JP2943902B2 - Flexible printed circuit board fixing jig - Google Patents
Flexible printed circuit board fixing jigInfo
- Publication number
- JP2943902B2 JP2943902B2 JP6199780A JP19978094A JP2943902B2 JP 2943902 B2 JP2943902 B2 JP 2943902B2 JP 6199780 A JP6199780 A JP 6199780A JP 19978094 A JP19978094 A JP 19978094A JP 2943902 B2 JP2943902 B2 JP 2943902B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- circuit board
- printed circuit
- suction hole
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
【０００１】[0001]
【産業上の利用分野】本発明は、エレクトロニクス実装
技術分野に関し、特にフレキシブルプリント基板（薄
板、フィルム基板等）への半導体装置、その他、電子部
品の実装技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of electronics packaging technology, and more particularly to the technology for mounting semiconductor devices and other electronic components on flexible printed boards (thin plates, film substrates, etc.).
【０００２】[0002]
【従来の技術】電子機器は高性能化、多機能化と共にコ
ンパクト化の傾向にある。このため、半導体装置を搭載
するこれら電子機器は、小型・軽量化のパッケージが必
要となり、半導体装置自体をそのまま実装するベアチッ
プ実装へと変わりつつある。また、これらのベアチップ
を搭載する回路基板も、薄型化、多層配線化が求められ
ると同時に可撓性も必要とされる。すなわち、実装面積
または実装体積の縮小された電子機器の配線には、可撓
性を有する基板、つまり、フレキシブルプリント基板
（FPC ）が最も適している。最近、携帯電話などFPC に
直接、半導体装置をダイボンディング、ワイヤボンディ
ングを行う方式が実用化され始めた。2. Description of the Related Art There is a tendency for electronic equipment to be more compact and to have higher performance and more functions. For this reason, these electronic devices on which a semiconductor device is mounted require a small-sized and light-weight package, and are being changed to bare chip mounting in which the semiconductor device itself is mounted as it is. In addition, the circuit board on which these bare chips are mounted is required to be thinner and have a multilayer wiring, and also to be flexible. That is, a flexible substrate, that is, a flexible printed circuit (FPC) is most suitable for wiring of an electronic device having a reduced mounting area or mounting volume. Recently, a method of directly bonding a semiconductor device to an FPC such as a mobile phone by die bonding and wire bonding has begun to be put into practical use.
【０００３】しかしながら、フレキシブルプリント基板
のベースとなるベースフィルムは、厚みが約50〜100mm
程度のポリイミド等の絶縁性樹脂であり、その可撓性か
ら反り、たわみ、うねりが発生し易く、また、ワイヤボ
ンディング時に、ワイヤボンダーのツール（キャピラリ
またはウェッジ）から加えられる超音波振動に呼応して
フレキシブルプリント基板の変位（ずれ）が発生し易い
という問題点があったので、フレキシブルプリント基板
へワイヤボンディングを行う場合は、フレキシブルプリ
ント基板の裏面にガラエポ、ポリイミド等の厚板を裏打
ち（接着）して、ワイヤボンディング時の接合不良を防
止していた。[0003] However, a base film serving as a base of a flexible printed circuit board has a thickness of about 50 to 100 mm.
It is an insulating resin such as polyimide, which is easily deformed and warped due to its flexibility, and responds to ultrasonic vibration applied from a wire bonder tool (capillary or wedge) during wire bonding. Therefore, there is a problem that displacement (displacement) of the flexible printed circuit board is apt to occur. Therefore, when performing wire bonding to the flexible printed circuit board, a thick plate such as glass epoxy or polyimide is backed (adhered) to the back surface of the flexible printed circuit board. As a result, bonding failure during wire bonding is prevented.
【０００４】図６に基づいて、従来のフレキシブルプリ
ント基板固定治具の一例について説明する。図６はダイ
ボンダ（図示省略）に組み込まれたフレキシブルプリン
ト基板固定治具によって、ベアチップ状の半導体装置を
実装したフレキシブルプリント基板を固定してワイヤボ
ンディングを行った状態を示す断面図である。図で、１
は平板状のセット台、２はフレキシブルプリント基板
（FPC ）、３はフレキシブルプリント基板２のベースと
なるベースフィルム、４はベースフィルム３上に形成さ
れた回路パターン、５はベアチップ状の半導体装置、６
は回路パターン４と半導体装置５とを接続するボンディ
ングワイヤ、７はフレキシブルプリント基板２の裏面に
接着された裏打ち用厚板、８はフレキシブルプリント基
板２の表面に当接してフレキシブルプリント基板２をセ
ット台１上に固定する押さえ治具である。An example of a conventional jig for fixing a flexible printed circuit board will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a state in which a flexible printed circuit board on which a bare chip semiconductor device is mounted is fixed by a flexible printed circuit board fixing jig incorporated in a die bonder (not shown) and wire bonding is performed. In the figure, 1
Is a flat set base, 2 is a flexible printed circuit board (FPC), 3 is a base film serving as a base of the flexible printed circuit board 2, 4 is a circuit pattern formed on the base film 3, 5 is a bare chip semiconductor device, 6
Is a bonding wire connecting the circuit pattern 4 and the semiconductor device 5, 7 is a backing thick plate adhered to the back surface of the flexible printed circuit board 2, and 8 is the flexible printed circuit board 2 set in contact with the surface of the flexible printed circuit board 2. A holding jig fixed on the table 1.
