with resin and the other surface is exposed, the resin molding method using the release film is not required. , As the thickness of the molded product becomes thinner, the action of clamping the molded product by the release film is diminished, and the resin easily wraps around the surface clamped by the release film, and the matrix is a series of small semiconductor chips. As in the case of resin-molding the lead frame, there is a problem that the resin tends to wrap around in the case of a molded product in which the pressing in the vicinity of the center of the cavity is insufficient. Particularly, in a map in which a large number of semiconductor chips are arranged in a matrix and the whole is resin-molded at once, the resin remarkably wraps around. In the matrix lead frame, resin molding is performed in the cavity range, and then each frame is cut together with the resin molding portion into individual semiconductor devices.

Compared with such a conventional resin molding method using a release film, the resin molding method using an adhesive film described above can effectively prevent the resin from wrapping around the resin molding surface of the molded article. There is an advantage. However, the operation of adhering the adhesive film to each molded product during resin molding and peeling the adhesive film from the molded product is complicated. The present invention, in a resin molding apparatus for resin-molding a pressure-sensitive adhesive film on a surface opposite to the resin-molded surface of a molded product, by automating the pressure-sensitive adhesive film adhesion operation, it is possible to improve production efficiency, Provided is a resin molding device that can be surely resin-molded using an adhesive film. Further, in a resin molding apparatus that performs resin molding using a release film, wrinkles that occur on the release film when the release film is supplied to the mold surface,
It is an object of the present invention to provide a resin molding device capable of preventing sagging and performing resin molding.

[0006]

In order to achieve the above object, the present invention has the following constitution. That is, in the resin molding apparatus for resin-molding the other surface side of the molded product by clamping the molded product with the upper mold and the lower mold via the adhesive film adhered to one surface of the molded product, An air suction hole that is in contact with an air mechanism for sucking air on the clamp surface of the adhesive film, and on the other side, a press part having an upper mold and a lower mold in which a cavity for resin molding is formed, and a molded product. And an in-loader section that supplies a resin material for resin molding to the press section, an unloader section that carries out a molded product resin-molded by the press section from the press section, and one of the molds attached to the press section. An adhesive film supply mechanism that supplies a long adhesive film to the clamp surface, with the adhesive part to be adhered to the molded product facing the other mold, and a molded product after resin molding. Characterized by comprising a release mechanism for peeling the et adhesive film.

Further, an in-loader section and an unloader section are arranged at positions on both sides of the press section, respectively, and the adhesive film supply mechanism is arranged so as to be orthogonal to the moving direction of the in-loader section and the unloader section. It is characterized in that a supply roll and a take-up roll that supply the adhesive film through the press section are arranged at positions on both sides of the sheet. By arranging the supply mechanism of the adhesive film so as to be orthogonal to the moving direction of the in-loader section and the unloader section,
The adhesive film supply mechanism can be arranged without interfering with the in-loader section and the unloader section, and the adhesive film supply mechanism can be easily attached to the conventional resin molding apparatus. Further, the adhesive film supply mechanism is disposed on the upper mold side of the press section, and the adhesive film is formed to have a width that covers the upper mold with substantially the entire width. This is preferable in that the configuration can be simplified.

Further, since the adhesive portion of the adhesive film is formed in the longitudinal direction of the adhesive film in the form of a stripe having a width dimension matching the resin-molded portion of the molding target,
It facilitates the alignment of the adhesive film and the product to be molded, and improves the moldability of the resin mold part. Further, the fact that the adhesive portion of the adhesive film is formed at a predetermined interval in the longitudinal direction of the adhesive film in accordance with the central region of the resin-molded portion of the molded article means that the adhesive film and the molded article are adhered to each other. This is effective in that the molded product can be easily peeled from the adhesive film while suppressing the degree of shrinkage, and the resin wraparound during molding can be suppressed, high quality resin molding is possible and productivity can be improved. . Further, in one or both of the in-loader section and the unloader section, when the in-loader and the unloader move, in contact with the adhesive film supplied to the one die, a slack of the adhesive film, a brush for correcting wrinkles, The adhesive film supplied to one of the molds is pressed against the one or both of the in-loader unit and the unloader unit when the in-loader unit and the unloader unit move, and the slack and wrinkles of the adhesive film are attached. It is effective to attach a roller for modifying the one in that one die to which the adhesive film is supplied is unevenly covered with the adhesive film to enable more reliable resin molding.

