JP3217586B2 - 陽極酸化装置及び陽極酸化方法 - Google Patents
陽極酸化装置及び陽極酸化方法Info
- Publication number
- JP3217586B2 JP3217586B2 JP07402394A JP7402394A JP3217586B2 JP 3217586 B2 JP3217586 B2 JP 3217586B2 JP 07402394 A JP07402394 A JP 07402394A JP 7402394 A JP7402394 A JP 7402394A JP 3217586 B2 JP3217586 B2 JP 3217586B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cathode electrode
- stage
- anodizing
- film metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02258—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07402394A JP3217586B2 (ja) | 1994-03-17 | 1994-03-17 | 陽極酸化装置及び陽極酸化方法 |
TW084102244A TW354854B (en) | 1994-03-17 | 1995-03-09 | Apparatus and method for anodic oxidation |
CNB95104060XA CN1309876C (zh) | 1994-03-17 | 1995-03-17 | 用于阳极氧化的设备及方法 |
KR1019950005581A KR950034597A (ko) | 1994-03-17 | 1995-03-17 | 양극산화용 장치 및 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07402394A JP3217586B2 (ja) | 1994-03-17 | 1994-03-17 | 陽極酸化装置及び陽極酸化方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001049710A Division JP3480840B2 (ja) | 2001-02-26 | 2001-02-26 | 半導体装置の作製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07263437A JPH07263437A (ja) | 1995-10-13 |
JP3217586B2 true JP3217586B2 (ja) | 2001-10-09 |
Family
ID=13535118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07402394A Expired - Fee Related JP3217586B2 (ja) | 1994-03-17 | 1994-03-17 | 陽極酸化装置及び陽極酸化方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3217586B2 (ko) |
KR (1) | KR950034597A (ko) |
CN (1) | CN1309876C (ko) |
TW (1) | TW354854B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101498241B1 (ko) * | 2013-09-17 | 2015-03-05 | 신태호 | 인공치아 보철의 표면 처리장치 |
US11211267B2 (en) | 2018-12-27 | 2021-12-28 | Toshiba Memory Corporation | Substrate processing apparatus and substrate processing method |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006058559A (ja) * | 2004-08-19 | 2006-03-02 | Bridgestone Corp | 画像表示用パネル及びその製造方法 |
KR100851204B1 (ko) * | 2006-11-09 | 2008-08-07 | 금오공과대학교 산학협력단 | 양극 산화 장치 |
CN101280447B (zh) * | 2007-04-07 | 2011-03-09 | 山东滨州渤海活塞股份有限公司 | 铝活塞环槽自动硬质阳极氧化装置 |
CN101942687A (zh) * | 2010-09-26 | 2011-01-12 | 西华大学 | 活塞顶面硬质阳极氧化方法 |
TWI449812B (zh) * | 2011-08-10 | 2014-08-21 | Chenming Mold Ind Corp | 漸層陽極表面處理方法 |
CN103590084B (zh) * | 2012-08-16 | 2018-08-17 | 盛美半导体设备(上海)有限公司 | 一种快速制备纳米结构阵列的装置及方法 |
JP5754520B2 (ja) * | 2013-01-22 | 2015-07-29 | 秋田県 | 電界洗浄方法、電界免疫組織染色方法、電界洗浄装置及び、電界免疫組織染色装置 |
CN104934481B (zh) * | 2014-03-21 | 2017-10-13 | 北京大学深圳研究生院 | 一种薄膜晶体管及其制备方法 |
CN105543927B (zh) * | 2015-12-23 | 2018-05-04 | 广东长盈精密技术有限公司 | 阳极氧化系统 |
CN105671623B (zh) * | 2016-04-02 | 2017-12-05 | 西南石油大学 | 一种吸盘式微弧氧化夹具 |
CN105646876B (zh) | 2016-04-08 | 2018-06-19 | 南京工业大学 | 一种有机催化制备聚酯酰胺的方法 |
TWI631238B (zh) * | 2017-06-23 | 2018-08-01 | 五環貿易有限公司 | Processing method for progressive dyeing of workpiece surface |
CN114717627B (zh) * | 2021-01-04 | 2024-04-19 | 善统工业股份有限公司 | 用于金属物件阳极处理的治具 |
