JPH11144904A - Chip electronic component - Google Patents

Chip electronic component

Info

Publication number
JPH11144904A
JPH11144904A JP9302707A JP30270797A JPH11144904A JP H11144904 A JPH11144904 A JP H11144904A JP 9302707 A JP9302707 A JP 9302707A JP 30270797 A JP30270797 A JP 30270797A JP H11144904 A JPH11144904 A JP H11144904A
Authority
JP
Japan
Prior art keywords
electrode
formed
surface
substrate
portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9302707A
Other languages
Japanese (ja)
Inventor
Yozo Obara
Masato Shimada
Katsumi Takeuchi
陽三 小原
真人 嶋田
勝己 竹内
Original Assignee
Hokuriku Electric Ind Co Ltd
北陸電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Ind Co Ltd, 北陸電気工業株式会社 filed Critical Hokuriku Electric Ind Co Ltd
Priority to JP9302707A priority Critical patent/JPH11144904A/en
Publication of JPH11144904A publication Critical patent/JPH11144904A/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements

Abstract

PROBLEM TO BE SOLVED: To prevent solders used for adjacent electrode parts from contacting each other, by forming one or more groove parts completely traversing a surface part of a board, and passing between two electrode parts arranged closely to each other with no electric element body existing between the electrode parts. SOLUTION: A connection electrode body 4A has a surface electrode 5a formed on the surface of an end part of a board 1, a back side electrode 5b formed on the backside of the end of the board 1, an end surface electrode 5c, and a plating layer 6 covering the surface electrode 5a, the backside electrode 5b and the end surface electrode 5c. The end surface electrode 5c formed to extend between the surface electrode 5a and the backside electrode 5b, over a recessed part 1a having a semicircular cross section formed on a lateral part of the board 1 and extending in the direction of thickness of the board 1. On the surface part of the board 1, three groove parts 8... passing between two adjacent electrode parts 4A and 4A arrayed along one end part and between two electrode parts 4B and 4B arrayed along the other end part and facing the electrode parts 4A and 4A are formed on each of both sides of the board 1.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、チップ抵抗器、チップコンデンサ等のチップ電子部品に関するものである。 TECHNICAL FIELD The present invention relates to a chip resistor, it relates to a chip electronic components such as chip capacitors.

【0002】 [0002]

【従来の技術】一般にチップ電子部品は、絶縁性材料からなる基板に印刷技術とメッキ技術を用いて複数の電極部を形成し、これら電極部に電気的に接続して抵抗体や誘電体等の電気素子体を基板上に形成して構成する。 BACKGROUND ART Generally, the chip electronic component, using a printing technology and plating technology on a substrate made of an insulating material to form a plurality of electrode portions, the resistor or the dielectric and the like electrically connected to these electrode portions an electric element assembly constructed by forming on a substrate. 例えば、多連状チップ抵抗器からなるチップ電子部品は、 For example, the chip electronic component comprising a multiple-shaped chip resistor,
基板の一方の端部表面に該端部表面に沿って間隔をあけて複数の電極部を形成し、これら複数の電極部とそれぞれ対向するように基板の他方の端部表面に複数の電極部を形成する。 On one end surface of the substrate along the end portion surface at intervals to form a plurality of electrode portions, a plurality of electrode portions to the other end surface of the substrate so as to face each of the plurality of electrode portions to form. そして、対向する一対の電極部間に跨がって抵抗体をそれぞれ形成して製造する。 Then, to manufacture by forming each resistor straddling between a pair of electrode portions face each other. このような多連状チップ抵抗器は、各電極部を回路基板の所定位置にそれぞれ半田付けして回路基板に取り付けられる。 Such multiple-shaped chip resistor is mounted on a circuit board by soldering, respectively each electrode portion at a predetermined position of the circuit board. しかしながら、このようにして半田付けを行うと、多連状チップ抵抗器の隣接する電極部にそれぞれ用いた半田が誤って相互に接触して短絡が生じるおそれがある。 However, when the thus soldering, there is a possibility that the multiple-shaped chip resistor short circuit in contact with each other solder accidentally using respectively adjacent electrode portions may occur. そこで、 there,
従来では、隣接する電極部の間において基板の厚み方向に延びる溝を基板側部に設けていた。 Conventionally, it has been provided a groove extending in the thickness direction of the substrate to the substrate side between the adjacent electrode unit. このような溝を設けると、隣接する電極部間の沿面距離が延びて、隣接する電極部にそれぞれ用いた半田の相互の接触を防ぐことができる。 The provision of such grooves, extending creeping distance between adjacent electrode portions, it is possible to prevent contact of solder was used as the electrode portions adjacent one another.