Further, a release film for supplying a release film to the resin molding surface of one or both of the upper mold and the lower mold, which is equipped with a press part having an upper mold and a lower mold for clamping and resin-molding a molded product. A resin mold including a supply mechanism for supplying a molded product and a resin material for resin molding to the press unit, and an unloader unit for unloading the molded product resin-molded by the press unit from the press unit. In the apparatus, when the inloader and the unloader are moved to one or both of the inloader section and the unloader section, the release film supplied to the one or both molds is brought into contact with the release film to adjust the slack and wrinkles of the release film. It is characterized in that a brush is attached. In addition, a roller that presses the release film supplied to the one mold to correct the slack and wrinkles of the release film when one or both of the inloader unit and the unloader unit moves, is provided. It is characterized by being attached.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. 1 to 3 show a front view, a plan view and a side view of an embodiment of a resin molding device according to the present invention. The resin molding apparatus according to the present embodiment has, as main components of the apparatus, a press section A on which a resin molding die is mounted, a supply section B for supplying an article to be molded, and a resin supply section C for supplying resin for molding. , The in-loader section D for loading the resin tablet and the molded article into the press section A,
An unloader section E for discharging the molded product from the press section A and a storage section F for the molded product are provided. The configuration of each of these parts is basically the same as the configuration in the conventional resin molding apparatus, and the characteristic point of this embodiment is that a supply mechanism G of an adhesive film that adheres to a molded product is provided.

The configuration of each of the above parts will be described below.
The press part A is a part in which a mold for resin molding is set and the molded product is clamped by the mold to perform resin molding. In the pressing unit A of the embodiment, the upper mold 20a is supported by the fixed platen 5, the lower mold 20b is supported by the movable platen 6, and the movable platen 6 is driven up and down by a hydraulic press for resin molding. The molded product supply unit B is a unit for sequentially sending the molded products such as lead frames housed in the magazine to the in-loader unit D. In this supply section B, a plurality of magazines containing the articles to be molded are set, and the lead frames are projected one by one into the in-loader section D by the pushers while gradually moving the magazines in the vertical direction to supply the articles to be molded. To do. Reference numeral 22 denotes a magazine storage unit, and 24 denotes a mechanism for the magazine lifting unit.

The supply section C for supplying the molding resin is
It has a parts feeder 26 for sequentially aligning and feeding the supplied resin tablets, and an aligning portion 28 for aligning the resin tablets supplied from the parts feeder 26 in accordance with the pot arrangement of the mold. The resin tablets aligned by the alignment unit 28 are transferred to the in loader unit D. The in-loader section D is provided so as to be capable of reciprocating between an outer position of the press section A (left side position in FIG. 1) and a position that has entered the press section A, and the article to be molded supplied from the supply section B and the alignment section 28. After chucking the resin tablet supplied from the mold in an arrangement corresponding to the arrangement of the molded product and the pot on the mold (lower mold 20b), it enters into the press section A, and the molded product and the resin on the lower mold 20b. Supply tablets. Reference numeral 30 is a turntable for arranging two molded products in parallel and facing each other.

The unloader section E is provided so as to be capable of reciprocating between a position where it enters the press section A and an outer position (the right side position in FIG. 1) of the press section A, and it enters the press section A and chucks a molded product. After that, it is carried out to a position outside the press section A. The storage unit F digs the molded product carried out by the unloader unit E to remove unnecessary resin, and then stores the molded products in a stacked manner. Reference numeral 32 denotes a storage mechanism portion for stacking and storing the molded products.