【０００５】[0005]
【発明が解決しようとする課題】以上に説明したよう
に、従来は、フレキシブルプリント基板２へワイヤボン
ディングによる電極接続を行う場合には、フレキシブル
プリント基板２の裏面に接着する裏打ち用厚板７が不可
欠であったため、工数が増え、コスト増となると共に、
フレキシブルプリント基板２の柔軟性を犠牲にしなけれ
ばならなかった。また、フレキシブルプリント基板２自
体も裏打ち用厚板７が接着されているため、重量が重く
なり厚くなってしまうという欠点があった。As described above, conventionally, when the electrodes are connected to the flexible printed board 2 by wire bonding, the backing thick plate 7 adhered to the back surface of the flexible printed board 2 is used. Because it was indispensable, the man-hour increased, the cost increased,
The flexibility of the flexible printed circuit board 2 has to be sacrificed. Further, since the flexible printed circuit board 2 itself has the backing thick plate 7 bonded thereto, there is a drawback that the flexible printed board 2 becomes heavy and thick.
【０００６】本発明は上記問題点に鑑みなされたもの
で、その目的とするところは、フレキシブルプリント基
板上でのワイヤボンディング時の接合不良を防止でき、
十分な接合信頼性を得ることができるフレキシブルプリ
ント基板固定治具の構造を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to prevent poor bonding at the time of wire bonding on a flexible printed circuit board.
An object of the present invention is to provide a structure of a flexible printed circuit board fixing jig capable of obtaining sufficient bonding reliability.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、請求項１記載のフレキシブルプリント基板固定治具
は、ワイヤボンディング等の電極接続時に真空吸着によ
りフレキシブルプリント基板を固定するフレキシブルプ
リント基板固定治具であって、真空源に連通すると共に
上方の開口に臨む空洞部が形成されたセット台本体と、
前記上方の開口を閉塞するように前記セット台本体に交
換可能に載置固定された平板とを備え、前記平板に表面
から裏面に貫通する吸着孔を等間隔、同形状でマトリッ
クス状に形 成し、前記フレキシブルプリント基板の電極
接続箇所の下方に位置する前記吸着孔に、その前記吸着
孔を閉塞する挿抜自在な閉塞支持ピンを嵌入したことを
特徴とするものである。According to a first aspect of the present invention, there is provided a flexible printed circuit board fixing jig for fixing a flexible printed circuit board by vacuum suction when connecting electrodes such as wire bonding. A set base body in which a cavity communicating with the vacuum source and facing the upper opening is formed,
A replaceably mounted fixed flat to the set rest body so as to close the upper opening, the flat plate surface
The suction holes that penetrate from the
Form shape hex-shaped, electrodes of the flexible printed circuit board
The suction hole located below the connection point
It is characterized in that an insertable / extractable closing support pin for closing the hole is fitted .
【０００８】請求項２記載のフレキシブルプリント基板
固定治具は、ワイヤボンディング等の電極接続時に真空
吸着によりフレキシブルプリント基板を固定するフレキ
シブルプリント基板固定治具であって、真空源に連通す
ると共に上方の開口に臨む空洞部が形成されたセット台
本体と、前記上方の開口を閉塞するように前記セット台
本体に交換可能に載置固定された平板とを備え、前記平
板に表面から裏面に貫通する吸着孔を等間隔、同形状で
マトリックス状に形成し、前記フレキシブルプリント基
板の電極接続箇所の下方に位置する前記吸着孔に、その
前記吸着孔を閉塞する挿抜自在な閉塞支持ピンを嵌入す
ると共に、前記フレキシブルプリント基板の、窓明けま
たはカッティングされた箇所の下方に位置する前記吸着
孔に、その前記吸着孔を閉塞する挿抜自在な閉塞ピンを
嵌入したことを特徴とするものである。According to a second aspect of the present invention, there is provided a flexible printed circuit board fixing jig for fixing a flexible printed circuit board by vacuum suction at the time of electrode connection such as wire bonding. A set base body having a cavity facing the opening; and a flat plate exchangeably mounted on and fixed to the set base body so as to close the upper opening. The suction holes are formed at regular intervals, in the same shape and in a matrix, and the suction holes located below the electrode connection portions of the flexible printed circuit board are provided with the suction holes.
Insert a removable support pin that closes the suction hole.
Of the flexible printed circuit board
Or the suction located below the cut point
In the hole, insert a removable pin that closes the suction hole.
It is characterized by being fitted .
