JP2890809B2 - Thick film printed circuit board - Google Patents
Thick film printed circuit boardInfo
- Publication number
- JP2890809B2 JP2890809B2 JP30208890A JP30208890A JP2890809B2 JP 2890809 B2 JP2890809 B2 JP 2890809B2 JP 30208890 A JP30208890 A JP 30208890A JP 30208890 A JP30208890 A JP 30208890A JP 2890809 B2 JP2890809 B2 JP 2890809B2
- Authority
- JP
- Japan
- Prior art keywords
- thick
- film
- silver
- wiring
- conductor wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、厚膜印刷基板に関し、特に厚膜印刷基板上
における厚膜導体配線の保護層に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick-film printed board, and more particularly to a protective layer for a thick-film conductor wiring on a thick-film printed board.
従来の厚膜印刷基板は、図面には示さないが、基板で
ある絶縁基板と、この絶縁基板上に形成される厚膜導体
配線及び厚膜抵抗による回路と、配線の交叉部における
絶縁を任うクロスオーバーガラスと、配線及び抵抗膜を
覆い保護する保護ガラスとを有している。Although not shown in the drawings, a conventional thick-film printed board is responsible for insulation at a crossing portion between the insulating board, which is a board, a thick-film conductor wiring and a thick-film resistor formed on the insulating board, and a wiring. And a protective glass for covering and protecting the wiring and the resistive film.
ここで、厚膜導体配線としては、例えば、銀を主体と
する金属成分を含有する銀パラジウム導体配線と銀プラ
チナ導体配線等とがあり、他に銅を主体とする金属成分
を含有する銅導体配線，金を主体とする金属成分を含有
する金導体配線等がある。Here, as the thick film conductor wiring, for example, there are a silver palladium conductor wiring containing a metal component mainly composed of silver and a silver platinum conductor wiring, and a copper conductor containing a metal component mainly composed of copper. There is a wiring, a gold conductor wiring containing a metal component mainly composed of gold, and the like.
これら厚膜導体配線で、銀を主体とする金属成分を含
有する厚膜導体配線のある厚膜印刷基板では、厚膜導体
配線を絶縁基板の上にクロスオーバーガラスを用いて一
部を２層構成として回路パターンを形成し、所望の位置
に抵抗体を形成し、さらに、最上層に保護ガラスを形成
している。In these thick-film conductor wiring, in the case of a thick-film printed circuit board having a thick-film conductor wiring containing a metal component mainly composed of silver, a part of the thick-film conductor wiring is formed in two layers by using a crossover glass on an insulating substrate. As a configuration, a circuit pattern is formed, a resistor is formed at a desired position, and a protective glass is formed on the uppermost layer.
また、銀を主体とする金属成分を含有する厚膜導体配
線は、水分の侵入による銀マイグレーションによる配線
パターン間の短絡を避けるため、銀にパラジウムを10〜
30重量％程度加えた金属成分の材料や、金にプラチナを
10〜30重量％程度加えた金属成分の材質を用いられてい
る。さらに最上層の保護ガラスは、厚膜抵抗体にレーザ
トリミングされた抵抗膜のマイクロクラック防止と配線
パターンの機械的保護等を目的に形成され、材質は、通
常、ポーラスのある非晶質ガラスを用いていた。In addition, a thick film conductor wiring containing a metal component mainly composed of silver has palladium on silver of 10 to 10 to avoid a short circuit between wiring patterns due to silver migration due to intrusion of moisture.
About 30% by weight of metal components and gold on platinum
The material of the metal component added about 10 to 30% by weight is used. Furthermore, the protective glass of the uppermost layer is formed for the purpose of preventing microcracks in the resistive film laser-trimmed on the thick-film resistor and mechanically protecting the wiring pattern, and is usually made of porous amorphous glass. Was used.
この従来の厚膜印刷基板では、水分の侵入による銀マ
イグレーションによる配線パターンが短絡しないよう
に、銀マイグレーションを起きにくくするために、銀に
パラジウムまたはプラチナを10〜30重量％加えているた
め、厚膜導体の材料費が高価となる欠点がある。In this conventional thick-film printed circuit board, 10 to 30% by weight of palladium or platinum is added to silver in order to prevent silver migration from occurring, so that the wiring pattern is not short-circuited due to silver migration due to intrusion of moisture. There is a disadvantage that the material cost of the membrane conductor is high.
本発明の目的は、かかる問題を解消すべく、信頼性の
あるより安価な厚膜印刷基板を提供することにある。An object of the present invention is to provide a reliable and inexpensive thick film printed circuit board in order to solve such a problem.