As shown in FIG. 3, the pressure-sensitive adhesive film supply mechanism G described above is wound up with a supply roll 42 for supplying the pressure-sensitive adhesive film 40 to the mold surface of the upper mold 20a with the press portion A sandwiched in the front-rear direction. The roll 44 is arranged. Supply roll 4
2 is a long adhesive film 40 wound into a roll. As shown in FIG. 2, the in-loader section D and the unloader section E move laterally between the position where they enter the press section A and the position where they are outside the press section A, whereas they are delivered from the supply roll 42 to the take-up roll 44. The adhesive film 40 that moves moves in a direction orthogonal to the moving direction of the in-loader section D and the unloader section E.

The resin molding apparatus of this embodiment is an apparatus for resin-molding an object to be molded on one side. A cavity for resin molding is provided in the lower mold 20b, and a clamp surface of the upper mold 20a is formed to be substantially flat. There is. Therefore, the adhesive film supply mechanism G is formed so as to be conveyed substantially parallel to the clamp surface of the upper mold 20a.

In the resin molding apparatus of this embodiment, a mount take-up reel 43 for winding the mount tape 43a is provided on the same side as the supply roll 42 for supplying the adhesive film 40. 46 is a separation roller for separating the adhesive film 40 and the mount tape 43a. The adhesive film 40 supported by the mount tape 43a and pulled out from the supply roll 42 is separated into the adhesive film 40 and the mount tape 43a when passing through the separation roller 46, and the adhesive film 40 is conveyed to the winding roll 44 side, The mount tape 43a is wound around the mount take-up reel 43. The adhesive surface of the adhesive film 40 is the surface facing the lower mold 20b, and the adhesive film 40 separated from the mount tape 43a.
Is slid on the clamping surface of the upper die 20a and pitch-fed toward the winding roll 44. Adhesive film 40
Does not need the mount tape 43a, it is not necessary to use the mount take-up reel 43 and the separation roller 46.

In FIG. 3, reference numerals 48a and 48b are vertical movement mechanisms for separating the adhesive film 40 conveyed from the supply roll 42 to the winding roll 44 from the clamp surface of the upper mold 20a and conveying it. The adhesive film 40 supplied to the clamp surface of the upper mold 20a is sucked by the air from the air suction holes provided in the clamp surface of the upper mold 20a so that the adhesive film 40 is sucked by the clamp surface. After the resin is molded, the vertical movement mechanisms 48a and 48b are moved from the clamp surface of the upper mold 20a to the adhesive film 40.
Is slightly pushed down to separate the adhesive film 40 from the clamp surface of the upper mold 20a and convey it. Supply roll 42, mount take-up reel 43, take-up roll 4
4 is supplied to the clamp surface of the upper mold 20a in cooperation with a drive mechanism such as an electric motor and in conjunction with a resin molding operation of the press part A or the like.

The upper die 2 is provided by the adhesive film supply mechanism G.
While supplying the adhesive film 40 to the clamp surface of 0a,
The to-be-molded product and the resin tablet are set in the lower mold 20b by the in-loader section D. The lower die 20b is a movable platen 6
It is supported by, is pushed up from the lower position to the upper clamp position, and is clamped via the adhesive film 40.
That is, the adhesive film 40 is adhered to the upper surface of the molded product.

FIG. 4 shows the cavity 5 in the upper die 20a.
0, the pot 52, the molding 60, and the like, and the upper die 2
It is explanatory drawing which shows the planar arrangement positional relationship of the adhesive film 40, the air suction hole 56, etc. in 0a. In the lower mold 20b, the cavities 50 are arranged on both sides of the pot 52,
A resin path 54 that connects the cavity 2 and the cavity 50 is formed. The molding target 60 is aligned and arranged at a predetermined position of the lower mold 20b. The molded product 60 is positioned, for example, by inserting a guide pin into a guide hole formed in the molded product 60.