【０００９】[0009]
【作用】上記の課題を解決するために、本発明のフレキ
シブルプリント基板固定治具は、フレキシブルプリント
基板上のベアチップ状の半導体装置の電極パッドと回路
パターン間、または、回路パターン同士のジャンパー接
続等を行うワイヤボンディングの際、セット台上の平板
に形成された複数の吸着孔を介して平板上に略均一な真
空吸着力を発生させ、平板上にフレキシブルプリント基
板を堅固に固定及び位置決めするものである。但し、吸
着孔は、ワイヤボンディングする箇所の下方位置を避け
て形成しておく。これにより、フレキシブルプリント基
板の反り等を発生させずに信頼性の高い電極接続を行う
ことができる。According to the present invention, there is provided a flexible printed circuit board fixing jig according to the present invention, which comprises a jumper connection between an electrode pad of a bare chip semiconductor device on a flexible printed board and a circuit pattern, or between circuit patterns, or the like. When performing wire bonding, a substantially uniform vacuum suction force is generated on the flat plate through a plurality of suction holes formed in the flat plate on the set table, and the flexible printed circuit board is firmly fixed and positioned on the flat plate. It is. However, the suction hole is formed so as not to be located below the position where the wire bonding is performed. Thereby, highly reliable electrode connection can be performed without causing warpage or the like of the flexible printed circuit board.
【００１０】また、汎用性をもたせるために、マトリッ
クス状に吸着孔を形成した平板を用いてもよいが、電極
接続を行う箇所の下方に吸着孔が位置する場合は、その
吸着孔を閉塞しフレキシブルプリント基板の電極接続箇
所を支持するための、挿抜自在な閉塞支持ピンをその吸
着孔に嵌入しておく。さらに、フレキシブルプリント基
板に、窓明けまたはカッティングされた部分が形成さ
れ、局所的にベースフィルムが除去されている場合は、
その除去された箇所の下方に位置する吸着孔に、その吸
着孔を閉塞する挿抜自在な閉塞ピン（閉塞支持ピンを含
む）を嵌入しておく。このように構成することによっ
て、形状の異なる多種のフレキシブルプリント基板に柔
軟に対応してワイヤボンディングを行うことができる。[0010] For the sake of general versatility, a flat plate having a matrix of suction holes may be used. However, if the suction holes are located below the locations where the electrodes are to be connected, the suction holes should be closed. An insertable / extractable closing support pin for supporting the electrode connection portion of the flexible printed board is fitted in the suction hole. Furthermore, if a window or a cut part is formed on the flexible printed circuit board and the base film is locally removed,
An insertable / extractable closing pin (including a closing support pin) for closing the suction hole is fitted in a suction hole located below the removed portion. With this configuration, wire bonding can be performed flexibly in response to various types of flexible printed boards having different shapes.
【００１１】[0011]
【実施例】図１に基づいて本発明のフレキシブルプリン
ト基板固定治具の一実施例について説明する。但し、図
６に示した構成と同等構成については同符号を付すこと
とし詳細な説明を省略する。図１は、フレキシブルプリ
ント基板をフレキシブルプリント基板固定治具によって
固定してワイヤボンディングを行った状態を示す断面図
である。図１で、９はダイボンダ（図示省略）に組み込
まれたセット台、１０は上方に開口する空洞部１０ａが
形成された、平面視略四角形状のセット台本体である。
１１はセット台本体１０の開口１０ｂを塞ぐように取り
付けられた平板、１１ａは平板１１の表面から裏面に貫
通する吸着孔である。セット台本体１０の側面にも貫通
孔が形成されており、その貫通孔にはセット台本体１０
の外側からパイプ１２が接続され、そのパイプ１２は真
空バルブ１３を介して真空源である真空ポンプ（図示省
略）に接続されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a jig for fixing a flexible printed board according to the present invention will be described with reference to FIG. However, the same components as those shown in FIG. 6 are denoted by the same reference numerals, and detailed description is omitted. FIG. 1 is a sectional view showing a state in which a flexible printed board is fixed by a flexible printed board fixing jig and wire bonding is performed. In FIG. 1, reference numeral 9 denotes a set base incorporated in a die bonder (not shown), and reference numeral 10 denotes a substantially rectangular set base main body in which a cavity 10a opening upward is formed.
Reference numeral 11 denotes a flat plate attached so as to close the opening 10b of the set base body 10, and reference numeral 11a denotes a suction hole penetrating from the front surface to the back surface of the flat plate 11. A through hole is also formed on the side surface of the set base body 10, and the through hole is formed in the through hole.
A pipe 12 is connected from the outside, and the pipe 12 is connected via a vacuum valve 13 to a vacuum pump (not shown) as a vacuum source.