本発明の第１の特徴は、絶縁基板上に形成される銀を
主体とする金属成分を含有する厚膜導体配線と、厚膜抵
抗体とを有する厚膜印刷基板において、前記厚膜体配線
の金属成分のうち銀が90重量％から100重量％であり、
前記厚膜抵抗体及び前記厚膜導体配線上に形成される非
晶質ガラス層と、該非晶質ガラス層を覆うように形成さ
れる有機樹脂の保護層とを有する厚膜印刷基板である。
また、第２の特徴は、絶縁基板上に形成される銀を主体
とする金属成分を含有する厚膜導体配線と、厚膜抵抗体
とを有する厚膜印刷基板において、前記厚膜体配線の金
属成分のうち銀が90重量％から100重量％であり、前記
厚膜抵抗体及び前記厚膜導体配線上に形成される非晶質
ガラス層と、前記厚膜導体配線上の該非晶質ガラス層を
覆うように形成される有機樹脂の保護層とを有する厚膜
印刷基板である。さらに、前記絶縁基板は、鉄製基板の
両面にホーロー層を形成したものであることが望まし
い。According to a first feature of the present invention, there is provided a thick-film printed circuit board including a thick-film conductor wiring containing a metal component mainly composed of silver and formed on an insulating substrate, and a thick-film resistor. 90% to 100% by weight of silver in the metal component of
A thick-film printed board comprising an amorphous glass layer formed on the thick-film resistor and the thick-film conductor wiring, and an organic resin protective layer formed to cover the amorphous glass layer.
A second feature is that in a thick-film printed circuit board having a thick-film conductor wiring containing a metal component mainly composed of silver and formed on an insulating substrate, and a thick-film resistor, 90% by weight to 100% by weight of silver in the metal component, the amorphous glass layer formed on the thick film resistor and the thick film conductor wiring, and the amorphous glass layer on the thick film conductor wiring And a protective layer made of an organic resin formed so as to cover the layer. Further, it is desirable that the insulating substrate is formed by forming an enamel layer on both surfaces of an iron substrate.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図（ａ）及び（ｂ）は本発明の実施例を示す厚膜
印刷基板の部分平面図及びＡ−Ａ線断面図である。この
厚膜印刷基板は、同図に示すように、配線である銀導体
2,クロス導体４及び抵抗体５上に保護ガラス６を形成
し、更にその上に、例えばエポキシ樹脂あるいはフェノ
ール樹脂の有機樹脂７を形成したことである。FIGS. 1 (a) and 1 (b) are a partial plan view and a sectional view taken along line AA of a thick-film printed board showing an embodiment of the present invention. As shown in the figure, this thick-film printed circuit board has a silver conductor as a wiring.
2. A protective glass 6 is formed on the cross conductor 4 and the resistor 5, and an organic resin 7 such as an epoxy resin or a phenol resin is further formed thereon.
この厚膜印刷基板の製造方法は、まず、アルミナセラ
ミック基板１の上にスクリーン印刷法により銀導体２を
形成し、次に配線の交叉部分にクロスガラス３を形成す
る。次に、クロスガラス３を介して銀導体配線を乗り越
えてクロス導体４を形成する。次に銀導体２と一部接触
して抵抗体５を形成する。次に、はんだ付けする部分を
除いた配線領域に保護ガラス６を形成し、最上層として
保護ガラス６と同一のパターンで有機樹脂７を形成して
いる。In the method of manufacturing this thick film printed board, first, a silver conductor 2 is formed on an alumina ceramic substrate 1 by a screen printing method, and then a cross glass 3 is formed at a crossing portion of the wiring. Next, the cross conductor 4 is formed over the silver conductor wiring via the cross glass 3. Next, the resistor 5 is formed in partial contact with the silver conductor 2. Next, the protective glass 6 is formed in the wiring region excluding the portion to be soldered, and the organic resin 7 is formed as the uppermost layer in the same pattern as the protective glass 6.
このように有機樹脂層を保護ガラス層上に形成するこ
とにより、ポーラスな保護ガラスのポーラスを樹脂が埋
め込められると同時に有機樹脂層の厚みにより水分の侵
入経路を長くし、導体配線に侵入する水分は著しく少な
くなる。なお、この樹脂層は基板全体に形成するより
は、配線部分に限定した方が、熱膨張による層の破壊を
避けることが出来る。By forming the organic resin layer on the protective glass layer in this manner, the porous resin of the porous protective glass can be embedded with the resin, and at the same time, the thickness of the organic resin layer lengthens the entry path of moisture, thereby increasing the moisture entering the conductor wiring. Is significantly reduced. It is to be noted that destruction of the layer due to thermal expansion can be avoided by limiting the resin layer to the wiring portion, rather than forming the resin layer over the entire substrate.