【0003】 [0003]

【発明が解決しようとする課題】しかしながら、このように基板の厚み方向に延びる溝を基板側部に設けるには手間がかかり、チップ電子部品の製造が繁雑になるという問題があった。 [SUMMARY OF THE INVENTION However, in this way to a groove extending in the thickness direction of the substrate provided on the substrate side takes time, there is a problem that the manufacture of the chip electronic component becomes complicated.

【0004】本発明の目的は、隣接する電極部にそれぞれ用いた半田の相互の接触を防ぐことができ、しかも簡単に製造できるチップ電子部品を提供することにある。 An object of the present invention is to provide a can prevent contact of solder was used as the electrode portions adjacent one another, yet the chip electronic component that can be easily manufactured.

【0005】本発明の他の目的は、隣接する電極部を形成する際にそれぞれ用いるメッキの相互の接触を防ぐことができるチップ電子部品を提供することにある。 Another object of the present invention is to provide a chip electronic component that can prevent mutual contact of the plating respectively used in forming the adjacent electrode unit.

【0006】 [0006]

【課題を解決するための手段】本発明は、絶縁性材料からなる基板に印刷技術とメッキ技術を用いて電極部が形成され、電極部に電気的に接続される抵抗体や誘電体等の電気素子体が基板の少なくとも一方の面に形成されているチップ電子部品を改良の対象とする。 The present invention SUMMARY OF], the electrode portion is formed by using a printing technology and plating technology on a substrate made of an insulating material, the resistor is electrically connected to the electrode and the dielectric or the like electric element body is an object of improving the chip electronic component is formed on at least one surface of the substrate. 本発明では、 In the present invention,
基板の表面部分には間に電気素子体が存在せず且つ近接して配置される2つの電極部の間を通って基板の表面部分を完全に横切る1本以上の溝部を形成する。 It passes between the two electrode portions electric element body is disposed in close proximity and absent forming the groove than one crossing completely the surface portion of the substrate between the surface portion of the substrate. 本発明のように溝部を形成すると、隣接する電極部間の沿面距離を延ばすことができる。 When forming the groove as in the present invention, it is possible to extend the creepage distance between adjacent electrode portions. そのため、電極部を回路基板に半田付けする際またはメッキされた電極部を形成する際に隣接する電極部にそれぞれ用いた半田またはメッキが相互に接触するのを防ぐことができる。 Therefore, solder or plating using the respective electrode portions adjacent in forming or plated electrode portion when soldering the electrode portions on the circuit board can be prevented from contacting each other. 特に本発明では、基板の表面部分を完全に横切るように溝部を形成するので、隣接する電極部間の沿面距離を延ばす溝部を簡単に形成することができる。 In particular, in this invention, because it forms a groove across the complete surface portion of the substrate, it is possible to easily form a groove extending the creepage distance between adjacent electrode portions.

