JP3493234B2 - ポリマーフィルムの構造化プロセス - Google Patents

ポリマーフィルムの構造化プロセス

Info

Publication number
JP3493234B2
JP3493234B2 JP31562794A JP31562794A JP3493234B2 JP 3493234 B2 JP3493234 B2 JP 3493234B2 JP 31562794 A JP31562794 A JP 31562794A JP 31562794 A JP31562794 A JP 31562794A JP 3493234 B2 JP3493234 B2 JP 3493234B2
Authority
JP
Japan
Prior art keywords
polymer film
container
gas
plasma
erosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31562794A
Other languages
English (en)
Japanese (ja)
Other versions
JPH083339A (ja
Inventor
シュミット ヴァルター
シュミット ヘルマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dyconex Patente AG
Original Assignee
Dyconex Patente AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dyconex Patente AG filed Critical Dyconex Patente AG
Publication of JPH083339A publication Critical patent/JPH083339A/ja
Application granted granted Critical
Publication of JP3493234B2 publication Critical patent/JP3493234B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating
    • B29C2037/903—Measuring, controlling or regulating by means of a computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Vapour Deposition (AREA)
JP31562794A 1993-11-23 1994-11-24 ポリマーフィルムの構造化プロセス Expired - Fee Related JP3493234B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH03486/93-7 1993-11-23
CH348693 1993-11-23

Publications (2)

Publication Number Publication Date
JPH083339A JPH083339A (ja) 1996-01-09
JP3493234B2 true JP3493234B2 (ja) 2004-02-03

Family

ID=4257036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31562794A Expired - Fee Related JP3493234B2 (ja) 1993-11-23 1994-11-24 ポリマーフィルムの構造化プロセス

Country Status (6)

Country Link
US (1) US5746929A (enExample)
EP (1) EP0658416B1 (enExample)
JP (1) JP3493234B2 (enExample)
AT (1) ATE199072T1 (enExample)
CA (1) CA2136361C (enExample)
DE (1) DE59409654D1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2751665B1 (fr) * 1996-07-23 1998-09-04 Air Liquide Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface
FR2751664B1 (fr) * 1996-07-23 1998-09-04 Air Liquide Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface d'un substrat solide en defilement
CN100345679C (zh) * 2000-12-12 2007-10-31 C核心技术公司 带有传导约束芯的轻重量电路板
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
WO2006024009A2 (en) * 2004-08-24 2006-03-02 C-Core Technologies, Inc. Edge plated printed wiring boards
WO2006026566A1 (en) * 2004-08-27 2006-03-09 Vasoya Kalu K Printed wiring boards possessing regions with different coefficients of thermal expansion
JP5491026B2 (ja) * 2005-03-15 2014-05-14 スタブルコー テクノロジー，インコーポレイティド プリント配線基板中に補強コア材料を構成する製造方法
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
WO2008008552A2 (en) * 2006-07-14 2008-01-17 Stablcor, Inc. Build-up printed wiring board substrate having a core layer that is part of a circuit
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
EP4017808A4 (en) * 2019-08-24 2023-10-25 Lohia Corp Limited A process and an apparatus for bag formation

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209356A (en) * 1978-10-18 1980-06-24 General Electric Company Selective etching of polymeric materials embodying silicones via reactor plasmas
JPS5925227A (ja) * 1982-08-02 1984-02-09 Hitachi Ltd プラズマエツチング装置
AU544534B2 (en) * 1983-06-14 1985-06-06 Toyota Jidosha Kabushiki Kaisha Plasma coating
US4445966A (en) * 1983-06-20 1984-05-01 Honeywell Inc. Method of plasma etching of films containing chromium
JPS61501397A (ja) * 1984-03-12 1986-07-10 コミツサレ・ア・レナジイ・アトミツク　エタブリスマン・ドウ・カラクテ−ル・サイエンテイフイツク・テクニツク・エ・アンドウストリ− 部品の表面処理およびとくに熱吹付けにより部品上に次いで蒸着される被膜の密着を改善するためのこの処理の使用
JPS61268730A (ja) * 1985-05-22 1986-11-28 Mazda Motor Corp プラズマ処理装置
JPS6250335A (ja) * 1985-08-29 1987-03-05 Toyoda Gosei Co Ltd プラズマ処理装置
JPS6289736A (ja) * 1985-10-15 1987-04-24 Daihatsu Motor Co Ltd プラズマ処理装置
JPS6399243A (ja) * 1986-10-15 1988-04-30 Mazda Motor Corp プラズマ処理装置
US5215619A (en) * 1986-12-19 1993-06-01 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
KR970003885B1 (ko) * 1987-12-25 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 에칭 방법 및 그 장치
US4971651A (en) * 1990-02-05 1990-11-20 Hitachi, Ltd. Microwave plasma processing method and apparatus
DE4232998A1 (de) * 1992-10-01 1994-04-07 Basf Ag Verfahren zur Oberflächenbehandlung von Kunststoffteilen
US5372673A (en) * 1993-01-25 1994-12-13 Motorola, Inc. Method for processing a layer of material while using insitu monitoring and control

Also Published As

Publication number Publication date
US5746929A (en) 1998-05-05
JPH083339A (ja) 1996-01-09
EP0658416A3 (enExample) 1995-07-26
EP0658416A2 (de) 1995-06-21
DE59409654D1 (de) 2001-03-15
EP0658416B1 (de) 2001-02-07
CA2136361A1 (en) 1995-05-24
ATE199072T1 (de) 2001-02-15
CA2136361C (en) 2005-11-15

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