第２図は本発明の他の実施例を示す厚膜印刷基板の断
面図である。この厚膜印刷基板は、同図に示すように、
基板を鉄製基板1aの両面にホーロー層1bを形成したこと
と、抵抗体５の領域を除いて銀プラチナ導体2aの上に有
機樹脂7aを形成したことである。FIG. 2 is a sectional view of a thick-film printed circuit board showing another embodiment of the present invention. As shown in FIG.
The substrate is that enamel layers 1b are formed on both sides of the iron substrate 1a, and that the organic resin 7a is formed on the silver platinum conductor 2a except for the region of the resistor 5.
この厚膜印刷基板の製造方法は、まず、鉄板1aの上に
絶縁層としてホーロー層1bが形成された基板の上に銀プ
ラチナ導体2aを形成し、その後抵抗体５を銀プラチナ導
体2aに一部重なる様に形成する。次に、銀プラチナ導体
2a及び抵抗体５上に保護ガラス12を形成し、最後に最上
層として抵抗体５の上を除いて有機樹脂7aを形成してい
る。In the method of manufacturing this thick film printed board, first, a silver platinum conductor 2a is formed on a substrate on which an enamel layer 1b is formed as an insulating layer on an iron plate 1a, and then the resistor 5 is connected to the silver platinum conductor 2a. It forms so that it may overlap. Next, the silver platinum conductor
The protective glass 12 is formed on the resistor 2a and the resistor 5, and finally the organic resin 7a is formed as the uppermost layer except for the portion above the resistor 5.
このような構造にすることにより、有機樹脂7aは、外
部から銀プラチナ導体2aへの水分の浸入を防ぐことが出
来、銀マイグレーションによるパターン間の短絡を防止
することができる。また、この有機樹脂7aを抵抗体11の
上にだけ選択的に形成しないようにすることにより、有
機樹脂7aを形成後にレーザトリミングを行えるので、部
品実装後に抵抗のトリミングも可能であるという利点が
ある。さらに、基板を安価な鉄製基板として、両面にホ
ーロ層を貼付けることにより、安価な基板が得られると
いう利点がある。With such a structure, the organic resin 7a can prevent moisture from entering the silver platinum conductor 2a from the outside, and can prevent a short circuit between patterns due to silver migration. In addition, since the organic resin 7a is not selectively formed only on the resistor 11, laser trimming can be performed after the organic resin 7a is formed, so that the resistance can be trimmed after the components are mounted. is there. Furthermore, there is an advantage that an inexpensive substrate can be obtained by attaching an enamel layer to both sides of the substrate as an inexpensive iron substrate.
第３図は高温高湿試験を行うときのサンプルを示す図
である。この発明による厚膜印刷基板を第３図に示すサ
ンプルを用いて85℃85％RHの高温高湿槽に入れ、配線パ
ターン間バイアス電圧100V印加し、1000時間における短
絡の発生率を、有機樹脂の有無及び、導体配線の中の銀
の含有率を99重量％の場合と、80重量％の場合について
比較試験を行った。FIG. 3 is a diagram showing a sample when a high-temperature and high-humidity test is performed. The thick-film printed circuit board according to the present invention was placed in a high-temperature and high-humidity bath at 85 ° C. and 85% RH using the sample shown in FIG. 3, and a bias voltage between wiring patterns of 100 V was applied. A comparison test was performed for the presence or absence and the case where the silver content in the conductor wiring was 99% by weight and 80% by weight.
その結果を下表に示す。 The results are shown in the table below.
この結果、有機樹脂層であるサンプルでは、配線導体
中の銀の含有率が99重量％でも短絡の発生をなくすこと
ができるということである。 As a result, in the sample of the organic resin layer, even if the content of silver in the wiring conductor is 99% by weight, the occurrence of the short circuit can be eliminated.
以上説明したように本発明は、より安価にするため
に、厚膜導体配線の金属成分を銀が90重量％から100重
量％にし、この配線の最上層を非晶質ガラスを介して有
機樹脂層を形成することによって、水分の侵入を防止出
来る。従って本発明によれば、より安価で、銀マイグレ
ーションによる短絡を起すことなく信頼製の高い厚膜印
刷基板が得られるという効果がある。As described above, according to the present invention, in order to reduce the cost, the metal component of the thick-film conductor wiring is changed from 90% by weight of silver to 100% by weight, and the uppermost layer of the wiring is made of an organic resin through amorphous glass. By forming the layer, penetration of moisture can be prevented. Therefore, according to the present invention, there is an effect that a thicker printed circuit board which is less expensive and has high reliability without causing a short circuit due to silver migration can be obtained.