【００１２】真空ポンプを動作させると、真空バルブ１
３及びパイプ１２及び空洞部１０ａを介して吸着孔１１
ａの表面側の開口に真空吸着力が発生するので、平板１
１上にフレキシブルプリント基板２を配置しておけば、
フレキシブルプリント基板２を平板１１上に堅固に固定
及び位置決めすることができる。また、真空バルブ１３
を操作することによって、フレキシブルプリント基板２
のセット台９への吸着及び脱着が容易に行える。また、
図１に示すように、フレキシブルプリント基板２の固定
に、押さえ治具８を補助的に用いてもよい。但し、真空
吸着力を平板１１の表面に発生させるための吸着孔１１
ａは、ワイヤボンディングする位置（電極接続を行う位
置）の下方位置を避けて形成しなければいけない。これ
は、ワイヤボンディングする位置の下方に吸着孔１１ａ
が存在すると、ワイヤボンディング箇所がセット台９に
よって支持されず、ワイヤボンディング時にツールがバ
ウンドしたり、回路パターン４が変形（変位）したりし
て、ボンディング性（接合信頼性）が悪くなるからであ
る。When the vacuum pump is operated, the vacuum valve 1
3 and the suction hole 11 through the pipe 12 and the cavity 10a.
Since a vacuum suction force is generated in the opening on the front surface side of
If the flexible printed circuit board 2 is arranged on 1,
The flexible printed board 2 can be firmly fixed and positioned on the flat plate 11. Also, the vacuum valve 13
By operating the flexible printed circuit board 2
Can be easily attached to and detached from the set table 9. Also,
As shown in FIG. 1, a holding jig 8 may be used for fixing the flexible printed circuit board 2. However, a suction hole 11 for generating a vacuum suction force on the surface of the flat plate 11.
a must be formed avoiding the position below the position where the wire bonding is performed (the position where the electrode is connected). This is because the suction hole 11a is located below the wire bonding position.
Is present, the wire bonding portion is not supported by the set table 9, and the tool bounces during wire bonding or the circuit pattern 4 is deformed (displaced), thereby deteriorating the bonding property (bonding reliability). is there.
【００１３】次に、ワイヤボンディングの方式について
説明する。フレキシブルプリント基板２として、一般的
な回路形成用の銅箔を接着剤層を介してベースフィルム
３（素材はボリイミド系）上に積層した銅張積層板（CC
L ）を用いる場合は、接着剤（主にエポキシ樹脂、ガラ
ス転位点は約150 〜160 ℃）のガラス転位点が低いた
め、ワイヤボンディング時に表面温度が約150 〜200 ℃
となるまで加熱すると接着剤が軟化してしまうので、超
音波エネルギーが吸収されてしまう、熱圧着と超音波圧
接併用のAuワイヤボンディングは不適当であり、加熱し
ない超音波圧接によるAlワイヤボンディングが適してい
る。フレキシブルプリント基板２として、接着剤層がな
く、ベースフィルム３（ポリイミド系）に直接、回路パ
ターン４を形成するための銅箔を、ベースフィルム３と
同じ素材のボリイミドワニスで張りつけた、または、銅
箔のベースをスパッタリングによりベースフィルム３上
に形成したフレキシブルプリント基板を用いた場合は、
およそ、170 〜180 ℃付近まで加熱できるため、常温で
行うAlワイヤボンディングに加えて、熱圧着と超音波圧
接併用のAuワイヤボンディングが可能である。Next, the wire bonding method will be described. As the flexible printed circuit board 2, a copper-clad laminate (CC) in which a general copper foil for forming a circuit is laminated on a base film 3 (a material is a polyimide) via an adhesive layer.
When L) is used, since the glass transition point of the adhesive (mainly epoxy resin, glass transition point is about 150 to 160 ° C) is low, the surface temperature during wire bonding is about 150 to 200 ° C.
When heated to the point where the adhesive softens, the ultrasonic energy is absorbed, and Au wire bonding using both thermocompression bonding and ultrasonic pressure bonding is inappropriate, and Al wire bonding using ultrasonic pressure bonding without heating is not suitable. Are suitable. As the flexible printed circuit board 2, a copper foil for forming the circuit pattern 4 directly on the base film 3 (polyimide) without an adhesive layer is adhered with a polyimide varnish of the same material as the base film 3, or a copper foil When using a flexible printed circuit board formed on the base film 3 by sputtering,
Since it can be heated to approximately 170 to 180 ° C., Au wire bonding using both thermocompression bonding and ultrasonic pressure bonding can be performed in addition to Al wire bonding performed at room temperature.
【００１４】次に、図２に基づいて、本発明のフレキシ
ブルプリント基板固定治具の異なる実施例について説明
する。但し、図１に示した実施例に対して平板のみが異
なるので、図２の平面図には平板１１のみを図示するこ
ととする。図２に示す平面視略四角形状の平板１１は、
マトリックス状（格子状）に略等間隔で、平面視略円形
の吸着孔１１ａを形成したものである。吸着孔１１ａの
形状及び間隔は、特に限定しないが、例えば、吸着孔１
１ａをφ0.2 〜0.5mm とした場合、その間隔はおよそ0.
