CA2136361C - Process for structuring polymer films - Google Patents
Process for structuring polymer films Download PDFInfo
- Publication number
- CA2136361C CA2136361C CA002136361A CA2136361A CA2136361C CA 2136361 C CA2136361 C CA 2136361C CA 002136361 A CA002136361 A CA 002136361A CA 2136361 A CA2136361 A CA 2136361A CA 2136361 C CA2136361 C CA 2136361C
- Authority
- CA
- Canada
- Prior art keywords
- polymer film
- gas
- plasma
- container
- process according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920006254 polymer film Polymers 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 55
- 230000008569 process Effects 0.000 title claims abstract description 53
- 239000000203 mixture Substances 0.000 claims abstract description 36
- 239000007789 gas Substances 0.000 claims description 97
- 230000003628 erosive effect Effects 0.000 claims description 64
- 238000005530 etching Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000013021 overheating Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 1
- 230000005284 excitation Effects 0.000 abstract description 9
- 238000009827 uniform distribution Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 238000011068 loading method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 6
- 230000000670 limiting effect Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
- B29C2037/903—Measuring, controlling or regulating by means of a computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH348693 | 1993-11-23 | ||
| CH03/486/93-7 | 1993-11-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2136361A1 CA2136361A1 (en) | 1995-05-24 |
| CA2136361C true CA2136361C (en) | 2005-11-15 |
Family
ID=4257036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002136361A Expired - Fee Related CA2136361C (en) | 1993-11-23 | 1994-11-22 | Process for structuring polymer films |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5746929A (enExample) |
| EP (1) | EP0658416B1 (enExample) |
| JP (1) | JP3493234B2 (enExample) |
| AT (1) | ATE199072T1 (enExample) |
| CA (1) | CA2136361C (enExample) |
| DE (1) | DE59409654D1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2751665B1 (fr) * | 1996-07-23 | 1998-09-04 | Air Liquide | Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface |
| FR2751664B1 (fr) * | 1996-07-23 | 1998-09-04 | Air Liquide | Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface d'un substrat solide en defilement |
| CN100345679C (zh) * | 2000-12-12 | 2007-10-31 | C核心技术公司 | 带有传导约束芯的轻重量电路板 |
| US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
| US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
| WO2006024009A2 (en) * | 2004-08-24 | 2006-03-02 | C-Core Technologies, Inc. | Edge plated printed wiring boards |
| WO2006026566A1 (en) * | 2004-08-27 | 2006-03-09 | Vasoya Kalu K | Printed wiring boards possessing regions with different coefficients of thermal expansion |
| JP5491026B2 (ja) * | 2005-03-15 | 2014-05-14 | スタブルコー テクノロジー，インコーポレイティド | プリント配線基板中に補強コア材料を構成する製造方法 |
| USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
| WO2008008552A2 (en) * | 2006-07-14 | 2008-01-17 | Stablcor, Inc. | Build-up printed wiring board substrate having a core layer that is part of a circuit |
| US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
| EP4017808A4 (en) * | 2019-08-24 | 2023-10-25 | Lohia Corp Limited | A process and an apparatus for bag formation |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4209356A (en) * | 1978-10-18 | 1980-06-24 | General Electric Company | Selective etching of polymeric materials embodying silicones via reactor plasmas |
| JPS5925227A (ja) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | プラズマエツチング装置 |
| AU544534B2 (en) * | 1983-06-14 | 1985-06-06 | Toyota Jidosha Kabushiki Kaisha | Plasma coating |
| US4445966A (en) * | 1983-06-20 | 1984-05-01 | Honeywell Inc. | Method of plasma etching of films containing chromium |
| JPS61501397A (ja) * | 1984-03-12 | 1986-07-10 | コミツサレ・ア・レナジイ・アトミツク エタブリスマン・ドウ・カラクテ−ル・サイエンテイフイツク・テクニツク・エ・アンドウストリ− | 部品の表面処理およびとくに熱吹付けにより部品上に次いで蒸着される被膜の密着を改善するためのこの処理の使用 |
| JPS61268730A (ja) * | 1985-05-22 | 1986-11-28 | Mazda Motor Corp | プラズマ処理装置 |
| JPS6250335A (ja) * | 1985-08-29 | 1987-03-05 | Toyoda Gosei Co Ltd | プラズマ処理装置 |
| JPS6289736A (ja) * | 1985-10-15 | 1987-04-24 | Daihatsu Motor Co Ltd | プラズマ処理装置 |
| JPS6399243A (ja) * | 1986-10-15 | 1988-04-30 | Mazda Motor Corp | プラズマ処理装置 |
| US5215619A (en) * | 1986-12-19 | 1993-06-01 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
| KR970003885B1 (ko) * | 1987-12-25 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 에칭 방법 및 그 장치 |
| US4971651A (en) * | 1990-02-05 | 1990-11-20 | Hitachi, Ltd. | Microwave plasma processing method and apparatus |
| DE4232998A1 (de) * | 1992-10-01 | 1994-04-07 | Basf Ag | Verfahren zur Oberflächenbehandlung von Kunststoffteilen |
| US5372673A (en) * | 1993-01-25 | 1994-12-13 | Motorola, Inc. | Method for processing a layer of material while using insitu monitoring and control |
-
1994
- 1994-11-02 EP EP94810634A patent/EP0658416B1/de not_active Expired - Lifetime
- 1994-11-02 DE DE59409654T patent/DE59409654D1/de not_active Expired - Lifetime
- 1994-11-02 AT AT94810634T patent/ATE199072T1/de not_active IP Right Cessation
- 1994-11-22 CA CA002136361A patent/CA2136361C/en not_active Expired - Fee Related
- 1994-11-24 JP JP31562794A patent/JP3493234B2/ja not_active Expired - Fee Related
-
1997
- 1997-08-18 US US08/912,537 patent/US5746929A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5746929A (en) | 1998-05-05 |
| JPH083339A (ja) | 1996-01-09 |
| EP0658416A3 (enExample) | 1995-07-26 |
| EP0658416A2 (de) | 1995-06-21 |
| DE59409654D1 (de) | 2001-03-15 |
| EP0658416B1 (de) | 2001-02-07 |
| CA2136361A1 (en) | 1995-05-24 |
| JP3493234B2 (ja) | 2004-02-03 |
| ATE199072T1 (de) | 2001-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20141124 |