In the upper die 20a, a plurality of air suction holes 56 opening at the clamp surface are formed along the side edge position where the molded product 60 is arranged. The air suction hole 56 communicates with an air suction mechanism outside the mold, and serves to suck the adhesive film 40 onto the clamp surface with air. The adhesive film 40 supplied to the clamp surface of the upper mold 20a has a width dimension that covers the mold surface of the upper mold 20a with substantially the entire width as shown in FIG. 2, and is conveyed in the same direction as the longitudinal direction of the molding target 60. It Therefore,
The adhesive portion 40a formed on the adhesive film 40 is formed in a stripe shape in parallel with the longitudinal direction of the molded product 60 in accordance with the position where the molded product 60 is arranged.

The adhesive portion 40a may of course be provided on the entire surface of the adhesive film 40, but for the purpose of preventing the resin from flowing around in the resin mold portion, the cavity 5
It is preferable to form the width of 0. In Figure 4, W is adhesive film 4
Adhesive part 4 showing the full width of 0 and S formed in stripes
Indicates the width of 0a. In addition, as in the present embodiment, the adhesive portion 40
In addition to forming a in a stripe shape, it is also possible to form rectangular adhesive portions 40a at predetermined intervals in accordance with the arrangement position of the cavity 50. Further, since the problem of resin wraparound tends to occur near the central portion of the cavity 50, instead of forming the adhesive portion 40a in the same rectangular shape as the cavity 50, the cavity 50 may be aligned with the central portion of the cavity 50 from a plane area. It is also possible to form a small circular adhesive portion. However, when the adhesive portion 40a is formed in a rectangular shape or a circular shape at a predetermined interval, the adhesive film 40 is placed so as to align the position of the cavity 50 formed in the lower mold 20b with the position of the adhesive portion 40a. Need to be transported. When the adhesive portion 40a is formed in a stripe shape, the alignment with the lower die 20b is easy.

In FIG. 4, reference numeral 58 denotes a slack preventing groove provided on the clamp surface of the upper die 20a. The adhesive film 40 is adsorbed on the clamp surface of the upper mold 20a by air through the air adsorption holes 56 and supported. The upper mold 20a and the lower mold 20b are heated to a predetermined temperature or higher to cure the resin. The adhesive film 40 supplied to the clamp surface of the upper mold 20a may be stretched by the heat of the mold, which may cause wrinkles on the clamp surface. The slack absorbing groove 58 is intended to eliminate slack by pulling the slack of the tape into the groove when the adhesive film 40 is stretched by heat. Reference numeral 59 is an air suction hole that opens at the bottom of the slack absorption groove 58. The air suction hole 59 communicates with an air suction mechanism outside the mold, and acts to draw the slack of the adhesive film 40 into the slack absorption groove 58.

FIG. 5 shows a method of clamping the molded product 60 with the upper mold 20a and the lower mold 20b to perform resin molding.
The figure shows a state in which the mold is opened in the left half of the center line CL, and the molded product 60 is clamped in the right half by the adhesive film 40 and the cavity 50 is filled with resin. With the mold opened, set the molded product 60 in the lower mold 20b, and press the upper mold 20a.
Then, the adhesive film 40 is supplied to the clamp surface and the adhesive film 40 is sucked and supported by the clamp surface by the air suction holes 56. Reference numeral 62 is a guide pin for positioning the molded product 60. The molded product 60 is a product of which one surface is resin-molded, and the lower mold 20
The cavity 50 is formed only in b.