5 〜1.5mm 程度にすればよい。このように構成すること
によって、フレキシブルプリント基板２はどの部分でも
略均一な真空吸着力で吸引され、平板１１上に固定され
るので、フレキシブルプリント基板２に、しわ、反り、
位置ずれ等が発生しにくくなる。Next, a description will be given of a different embodiment of the flexible printed circuit board fixing jig of the present invention with reference to FIG. However, since only the flat plate differs from the embodiment shown in FIG. 1, only the flat plate 11 is shown in the plan view of FIG. The substantially rectangular flat plate 11 shown in FIG.
The suction holes 11a are formed at substantially regular intervals in a matrix (lattice shape) at substantially equal intervals in plan view. The shape and interval of the suction holes 11a are not particularly limited.
When 1a is φ0.2-0.5mm, the interval is about 0.
It should be about 5 to 1.5 mm. With such a configuration, the flexible printed circuit board 2 is sucked by any uniform vacuum suction force and fixed on the flat plate 11, so that the flexible printed circuit board 2 can be wrinkled, warped,
Displacement and the like hardly occur.
【００１５】平板１１において、吸着孔１１ａを形成す
る位置は、図２に示した実施例に限定されないので、例
えば、数個の吸着孔からなる配列パターンが繰り返され
るようなパターンで形成してもよいが、前述したよう
に、フレキシブルプリント基板２のワイヤボンドする箇
所（電極接続を行う箇所）の下方位置を避ける必要があ
るので、図２に示すような汎用の平板１１を用いる場合
は、ワイヤボンディングする箇所の下方に位置する吸着
孔１１ａを塞ぐ必要がある。この場合、例えば、その吸
着孔１１ａを、後述する挿抜自在な閉塞支持ピンで塞ぐ
ように構成すればよい。但し、塞がれた吸着孔１１ａの
表面側の開口に露出する閉塞支持ピンの表面が、平板１
１の表面と略面一となるように構成する必要がある。こ
のように構成して、ワイヤボンディングする箇所を閉塞
支持ピンで支持すると共に、そのワイヤボンディングす
る箇所の周辺を真空吸着によって固定することによっ
て、フレキシブルプリント基板２の反り、たわみ、ひね
り、ずれ等を発生させずに、信頼性の高いワイヤボンデ
ィングを行うことができる。In the flat plate 11, the position at which the suction holes 11a are formed is not limited to the embodiment shown in FIG. 2, and therefore, for example, even if the suction holes 11a are formed in a pattern in which an array pattern composed of several suction holes is repeated. However, as described above, it is necessary to avoid a position below a portion of the flexible printed circuit board 2 where wires are bonded (a portion where electrodes are connected). Therefore, when a general-purpose flat plate 11 as shown in FIG. It is necessary to close the suction hole 11a located below the bonding position. In this case, for example, the suction hole 11a may be configured to be closed by a pluggable support pin, which will be described later. However, the surface of the blocking support pin exposed at the opening on the front side of the closed suction hole 11a is
1 is required to be substantially flush with the surface. With such a configuration, the portion to be wire-bonded is supported by the closing support pins, and the periphery of the portion to be wire-bonded is fixed by vacuum suction, so that the flexible printed circuit board 2 can be prevented from warping, bending, twisting, misalignment and the like. It is possible to perform highly reliable wire bonding without causing the generation.
【００１６】次に、図３に基づいて閉塞支持ピンの一実
施例について説明する。図３は平板１１に形成された吸
着孔１１ａに閉塞支持ピン１４を嵌入した状態を示す断
面図である。図３に示す閉塞支持ピン１４は、円柱状の
軸の一端に軸部分より径の大きな円板状の頭部を形成し
たものである。閉塞支持ピン１４の軸部分の長さは平板
１１の厚さと略同一寸法となるように構成しておく。こ
のように構成して平板１１の裏面側の吸着孔１１ａの開
口に閉塞支持ピン１４の軸部分を圧入することによっ
て、ワイヤボンディング時、吸着孔１１ａからのエアー
の漏れを防止して真空吸着力の低下を防止することがで
きると共に、吸着孔１１ａの上方に位置するフレキシブ
ルプリント基板２のワイヤボンディング箇所を確実に支
持してワイヤボンディング時の接合不良を防止すること
ができる。Next, an embodiment of the closing support pin will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a state in which the closing support pins 14 are fitted into the suction holes 11 a formed in the flat plate 11. The closing support pin 14 shown in FIG. 3 is formed by forming a disk-shaped head having a diameter larger than that of a shaft portion at one end of a cylindrical shaft. The length of the shaft portion of the closing support pin 14 is configured to be substantially the same as the thickness of the flat plate 11. By press-fitting the shaft portion of the blocking support pin 14 into the opening of the suction hole 11a on the back surface side of the flat plate 11 with such a configuration, it is possible to prevent air from leaking from the suction hole 11a at the time of wire bonding and to achieve a vacuum suction force. Can be prevented, and the wire bonding portion of the flexible printed circuit board 2 located above the suction hole 11a can be reliably supported to prevent bonding failure at the time of wire bonding.
