JPH0319149B2 - - Google Patents
Info
- Publication number
- JPH0319149B2 JPH0319149B2 JP59072546A JP7254684A JPH0319149B2 JP H0319149 B2 JPH0319149 B2 JP H0319149B2 JP 59072546 A JP59072546 A JP 59072546A JP 7254684 A JP7254684 A JP 7254684A JP H0319149 B2 JPH0319149 B2 JP H0319149B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- adhesive tape
- peeling
- tape
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 63
- 230000001681 protective effect Effects 0.000 claims description 63
- 238000004804 winding Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
- B29C63/0013—Removing old coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H3/00—Separating articles from piles
- B65H3/20—Separating articles from piles using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、例えば集積回路などの製造に用い
るシリコンウエハ、セラミツクウエハ等の薄板状
物品の表面に貼着した保護フイルムの剥離方法に
関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for peeling off a protective film stuck to the surface of a thin plate-like article such as a silicon wafer or a ceramic wafer used for manufacturing integrated circuits. be.
上記のようなシリコンウエハの場合、表面に保
護フイルムを貼着して保護したのち、フイルムを
貼着していない側を水流を併用して研磨するなど
の作業を行ない、その後不用になつた保護フイル
ムを剥離するようにしていた。
In the case of silicon wafers like the ones mentioned above, a protective film is attached to the surface to protect it, and then the side to which the film is not attached is polished using a jet of water to remove the protection that is no longer needed. I was trying to peel off the film.
従来は上記のような保護フイルムの剥離作業を
手作業で行なつていたのできわめて手数がかかり
非能率なものであつた。
Conventionally, the above-mentioned process of removing the protective film was performed manually, which was extremely time-consuming and inefficient.
このため、第１３図ないし第１７図に示すよう
に保護フイルムの上にこれより強い粘着力をもつ
た剥離用の粘着テープを貼着し、この粘着テープ
とともに保護テープを剥離する方法も考えられ
る。 Therefore, as shown in Figures 13 to 17, a method can be considered in which a peeling adhesive tape with a stronger adhesive strength is pasted on top of the protective film, and the protective tape is peeled off together with this adhesive tape. .
すなわち、第１３図、第１４図に示すようにシ
リコンウエハのような薄板状物品３０の上に貼着
した保護フイルム３１上に貼着した粘着テープ３
３により剥離する方法において、移動台３２に設
けた上下の剥離用テープ案内ローラ３４と下端の
テープ案内片３５に粘着テープ３３を係合させ、
移動台３２を矢印方向に移動させてテープ３３を
たるませずに剥離する場合、第１３図、第１４図
のように粘着テープ３３が貼着面に対して30度〜
90度に立上つた状態に引張つて剥離されることに
なり、剥離に要する力が過大になつて、薄板状物
品３０に歪みを生じさせたり破損させることがあ
る。 That is, as shown in FIGS. 13 and 14, an adhesive tape 3 is attached to a protective film 31 attached to a thin plate-like article 30 such as a silicon wafer.
In the peeling method according to step 3, the adhesive tape 33 is engaged with the upper and lower peeling tape guide rollers 34 provided on the moving table 32 and the tape guide piece 35 at the lower end,
When moving the moving platform 32 in the direction of the arrow to peel off the tape 33 without causing it to slacken, the adhesive tape 33 is held at an angle of 30 degrees to the surface to which it is attached, as shown in FIGS. 13 and 14.
Since the thin plate-like article 30 is pulled and peeled at an angle of 90 degrees, the force required for peeling becomes excessive, and the thin plate-like article 30 may be distorted or damaged.
また、第１５図のように移動台３２に３本の剥
離用テープ案内ローラ３４を取付けてテープ３３
をたるませずに剥離すると、保護フイルム３１と
物品３０の間に第１６図の拡大図のｂのような糊
引き現象が起り、物品３０の表面に貼つた保護フ
イルム３１の粘着剤（糊）を物品３０の表面に残
すことになる。 In addition, as shown in FIG. 15, three peeling tape guide rollers 34 are attached to the moving base 32, and the tape
If the protective film 31 is peeled off without loosening, a gluing phenomenon as shown in b in the enlarged view of FIG. 16 occurs between the protective film 31 and the article 30, and the adhesive (glue) of the protective film 31 attached to the surface of the article 30 occurs. will be left on the surface of the article 30.
