JP2539593Y2 - Thick film printed circuit - Google Patents
Thick film printed circuitInfo
- Publication number
- JP2539593Y2 JP2539593Y2 JP9663691U JP9663691U JP2539593Y2 JP 2539593 Y2 JP2539593 Y2 JP 2539593Y2 JP 9663691 U JP9663691 U JP 9663691U JP 9663691 U JP9663691 U JP 9663691U JP 2539593 Y2 JP2539593 Y2 JP 2539593Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- printed circuit
- pattern
- glass protective
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本考案は、ハイブリッドIC等に
用いられる厚膜印刷回路に関し、特に回路基板表面を保
護する目的でガラス膜により覆われた導体膜が印刷され
る厚膜印刷回路に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film printed circuit used for a hybrid IC or the like, and more particularly to a thick film printed circuit on which a conductive film covered with a glass film is printed for the purpose of protecting a circuit board surface.
【0002】[0002]
【従来の技術】例えばハイブリッドIC等に於いて、セ
ラミック等からなる基板表面に所望のパターンに形成さ
れた導体膜や抵抗体膜を外部からの影響から保護すると
共に各膜間を互いに絶縁すべくその表面を含む基板表面
をガラス膜により覆うことが一般的に行われている。こ
のとき、チップ等の部品が搭載される電極部やリードフ
レームを接合するための電極部はガラス保護膜で覆わな
い。2. Description of the Related Art In a hybrid IC, for example, a conductor film or a resistor film formed in a desired pattern on a surface of a substrate made of ceramic or the like is protected from external influences and is insulated from each other. It is common practice to cover the substrate surface including the surface with a glass film. At this time, the electrode portion on which components such as chips are mounted and the electrode portion for joining the lead frame are not covered with the glass protective film.
【0003】上記した厚膜印刷回路によれば、回路基板
上にプリントされた導体膜、ガラス膜等の膜厚は、部品
搭載前のパターンのガラス膜で覆われていない部分に於
いて測定可能であるが、部品を搭載してしまうとガラス
膜で覆われていない部分が存在しないため、特に全品検
査、事後検査等の製造終了後の回路基板を管理する上で
不都合を来していた。According to the above-described thick-film printed circuit, the thickness of a conductor film, a glass film, and the like printed on a circuit board can be measured in a portion of the pattern which is not covered with the glass film before the component is mounted. However, when the components are mounted, there is no portion that is not covered with the glass film, so that there is an inconvenience in managing the circuit board after manufacturing such as inspection of all products and post inspection.
【0004】[0004]
【考案が解決しようとする課題】このような従来技術の
問題点に鑑み、本考案の主な目的は、部品搭載後の各膜
厚測定を容易にできる厚膜印刷回路を提供することにあ
る。SUMMARY OF THE INVENTION In view of the above problems of the prior art, a main object of the present invention is to provide a thick film printed circuit which can easily measure each film thickness after mounting components. .
【0005】[0005]
【課題を解決するための手段】上述した目的は本考案に
よれば、基板表面に形成された導体膜、抵抗体膜等のパ
ターンを保護するためのガラス保護膜を有する厚膜印刷
回路であって、前記ガラス保護膜に、前記パターンの一
部及び該部分に隣接する前記基板を露出させる窓が設け
られていることを特徴とする厚膜印刷回路を提供するこ
とにより達成される。According to the present invention, the above-mentioned object is to provide a thick-film printed circuit having a glass protective film for protecting a pattern such as a conductor film and a resistor film formed on a substrate surface. This is achieved by providing a thick film printed circuit, wherein the glass protective film is provided with a window exposing a part of the pattern and the substrate adjacent to the part.
【0006】[0006]
【作用】このようにすれば、ガラス保護膜に設けられた
窓より、パターン及び基板が露出しているため、例えば
この窓内に接触型膜厚測定器を適用すれば、パターン及
びガラス保護膜の膜厚測定が容易に行える。In this way, since the pattern and the substrate are exposed from the window provided in the glass protective film, for example, if a contact type film thickness measuring instrument is applied in this window, the pattern and the glass protective film can be obtained. Can be easily measured.
【0007】[0007]
【実施例】以下に添付の図面を参照して本考案を特定の
実施例について詳細に説明する。BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to a specific embodiment, with reference to the accompanying drawings, in which: FIG.
【0008】図1は本考案が適用されたハイブリッドI
Cの要部平面図を示す。FIG. 1 shows a hybrid I to which the present invention is applied.
The principal part top view of C is shown.