第１図（ａ）及び（ｂ）は本発明の一実施例を示す厚膜
印刷基板の部分平面図及びＡ−Ａ線断面図、第２図は本
発明の他の実施例を示す厚膜印刷配線の断面図、第３図
は高温高湿試験を行うときのサンプルを示す図である。 １……アルミナセラミック基板、1a……鉄製基板、1b…
…ホーロ層、2,2a……銀導体、３……クロスガラス、４
……クロス導体、５……抵抗体、6,6a……保護ガラス、
7,7a,7b……有機樹脂、８……導体線間、９……導体配
線、10……絶縁基板。1 (a) and 1 (b) are a partial plan view and a sectional view taken along line AA of a thick film printed board showing one embodiment of the present invention, and FIG. 2 is a thick film showing another embodiment of the present invention. FIG. 3 is a cross-sectional view of the printed wiring, and FIG. 3 is a diagram showing a sample when performing a high-temperature and high-humidity test. 1 ... alumina ceramic substrate, 1a ... iron substrate, 1b ...
... Holo layer, 2,2a ... Silver conductor, 3 ... Cross glass, 4
... cross conductor, 5 ... resistor, 6, 6a ... protective glass,
7, 7a, 7b: organic resin, 8: between conductor lines, 9: conductor wiring, 10: insulating substrate.
Claims (3)
属成分を含有する厚膜導体配線と、厚膜抵抗体とを有す
る厚膜印刷基板において、前記厚膜体配線の金属成分の
うち銀が90重量％から100重量％であり、前記厚膜抵抗
体及び前記厚膜導体配線上に形成される非晶質ガラス層
と、該非晶質ガラス層を覆うように形成される有機樹脂
の保護層とを有することを特徴とする厚膜印刷基板。A thick-film printed wiring board having a thick-film conductor wiring containing a metal component mainly composed of silver and a thick-film resistor formed on an insulating substrate; And 90% by weight to 100% by weight of silver, and an amorphous glass layer formed on the thick-film resistor and the thick-film conductor wiring; and an organic resin formed so as to cover the amorphous glass layer. A thick-film printed board, comprising:
属成分を含有する厚膜導体配線と、厚膜抵抗体とを有す
る厚膜印刷基板において、前記厚膜体配線の金属成分の
うち銀が90重量％から100重量％であり、前記厚膜抵抗
体及び前記厚膜導体配線上に形成される非晶質ガラス層
と、前記厚膜導体配線上の該非晶質ガラス層を覆うよう
に形成される有機樹脂の保護層とを有することを特徴と
する厚膜印刷基板。2. A thick-film printed circuit board having a thick-film conductor wiring containing a metal component mainly composed of silver formed on an insulating substrate and a thick-film resistor, wherein the metal component of the thick-film wiring is And 90% by weight to 100% by weight of silver, and covers the amorphous glass layer formed on the thick film resistor and the thick film conductor wiring and the amorphous glass layer on the thick film conductor wiring. And a protective layer of an organic resin formed as described above.
ー層を形成したものであることを特徴とする請求項１も
しくは請求項２記載の厚膜印刷基板。3. The thick film printed circuit board according to claim 1, wherein said insulating substrate is formed by forming an enamel layer on both surfaces of an iron substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30208890A JP2890809B2 (en) | 1990-11-07 | 1990-11-07 | Thick film printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30208890A JP2890809B2 (en) | 1990-11-07 | 1990-11-07 | Thick film printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04174592A JPH04174592A (en) | 1992-06-22 |
| JP2890809B2 true JP2890809B2 (en) | 1999-05-17 |
Family
ID=17904782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30208890A Expired - Lifetime JP2890809B2 (en) | 1990-11-07 | 1990-11-07 | Thick film printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2890809B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006134839A1 (en) | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| US7997760B2 (en) | 2005-06-07 | 2011-08-16 | Fujikura Ltd. | Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal |
-
1990
- 1990-11-07 JP JP30208890A patent/JP2890809B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7997760B2 (en) | 2005-06-07 | 2011-08-16 | Fujikura Ltd. | Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal |
| WO2006134839A1 (en) | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| US7982230B2 (en) | 2005-06-13 | 2011-07-19 | Fujikura Ltd. | Substrate for mounting light emitting element, light emitting module and lighting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04174592A (en) | 1992-06-22 |
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