従つて物品３０を持ち上げないようにし、かつ
糊残りを生じさせないようにする必要がある。 Therefore, it is necessary to avoid lifting the article 30 and to avoid leaving adhesive residue.
このため、テープの剥れる部分での状態を鋭角
にする必要がある。 For this reason, it is necessary to form an acute angle at the part where the tape peels off.
鋭角にする方法としては第１７図のように移動
台３７に鋭角状のピーリンングバー３６を設けて
テープ３３を鋭角状にして剥離する方法も考えら
れるが、物品３０がシリコンウエハのような半導
体ICなどの場合、表面に圧力や傷を与えるおそ
れがあるためバー３６のようなものを接触させる
ことはできない。 As a method of forming an acute angle, it is possible to provide a peeling bar 36 with an acute angle on the movable table 37 as shown in FIG. In the case of a semiconductor IC, etc., it is not possible to bring something like the bar 36 into contact with it because it may cause pressure or damage to the surface.
また、粘着テープを保護フイルム上に貼着する
場合、押圧ローラで粘着テープを保護テープ上に
押し付けると、その下部の薄板状物品を破損させ
る場合がある。 Furthermore, when adhering an adhesive tape onto a protective film, pressing the adhesive tape onto the protective tape with a pressure roller may damage the thin plate-like article underneath.
この発明の課題は上記の問題点を解決して押圧
ローラを用いずに保護フイルムに粘着テープを貼
着するとともに保護フイルムに貼着した粘着テー
プを所要の傾斜角を維持しながら剥離方向に引張
つて、保護フイルムと一体に剥離する方法を提供
することである。 The problem of this invention is to solve the above problems and apply adhesive tape to a protective film without using a pressure roller, and to pull the adhesive tape applied to the protective film in the peeling direction while maintaining the required angle of inclination. Therefore, it is an object of the present invention to provide a method for peeling off the protective film together with the protective film.
〔課題を解決するための手段〕
上記の目的を達成するために、この発明は薄板
状物品の保持台上方に粘着テープ供給装置と、剥
離装置を設け、保護フイルムを表面に貼着した薄
板状物品に粘着テープを粘着テープ供給装置によ
り供給して保護フイルム上に貼着し、その後粘着
テープの巻取りを行ない粘着テープと保護フイル
ムとを一体に剥離するようにした保護フイルムの
剥離方法において、保持台上の保護フイルムを貼
着した薄板状物品の上方に、粘着テープを粘着層
を下にするとともに、保護フイルムとの間に若干
の間隙を存して張りわたし、ついで、この粘着テ
ープを弛めることにより保護フイルムの表面に接
触させ、この粘着テープの粘着力による引きはが
し力のみで保護フイルムを薄板状物品から剥離す
る方法を提供する。[Means for Solving the Problems] In order to achieve the above object, the present invention provides an adhesive tape supply device and a peeling device above a holding table for a thin plate-shaped article, and provides a thin plate-shaped article with a protective film attached to the surface. In a method for peeling off a protective film, the adhesive tape is supplied to an article by an adhesive tape supply device, the adhesive tape is pasted onto the protective film, and the adhesive tape is then wound up to peel off the adhesive tape and the protective film together, Place the adhesive tape over the thin plate-shaped article with the protective film attached on the holding table, with the adhesive layer facing down, leaving a slight gap between the adhesive tape and the protective film, and then apply the adhesive tape. To provide a method in which a protective film is brought into contact with the surface of a thin plate-like article by loosening the adhesive tape, and the protective film is peeled off from a thin plate-like article using only the peeling force due to the adhesive force of the adhesive tape.
また、保護フイルムを表面に貼着した薄板状物
品を保持台上に保持せしめ、粘着テープ供給装置
のテープの繰出し側にある剥離装置を保持台上面
と平行の系路に沿つて走らせて、粘着テープを保
護フイルム上に若干の間隙を存して張りわたした
のち、上記剥離装置を逆行させて粘着テープを弛
ませることにより、粘着テープを保護フイルム上
に接触させ、ついで、剥離装置を元の位置まで戻
すことにより粘着テープとともに保護フイルムを
剥離するとともに、粘着テープの供給装置により
粘着テープを巻取る方法および上記の粘着テープ
の巻取り開始時に対し剥離装置の移動開始時を先
行させる時間差を設け、この時間差により、テー
プをたるませた状態で保護フイルムの剥離を行な
う方法も提供する。 In addition, a thin plate-shaped article with a protective film attached to its surface is held on a holding table, and a peeling device on the tape feeding side of the adhesive tape supply device is run along a path parallel to the top surface of the holding table. After stretching the tape over the protective film with a slight gap, the peeling device is moved backwards to loosen the adhesive tape so that the adhesive tape comes into contact with the protective film, and then the peeling device is returned to its original position. The protective film is peeled off along with the adhesive tape by returning it to the position, and the adhesive tape is wound up by the adhesive tape supply device, and a time difference is provided in which the time when the peeling device starts moving is preceded by the time when the above-mentioned start of winding of the adhesive tape is started. The present invention also provides a method of peeling off the protective film with the tape slackened due to this time difference.