【００１７】さらに、図４に基づいて閉塞支持ピンの異
なる実施例について説明する。図４に示す閉塞支持ピン
１５は、吸着孔１１ａに圧入し易いように、図３に示し
た閉塞支持ピンの軸部分の中間部分を両端部分より若干
太くし、軸部分に、中心軸に沿って軸部分を二分する溝
を形成したものである。このように閉塞支持ピン１５を
形成した場合、吸着孔１１ａも閉塞支持ピン１５に対応
して、図４に示すように平板１１の表面側の開口に、閉
塞支持ピン１５の頭部を収納する座ぐり形状を形成して
おく。但し、閉塞支持ピン１５の頭部の厚みと座ぐり形
状の深さが略同寸法となるように構成しておく。Further, another embodiment of the closing support pin will be described with reference to FIG. In the closing support pin 15 shown in FIG. 4, the middle portion of the shaft portion of the closing support pin shown in FIG. 3 is slightly thicker than both end portions so as to be easily pressed into the suction hole 11a. And a groove for bisecting the shaft portion. When the closing support pin 15 is formed in this manner, the suction hole 11a also accommodates the head of the closing support pin 15 in the opening on the front side of the flat plate 11 as shown in FIG. A counterbore shape is formed in advance. However, the thickness of the head of the closing support pin 15 and the depth of the spot facing shape are configured to be substantially the same.
【００１８】以上に説明した閉塞支持ピンは、吸着孔に
対して挿抜可能に構成するわけであるが、閉塞支持ピン
には平板１１の裏面から真空吸着力が作用すると共に、
超音波振動が印加されるため、吸着孔１１ａから閉塞支
持ピンが容易に抜けないような構造にしておく必要があ
る。また、閉塞支持ピンを吸着孔１１ａに挿入する場合
は、セット台９上で移動送りされるフレキシブルプリン
ト基板２が閉塞支持ピンに接触して、フレキシブルプリ
ント基板２が破損したり、送りが阻害されないよう、閉
塞支持ピンが吸着孔１１ａの表面側開口から突出しない
ように確実に挿入する必要がある。閉塞支持ピンの材料
は限定されないが吸着孔１１ａに密着しやすい樹脂等
（プラスチックピン）で構成してもよい。また、頭部の
上面が平坦なネジを閉塞支持ピンとして用いてもよい。The closing support pin described above is configured to be insertable into and removable from the suction hole. A vacuum suction force acts on the closing support pin from the back surface of the flat plate 11, and
Since ultrasonic vibration is applied, it is necessary to make the structure such that the closing support pin does not easily come out of the suction hole 11a. Further, when the closing support pin is inserted into the suction hole 11a, the flexible printed board 2 that is moved and fed on the set table 9 comes into contact with the closing support pin, and the flexible printed board 2 is not damaged or the feeding is not hindered. Therefore, it is necessary to insert the blocking support pin securely so as not to protrude from the opening on the front surface side of the suction hole 11a. The material of the closing support pin is not limited, but may be made of a resin or the like (plastic pin) which easily adheres to the suction hole 11a. Further, a screw having a flat top surface may be used as the closing support pin.
【００１９】次に、図５に基づいて本発明のフレキシブ
ルプリント基板固定治具のさらに異なる実施例について
説明する。図５は窓明けまたはカッティングが施された
フレキシブルプリント基板を平板上に配置した状態を示
す平面図である。但し、図１及び図２に示した構成と同
等構成については同符号を付すこととする。また、フレ
キシブルプリント基板については、ベースフィルムの輪
郭線のみを示すこととし詳細形状は図示を省略すること
とする。さらに、閉塞支持ピンも図示を省略する。図に
示すフレキシブルプリント基板２には窓明け部２ａ及び
カッティング部２ｂが形成され、局所的にベースフィル
ムが除去されている。このようなフレキシブルプリント
基板２にワイヤボンディングを行う場合には、図に示す
ように、フレキシブルプリント基板２の窓明け部２ａ及
びカッティング部２ｂの下方に位置する吸着孔１１ａを
閉塞ピン１６で塞いでおく。このように構成することに
よって、真空吸着力を低下させずに、フレキシブルプリ
ント基板２の形状に合わせて、平板１１を変更すること
なく、フレキシブルプリント基板２を略均一な真空吸着
力で固定することができる。閉塞ピン１６は吸着孔１１
ａを塞げるような形状に構成すればよく、フレキシブル
プリント基板２を支持するように構成する必要はない
が、閉塞ピンとして閉塞支持ピンを用いてもよい。Next, another embodiment of the flexible printed circuit board fixing jig of the present invention will be described with reference to FIG. FIG. 5 is a plan view showing a state in which a flexible printed circuit board on which a window is opened or cut is placed on a flat plate. However, the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals. For the flexible printed circuit board, only the outline of the base film is shown, and the detailed shape is not shown. Further, the illustration of the closing support pin is omitted. A window portion 2a and a cutting portion 2b are formed on the flexible printed board 2 shown in the figure, and the base film is locally removed. When performing wire bonding to such a flexible printed circuit board 2, as shown in the figure, the suction holes 11 a located below the window opening portion 2 a and the cutting portion 2 b of the flexible printed circuit board 2 are closed by closing pins 16. deep. With this configuration, the flexible printed circuit board 2 can be fixed with a substantially uniform vacuum suction force without changing the flat plate 11 according to the shape of the flexible printed circuit board 2 without reducing the vacuum suction force. Can be. The closing pin 16 is attached to the suction hole 11.
