JP3021071U - Semiconductor device mounting device - Google Patents

Abstract

(57) [Abstract] [Purpose] The screw holes for fixing are eliminated from the package of the semiconductor device to reduce the external size and cost,
At the same time, there is provided a mounting device for a semiconductor device, which can be fixed to a mounting base of a destination by a simple mounting operation. [Structure] A resin case 7 in which a main circuit terminal 8 and a control terminal 9 are drawn out on an upper surface of an assembly in which a chip element for a power circuit and a control circuit is mounted on a metal base plate 4 for heat dissipation via an insulating substrate.
When fixing the semiconductor device surrounded and packaged with the cooling fin block 2 as the mounting base, the metal base plate of the semiconductor device is superposed on the surface of the mounting base, and in this state, the belt-shaped clip 10 Thus, the resin case of the semiconductor device is held and pinched and fixed at a fixed position on the cooling fin block.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device mounting device for an IPM (intelligent power module) or the like applied to an inverter device, for example.

[0002]

[Prior art]

 First, the above-mentioned semiconductor device (IPM) and a conventional mounting structure are shown in FIGS. 3 (a) and 3 (b). In the figure, 1 is a semiconductor device, 2 is a cooling fin block that also serves as a heat sink for mounting the semiconductor device 1 (mounting base of the semiconductor device), and 3 is a fastening screw. Here, in the semiconductor device 1, an assembly in which a chip element 6 of a power circuit and a control circuit is mounted on a metal base plate 4 for heat dissipation via an insulating substrate 5 such as ceramic is assembled in a molding resin case 7, and further, a resin sealing is performed. The main circuit terminal (faston terminal) 8 and the control terminal (pin terminal) 9 are pulled out to both sides of the upper surface of the resin case 7, and the screw holes 7a of the fastening screw 3 are provided on the left and right ends of the resin case. The structure is perforated.

In order to attach the product of the semiconductor device 1 to the cooling fin block 2 on the user side of the user, the metal base plate 4 is placed on the end face of the block 2 and the semiconductor device 1 is placed at a predetermined attachment position. Then, in this state, the fastening screw 3 inserted into the screw hole 7a is screwed into the block 2 and fixed. Further, in this mounted state, the heat generated in the power element and the like of the semiconductor device 1 due to the energization is transferred from the metal base plate 4 to the cooling fin block 2 and radiated.

[0004]

[Problems to be solved by the device]

 By the way, the above-mentioned conventional structure has the following problems in terms of product cost and mounting work at the place of use. That is, 1) In order to make the resin case 7 of the semiconductor device 1 sufficiently resistant to the tightening force of the tightening screw 3, a metal ring 7b for reinforcement is inserted into the screw hole 7a in advance and resin molding is performed. As a result, the number of parts increases and the manufacturing cost of the package increases.

2) When fixing the product of the semiconductor device to the cooling fin block 2 on the user side, it is required to tighten the fastening screw 3 with a constant torque in order to prevent the resin case 7 from being damaged. Is troublesome. The present invention has been made in view of the above points, and an object thereof is to solve the above problems and to reduce the external size and cost by eliminating the screw holes for fixing from the package of the semiconductor device. Another object of the present invention is to provide a mounting device for a semiconductor device, which can be fixed to a mounting base of a destination by a simple mounting operation.

[0006]

[Means for Solving the Problems]

 According to the present invention, in order to achieve the above object, a metal base plate provided on a semiconductor device is superposed on a surface of a mounting base such as a cooling fin block, and is fixed to the mounting base in this state. The resin case of the semiconductor device shall be clamped and fixed in place via the mounting member.

Further, the mounting member in the above configuration is a belt-like clip that holds the resin case of the semiconductor device and has both ends thereof locked to the mounting base, or one end of which is screwed to the mounting base. A hook-shaped clip whose end tongue is locked in the resin case of the semiconductor device is used, and a recess is formed on both upper surfaces of the resin case of the semiconductor device to engage with the clip. is there.

[0008]

[Action]

 In the above structure, the resin case of the semiconductor device does not require a screw hole for the fastening screw, so that the resin case can be downsized and the manufacturing cost thereof can be reduced. Also, on the user side, when mounting a semiconductor device product on a mounting base such as a cooling fin block, there is no need to control the torque of the fastening screw, and it can be mounted with a simple operation by simply locking the clip. It will be easier to use. In particular, by forming a recess that engages with the clip on the upper surface of the resin case, the semiconductor device can be stably clamped and fixed by the clip without fear of falling off.