第１図はこの発明方法を実施する装置の一例で
ある。１は機台であつて、その上部後寄りに多数
のシリコンウエハのような薄板上物品２を一定の
間隔で積上げたマガジン３を設ける。このマガジ
ン内の物品２の上面には粘着フイルムからなる保
護フイルム４が粘着してある。
FIG. 1 shows an example of an apparatus for carrying out the method of this invention. Reference numeral 1 designates a machine base, and a magazine 3 in which a large number of thin plate articles 2 such as silicon wafers are stacked at regular intervals is provided at the rear of the machine base. A protective film 4 made of an adhesive film is adhered to the upper surface of the article 2 in this magazine.
５は無端搬送ベルト６を有する取出し手段、７
はベルト６の駆動プーリであり、図示省略してあ
るモータにより駆動される。 5 is a take-out means having an endless conveyor belt 6;
is a drive pulley for the belt 6, which is driven by a motor (not shown).
８はマガジンの受台であり、適宜の昇降機構９
により一定ピツチにて下降し、次の物品２をベル
ト６上に載せる作用を行なう。１０は機台１上の
側方に設けた機箱で、その側面に一対の巻軸１
１，１２を設ける。 8 is a cradle for the magazine, and an appropriate lifting mechanism 9
The belt 6 descends at a constant pitch and places the next article 2 on the belt 6. 10 is a machine box installed on the side of the machine base 1, and a pair of winding shafts 1 are mounted on the side of the machine box.
1 and 12 are provided.
巻軸１１には粘着テープ１４を巻く。巻軸１２
は物品２から剥離した保護フイルム４と共に粘着
テープ１４を巻き取るものであり、巻軸１１には
制動装置、巻軸１２には駆動装置を設け、これら
により、巻軸１２のテープ繰出し側から繰出した
粘着テーープ１４を巻軸１１に巻取る粘着テープ
供給装置を構成する。 An adhesive tape 14 is wound around the winding shaft 11. Winding shaft 12
is for winding up the adhesive tape 14 together with the protective film 4 peeled off from the article 2.The winding shaft 11 is provided with a braking device, and the winding shaft 12 is equipped with a drive device, and these allow the tape to be unrolled from the tape unwinding side of the winding shaft 12. An adhesive tape supply device is configured to wind up the adhesive tape 14 onto the winding shaft 11.
１５は機箱１０に設けたガイドローラであり、
このガイドローラ１５の下部に適宜の駆動装置に
よつて矢印方向へ駆動されている引取りローラ１
５′がある。 15 is a guide roller provided in the machine box 10;
A take-up roller 1 is mounted below the guide roller 15 and is driven in the direction of the arrow by an appropriate drive device.
There is 5′.
引取りローラ１１５′の前方には真空吸引機能
を備えた保持台１６がある。この保持台１６は第
６図のように上面に無数の吸引孔を有する中空体
であり、真空吸引装置に弁を介して連通してい
る。 In front of the take-up roller 115' is a holding table 16 equipped with a vacuum suction function. As shown in FIG. 6, this holding table 16 is a hollow body having numerous suction holes on its upper surface, and communicates with a vacuum suction device via a valve.
