JP3213925U - 可撓性黒鉛シート支持構造と熱管理装置 - Google Patents
可撓性黒鉛シート支持構造と熱管理装置 Download PDFInfo
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- JP3213925U JP3213925U JP2017600067U JP2017600067U JP3213925U JP 3213925 U JP3213925 U JP 3213925U JP 2017600067 U JP2017600067 U JP 2017600067U JP 2017600067 U JP2017600067 U JP 2017600067U JP 3213925 U JP3213925 U JP 3213925U
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 109
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 109
- 239000010439 graphite Substances 0.000 title claims abstract description 109
- 238000005452 bending Methods 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Geology (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
102 可撓性黒鉛シート
104 支持部材
106 支持部材
120 屈曲調節部分
122 中央湾曲部分
124 外向き凹形部分
130 第1の湾曲保持部材
132 湾曲表面
142 湾曲表面
140 第2の湾曲保持部分
Claims (10)
- 可撓性黒鉛シート支持構造において、
第1の支持部材と、前記第1の支持部材から間隔が空けられている第2の支持部材であって、前記第1の支持部材及び前記第2の支持部材の一方がその他方に対して相対的に移動するようになっている、第1の支持部材及び第2の支持部材と、
互いに間隔が空けられている前記第1の支持部材及び前記第2の支持部材に固定されている可撓性黒鉛シートであって、互いに間隔が空けられている前記第1の支持部材及び前記第2の支持部材の間を延びる自立屈曲調節部分を有し、前記屈曲調節部分は、互いに反対側に位置した複数の外向き凹形湾曲部分の間に配置されている中央湾曲部分を有する釣鐘形曲線の形状である可撓性黒鉛シートと、
前記複数の外向き凹形湾曲部分のそれぞれ1つに隣接して配置されており且つそれに面している凸形湾曲表面を有する第1の湾曲保持部材と、前記複数の外向き凹形湾曲部分の他方に隣接して配置されており且つそれに面している凸形湾曲表面を有する第2の湾曲保持部材であって、前記可撓性黒鉛シートは前記凸形湾曲表面に固定されていない、第1の湾曲保持部材と第2の湾曲保持部材とを備える、可撓性黒鉛シート支持構造。 - 前記可撓性黒鉛シートは、約0.025mmから約0.500mmの間の厚さと、約0.6g/ccから約2.0g/ccの間の密度とを有する請求項1に記載の可撓性黒鉛シート支持構造。
- 前記湾曲保持部材は、前記支持部材に連結されている少なくとも1つであり、且つ、支持部材と一体状である請求項1に記載の可撓性黒鉛シート支持構造。
- 前記可撓性黒鉛シートの前記複数の外向き凹形湾曲部分はそれぞれの半径R2、R3を有し、前記中央湾曲部分は半径R1を有し、さらには、
a.R1≠R2且つR1≠R3、又は、
b.R1=R2=R3
である、請求項1に記載の可撓性黒鉛シート支持構造。 - 前記可撓性黒鉛シートの前記複数の外向き凹形湾曲部分はそれぞれの半径R2、R3を有し、前記中央湾曲部分は半径R1を有し、さらには、
R2とR3は前記凸形湾曲表面全体にわたって一定不変であり、及び、
R2とR3は前記凸形湾曲表面全体にわたって互いに等しい、の少なくとも一方を有する、請求項1に記載の可撓性黒鉛シート支持構造。 - 前記可撓性黒鉛シートの前記複数の外向き凹形湾曲部分はそれぞれの半径R2、R3を有し、前記中央湾曲部分は半径R1を有し、R2≠R3である請求項1に記載の可撓性黒鉛シート支持構造。
- 前記可撓性黒鉛シートの前記複数の外向き凹形湾曲部分はそれぞれの半径R2、R3を有し、前記中央湾曲部分は半径R1を有し、R2とR3は、前記凸形湾曲表面が、非円形の曲線、オイラー螺旋、螺旋曲線、及び、3次曲線の少なくとも1つである表面を画定するように、前記凸形湾曲表面に沿って変化する請求項1に記載の可撓性黒鉛シート支持構造。
- 前記可撓性黒鉛シートの前記複数の外向き凹形湾曲部分はそれぞれの半径R2、R3を有し、前記中央湾曲部分は半径R1を有し、前記支持部材は、距離DGの間隔を空けられており、R1+R1+R2+R3=DG、且つ、R1=R2=R3である請求項1に記載の可撓性黒鉛シート支持構造。
- 前記可撓性黒鉛シートは、さらに、一体的に積層されている複数のシートを含む少なくとも1つの部分と、一体的に積層されていない複数のシートを含む少なくとも1つの部分とを備える請求項1に記載の可撓性黒鉛シート支持構造。
- 前記可撓性黒鉛シートは、剥離黒鉛の圧縮粒子の1つ又は複数のシートと、熱分解性黒鉛の1つ又は複数のシートの少なくとも1つを備える請求項1に記載の可撓性黒鉛シート支持構造。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462090244P | 2014-12-10 | 2014-12-10 | |
US62/090,244 | 2014-12-10 | ||
PCT/US2015/063509 WO2016094150A1 (en) | 2014-12-10 | 2015-12-02 | Flexible graphite sheet support structure and thermal management arrangement |
Publications (1)
Publication Number | Publication Date |
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JP3213925U true JP3213925U (ja) | 2017-12-14 |
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JP2017600067U Active JP3213925U (ja) | 2014-12-10 | 2015-12-02 | 可撓性黒鉛シート支持構造と熱管理装置 |
Country Status (6)
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US (1) | US10177070B2 (ja) |
EP (1) | EP3243366B1 (ja) |
JP (1) | JP3213925U (ja) |
KR (1) | KR102428171B1 (ja) |
CN (1) | CN207369488U (ja) |
WO (1) | WO2016094150A1 (ja) |
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- 2015-12-02 JP JP2017600067U patent/JP3213925U/ja active Active
- 2015-12-02 CN CN201590001191.1U patent/CN207369488U/zh active Active
- 2015-12-02 KR KR1020177015470A patent/KR102428171B1/ko active IP Right Grant
- 2015-12-02 US US15/529,644 patent/US10177070B2/en active Active
- 2015-12-02 EP EP15867636.1A patent/EP3243366B1/en active Active
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US20170365538A1 (en) | 2017-12-21 |
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WO2016094150A1 (en) | 2016-06-16 |
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