After setting the molding target 60 and the adhesive film 40 and supplying the resin tablet 70 to the pot 52,
The lower mold 20b is raised and the molded product 60 is clamped via the adhesive film 40. Since the lower surface of the adhesive film 40 facing the molded product 60 is an adhesive surface, it is adhered to the upper surface of the molded product 60 when the molded product 60 is clamped. The adhesive film 40 is adhered to the surface of the article 60 to be molded, so that the resin is effectively prevented from wrapping around the exposed surface of the article. In addition, due to the flexibility and stretchability of the adhesive film 40 itself, the molded product 60
Clamping force can be reliably applied to the resin for resin molding, and the clamping surface of the upper die 20a is adhesive film 4
By coating with 0, it is possible to prevent resin from adhering to the surface of the mold during resin molding, and to perform resin molding. As the base material of the adhesive film 40, required heat resistance,
A film material having flexibility and cushioning property can be appropriately used, and for example, FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, ETFE film, polypropylene, etc. can be used.

In the right half of the center line in FIG. 5, the cavity 50 is filled with the resin 70a. 64 is a heater for heating the mold. Reference numeral 66 is an ejector pin for releasing the molded product from the lower mold 20b after the resin molding. After ejector pin 66 is molded with resin,
Lower mold 20b by slightly protruding the resin molding part
Release the molded product from. It should be noted that an escape recess 50a for allowing the thickness of the adhesive film 40 to escape may be provided in a portion of the upper mold 20a facing the cavity 50. The purpose is to eliminate the depression of the article to be molded 60 by the thickness of the adhesive film 40 when the article to be molded 60 is clamped by the upper die 20a and the lower die 20b by the relief 50a.

When the molded article 60 is resin-molded by the resin molding apparatus of this embodiment, the adhesive film 40
The molded product 60 adheres to the adhesive portion 40a of the adhesive film 40 and the resin cured in the cull portion and the resin passage 54 is adhered to the adhesive film
Adhere to. Therefore, when the mold is opened after resin molding, it is necessary to release the molded product from the lower mold 20b and peel the molded product from the adhesive film 40. The unloader enters the press section A in the mold open state, and carries out the molded product peeled from the adhesive film 40 and placed on the lower mold 20b together with the resin cured in the cull section and the resin passage 54.

As a peeling mechanism for peeling the molded product from the adhesive film 40, for example, the lower mold 20 after resin molding is used.
When b is lowered, the molded product is chucked by the lower mold 20b to lower the molded product together with the lower mold 20b, and the adhesive film 40 is air-adsorbed by the upper mold 20a so as not to be separated from the upper mold 20a. Good. When the adhesive film 40 is fixed to the upper mold 20a and the molded product is lowered together with the lower mold 20b, the adhesive film 40 is separated from the molded product. As a method of chucking a molded product to the lower mold 20b, the lower mold 20
There are a method of providing a clamp mechanism such as a clamp claw on b, a method of providing an adsorption hole for adsorbing the molded product 60 to the lower die 20b and adsorbing and supporting the molded article on the lower die 20b.

In consideration of peeling the molded product from the adhesive film 40, since the adhesive portion 40a is not provided at the portion corresponding to the cull portion and the resin passage 54, the adhesive property of the resin as the base material of the adhesive film 40 can be improved. Use good things,
It is preferable that the adhesiveness of the adhesive portion 40a with respect to the molded product 60 is such that the molded product can be easily peeled off after the resin molding. Further, as the adhesive portion 40a, it has a required adhesiveness at a mold temperature of about 180 ° C.,
It is also possible to use a material whose adhesiveness is lowered when the temperature of the molded article is lowered by opening the mold. Also, the adhesive section 40
Instead of providing a, it is possible to use a method of adhering a tape to a molded product by using static electricity.

In this way, after resin molding, the molded product is taken out by the unloader section E, unnecessary resin is removed from the molded product, and the molded product is stored in the molded product storage section F.
In the resin molding apparatus of the present embodiment, the adhesive film 40 is newly pitch-fed to the upper mold 20a for each resin molding operation described above, and the molded product 60 and the resin tablet 70 are set in the lower mold 20b. It is possible to automatically perform resin molding by repeating the operation of adhering the adhesive film 40 and clamping it.