この保持台１６の前方には剥離装置がある。こ
の剥離装置は上下一対の剥離用テープ案内ローラ
１７と、その下部のテープ案内片２３を移動台１
９に取付けたものである。この移動台１９は機箱
１０に設けたガイドレール２０に摺動自在に取付
けられ、動力駆動の送りネジあるいはエアシリン
ダなどにより保持台１６の上面と平行に移動す
る。また、テープ案内片２３は、粘着テープ１４
を物品２の上面面に接触させないように、保持台
１６の上面より若干高い位置に設けられる。 In front of this holding table 16 is a peeling device. This peeling device has a pair of upper and lower peeling tape guide rollers 17 and a tape guide piece 23 at the bottom of the peeling tape guide rollers 17,
This is what was installed on 9. This moving table 19 is slidably attached to a guide rail 20 provided in the machine box 10, and is moved parallel to the upper surface of the holding table 16 by a power-driven feed screw or an air cylinder. Further, the tape guide piece 23 is connected to the adhesive tape 14.
It is provided at a position slightly higher than the upper surface of the holding table 16 so as not to contact the upper surface of the article 2.
粘着テープ１４は巻軸１１から引出され、上記
ガイドローラ１５の下面、保持台１６の上方を経
てテープ案内片２３に掛けられ、更に剥離用案内
ローラ１７間及びガイドローラ１８を通つて巻軸
１２に巻取られる。 The adhesive tape 14 is pulled out from the winding shaft 11, passes through the lower surface of the guide roller 15 and above the holding table 16, is hung on the tape guide piece 23, and is further passed between the peeling guide rollers 17 and through the guide roller 18 onto the winding shaft 12. It is wound up.
前記マガジン３から送り出された物品２は取出
し手段５のベルト６により所定の速度で取出さ
れ、引取りローラ１５′により加速されて慣性に
より吸引台１６上へ送り込まれる。 The article 2 sent out from the magazine 3 is taken out at a predetermined speed by the belt 6 of the take-out means 5, accelerated by the take-up roller 15', and sent onto the suction table 16 by inertia.
こうして物品２が保持台１６上に来ると、巻軸
１１，１２および引取りローラ１５′は一旦停止
する。このとき、第３図のように物品２上に粘着
層２１を下にした粘着テープ１４が若干の間隙を
存して張りわたされた状態にある。 When the article 2 is thus placed on the holding table 16, the winding shafts 11, 12 and the take-up roller 15' are temporarily stopped. At this time, as shown in FIG. 3, the adhesive tape 14 with the adhesive layer 21 facing down is stretched over the article 2 with a slight gap.
ついで、保持台１６の真空吸引が始まり、物品
２を保持台１６上に固定したのち、移動台１９が
第３図の矢印方向へ戻り始める。このとき、巻軸
１１，１２は停止しているから、ローラ１５，１
７間のテープ１４が第４図のように弛む。 Next, vacuum suction of the holding table 16 is started, and after the article 2 is fixed on the holding table 16, the moving table 19 starts to return in the direction of the arrow in FIG. 3. At this time, since the winding shafts 11 and 12 are stopped, the rollers 15 and 1
The tape 14 between the holes 7 and 7 loosens as shown in FIG.
従つて、第６図のように物品２上に粘着層１３
を介して貼着してある保護フイルム４上にテープ
１４が粘着層２１を介して接着される。 Therefore, as shown in FIG.
The tape 14 is adhered to the protective film 4 through the adhesive layer 21.
上記のようにテープ１４が弛んで保護フイルム
４上に接着したのちも移動台１９は引きつづき矢
印方向へ戻つている。 Even after the tape 14 has loosened and adhered to the protective film 4 as described above, the moving table 19 continues to return in the direction of the arrow.
上記のように移動台１９が戻り始めた時から若
干の時間差をおいて、巻軸１２が第１図の矢印方
向へ回転を始めて粘着テープ１４の巻上げを開始
する。このとき、巻軸１１は制動装置の働きによ
り回転を阻止されている。 As mentioned above, after a slight time lag after the movable table 19 begins to return, the winding shaft 12 begins to rotate in the direction of the arrow in FIG. 1 and begins to wind up the adhesive tape 14. At this time, the winding shaft 11 is prevented from rotating by the action of the braking device.
従つて粘着テープ１４は第５図のように弛んだ
まま接着した保護フイルム４をテープ１４の引は
がし力のみではがしていき、薄板状物品２に応力
を与えない。 Therefore, as shown in FIG. 5, the adhesive tape 14 peels off the adhered protective film 4 with only the peeling force of the tape 14, and does not apply stress to the thin plate-like article 2.