It is only necessary to configure the flexible printed circuit board 2 so as to cover the flexible printed circuit board 2, but a closing support pin may be used as the closing pin.
【００２０】尚、平板及び閉塞ピン及び閉塞支持ピンの
形状は実施例に限定されるものではない。また、吸着孔
の形状及び形成位置も実施例に限定されない。さらに、
実施例では片面基板のフレキシブルプリント基板を示し
たが両面基板としてもよい。The shapes of the flat plate, the closing pin and the closing support pin are not limited to those of the embodiment. Further, the shape and the position of the suction holes are not limited to those of the embodiment. further,
In the embodiment, a single-sided flexible printed board is shown, but a double-sided board may be used.
【００２１】[0021]
【発明の効果】以上、説明したように、請求項１または
請求項２記載のフレキシブルプリント基板固定治具によ
れば、真空吸着力によりセット台上にフレキシブルプリ
ント基板を確実に固定及び位置決めができるため、フレ
キシブルプリント基板へのワイヤボンディングを安定し
て行うことができ、十分な接合品質を得ることができる
ので、耐環境特性に優れた電子機器が得られる。また、
ワイヤボンディングの歩留りを向上させることができ
る。さらに、裏打ち用厚板が不要となるため、フレキシ
ブルプリント基板の特性を生かした小型、軽量かつ薄型
の電子機器の造出に寄与することができる。As described above, according to the flexible printed circuit board fixing jig according to the first or second aspect , the flexible printed circuit board is securely fixed on the set table by the vacuum suction force. Since positioning can be performed, wire bonding to the flexible printed circuit board can be performed stably, and sufficient bonding quality can be obtained, so that an electronic device having excellent environmental resistance characteristics can be obtained. Also,
The yield of wire bonding can be improved. Furthermore, since a thick backing plate is not required, it is possible to contribute to the creation of a small, lightweight, and thin electronic device utilizing the characteristics of a flexible printed circuit board.
【００２２】また、吸着孔への閉塞支持ピンまたは閉塞
ピンの嵌入位置を変えることによって、セット台を変更
することなく、形状の異なる多種のフレキシブルプリン
ト基板に接合信頼性の高いワイヤボンディングを行うこ
とができる。Further, by changing the position where the closing support pin or the closing pin is inserted into the suction hole, it is possible to perform highly reliable wire bonding to various kinds of flexible printed circuit boards having different shapes without changing the set table. Can be.
【図１】本発明のフレキシブルプリント基板固定治具の
一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a jig for fixing a flexible printed circuit board according to the present invention.
【図２】本発明のフレキシブルプリント基板固定治具の
異なる実施例を示す平面図である。FIG. 2 is a plan view showing another embodiment of the flexible printed circuit board fixing jig of the present invention.
【図３】閉塞支持ピンの一実施例を示す断面図である。FIG. 3 is a cross-sectional view showing one embodiment of a closing support pin.
【図４】閉塞支持ピンの異なる実施例を示す断面図であ
る。FIG. 4 is a sectional view showing a different embodiment of the closing support pin.
【図５】本発明のフレキシブルプリント基板固定治具の
さらに異なる実施例を示す平面図である。FIG. 5 is a plan view showing still another embodiment of the flexible printed circuit board fixing jig of the present invention.
【図６】従来のフレキシブルプリント基板固定治具の一
例を示す断面図である。FIG. 6 is a sectional view showing an example of a conventional flexible printed circuit board fixing jig.