As described above, in the resin molding apparatus of this embodiment, the adhesive film 40 is attached to the clamp surface of the upper mold 20a.
It is important to prevent wrinkling of the adhesive film 40 on the clamp surface when the adhesive film 40 is supplied to the upper mold 20a. This is because it is possible to prevent the resin from wrapping around and to surely perform the resin molding by firmly adhering the adhesive film 40 to the molded product 60. When mass-producing semiconductor devices, certainty and stability of such operations are required.

In the resin molding apparatus of the present embodiment, since the adhesive film 40 surely covers the clamp surface of the upper mold 20a, the adhesive film 40 is flatly placed on the unloader.
A mechanism for attaching to 0a was attached. 6 is a front view of the unloader provided in the unloader section E, and FIG. 7 is a side view.
The unloader is provided with a mechanism for chucking and carrying out the molded product on the lower die 20b, and a removing mechanism for removing the resin adhering to the die surface during resin molding. 6 and 7 show the removing mechanism of this unloader.

In FIGS. 6 and 7, 80a and 80b are brushes for brushing the mold surfaces of the upper mold 20a and the lower mold 20b, and 82 is dust suction for sucking unnecessary resin remaining on the mold surfaces of the lower mold 20b. Reference numeral 84 is a dust collecting duct. The brush 80b is arranged so as to face the mold surface of the lower mold 20b, and is for brushing the mold surface of the lower mold 20b to remove the resin adhering to the mold surface. The brush 80b is provided so as to swing right and left via a drive mechanism such as an electric motor and a cam mechanism, and by using a relatively hard brush, the resin adhering to the mold surface is easily peeled off. Reference numeral 86 is a spring that always supports the brush 80b at the retracted position and separates the brush 80b from the mold surface.
Is an air cylinder for pressing the brush 80b against the mold surface side during brushing.

In this embodiment, since the clamp surface of the upper mold 20a is covered with the adhesive film 40, the upper mold 2
The brush 80a arranged so as to face the clamp surface of 0a does not need to brush the mold surface, and is attached for the purpose of correcting wrinkles of the adhesive film 40 covering the clamp surface. Therefore, the brush 80a is made of a material softer than the brush 80b used for brushing the lower die 20b, and the adhesive film 40 is easily attached to the clamp surface of the upper die 20a while swinging left and right like the brush 80b. Try to put it on. The adhesive film 40 is newly fed to the clamp surface of the upper mold 20a by the adhesive film supply mechanism G each time the resin molding operation is performed. The unloader is in the press section A with the mold opened.
When it enters the inside and moves from the press section A to the outside, the pressure-sensitive adhesive film 40 is lightly pressed by the brush 80a so that the pressure-sensitive adhesive film 40 is covered.

It is also possible to install a roller 90 such as a sponge that exerts a soft pressing force on the front side where the brush 80a is arranged, press the adhesive film 40 with the brush 80a, and press the adhesive film 40 with the roller 90. it can. Adjust the strength of the spring 86 and the air cylinder 88 that support the brush 80a,
By appropriately adjusting the pressing force of the brush 80a and the roller 90 against the adhesive film 40, it is possible to effectively prevent the slack and wrinkles of the adhesive film 40. The roller 90 is also preferably opened and closed by the air cylinder 88 in the same manner as the brush 80a.

Dust suction section 82 arranged at the front end of the unloader
When the unloader moves to the outside of the press part A, unnecessary resin remaining on the mold surface of the lower mold 20b is sucked by air and discharged from the dust collecting duct 84 to the outside. With the movement of the unloader, the dust suction part 82 moves on the lower mold surface brushed by the brush 80b, whereby the entire mold surface of the lower mold 20b can be cleaned. Reference numeral 92 is an exhaust tube connected to the dust collection duct 90, and 94 is a high-voltage cable connected to the ion blower 96. The ion blower 96 is provided to neutralize static electricity such as flash that adheres to the mold surface.