また、保護イルムの剥離始端ａ（第５図参照）
に比べ、剥離ローラ１７の位置が後方（剥離方
向）に一定距離だけ先行し、粘着テープ１４はテ
ープ案内片２３から離れた状態で上記の剥離始端
ａから斜め後方に立上がる。 Also, the peeling start edge a of the protective film (see Figure 5)
Compared to this, the position of the peeling roller 17 is advanced by a certain distance backward (in the peeling direction), and the adhesive tape 14 rises diagonally backward from the peeling start end a while being separated from the tape guide piece 23.
粘着テープ１４の粘着力は保護フイルム４の粘
着力より強いものを使用するので、移動台１９の
移動とともに粘着テープ１４が保護フイルム４と
ともに剥離される。このとき移動台１９の移動速
度と巻軸１２の巻取り速度を一定に保つことによ
り、粘着テープ１４の傾斜角度は一定に維持され
る。 Since the adhesive tape 14 has a stronger adhesive force than the protective film 4, the adhesive tape 14 is peeled off together with the protective film 4 as the moving table 19 moves. At this time, by keeping the moving speed of the moving table 19 and the winding speed of the winding shaft 12 constant, the inclination angle of the adhesive tape 14 is kept constant.
こうして、保護フイルム４が物品２から殆んど
剥離した段階で巻軸１１の制動および保持台１６
の真空吸引を解除し、さらに巻軸１２を駆動して
テープ１４を巻取りながら移動台９を前方に移動
させると、粘着テープ１４の粘着力で、物品２上
から大部分剥離された保護フイルム４とともに物
品２も同方向に移動し、物品２はつぎの無端搬送
ベルト２２上へ載り、保護フイルム４は物品２か
ら完全に剥がれてテープ１４とともに巻軸１２に
巻取られる。 In this way, when the protective film 4 is almost peeled off from the article 2, the winding shaft 11 is braked and the holding stand 16
When the vacuum suction is released and the moving table 9 is moved forward while winding the tape 14 by driving the winding shaft 12, most of the protective film is peeled off from the article 2 due to the adhesive force of the adhesive tape 14. 4, the article 2 also moves in the same direction, the article 2 is placed on the next endless conveyor belt 22, the protective film 4 is completely peeled off from the article 2, and is wound up on the winding shaft 12 together with the tape 14.
また、第８図、第９図に示すように、保持台１
６を複数に分割してベルト２２の後部が保持台１
６間に組み込まれるようにしてテープ剥離の終了
した物品２をベルト２２により送り出すようにす
る場合がある。この際、保持台１６を上下するよ
うにして、物品２がベルト２２上にきたとき保持
台１６を下げると物品２はベルト２２に確実に乗
り移ることができる。 In addition, as shown in FIGS. 8 and 9, the holding table 1
6 is divided into multiple parts, and the rear part of the belt 22 is the holding base 1.
In some cases, the article 2 that has been removed from the tape is sent out by the belt 22 so that the article 2 is assembled between the belts 6 and 6. At this time, by moving the holding stand 16 up and down and lowering the holding stand 16 when the article 2 is on the belt 22, the article 2 can be reliably transferred to the belt 22.
また、第１０図のようにベルト２２を引取りベ
ルト２２を引取りローラ１５′に接近させると品
物２の移動が円滑に行なわれる。その他の第１１
図のように引取りローラ１５′を廃止し、そのか
わりに無端搬送ベルト６とベルト２２の間に無端
ベルト２７を設けてこれの間欠駆動により物品２
の吸引台１６上への送り込みや送り出しを行なう
場合、あるいは第１２図のようにベルト２２を廃
止し、無端搬送ベルト６のみを装置の全長に亘つ
て設け、適当な個所にベルト６を支える複数のキ
ヤリヤローラ２８を配置してこのベルト６の駆動
プーリ７により間欠駆動する場合もあり、これら
の場合は何れも第９図に示すような吸引台１６を
用いる。 Further, as shown in FIG. 10, when the belt 22 is brought closer to the take-up roller 15', the article 2 can be moved smoothly. Other 11th
As shown in the figure, the take-up roller 15' is eliminated, and instead, an endless belt 27 is provided between the endless conveyor belt 6 and the belt 22, and the article is picked up by intermittent driving of the endless belt 27.
When transporting to or from the suction table 16, or as shown in FIG. 12, the belt 22 is abolished and only the endless conveyor belt 6 is provided over the entire length of the device, and a plurality of belts supporting the belt 6 are placed at appropriate locations. In some cases, a carrier roller 28 is arranged and driven intermittently by the drive pulley 7 of the belt 6, and in both cases, a suction table 16 as shown in FIG. 9 is used.
