JP3329941B2 - Heat sink holder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heatsink holder for holding a heatsink used mainly for radiating heat generated from electronic parts such as ICs and transistors so as not to be displaced from the electronic parts. The present invention relates to a heat sink holder suitable for holding an active heat sink provided.

[0002]

2. Description of the Related Art Conventionally, as a heat sink holder, for example, as disclosed in Japanese Patent Application Laid-Open No. 64-71154, a passive heat sink having a large number of heat dissipating fins is used.
There is known a clamp type which is formed so as to be attachable to an IC or an IC socket so as to be held on the C.

[0003]

In the meantime, besides the above-mentioned passive type heat sink provided with a large number of heat dissipating fins, an active type heat sink for rotating the fan to forcibly generate an air flow to exchange heat is used. Things are known. This active type heat sink generally includes a fan in a rectangular parallelepiped case having an air inlet on an upper surface and a number of air outlets on a side surface, and an IC on a lower surface of the case.
By turning the fan in contact with etc., an air flow that enters through the air intake and exits through the air exhaust port is generated,
The air flow is configured to actively radiate the heat generated by the IC or the like.

There is a demand for a heat sink holder that can securely hold the active heat sink to an IC or the like without impairing the heat radiation function, but there has been no suitable heat sink in the past.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a heat sink holder capable of securely holding an active heat sink to an IC or the like without impairing its heat radiation function. To provide.

[0006]

To achieve the above object, a heat sink holder according to the present invention comprises a frame-shaped base extending along four sides of the upper surface of a rectangular parallelepiped heat sink, and a pair of corners at diagonal positions of the base. A pair of engaging portions provided on the upper portion of the heat sink and engaging with the corners on the upper surface of the heat sink, and extending downward from the vicinity of the pair of corners at the other diagonal positions of the base portion, respectively, and supporting the heat sink holder And a leg portion to be hooked on.

[0007] The heat sink holder supporting member includes:
A component that does not relatively displace with respect to a component that generates heat, specifically, a component to which an IC such as an IC socket or a substrate is mounted or an IC itself, that is, a component that generates heat when the component that generates heat is an IC.

[0008]

According to the heat sink holder of the present invention, the base facing the upper surface of the heat sink is formed in a frame shape extending along four sides of the upper surface, and the base facing the side surface of the heat sink is basically Since only the legs extend downward from a pair of corners at diagonal positions of the base, the active heat sink has an air inlet on the upper surface and an air outlet on the side surface. Even when the heat sink is mounted, there is little possibility that the air flow generated by the fan is obstructed, and therefore, the heat radiation function of the heat sink is not impaired.

Further, when the heat sink of the present invention is mounted, a pair of engaging portions provided on the frame-shaped base press the corners on the upper surface of the heat sink downward, so that the heat generating component against the heat-generating component can be prevented. It is possible to securely hold so as not to shift. Specifically, when the pair of legs are hooked to the heat sink holder attaching member, a force acts on the frame-shaped base so as to bend the base downward about a diagonal line connecting the pair of engagement parts. Since the pair of engaging portions are respectively engaged with the corners of the upper surface of the heat sink, when this bending force acts on the frame-shaped base, the frame-shaped base has elasticity against bending, so that the base and the legs are provided. A part in which the corner and the corner provided with the engaging part are connected to each other acts as a spring, and a force is applied to press the heat sink downward from the part of the engaging part that comes into contact with the upper surface of the heat sink. It is.

The method of engaging the pair of engaging portions with the corners of the upper surface of the heat sink may be such that the pair of engaging portions only abuts the upper surface of the heat sink, but only the abutment of the upper surface of the heat sink. Instead, a pair of corners may contact the upper part of the side surface of the heat sink so that the corners of the heat sink are positioned. Then, the heat sink can be held more reliably, and the mounting of the heat sink holder on the heat sink is facilitated.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a view showing a heat sink holder according to an embodiment of the present invention. FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is a right side view. The illustrated heat sink holder 10 is formed by stamping and molding a metal plate having elasticity against bending.
), A pair of engaging portions 12 formed by bending a pair of corners at diagonal positions of the base 11 downward, and another pair of bases 11. And a pair of legs 13 extending horizontally from the vicinity of the pair of corners at the corners and bent downward.

The engaging portion 12 is located between a pair of claw portions 12a which are engaged with a pair of concave portions 45 formed at four corner portions of the upper surface of the heat sink 40, respectively, between the pair of claw portions 12a. The leg 13 has a contact portion 12b contacting the upper surface of the heat sink 40, and the leg 13 is hooked on a lower end thereof to a hooking projection 24 formed on a side surface of an IC socket 20 (see FIG. 2) described later. It has a hook 13a to be stopped.

FIG. 2 shows an IC socket, and FIG. 3 shows an IC socket.
(A) is a plan view, (b) is a front view, and (c) is a right side view. IC socket shown in FIG.
Reference numeral 20 denotes a ZIF type burn-in socket which is configured so that the IC can be attached and detached with a light force by rotating the rotating lever 21 (see Japanese Patent Application Laid-Open No. 62-278778).
The upper surface has a number of holes 22 to which terminals of the IC are connected, and the lower surface has a number of terminals 23 to be soldered to the substrate 50. Further, protrusions 24 for hooking the heat sink holder are provided on the left and right side surfaces of the IC socket 20, respectively.