【0007】メッキされた電極部を形成する具体的な例のチップ電子部品は、セラミックス等の絶縁性材料からなる基板と、基板の表面の両端に導電性ペーストを用いて形成された一対の表面電極と、基板の裏面に一対の表面電極と対向するように導電性ペーストを用いて形成された一対の裏面電極と、基板を間にして対向する表面電極と裏面電極とに跨がってそれぞれ導電性ペーストを用いて形成された一対の端面電極と、一対の表面電極間に跨がるように形成された抵抗体や誘電体等の電気素子体と、絶縁性ペースト材料を用いて形成されて電気素子体を覆うオーバコートと、表面電極,裏面電極及び端面電極を覆う少なくとも1層以上のメッキ層とを具備している。 [0007] Plated specific examples chip electronic components forming the electrode portion includes a substrate made of an insulating material such as ceramics, a pair of surfaces which are formed by using a conductive paste to both ends of the surface of the substrate each electrode and a pair of back surface electrode formed using the conductive paste so as to face the pair of surface electrodes on the back surface of the substrate, straddling the surface electrode and the back electrode opposing to between the substrate a pair of end-face electrodes which are formed by using a conductive paste, and the electrical elements of the resistor or the dielectric or the like formed so as to extend over between a pair of surface electrodes are formed by using the insulating paste material It is provided with an overcoat to cover the electrical element body surface electrodes, and at least one layer of plating layer covering the back electrode and the end surface electrodes Te. そして、基板の裏面部には一対の裏面電極間を通って裏面部を完全に横切る1本以上の溝部を形成する。 Then, the back surface of the substrate to form one or more grooves across the full back surface portion through a pair of back electrode. このようにチップ電子部品を構成すれば、溝部により、一方の裏面電極と他方の裏面電極との間の沿面距離を延ばすことができる。 Thus if constituting the chip electronic component, the groove can extend the creepage distance between one of the back electrode and the other of the back electrode. そのため、一方の裏面電極を覆うメッキ層を形成するメッキと、他方の裏面電極を覆うメッキ層を形成するメッキとが相互に接触するのを防ぐことができる。 Therefore, the plating to form a plating layer which covers one of the back electrode, and plating to form a plating layer which covers the other of the back electrode can be prevented from contacting each other.

【0008】このような溝部は2本以上形成し、隣接する2本の溝部の間に位置する基板の裏面部の上には絶縁ペースト材料からなる絶縁層を形成するのが好ましい。 [0008] Such grooves form two or more, on the back surface of the substrate located between the grooves of two adjacent is preferable to form an insulating layer made of an insulating paste material.
このようにすれば、一方の裏面電極と他方の裏面電極との間の沿面距離を更に延ばすことができる。 In this way, it is possible to further extend the creeping distance between one of the back electrode and the other of the back electrode.

【0009】電極部を回路基板に半田付けする具体的な例の多連状チップ電子部品は、セラミックス等の絶縁性材料からなる基板の一方の端部表面に該端部表面に沿って間隔をあけて複数の電極部が印刷技術とメッキ技術を用いて形成され、基板の他方の端部表面には一方の端部表面に形成された複数の電極部とそれぞれ対向するように複数の電極部が印刷技術とメッキ技術を用いて形成され、基板の表面には対向する一対の電極部間に跨がって抵抗体や誘電体等の電気素子体がそれぞれ形成されているものがある。 [0009] multiple-shaped chip electronic components specific example soldering the electrode portions on the circuit board, the distance along the said end surface on one end surface of the substrate made of an insulating material such as ceramics drilled portion a plurality of electrodes are formed by using a printing technology and plating technology, a plurality of electrode portions as the other end surface of the substrate facing each plurality of electrode parts formed on one end surface there is formed using a printing technology and plating technology, the surface of the substrate there is an electric element assembly such as a resistor or a dielectric straddling between a pair of electrode portions opposed are formed. そして、基板の表面部分には一方の端部に沿って並ぶ複数の電極部の隣接する2つの電極部間と他方の端部に沿って並び2つの電極部と対向する2つの電極部間をそれぞれ延びて表面部分を横切る溝部を形成する。 Then, between two electrode portions facing the arrangement of two electrode portions along the two electrode portions between the other adjacent ends of the plurality of electrode portions on the surface portion of the substrate arranged along the one end forming a groove across the surface portions extending respectively. このように多連状チップ電子部品を構成すれば、 By configuring in this way the multiple-shaped chip electronic component,
溝部により、一方の端部または他方の端部において隣接している2つの電極部の間の沿面距離を延ばすことができる。 Groove, it is possible to extend the creepage distance between the two electrode portions are adjacent at one end or the other end. そのため、電極部を回路基板の所定位置にそれぞれ半田付けして多連状チップ電子部品を回路基板に取り付ける際に、隣接する電極部にそれぞれ用いた半田が誤って相互に接触するのを防ぐことができる。 Therefore, when mounting and respectively soldered to the electrode section in a predetermined position of the circuit board a multiple-shaped chip electronic component on a circuit board, to prevent from contacting with each other accidentally solder was used as the electrode portions adjacent can. また、隣接している2つの電極部間のマイグレーションを防止することができる。 Further, it is possible to prevent migration between the two electrode portions that are adjacent. 特に基板の表面部分を横切るように溝部を形成するので、簡単に隣接する電極部間の沿面距離を延ばすことができる。 In particular, since forming the groove so as to cross the surface portion of the substrate, it can be extended easily creepage distance between adjacent electrode portions. 例えば、大型の基板材料を用いて多数個取りにより、多連状チップ電子部品を製造する場合には、基板分割用スリットと同時に沿面距離を延ばす溝部を形成できる利点がある。 For example, the multi-cavity using a large substrate materials, in the production of multiple-shaped chip electronic components, can be advantageously forming the groove to extend the creeping distance at the same time as the substrate dividing slit.