In this embodiment, the brush 80a and the roller 90 are attached to the unloader as a mechanism for preventing the slack and wrinkles of the adhesive film 40. However, the mechanism for preventing such slack is attached to the lower mold 20b. Molded product 60
It is also possible to attach it to an in-loader for supplying. When the inloader enters the press section A or retracts from the press section A to the outside, the adhesive film 40 is applied to the brush 8
By pressing with 0a or the roller 90, the slack or wrinkle of the adhesive film 40 can be corrected similarly to the above method.

According to the resin molding apparatus of this embodiment,
By adhering the adhesive film to the surface of the molded product 60 opposite to the resin molding surface, resin molding can be performed without causing the resin to wrap around the exposed surface side of the product. In the molding method, even if a release film is used, resin molding can be surely performed even when resin burrs are easily generated. Further, as described above, the adhesive film 40 can be surely adhered to the molded article 60 by air-adsorbing the adhesive film 40 to the upper mold 20a, and a resin-molded product of stable quality can be obtained. it can.

Further, the resin molding apparatus of this embodiment is
By incorporating the adhesive film supply mechanism G in the resin molding apparatus, it is possible to automate the resin molding method using the adhesive film 40 and perform extremely efficient resin molding. In addition, since the configuration of the resin molding apparatus of this embodiment can be constructed by attaching the adhesive film supply mechanism G to the conventional resin molding apparatus, the conventional resin molding apparatus can be effectively used.

In the embodiment of the resin molding apparatus described above, the upper mold 20a is the fixed side and the lower mold 20b is the movable side. However, the resin mold in which the upper mold 20a is the movable side and the lower mold 20b is the fixed side. The same can be applied to the device. Further, in the above-described embodiment, the adhesive film 40 supplied to the upper mold 20a is formed of a single film covering the entire width of the upper mold 20a, but two adhesive films are independently provided according to the respective arrangement positions of the molded product 60. It can also be configured to supply 40. Further, in the above embodiment,
The adhesive film 40 was supplied to the upper mold 20a, but the pot 52
The adhesive film 40 may be supplied to both sides of the upper mold 20a to form the cavity, and the adhesive film 40 may be supplied to the lower mold 20b.

In the above embodiment, the brush 80a and the roller 90 are provided in the unloader to attach the adhesive film 40 evenly to the upper die 20a. However, these configurations are not limited to the adhesive film and the release film. The same can be applied to a resin molding device using the same. When the mold is covered with the release film and resin-molded, the release film is prevented from wrinkling or slackening, so that the resin-molding can be surely performed.

[0041]

As described above, according to the resin molding apparatus using the pressure-sensitive adhesive film of the present invention, the molded product can be resin-molded without causing problems such as resin burrs, which is extremely reliable. It becomes possible to manufacture a high semiconductor device. In addition, by incorporating the adhesive film supply mechanism in the resin molding device, the operation of adhering the adhesive film to the molded product and peeling the adhesive film from the molded product is automated, enabling efficient resin molding operation. It has a remarkable effect that it can be enabled.

[Brief description of drawings]

FIG. 1 is a front view showing a configuration of an embodiment of a resin molding device according to the present invention.

FIG. 2 is a plan view of a resin molding device according to an embodiment.

FIG. 3 is a side view of the resin molding device according to the embodiment.

FIG. 4 is an explanatory diagram showing a positional relationship in plane arrangement between a die and an adhesive film.

FIG. 5 is a cross-sectional view showing a method of clamping a molded product with an upper mold and a lower mold to perform resin molding.

FIG. 6 is a front view showing a configuration of an unloader.

FIG. 7 is a side view showing a configuration of an unloader.

FIG. 8 is an explanatory diagram showing a method of resin-molding using an adhesive film.