また、粘着テープ１４は第７図に示すように物
品２の巾に比較して狭いものでもよい。 Further, the adhesive tape 14 may be narrower than the width of the article 2, as shown in FIG.
上記のように保護フイルム４が剥がされてベル
ト２２上に載つた物品２はつぎのマガジン２６内
に送り込まれる。 As described above, the protective film 4 is peeled off and the articles 2 placed on the belt 22 are fed into the next magazine 26.
このマガジン２６も前記マガジン３とほぼ類似
するもので、適宜の昇降機構２４により昇降され
る受台２５上に載り、物品２がマガジン２６内に
１枚挿入される毎に受台２５が１ピツチ上昇する
ものである。 This magazine 26 is also almost similar to the magazine 3, and is placed on a pedestal 25 that is raised and lowered by an appropriate elevating mechanism 24, and each time one article 2 is inserted into the magazine 26, the pedestal 25 moves one pitch. It is something that rises.
上記の作用において、剥離用テープ案内ローラ
１７を有する移動台１９が前方に移動している途
中において、搬送ベルト６が駆動され、つぎの物
品が引取りローラ１５′上に送り込まれてくる。 In the above operation, while the movable table 19 having the peeling tape guide roller 17 is moving forward, the conveyor belt 6 is driven and the next article is sent onto the take-up roller 15'.
実施例の装置では上記の作用の繰返しにより、
つぎつぎと物品２上の保護フイルム４が粘着テー
プ１４の粘着力により剥離され、剥がされたフイ
ルム４はテープ１４とともに巻軸に巻取られ、フ
イルム４を剥離した物品２はマガジン２６に収容
されるので、従来きわめて手数がかかつていた保
護フイルム４の剥離作業が全自動的に能率よく行
われ、しかも物品２に圧力をかけて破損させるよ
うなことがない。 In the device of the embodiment, by repeating the above action,
The protective film 4 on the article 2 is peeled off one after another by the adhesive force of the adhesive tape 14, the peeled off film 4 is wound up on a reel together with the tape 14, and the article 2 from which the film 4 has been peeled off is stored in the magazine 26. Therefore, the work of peeling off the protective film 4, which has conventionally been very time-consuming, can be carried out fully automatically and efficiently, and there is no need to apply pressure to the article 2 and damage it.
また、この発明方法においては必要に応じて部
分的にウエハの外周縁部のみを押圧することも可
能である。 Further, in the method of the present invention, it is also possible to partially press only the outer peripheral edge of the wafer, if necessary.
なお、実施例は物品の供給およびフイルム剥離
後の物品の送り出しをベルトコンベヤにて行なつ
ているが、物品の吸着器により搬送する方式ある
いはプツシヤーを用いてもよい。 In the embodiment, a belt conveyor is used to supply the articles and send out the articles after the film has been peeled off, but a system in which the articles are conveyed by a suction device or a pusher may also be used.
この発明は上記のように、粘着テープを薄板状
物品の上面に若干の間隙を存して張りわたし、そ
ののちこれを弛ませて保護フイルに接着させたの
ち、薄板状物品を保持しつつ粘着テープを引張る
手数を有する簡単な装置により自動的に保護フイ
ルムを剥離できるものであるが、この発明の場
合、粘着テープの接着時に押圧ローラなどで物品
に圧力を加えず、粘着テープの引きはがし力のみ
で保護フイルムをはがすのであり、その際、粘着
フイルム及びこれと一体の保護フイルムを後方へ
ほぼ一定の傾斜角を維持しながら剥離することが
できるので、その剥離に際して薄板状物品に与え
る荷重を極力小さくすることができ、当該物品に
与える歪みや破損や回路断線を無くすることがで
きる。
As described above, this invention involves stretching an adhesive tape over the top surface of a thin plate-shaped article with a slight gap, then loosening it and adhering it to a protective film, and then adhering it to a protective film while holding the thin plate-shaped article. The protective film can be automatically peeled off using a simple device that has the ability to pull the tape, but in the case of this invention, pressure is not applied to the article using a pressure roller or the like when adhering the adhesive tape, and the peeling force of the adhesive tape is reduced. The protective film can be peeled off with a chisel, and at that time, the adhesive film and the protective film integrated with it can be peeled off while maintaining an approximately constant angle of inclination to the rear. It can be made as small as possible, and distortion and damage to the article, as well as circuit breakage, can be eliminated.