【0010】また、多連状チップ電子部品としては、基板の表面に導電性ペーストを用いて形成された表面電極と、基板の裏面に導電性ペーストを用いて形成された裏面電極と、基板を間にして対向する表面電極と裏面電極とに跨がって形成された端面電極とから電極部が構成され、基板の側部に形成され基板の厚み方向に延びる凹部上を延びるように端面電極が形成されているものがある。 Further, as the multiple-shaped chip electronic component, and a surface electrode formed using the conductive paste on the surface of the substrate, the back surface electrode formed using the conductive paste on the back surface of the substrate, the substrate electrode portion is composed to an opposing surface electrode and the back electrode and the formed straddling the end surface electrode in between the edge electrode to extend over the recess extending in the thickness direction of the substrate is formed on the side of the substrate there is what is formed. この種の多連状チップ電子部品では、電極部の電気素子体に近い領域まで半田が付着し、隣接している2つの電極部にそれぞれ用いた半田が誤って相互に接触する可能性が高くなる。 The multiple-shaped chip electronic component of this type, the solder adheres to a region close to the electric element of the electrode portions, it is likely to contact with each other accidentally solder used respectively to the two electrode portions adjacent Become. また、隣接している2つの電極部間のマイグレーションも発生しやすくなる。 It also tends to occur migration between the two electrode portions that are adjacent. そのため、本発明の効果が高くなる。 Therefore, the effect of the present invention is high.

【0011】 [0011]