[Explanation of symbols]

5 Fixed platen 6 Movable platen 10 Molded product 12 Adhesive film 20a Upper mold 20b lower mold 40 Adhesive film 40a adhesive section 42 supply roll 43 reels 43a Mount tape 44 rolls 46 Separation roller 48a Vertical movement mechanism 50 cavities 50a escape recess 52 pots 54 Resin Road 56 Air suction hole 58 Absorption groove 59 Air suction hole 60 molded products 66 ejector pin 70 resin tablets 70a resin 80a, 80b brush 82 Dust collector 84 dust collection duct 86 spring 88 air cylinder 90 Laura 90 Dust collection duct

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Claims (9)

(57) [Claims] 1. A resin molding apparatus for resin-molding the other surface side of a molded product by clamping the molded product with an upper die and a lower mold via an adhesive film adhered to one surface of the molded product. In, the one side is provided with an air suction hole for adsorbing air to the clamp surface of the adhesive film, which is connected to the air mechanism, and the other side is a press part having an upper mold and a lower mold in which a cavity for resin molding is formed, An in-loader unit that supplies a molded product and a resin material for resin molding to the press unit, an unloader unit that carries out a molded product resin-molded by the press unit from the press unit, and one of the ones mounted on the press unit. On the clamp surface of the mold,
An adhesive film supply mechanism that supplies a long adhesive film with the adhesive portion that is adhered to the molded product facing the other mold, and a peeling mechanism that peels the adhesive film from the molded product after resin molding. A resin molding device comprising: 2. An inloader section and an unloader section are arranged at positions on both sides of the press section, and the adhesive film supply mechanism is arranged so as to be orthogonal to a moving direction of the inloader section and the unloader section. The resin molding apparatus according to claim 1, wherein a supply roll and a take-up roll that supply the adhesive film through the press portion are arranged at positions on both sides of the resin molding device. 3. The adhesive film supply mechanism is disposed on the upper die side of the press section, and the adhesive film is formed to have a width that covers the upper die with substantially the entire width.
Alternatively, the resin molding device according to the item 2. 4. The pressure-sensitive adhesive portion of the pressure-sensitive adhesive film is formed in the longitudinal direction of the pressure-sensitive adhesive film in the shape of a stripe having a width dimension matching the resin-molded portion of the molded article. 3. The resin molding device according to item 3. 5. The adhesive part of the adhesive film is formed at predetermined intervals in the longitudinal direction of the adhesive film so as to match the central region of the resin molded part of the article to be molded. 2. The resin molding device according to 2 or 3. 6. The slack and wrinkles of the adhesive film are corrected by contacting the adhesive film supplied to the one mold when the inloader and the unloader move to one or both of the inloader section and the unloader section. Brushes are attached, Claims 1, 2, 3,
4. The resin molding device according to 4 or 5. 7. The slack and wrinkles of the adhesive film are corrected by pressing an adhesive film supplied to the one mold when one of the inloader portion and the unloader portion or both of them moves. A roller is attached to the roller.
The resin molding device according to 4, 5, or 6. 8. A release film for supplying a release film to the resin molding surface of one or both of the upper mold and the lower mold, which comprises a press unit having an upper mold and a lower mold for clamping and molding the article to be resin-molded. A resin mold including a supply mechanism for supplying a molded product and a resin material for resin molding to the press unit, and an unloader unit for unloading the molded product resin-molded by the press unit from the press unit. In the device, one or both of the inloader section and the unloader section,
A resin molding apparatus, characterized in that, when the in-loader and the unloader are moved, a brush for fixing slack and wrinkles of the release film is attached in contact with the release film supplied to the one or both molds. . 9. The slack and wrinkles of the release film are adjusted by pressing a release film supplied to the one mold when one of the inloader part and the unloader part or both of them moves. The resin molding device according to claim 8, wherein a roller is attached.