[0009]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings of the embodiments, the same members corresponding to FIG. 3 are designated by the same reference numerals. Example 1 In FIGS. 1A and 1B, the semiconductor device 1 has basically the same structure as that of FIG. 3, but the resin case 7 of the semiconductor device 1 has the screw holes shown in FIG. Notably, recesses 7b are formed between the rows of the main circuit terminals 8 and the rows of the control terminals 9, which engage with the crib components described later, especially at the left and right ends of the upper surface and in the central portion.

When the product of the semiconductor device 1 is mounted on the cooling fin block (mounting base) 2 on the user side, the semiconductor device 1 is arranged so that the metal base plate 4 is superposed on the upper surface of the cooling fin block 2. After the above product is placed, the belt-shaped clip 10 having the following shape is used as a mounting member so as to hold the resin case 7 and clamp it on the cooling fin block 2.

Here, the belt-shaped clip 10 has both ends folded back in a U-shape as shown in the drawing, and a convex portion that fits into the recess 7 b of the resin case 7 described above inside and in the center. It is made of an elastic material (made of metal or hard resin) in which a stepped portion is formed. As shown in the drawing, the folded-back portions at both ends are hooked on the cooling fin block 2, and the protruding stepped portion is a recess of the resin case 7. The semiconductor device 1 is fixed by being fitted into 7b.

When the clip 10 is made of metal, its peripheral surface is preferably covered with an insulating material or coated. Embodiment 2 FIG. 2 shows a different embodiment of the present invention, in which a pair of left and right hook-shaped clips 11 are used as mounting members. The hook-shaped clip 11 has one end fastened to both ends of the cooling fin block 2 with a screw 12, and the tongue on the other end is locked to the recesses 7b formed at the left and right ends of the resin case 7 of the semiconductor device 1. It is sandwiched and fixed.

[0013]

[Effect of device]

 As described above, according to the configuration of the present invention, the screw hole for the fastening screw is not required in the resin case of the semiconductor device, so that the package outline can be downsized, the manufacturing cost can be reduced, and the user can reduce the manufacturing cost. When a semiconductor device product is mounted on the mounting base such as a cooling fin block on the side, it can be easily attached and detached by using a belt-shaped or hook-shaped clip to improve workability. Real profit is obtained.

[Brief description of drawings]

1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a partial sectional side view and FIG. 1B is a plan view.

2A and 2B show a second embodiment of the present invention, in which FIG. 2A is a partial sectional side view and FIG. 2B is a plan view.

FIG. 3 shows a conventional semiconductor device mounting structure,
(A) is an external perspective view of a semiconductor device, (b) is a partial cross-sectional side view showing a state of attachment to a cooling fin block

[Explanation of symbols]

 1 semiconductor device 2 cooling fin block (mounting base) 4 metal base plate 5 insulating substrate 6 chip element 7 resin case 7b recess 8 main circuit terminal 9 control terminal 10 belt-like clip 11 hook-like clip

Claims (5)

[Scope of utility model registration request] 1. A resin case encloses an assembly in which chip elements of a power circuit and a control circuit are mounted on a metal base plate for heat dissipation via an insulating substrate, and a main circuit terminal and a control terminal are provided on the upper surface of the resin case. A mounting device for fixing a semiconductor device that is pulled out to a mounting base that also serves as a heat sink, and a clip that is fixed to the mounting base in this state by stacking the metal base plate of the semiconductor device on the surface of the mounting base. A mounting device for a semiconductor device, characterized in that a resin case of the semiconductor device is clamped and fixed at a fixed position via a mounting member of a type. 2. The mounting device according to claim 1, wherein the mounting member is a belt-shaped clip in which a resin case of the semiconductor device is held and both ends thereof are locked to a mounting base. Mounting device. 3. The mounting device according to claim 1, wherein the mounting member is a hook-shaped clip in which one end of the mounting member is screwed to the mounting base and the tongue piece at the other end is locked to the resin case of the semiconductor device. A mounting device for a semiconductor device, characterized by: 4. A mounting device for a semiconductor device according to claim 2, wherein a recess for engaging with a clip is formed on both upper surface portions of a resin case of the semiconductor device. 5. The mounting device according to claim 1, wherein the mounting base is a cooling fin block.