【発明の実施の形態】以下、図面を参照して多連状チップ抵抗体に適用した本発明のチップ電子部品の実施の形態を詳細に説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, detailed description of the embodiments of the chip electronic component of the present invention applied with reference to the accompanying drawings in multiple-shaped chip resistor. 図1は、本実施の形態の多連状チップ抵抗体の概略平面図であり、図2は、図1のII−II Figure 1 is a schematic plan view of a multiple-shaped chip resistor of the embodiment, FIG. 2, in FIG. 1 II-II
線で切断した概略部分断面図である。 It is a schematic partial cross-sectional view taken along line. 両図に示すように、本実施の形態の多連状チップ抵抗体は、セラミックス等の絶縁性材料からなる基板1に複数(4つ)の抵抗体構成部2…が形成されて構成されている。 As shown in the figures, multiple-shaped chip resistor of the present embodiment, the resistance-constituting part of a plurality (four) of the substrate 1 made of an insulating material such as ceramics 2 ... it is constituted formed there. 抵抗体構成部2は、図1の最下部の抵抗体構成部2に示すように、 Resistor component 2, as shown in resistor components 2 lowermost in Figure 1,
抵抗体3と、この抵抗体3に電気的に接続され且つ基板1の両端部にそれぞれ形成された接続用電極体4A,4 And the resistor 3, the resistor 3 in electrically connected and at both ends of the substrate 1 formed connecting electrode body 4A, 4
Bとを有している。 And a B. 接続用電極体4A,4Bはいずれも同じ構造を有しているので、図面左側の接続用電極体4 Connection electrode body 4A, since they have the same structure both. 4B, left side in the drawing of the connection electrode body 4
Aを参照して接続用電極体4A,4Bの構造を説明する。 Connection electrode body 4A with reference to A, the structure of 4B will be described. 接続用電極体4Aは、基板1の端部の表面上に形成された表面電極5aと、基板1の端部の裏面上に形成された裏面電極5bと、端面電極5cと、これら表面電極5a,裏面電極5b及び端面電極5cを覆うメッキ層6 Connection electrode body 4A includes a surface electrode 5a formed on the surface of the end portion of the substrate 1, and the back electrode 5b formed on the back surface of the end portion of the substrate 1, the edge electrode 5c, these surface electrodes 5a plating layer 6 covering the back electrode 5b and the end surface electrode 5c
とを有している。 And it has a door. 端面電極5cは、基板1の側部に形成された基板1の厚み方向に延びる断面が半円状の凹部1 End electrode 5c, the recess 1 in the thickness direction extending cross-section semicircular substrate 1 formed on the side of the substrate 1
a上を延びて表面電極5aと裏面電極5bとに跨がるように形成されている。 It is formed so as to extend over the surface electrode 5a and the back electrode 5b extend over a. 表面電極5a,裏面電極5bは、 Surface electrodes 5a, the back electrode 5b is
熱硬化性樹脂中に銀粉末を含有する樹脂銀からなる導電性ペーストを印刷して焼成することによって形成されている。 It is formed by firing printed conductive paste made of a resin containing silver silver powder in a thermosetting resin. 端面電極5cはメッキ等により形成されている。 End electrode 5c is formed by plating or the like.
メッキ層6は、NiメッキまたはNi・Crメッキからなる厚み4〜5μmの下部メッキ層6aと、該下部メッキ層6a上に形成された半田濡れ性のよいCuメッキ, Plating layer 6, Ni plating or Ni · Cr and the lower plating layer 6a having a thickness 4~5μm consisting plating, solder wettability good Cu plating formed on the lower plating layer 6a,
AgメッキまたはAuメッキからなる厚み4〜5μmの上部メッキ層6bとから形成されている。 It is formed from an upper plated layer 6b having a thickness 4~5μm made of Ag plating or Au plating.

【0012】このように多連状チップ抵抗体では、基板1の一方の端部表面には、該端部表面に沿って間隔をあけて複数の電極部4A…が形成され,他方の該端部表面には、電極部4A…とそれぞれ対向するように複数の電極部4B…が形成されることになる。 [0012] In this way, multiple-shaped chip resistor, the one end surface of the substrate 1, at intervals along the end portion surface a plurality of electrode portions 4A ... is formed, the other of the end the part surface, a plurality of electrode portions 4B ... are formed so that the electrode portion 4A ... respectively opposed. そして抵抗体3 And resistor 3
は、抵抗体基板の表面に対向する一対の電極部4A,4 A pair of electrode portions 4A which face the surface of the resistor substrate, 4
Bのそれぞれの表面電極5a,5a間に跨がって形成されている。 Each of the surface electrodes 5a of the B, and is formed to bridge between 5a. 抵抗体3は、酸化ルテニウムを含有するペーストが印刷されて形成されており、トリミングを容易にするためのガラスコートと、該ガラスコートを覆う保護用のレジンコートとからなるオーバコート7で覆われている。 Resistor 3 is formed by printing paste containing a ruthenium oxide, is covered with an overcoat 7 made of a glass coat to facilitate trimming, the resin-coated for protection covering the glass coat ing.