２ フレキシブルプリント基板 １０ セット台本体 １０ａ 空洞部 １０ｂ 開口 １１ 平板 １１ａ 吸着孔 １４，１５ 閉塞支持ピン １６ 閉塞ピン 2 Flexible Printed Circuit Board 10 Set Stand Main Body 10a Cavity 10b Open 11 Flat Plate 11a Suction Hole 14, 15 Closure Support Pin 16 Closure Pin
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−190400（ＪＰ，Ａ) 特開 昭63−299300（ＪＰ，Ａ) 特開 平２−172641（ＪＰ，Ａ) 実開 昭63−38934（ＪＰ，Ｕ) 実開 平３−38700（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/04 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-190400 (JP, A) JP-A-63-299300 (JP, A) JP-A-2-172641 (JP, A) 38934 (JP, U) Hikaru Hira 3-38700 (JP, U) (58) Field surveyed (Int. Cl. 6 , DB name) H05K 13/04
Claims (2)
空吸着によりフレキシブルプリント基板を固定するフレ
キシブルプリント基板固定治具であって、真空源に連通
すると共に上方の開口に臨む空洞部が形成されたセット
台本体と、前記上方の開口を閉塞するように前記セット
台本体に交換可能に載置固定された平板とを備え、前記
平板に表面から裏面に貫通する吸着孔を等間隔、同形状
でマトリックス状に形成し、前記フレキシブルプリント
基板の電極接続箇所の下方に位置する前記吸着孔に、そ
の前記吸着孔を閉塞する挿抜自在な閉塞支持ピンを嵌入
したことを特徴とするフレキシブルプリント基板固定治
具。1. A flexible printed circuit board fixing jig for fixing a flexible printed circuit board by vacuum suction at the time of electrode connection such as wire bonding or the like, wherein the set base communicates with a vacuum source and has a hollow portion facing an upper opening. A main body, and a flat plate exchangeably mounted and fixed to the set base main body so as to close the upper opening,
Adsorption holes penetrating from the front to the back of a flat plate are equally spaced and have the same shape
Formed in a matrix with the flexible print
The suction hole located below the electrode connection point on the substrate
A flexible printed circuit board fixing jig , wherein an insertable / removable closing support pin for closing the suction hole is inserted .
空吸着によりフレキシブルプリント基板を固定するフレ
キシブルプリント基板固定治具であって、真空源に連通
すると共に上方の開口に臨む空洞部が形成されたセット
台本体と、前記上方の開口を閉塞するように前記セット
台本体に交換可能に載置固定された平板とを備え、前記
平板に表面から裏面に貫通する吸着孔を等間隔、同形状
でマトリックス状に形成し、前記フレキシブルプリント
基板の電極接続箇所の下方に位置する前記吸着孔に、そ
の前記吸着孔を閉塞する挿抜自在な閉塞支持ピンを嵌入
すると共に、前記フレキシブルプリント基板の、窓明け
またはカッティングされた箇所の下方に位置する前記吸
着孔に、その前記吸着孔を閉塞する挿抜自在な閉塞ピン
を嵌入したことを特徴とするフレキシブルプリント基板
固定治具。2. A flexible printed circuit board fixing jig for fixing a flexible printed circuit board by vacuum suction at the time of electrode connection such as wire bonding, wherein the set base communicates with a vacuum source and has a hollow portion facing an upper opening. A main body, and a flat plate exchangeably mounted on and fixed to the set base main body so as to close the upper opening. And formed in the suction hole located below the electrode connection portion of the flexible printed circuit board.
A removable support pin for closing the suction hole.
And the window of the flexible printed circuit board
Or, the suction pipe located below the cut point
A detachable closing pin that closes the suction hole in the mounting hole.
A jig for fixing a flexible printed circuit board, wherein a jig is inserted .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6199780A JP2943902B2 (en) | 1994-08-24 | 1994-08-24 | Flexible printed circuit board fixing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6199780A JP2943902B2 (en) | 1994-08-24 | 1994-08-24 | Flexible printed circuit board fixing jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0864997A JPH0864997A (en) | 1996-03-08 |
| JP2943902B2 true JP2943902B2 (en) | 1999-08-30 |
Family
ID=16413491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6199780A Expired - Fee Related JP2943902B2 (en) | 1994-08-24 | 1994-08-24 | Flexible printed circuit board fixing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2943902B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101402925B1 (en) * | 2012-11-06 | 2014-06-02 | 주식회사 오라컴 | Vaccum Zig System For Flexible Printed Circuit Board |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970078783A (en) * | 1996-05-14 | 1997-12-12 | 이대원 | Carrier system for mounting flexible printed circuit board components and control method thereof |
| JP2002158498A (en) * | 2000-11-22 | 2002-05-31 | Nec Kagoshima Ltd | Holding stage of flexible printed board |
| KR100457642B1 (en) * | 2003-06-26 | 2004-11-18 | 에스이디스플레이 주식회사 | Automatic transfer system of flexible printed circuit |
| KR100828312B1 (en) * | 2006-08-29 | 2008-05-08 | 주식회사 에스에프에이 | Apparatus and Method for Bonding Printed Circuit on FPD Panel |
| TWI500519B (en) * | 2013-02-01 | 2015-09-21 | Au Optronics Corp | Screen printing fixture having supporting surface in form of arc surface |
| US11708263B2 (en) * | 2020-05-13 | 2023-07-25 | Sheba Microsystems Inc. | Thermal compensation of lens assembly focus using image sensor shift |
-
1994
- 1994-08-24 JP JP6199780A patent/JP2943902B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101402925B1 (en) * | 2012-11-06 | 2014-06-02 | 주식회사 오라컴 | Vaccum Zig System For Flexible Printed Circuit Board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0864997A (en) | 1996-03-08 |
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| LAPS | Cancellation because of no payment of annual fees |