On the other hand, an IC 30 shown in FIG.
IC package 31 covering chip and IC package
This is a conventionally known device having a large number of terminals 32 projecting from the lower surface of 31, and a detailed description thereof will be omitted.

FIGS. 4A and 4B show a heat sink. FIG. 4A is a plan view, FIG. 4B is a front view, and FIG. 4C is a right side view. The heat sink 40 shown in FIG. 4 is of an active type configured to actively generate heat by generating an air flow, and includes a rectangular parallelepiped case 41 and an electric fan 42 mounted in the case 41. Have. A circular air inlet 43 is formed on the upper surface of the case 41, and a large number of slit-shaped air outlets 44 are formed on the side surface, and the heat sink 40 rotates the electric fan 42 to rotate the air inlet 43. It is configured to generate an air flow that enters from the air outlet and exits from the air discharge port 44 to positively dissipate heat.

Also, at the four corners of the upper surface of the case 41,
A pair of recesses 45 are formed, each of which engages the claw portion 12a of the locking portion 12 of the heat sink holder 10. Reference numeral 46 in the figure indicates a lead wire of the electric fan 42.

Next, a heat sink holder according to the present embodiment
The operation of 10 will be described. FIGS. 5A and 5B are views showing a mounted state of the heat sink holder, wherein FIG. 5A is a plan view and FIG. 5B is a front view.

As shown in FIG. 5B, the IC 30 is connected to the upper surface of the IC socket 20 fixed to the substrate 50, and the heat sink holder 10 is mounted on the heat sink 40 mounted on the upper surface of the IC 30. Is done. First, the heat sink holder 10 is attached to the pair of claw portions of the pair of engagement portions 12.
12a are arranged so as to be hooked in the concave portions 45 of the heat sink 40, respectively. At this time, the pair of claws 12 a abut the side surfaces of the heat sink 40 from both sides with the corners interposed therebetween, so that the heat sink 40 is positioned with respect to the heat sink holder 10.

Next, the pair of legs 13 is pulled downward, and the hook 13a is hooked on the hook projection 24 of the IC socket 20.
At this time, the base 11 of the heat sink holder 10 is bent downward around a diagonal line connecting the pair of engagement portions 12,
Due to the elasticity of the base 11 against this bending, the base 11 functions as a leaf spring, and the abutting portions 12b of the pair of engaging portions 12 press the upper surface of the heat sink 40 downward. As a result, the heat sink 40 is pressed against the upper surface of the IC 30,
Deviation from 30 is prevented.

Looking at the state in which the heat sink holder 10 is mounted, only the frame-shaped base 11 extending along four sides of the upper surface of the heat sink 40 faces the upper surface of the heat sink 40, and the base 11 is Since the heat sink holder 10 is away from the upper surface, the heat sink holder 10 does not hinder the air intake from the air intake 43. Also heat sink
Only the pair of legs 13 is opposed to the side surface of the heat sink 40, and since the pair of legs 13 is separated from the side surface of the heat sink 40, the heat sink holder 10 prevents air from being discharged from the air discharge port 44. It will not be. As a result, the heat sink
The numeral 40 can sufficiently exhibit its function even when the heat sink holder 10 is mounted.

In this embodiment, the heat sink 40
The upper surface of the heat sink 40 is formed in a square shape, and the heat sink 40 can be installed by changing the direction by 90 degrees with respect to the IC socket 20, but the heat sink holder 10 can be placed in any direction regardless of the orientation of the heat sink 40. It is configured to be attachable.

Although the embodiment of the present invention has been described above, the heat sink holder of the present invention is not limited to the specific embodiment of the embodiment, and it is needless to say that various modifications can be made. It is.

[Brief description of the drawings]

FIG. 1 is a view showing a heat sink holder according to an embodiment of the present invention.

FIG. 2 shows an IC socket.

FIG. 3 shows an IC.

FIG. 4 shows a heat sink.

FIG. 5 is a view showing a mounting state of a heat sink holder.

[Explanation of symbols]

 10 Heat sink holder 11 Base 12 Engagement part 12a Claw part 12b Contact part 13 Leg part 13a Hook part 20 IC socket 30 IC 40 Heat sink 41 Case 42 Fan 43 Air intake 44 Air exhaust 50 PCB

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 23/40 H01L 23/467

Claims (1)

(57) [Claims] 1. A heat sink holder for holding a rectangular parallelepiped heat sink mounted on a heat-generating component so as not to be displaced with respect to the heat-generating component, wherein the heat sink holder has a frame shape extending along four sides of an upper surface of the heat sink. A base, a pair of engagement portions respectively provided at a pair of corners at diagonal positions of the base, and engaged with corners of the upper surface of the heat sink; and a pair of corners at other diagonal positions of the base And a leg portion extending downward from the vicinity of the first member and being hooked to the heat sink holder supporting member.