JP3242720U - パッケージ構造 - Google Patents

パッケージ構造 Download PDF

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Publication number
JP3242720U
JP3242720U JP2023001563U JP2023001563U JP3242720U JP 3242720 U JP3242720 U JP 3242720U JP 2023001563 U JP2023001563 U JP 2023001563U JP 2023001563 U JP2023001563 U JP 2023001563U JP 3242720 U JP3242720 U JP 3242720U
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Japan
Prior art keywords
package structure
chip
circuit wiring
height
lead
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JP2023001563U
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English (en)
Japanese (ja)
Inventor
志宏 魏
明昌 ▲呉▼
明倫 郭
美玲 ▲黄▼
皇毅 李
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研晶光電股▲ふん▼有限公司
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  • Lead Frames For Integrated Circuits (AREA)
JP2023001563U 2022-12-15 2023-05-09 パッケージ構造 Active JP3242720U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW111213849U TWM642303U (zh) 2022-12-15 2022-12-15 封裝結構
TW111213849 2022-12-15

Publications (1)

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JP3242720U true JP3242720U (ja) 2023-07-06

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JP2023001563U Active JP3242720U (ja) 2022-12-15 2023-05-09 パッケージ構造

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JP (1) JP3242720U (zh)
TW (1) TWM642303U (zh)

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Publication number Publication date
TWM642303U (zh) 2023-06-11

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