JP3421457B2 - 金属表面の乾式処理のための方法および装置 - Google Patents

金属表面の乾式処理のための方法および装置

Info

Publication number
JP3421457B2
JP3421457B2 JP31093294A JP31093294A JP3421457B2 JP 3421457 B2 JP3421457 B2 JP 3421457B2 JP 31093294 A JP31093294 A JP 31093294A JP 31093294 A JP31093294 A JP 31093294A JP 3421457 B2 JP3421457 B2 JP 3421457B2
Authority
JP
Japan
Prior art keywords
gas
electrode
gas mixture
initial
gas phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31093294A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0820859A (ja
Inventor
ティエリー・サンザングル
ステファーヌ・ラビア
ダニエル・ゲラン
クリスチャン・ラルケ
Original Assignee
レール・リキード−ソシエテ・アノニム・ア・ディレクトワール・エ・コンセイユ・ドゥ・スールベイランス・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by レール・リキード−ソシエテ・アノニム・ア・ディレクトワール・エ・コンセイユ・ドゥ・スールベイランス・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード filed Critical レール・リキード−ソシエテ・アノニム・ア・ディレクトワール・エ・コンセイユ・ドゥ・スールベイランス・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード
Publication of JPH0820859A publication Critical patent/JPH0820859A/ja
Application granted granted Critical
Publication of JP3421457B2 publication Critical patent/JP3421457B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
JP31093294A 1993-12-15 1994-12-14 金属表面の乾式処理のための方法および装置 Expired - Fee Related JP3421457B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9315108 1993-12-15
FR9315108A FR2713670B1 (fr) 1993-12-15 1993-12-15 Procédé et dispositif de traitement de surfaces métalliques par voie sèche.

Publications (2)

Publication Number Publication Date
JPH0820859A JPH0820859A (ja) 1996-01-23
JP3421457B2 true JP3421457B2 (ja) 2003-06-30

Family

ID=9453981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31093294A Expired - Fee Related JP3421457B2 (ja) 1993-12-15 1994-12-14 金属表面の乾式処理のための方法および装置

Country Status (5)

Country Link
EP (1) EP0658637B1 (fr)
JP (1) JP3421457B2 (fr)
DE (1) DE69421250T2 (fr)
ES (1) ES2139723T3 (fr)
FR (1) FR2713670B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2778190B1 (fr) * 1998-05-04 2000-06-02 Air Liquide Procede et appareil de traitement de surfaces metalliques par voie seche

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1421249A1 (ru) * 1985-10-30 1992-05-30 Предприятие П/Я А-1131 Способ очистки поверхности изделий
JP2811820B2 (ja) * 1989-10-30 1998-10-15 株式会社ブリヂストン シート状物の連続表面処理方法及び装置
JP3206095B2 (ja) * 1991-04-12 2001-09-04 株式会社ブリヂストン 表面処理方法及びその装置
DE4113523A1 (de) * 1991-04-25 1992-10-29 Abb Patent Gmbh Verfahren zur behandlung von oberflaechen
US5236512A (en) * 1991-08-14 1993-08-17 Thiokol Corporation Method and apparatus for cleaning surfaces with plasma

Also Published As

Publication number Publication date
FR2713670A1 (fr) 1995-06-16
ES2139723T3 (es) 2000-02-16
JPH0820859A (ja) 1996-01-23
DE69421250T2 (de) 2000-05-31
FR2713670B1 (fr) 1996-01-12
DE69421250D1 (de) 1999-11-25
EP0658637B1 (fr) 1999-10-20
EP0658637A1 (fr) 1995-06-21

Similar Documents

Publication Publication Date Title
US8591660B2 (en) Method for the plasma cleaning of the surface of a material coated with an organic substance
US5938854A (en) Method and apparatus for cleaning surfaces with a glow discharge plasma at one atmosphere of pressure
US5807615A (en) Method and device for forming an excited gaseous treatment atmosphere lacking electrically charged species used for treating metallic substrates
US5627435A (en) Hollow cathode array and method of cleaning sheet stock therewith
JP2002158219A (ja) 放電プラズマ処理装置及びそれを用いた処理方法
WO1998035379A1 (fr) Jet de plasma a pression atmospherique
JP2001329083A (ja) プラズマ処理を受けさせた材料
US6564810B1 (en) Cleaning of semiconductor processing chambers
Inomata et al. Open air photoresist ashing by a cold plasma torch: catalytic effect of cathode material
JPH02281734A (ja) プラズマ表面処理法
US6007637A (en) Process and apparatus for the dry treatment of metal surfaces
US6673197B2 (en) Chemical plasma cathode
US20060201624A1 (en) Method of in-situ chamber cleaning
JP2002237463A (ja) 半導体素子の製造方法及び装置
JP3421457B2 (ja) 金属表面の乾式処理のための方法および装置
JP2002155370A (ja) 常圧プラズマ処理方法及びその装置
JPH03229886A (ja) 大気圧グロープラズマエッチング方法
US20100024845A1 (en) Process and apparatus for degreasing objects or materials by means of oxidative free radicals
JP2002151507A (ja) 半導体素子の製造方法及びその装置
JPS6344965A (ja) 多層塗膜の形成法
JP2002151476A (ja) レジスト除去方法及びその装置
JP2002151513A (ja) 半導体素子の製造方法及びその装置
JP2002151436A (ja) 半導体素子の製造方法及びその装置
JP2002110587A (ja) 半導体素子の製造方法
JP2002151508A (ja) 半導体素子の製造方法及びその装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080418

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090418

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100418

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees