JPS63296260A - Printed substrate of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To enable the highly accurate trimming of electric components on a printed substrate, by using probing pads with two layers piled in print. CONSTITUTION:Resistors 13 connected between two electrodes 12 on a printed substrate 1, probing pads 11 used on the electrodes 12 upon the trimming of the resistor 13, are printed on the substrate 1. Each pad 11 is composed of an upper conductor 11a and a lower conductor 11b piled in print on the electrode 12. When a hard needle 21 of the probe 2 is pressed in contact with the upper conductor 11a and the lower conductor 11b during a trimming process, a contact area is formed largely astride of both layers and so contact resistance can be made small, so that the trimming can be performed with high accuracy.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a printed circuit board for a hybrid integrated circuit, and more particularly to a printed circuit board for a hybrid integrated circuit on which probing pads for trimming electrical component bodies on the printed circuit board are printed. .

[Conventional technology]

Conventionally, in printed circuit boards of this type of hybrid integrated circuit, when laser trimming electrical components on the printed circuit board, probing pads are used to measure the characteristic values of the electrical components, such as the resistance value in the case of resistors. , the conductor contacted by the probe is printed in only one layer.

[Problem that the invention seeks to solve]

In the conventional hybrid integrated circuit printed circuit board described above, the conductor of the probing pad is printed in a single layer, so the contact resistance between the probe needle for measuring characteristic values and the probing pad is large, making it possible to perform highly accurate trimming. The disadvantage is that it is very difficult to do so.

[Means for solving problems]

The printed circuit board of the hybrid integrated circuit of the present invention has two conductors used for measuring characteristic values during trimming of electrical components on the printed circuit board.
It has a probing pad printed in layers.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a partial top view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG.

In FIG. 1, a printed circuit board 1 of the hybrid integrated circuit of this embodiment is shown.
are two electrodes 12 on the printed circuit board 1 and two electrodes 12 on the printed circuit board 1.
A blobbing pad 11 used for measuring the resistance value during trimming of the resistor 13 is printed on each of the two electrodes 12 and the resistor 13 connected therebetween.

Further, as shown in FIG. 2, each blowing pad 11 has an upper conductor 11a and a lower conductor 11 on the electrode 12.
b is printed in two overlapping layers.

Measurement of the resistance value during trimming of the resistor 13 is carried out by press-fitting a hard conductive needle 21 of the probe 2, indicated by a broken line in FIG. 2, into contact with the upper conductor 11a and the lower conductor 11b.

The needle 21 straddles the upper conductor 11a and the lower conductor 11b and makes contact with it over a wider contact area than in the conventional single-layer case, thereby reducing contact resistance.

〔Effect of the invention〕

As explained above, the present invention provides a two-layer conductor structure for the blowing pad used when trimming the electrical component body, so that the contact between the probe needle and the blowing pad for measuring the characteristic values of the electrical component body is improved. Since the resistance is lowered, there is an effect that highly accurate trimming can be performed.

[Brief explanation of the drawing]

FIG. 1 is a partial top view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. DESCRIPTION OF SYMBOLS 1...Printed board, 2...Probe, 11...Blowing pad, lla...Top conductor, llb...
Lower conductor, 12... Electrode, 13... Resistor, 21.
··needle. I

Claims (1)

[Claims] 1. A printed board for a hybrid integrated circuit, comprising a probing pad printed with two layers of conductors used for measuring characteristic values during trimming of an electrical component body on the printed board.