第１図はこの発明の剥離方法を実施する装置の
一例を示す一部縦断正面図、第２図は同上の平面
図、第３図、第４図、第５図は同上要部の作用を
示す一部切欠拡大正面図、第６図は粘着状態の拡
大縦断面図、第７図は保持台の平面図、第８図は
保持台付近の他の例の縦断側面図、第９図は同上
の正面図、第１０図ないし第１２図は他の各実施
例を示す正面図、第１３図ないし第１７図は従来
のテープ剥離方法の各例を示す一部切欠拡大正面
図である。
１……機台、２……薄板状物品、３……マガジ
ン、４……保護フイルム、５……取出し手段、６
……無端搬送ベルト、７……駆動プーリ、８……
受台、９……昇降機構、１０……機箱、１１，１
２……巻軸、１４……粘着テープ、１５……圧着
ローラ、１６……保持台、１７……テープ案内ロ
ーラ、１８……案内ローラ、１９……移動台、２
０………ガイドロール、２２……ベルト、２３…
…テープ案内片、２４……昇降機構、２５……受
台、２６……マガジン。
FIG. 1 is a partially longitudinal front view showing an example of an apparatus for implementing the peeling method of the present invention, FIG. 2 is a plan view of the same, and FIGS. 3, 4, and 5 show the operation of the main parts of the same. FIG. 6 is an enlarged vertical sectional view of the adhesive state, FIG. 7 is a plan view of the holding base, FIG. 8 is a longitudinal sectional side view of another example near the holding base, and FIG. 9 is a partially cutaway enlarged front view. FIGS. 10 to 12 are front views showing other embodiments, and FIGS. 13 to 17 are partially cutaway enlarged front views showing examples of conventional tape peeling methods. DESCRIPTION OF SYMBOLS 1... Machine base, 2... Thin plate-like article, 3... Magazine, 4... Protective film, 5... Removal means, 6
... Endless conveyor belt, 7 ... Drive pulley, 8 ...
cradle, 9...lifting mechanism, 10...machine box, 11,1
2... Winding shaft, 14... Adhesive tape, 15... Pressure roller, 16... Holding stand, 17... Tape guide roller, 18... Guide roller, 19... Moving stand, 2
0...Guide roll, 22...Belt, 23...
...tape guide piece, 24...lifting mechanism, 25...cradle, 26...magazine.
Claims (1)
置と、剥離装置を設け、保護フイルムを表面に貼
着した薄板状物品に粘着テープを粘着テープ供給
装置により供給して保護フイルム上に貼着し、そ
の後粘着テープの巻取りを行ない粘着テープと保
護フイルムとを一体に剥離するようにした保護フ
イルムの剥離方法において、保持台上の保護フイ
ルムを貼着した薄板状物品の上方に、粘着テープ
を粘着層を下にするとともに、保護フイルムとの
間に若干の間隙を存して張りわたし、ついで、こ
の粘着テープを弛めることにより保護フイルムの
表面に接触させて、この粘着テープの粘着力によ
る引きはがし力のみで保護フイルム薄板状物品か
ら剥離することを特徴とする保護フイルムの剥離
方法。 ２ 保護フイルムを表面に貼着した薄板状物品を
保持台上に保持せしめ、粘着テープ供給装置のテ
ープ繰出し側にある剥離装置を保持台上面と平行
の系路に沿つて走らせて、粘着テープを保護フイ
ルム上に若干の間隙を存して張りわたしたのち、
上記剥離装置を逆行させて粘着テープを弛ませる
ことにより、粘着テープを保護フイルム上に接触
させ、ついで、剥離装置を元の位置まで戻すこと
により粘着テープとともに保護フイルムを剥離す
るとともに、粘着テープの供給装置により粘着テ
ープを巻取ることを特徴とする特許請求の範囲第
１項記載の保護フイルムの剥離方法。 ３ 上記の粘着テープの巻取り開始時に対し剥離
装置の移動開始時を先行させる時間差を設け、こ
の時間差により、テープをたるませた状態で保護
フイルムの剥離を行なうことを特徴とする特許請
求の範囲第１項記載の保護フイルムの剥離方法。[Scope of Claims] 1. An adhesive tape supply device and a peeling device are provided above a holding table for a thin plate-shaped article, and the adhesive tape is supplied to the thin plate-shaped article with a protective film attached to the surface by the adhesive tape supply device to protect the thin plate-shaped article. In a method for peeling off a protective film, in which the adhesive tape and the protective film are peeled off together by pasting the adhesive tape onto the film and then winding up the adhesive tape, the thin plate-like article with the protective film on the holding table is peeled off. Spread the adhesive tape upward, with the adhesive layer facing down, leaving a slight gap between it and the protective film, then loosen the adhesive tape so that it comes into contact with the surface of the protective film. A method for peeling a protective film, characterized in that the protective film is peeled off from a thin plate-like article using only the peeling force due to the adhesive force of the tape. 2. A thin plate-shaped article with a protective film attached to its surface is held on a holding table, and the peeling device on the tape feeding side of the adhesive tape supply device is run along a path parallel to the top surface of the holding table to remove the adhesive tape. After stretching it over the protective film with a slight gap,