【0009】セラミック基板1上に形成された導体膜、
抵抗体膜等からなる形成パターン2の表面には、チップ
等が搭載される電極部領域3及びリードフレームが接合
される電極部領域4以外の部分がガラス保護膜5により
覆われている。このガラス保護膜は主成分が酸化鉛(P
bO)からなり、焼成温度が500℃〜550℃の低融
点ガラスからなるガラスペーストを焼成した膜である。
このガラス保護膜5を焼成した後に各電極部領域3、4
にはんだが盛られ、図示されないチップ部品、リードフ
レーム等が取り付けられる。A conductive film formed on the ceramic substrate 1,
On the surface of the formation pattern 2 made of a resistor film or the like, portions other than the electrode portion region 3 on which the chip and the like are mounted and the electrode portion region 4 to which the lead frame is joined are covered with a glass protective film 5. The main component of this glass protective film is lead oxide (P
bO) and a film obtained by firing a glass paste made of a low-melting glass having a firing temperature of 500 ° C. to 550 ° C.
After firing this glass protective film 5, each of the electrode portion regions 3, 4
, And chip components (not shown), a lead frame, and the like are attached.
【0010】パターン2のガラス保護膜5に覆われた部
分の図1に於ける右側には、セラミック基板1表面、及
びパターン2が露出するように窓6が形成されている。
即ち図2に示すように、パターン2の一部にはガラス保
護膜5が覆われていない部分が存在するわけである。A window 6 is formed on the right side of the portion of the pattern 2 covered with the glass protective film 5 in FIG. 1 so that the surface of the ceramic substrate 1 and the pattern 2 are exposed.
That is, as shown in FIG. 2, there is a portion of the pattern 2 where the glass protective film 5 is not covered.
【0011】このように構成されたセラミック基板1上
に形成された各膜の膜厚測定の際には、各電極部領域
3、4に図示されない部品等が搭載された後であって
も、窓6内に図示されない接触型膜厚測定器の接触針を
摺接させれば、パターン2及びガラス保護膜5の膜厚測
定が容易に行える。When measuring the film thickness of each film formed on the ceramic substrate 1 configured as described above, even after components (not shown) are mounted in the electrode regions 3 and 4, If a contact needle of a contact-type film thickness measuring device (not shown) is slid in the window 6, the film thickness of the pattern 2 and the glass protective film 5 can be easily measured.
【0012】尚、窓6は、パターン2のガラス保護膜5
で覆われた部分であれば、セラミック基板1上のどの部
分に形成しても本実施例と同様の効果が得られる。The window 6 is provided with the glass protective film 5 of the pattern 2.
The same effect as that of the present embodiment can be obtained regardless of the portion on the ceramic substrate 1 as long as the portion is covered with.
【0013】[0013]
【考案の効果】以上の説明により明らかなように、本考
案による厚膜印刷回路によれば、窓を形成するだけで、
部品搭載後に導体膜、抵抗体膜等のパターン及びガラス
保護膜の膜厚測定を容易にしかも同位置で測定できるこ
とから、製造工程を何等複雑化することなく品質管理上
好適な厚膜印刷回路を提供できる。特に、必要に応じて
何時でも検査できることから、ユーザにとって品質管理
上極めて好都合である。As is clear from the above description, according to the thick-film printed circuit of the present invention, only the window is formed,
Since the thickness of the pattern of the conductor film, resistor film, etc. and the glass protective film can be measured easily and at the same position after the components are mounted, a thick film printed circuit suitable for quality control without complicating the manufacturing process at all. Can be provided. In particular, since the inspection can be performed at any time as needed, it is very convenient for the user in quality control.
【図1】本考案が適用されたハイブリッドICの要部平
面図である。FIG. 1 is a plan view of a main part of a hybrid IC to which the present invention is applied.
【図2】図1のII−II線について見た拡大断面図であ
る。FIG. 2 is an enlarged sectional view taken along line II-II of FIG.
1 セラミック基板 2 導体膜、抵抗体膜 3、4 電極部領域 5 ガラス保護膜 6 窓 DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 Conductor film, resistor film 3, 4 Electrode area 5 Glass protective film 6 Window
Claims (1)
等のパターンを保護するためのガラス保護膜を有する厚
膜印刷回路であって、 前記ガラス保護膜に、前記パターンの一部及び該部分に
隣接する前記基板を露出させる窓が設けられていること
を特徴とする厚膜印刷回路。1. A thick film printed circuit having a glass protective film for protecting a pattern such as a conductor film and a resistor film formed on a substrate surface, wherein the glass protective film includes a part of the pattern and A thick-film printed circuit comprising a window exposing the substrate adjacent to the portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9663691U JP2539593Y2 (en) | 1991-10-29 | 1991-10-29 | Thick film printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9663691U JP2539593Y2 (en) | 1991-10-29 | 1991-10-29 | Thick film printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0538949U JPH0538949U (en) | 1993-05-25 |
JP2539593Y2 true JP2539593Y2 (en) | 1997-06-25 |
Family
ID=14170323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9663691U Expired - Fee Related JP2539593Y2 (en) | 1991-10-29 | 1991-10-29 | Thick film printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2539593Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102281457B1 (en) * | 2015-01-13 | 2021-07-27 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
-
1991
- 1991-10-29 JP JP9663691U patent/JP2539593Y2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0538949U (en) | 1993-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |