JP3231329B2 - 多孔性半導体処理コンポネントの浸漬試験 - Google Patents
多孔性半導体処理コンポネントの浸漬試験Info
- Publication number
- JP3231329B2 JP3231329B2 JP50974495A JP50974495A JP3231329B2 JP 3231329 B2 JP3231329 B2 JP 3231329B2 JP 50974495 A JP50974495 A JP 50974495A JP 50974495 A JP50974495 A JP 50974495A JP 3231329 B2 JP3231329 B2 JP 3231329B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- cover plate
- processing
- cover
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/223—Supports, positioning or alignment in fixed situation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/101—Number of transducers one transducer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/263—Surfaces
- G01N2291/2632—Surfaces flat
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US124,332 | 1980-02-25 | ||
US08/124,332 | 1993-09-21 | ||
US08/124,332 US6085591A (en) | 1993-09-21 | 1993-09-21 | Immersion testing porous semiconductor processing components |
PCT/US1994/007792 WO1995008766A1 (en) | 1993-09-21 | 1994-07-11 | Immersion testing porous semiconductor processing components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09503055A JPH09503055A (ja) | 1997-03-25 |
JP3231329B2 true JP3231329B2 (ja) | 2001-11-19 |
Family
ID=22414250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50974495A Expired - Fee Related JP3231329B2 (ja) | 1993-09-21 | 1994-07-11 | 多孔性半導体処理コンポネントの浸漬試験 |
Country Status (5)
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6591680B2 (en) * | 2001-06-15 | 2003-07-15 | General Electric Company | System and method for ultrasonic immersion inspection of components |
US7131333B2 (en) * | 2002-07-16 | 2006-11-07 | Sonix, Inc. | Pulse echo ultrasonic test chamber for tray production system |
US7181969B2 (en) * | 2002-07-16 | 2007-02-27 | Sonix, Inc. | Ultrasonic test chamber for tray production system and the like |
US7013732B2 (en) * | 2003-02-19 | 2006-03-21 | Sonix, Inc. | Method and apparatus for temperature-controlled ultrasonic inspection |
US7661315B2 (en) * | 2004-05-24 | 2010-02-16 | Sonix, Inc. | Method and apparatus for ultrasonic scanning of a fabrication wafer |
US7249514B2 (en) * | 2004-11-30 | 2007-07-31 | The Boeing Company | Repositionable mask for ultrasonic inspection |
US7917317B2 (en) * | 2006-07-07 | 2011-03-29 | Sonix, Inc. | Ultrasonic inspection using acoustic modeling |
CA2661439A1 (en) * | 2006-08-22 | 2008-08-14 | Tactical Design Labs | Top lock security holster |
US20080179360A1 (en) * | 2006-10-23 | 2008-07-31 | Lowe Michael V | Top lock security holster ii |
GB0807955D0 (en) * | 2008-05-01 | 2008-06-11 | Airbus Uk Ltd | Ultrasound inspection method and apparatus |
KR101975741B1 (ko) * | 2009-11-13 | 2019-05-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 타깃 재료의 포장 방법 및 타깃의 장착 방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH589277A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-11-26 | 1977-06-30 | Western Electric Co | |
US4059098A (en) * | 1975-07-21 | 1977-11-22 | Stanford Research Institute | Flexible ultrasound coupling system |
DE2607485C3 (de) * | 1976-02-20 | 1978-09-28 | Mannesmann Ag, 4000 Duesseldorf | Verfahren zum Einstellen von Einschallwinkeln bei der US-Prüfung von Rohren, Bändern und gebogenen Blechen |
US4158308A (en) * | 1977-09-22 | 1979-06-19 | Automation Industries, Inc. | Time-variable bandwidth ultrasonic testing apparatus |
US4252022A (en) * | 1978-11-17 | 1981-02-24 | Westinghouse Electric Corp. | Detection, characterization and studying of flaws in work by acoustic imaging |
SU1104412A1 (ru) * | 1982-03-31 | 1984-07-23 | Институт Прикладной Физики Ан Бсср | Датчик контрол работы ванны дл ультразвуковой обработки изделий |
DE3337842A1 (de) * | 1982-10-26 | 1984-04-26 | Storz Instrument Co., St. Louis, Mo. | Ultraschallsonde |
JPS60249944A (ja) * | 1984-05-28 | 1985-12-10 | 株式会社日立メディコ | 超音波探触子 |
JPH02193065A (ja) * | 1989-01-20 | 1990-07-30 | Canon Inc | 超音波装置 |
SU1693532A1 (ru) * | 1989-06-16 | 1991-11-23 | Всесоюзный Теплотехнический Научно-Исследовательский Институт Им.Ф.Э.Дзержинского | Способ ультразвукового контрол швов аустенитных сварных соединений |
US5123281A (en) * | 1990-04-20 | 1992-06-23 | General Dynamics Corporation | Ultrasonic testing device |
US5406849A (en) * | 1992-07-31 | 1995-04-18 | The United States Of America, As Represented By The Secretary Of Commerce | Method and apparatus for detecting guided leaky waves in acoustic microscopy |
US5406850A (en) * | 1993-01-14 | 1995-04-18 | Tosoh Smd, Inc. | Method of non-destructively testing a sputtering target |
-
1993
- 1993-09-21 US US08/124,332 patent/US6085591A/en not_active Expired - Fee Related
-
1994
- 1994-07-11 WO PCT/US1994/007792 patent/WO1995008766A1/en active Application Filing
- 1994-07-11 AU AU73599/94A patent/AU7359994A/en not_active Abandoned
- 1994-07-11 JP JP50974495A patent/JP3231329B2/ja not_active Expired - Fee Related
- 1994-07-14 TW TW083106426A patent/TW252218B/zh active
Also Published As
Publication number | Publication date |
---|---|
AU7359994A (en) | 1995-04-10 |
JPH09503055A (ja) | 1997-03-25 |
WO1995008766A1 (en) | 1995-03-30 |
TW252218B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1995-07-21 |
US6085591A (en) | 2000-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100914 Year of fee payment: 9 |
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LAPS | Cancellation because of no payment of annual fees |