CN115125599B (zh) * | 2021-08-03 | 2023-09-12 | 天津科技大学 | 一种制备多孔阳极氧化铝膜的装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825759B2 (ja) * | 1975-12-15 | 1983-05-30 | ウエムラコウギヨウ カブシキガイシヤ | ヨウキサクサンカノコウノウリツカホウホウ |
US4118303A (en) * | 1976-08-30 | 1978-10-03 | Burroughs Corporation | Apparatus for chemically treating a single side of a workpiece |
-
1994
- 1994-03-17 JP JP07402394A patent/JP3217586B2/ja not_active Expired - Fee Related
-
1995
- 1995-03-09 TW TW084102244A patent/TW354854B/zh not_active IP Right Cessation
- 1995-03-17 CN CNB95104060XA patent/CN1309876C/zh not_active Expired - Fee Related
- 1995-03-17 KR KR1019950005581A patent/KR950034597A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101498241B1 (ko) * | 2013-09-17 | 2015-03-05 | 신태호 | 인공치아 보철의 표면 처리장치 |
US11211267B2 (en) | 2018-12-27 | 2021-12-28 | Toshiba Memory Corporation | Substrate processing apparatus and substrate processing method |
Also Published As
Publication number | Publication date |
---|---|
TW354854B (en) | 1999-03-21 |
CN1124304A (zh) | 1996-06-12 |
CN1309876C (zh) | 2007-04-11 |
JPH07263437A (ja) | 1995-10-13 |
KR950034597A (ko) | 1995-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3217586B2 (ja) | 陽極酸化装置及び陽極酸化方法 | |
JP3277892B2 (ja) | ディスプレイ基板の製造方法 | |
US6294799B1 (en) | Semiconductor device and method of fabricating same | |
US6198132B1 (en) | Thin-film device with annular shaped insulation on its gate electrode | |
KR101004219B1 (ko) | 배선, 배선의 형성방법, 박막 트랜지스터 및 표시장치 | |
KR950008261B1 (ko) | 반도체장치의 제조방법 | |
JP2011238956A (ja) | 半導体装置 | |
CN101802987B (zh) | 电子器件的制造方法 | |
US5877069A (en) | Method for electrochemical local oxidation of silicon | |
JP4423353B2 (ja) | コンタクトホール形成方法 | |
JPH0862628A (ja) | 液晶表示素子およびその製造方法 | |
US5970326A (en) | Thin film transistor films made with anodized film and reverse-anodized etching technique | |
JP3480840B2 (ja) | 半導体装置の作製方法 | |
KR100242498B1 (ko) | 액정표시장치와 이에 사용되는 박막트랜지스터의 제조방법 | |
KR100437295B1 (ko) | 박막트랜지스터에서접촉홀형성방법 | |
JP2000036603A (ja) | 薄膜トランジスタの製造方法 | |
JPH07326766A (ja) | 半導体装置およびその作製方法 | |
JPH07321337A (ja) | 半導体集積回路およびその作製方法 | |
JP2004349604A (ja) | 薄膜トランジスタ及びその製造方法 | |
JP3476582B2 (ja) | 陽極酸化装置および陽極酸化方法 | |
KR0167448B1 (ko) | 박막 트랜지스터-액정표시장치 | |
JPH08122822A (ja) | 薄膜トランジスタ基板及びその製造方法及び陽極酸化装置 | |
JPH0936372A (ja) | 半導体装置の製造方法 | |
JPH05315329A (ja) | アルミニウム配線または電極の形成方法および薄膜トランジスタマトリックスの製造方法 | |
JPH0621465A (ja) | 半導体装置とその作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070803 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080803 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080803 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090803 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090803 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090803 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100803 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100803 Year of fee payment: 9 |
|
LAPS | Cancellation because of no payment of annual fees |