By moving the peeling device backwards to loosen the adhesive tape, the adhesive tape comes into contact with the protective film, and then by returning the peeling device to its original position, the protective film is peeled off along with the adhesive tape, and the adhesive tape is removed. A method for peeling a protective film according to claim 1, characterized in that the adhesive tape is wound up by a supply device. 3. Claims characterized in that a time difference is provided in which the start of movement of the peeling device precedes the start of winding of the adhesive tape, and the protective film is peeled off with the tape slackened due to this time difference. The method for peeling off the protective film according to item 1.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7254684A JPS60218257A (en) | 1984-04-10 | 1984-04-10 | Stripping-off of protective film |
| GB08416030A GB2157193B (en) | 1984-04-10 | 1984-06-22 | Process for peeling protective film off a thin article |
| US06/626,083 US4631103A (en) | 1984-04-10 | 1984-06-29 | Process for peeling protective film off a thin article |
| DE3425192A DE3425192C2 (en) | 1984-04-10 | 1984-07-09 | Method and apparatus for peeling off a protective film from a thin object |
| FR8410999A FR2562528B1 (en) | 1984-04-10 | 1984-07-11 | METHOD FOR TAKING OFF A PROTECTIVE FILM FROM A THIN OBJECT AND APPARATUS FOR IMPLEMENTING SAME |
| US06/900,952 US4732642A (en) | 1984-04-10 | 1986-08-27 | Apparatus for peeling protective film off a thin article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7254684A JPS60218257A (en) | 1984-04-10 | 1984-04-10 | Stripping-off of protective film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60218257A JPS60218257A (en) | 1985-10-31 |
| JPH0319149B2 true JPH0319149B2 (en) | 1991-03-14 |
Family
ID=13492460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7254684A Granted JPS60218257A (en) | 1984-04-10 | 1984-04-10 | Stripping-off of protective film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60218257A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS639122A (en) * | 1986-06-30 | 1988-01-14 | Teikoku Seiki Kk | Method for peeling silicon-wafer protective masking sheet |
| JP2502547B2 (en) * | 1986-10-28 | 1996-05-29 | 松下電器産業株式会社 | Cover film peeling device |
| JPH0650443Y2 (en) * | 1990-06-29 | 1994-12-21 | 株式会社サンテック | Multilayer board peeling device |
| JP2602781B2 (en) * | 1994-04-21 | 1997-04-23 | ニューロング精密工業株式会社 | Plate protection film peeling device |
| US6149758A (en) * | 1997-06-20 | 2000-11-21 | Lintec Corporation | Sheet removing apparatus and method |
| KR20040083579A (en) * | 2003-03-24 | 2004-10-06 | 이종수 | Method for Peeling protective film by means of adhesive tape and device theref |
| KR100849699B1 (en) | 2006-09-30 | 2008-08-01 | 전익희 | Detach device of printed circuits board film |
| JP5945158B2 (en) * | 2012-05-14 | 2016-07-05 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347773A (en) * | 1976-10-13 | 1978-04-28 | Hitachi Ltd | Peering method for unnecessarily formed layer |
-
1984
- 1984-04-10 JP JP7254684A patent/JPS60218257A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347773A (en) * | 1976-10-13 | 1978-04-28 | Hitachi Ltd | Peering method for unnecessarily formed layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60218257A (en) | 1985-10-31 |
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