【0013】基板1の表面部分には、一方の端部に沿って並ぶ複数の電極部4A…の隣接する2つの電極部4 [0013] On the surface portion of the substrate 1, a plurality of electrode portions 4A ... adjacent two electrode portions 4 of which line the one end
A,4A間と、他方の端部に沿って並び電極部4A,4 A, 4A and between, along the other end portion arrangement the electrode portion 4A, 4
Aと対向する2つの電極部4B,4B間とをそれぞれ延びて表面部分を横切る溝部8…が基板1の両面にそれぞれ3本ずつ形成されている。 A facing the two electrode portions 4B, the groove portion 8 across the surface portions extending respectively and inter 4B ... are formed by three respectively on both sides of the substrate 1. 溝部8は、断面がV字の形状を有している。 Groove 8 in cross section has the shape of a V-shape. 断面の具体的な寸法は、基板1の表面上の開口部の辺の長さl1 が0.1mmで、V字を形成する二辺の長さl2 ,l2 がそれぞれ0.3mmである。 Specific dimensions of the cross section, the length l1 is 0.1mm sides of the opening on the surface of the substrate 1, the length of the two sides forming the V-l2, l2 is 0.3mm, respectively.

【0014】本例では、溝部8により隣接している2つの電極部4A,4A間または4B,4B間の沿面距離を0.5mm(2×l2 −l1 )だけ延ばすことができる。 [0014] In this example, it is possible to extend the two electrode portions 4A which are adjacent the groove 8, 4A or between 4B, the creepage distance between 4B only 0.5mm (2 × l2 -l1). そのため、電極部4A…,4B…を回路基板の所定位置にそれぞれ半田付けして多連状チップ抵抗体を回路基板に取り付ける際に、隣接する電極部4A,4A間または4B,4B間にそれぞれ用いた半田が誤って相互に接触するのを防ぐことができる。 Therefore, the electrode portion 4A ..., 4B ... respectively soldered to multiple-shaped chip resistor when mounting the circuit board at a predetermined position of the circuit board, adjacent electrode portions 4A, 4A or between 4B, between 4B respectively solder used can be prevented from contacting with each other accidentally. 特に本例では、基板1 In particular, in this embodiment, the substrate 1
の側部に形成された基板1の厚み方向に延びる凹部1a Recess 1a extending in the thickness direction of the substrate 1 which is formed in the side
上を延びるように端面電極5cが形成されているので、 Since edge electrode 5c is formed so as to extend upward,
多連状チップ抵抗体を回路基板に取り付ける際に電極部4A,4Bの抵抗体3に近い領域まで半田が付着する。 Electrode portion 4A when mounting a multiple-shaped chip resistor on a circuit board, a solder to a region close to the resistor 3 and 4B are attached.
そのため、半田が誤って相互に接触する可能性が高くなる。 Therefore, the possibility of contact with each other incorrectly solder becomes higher. また、隣接している2つの電極部間のマイグレーションも発生しやすくなる。 It also tends to occur migration between the two electrode portions that are adjacent. そのため、溝部8による効果は高くなる。 For this reason, the effect is increased by the groove 8. また、基板1の表面部分を横切るように溝部8は形成されているので、簡単に隣接する電極部4 Further, since the groove portion 8 across the surface portion of the substrate 1 is formed, the electrode portions adjacent easily 4
A,4A間または4B,4B間の沿面距離を延ばすことができる。 It can be extended A, 4A or between 4B, the creepage distance between 4B. 例えば、大型の基板材料を用いて多数個取りにより、多連状チップ抵抗器を製造する場合には、基板分割用スリットと同時に沿面距離を延ばす溝部8…を形成できる利点がある。 For example, the multi-cavity using a large substrate materials, in the production of multiple-like chip resistors, there is an advantage that can form a groove 8 ... to extend the time creeping distance between the substrate dividing slit.

【0015】図3は、チップ抵抗体に適用した本発明の他の実施の形態のチップ電子部品の概略断面図である。 [0015] Figure 3 is a schematic cross-sectional view of the chip electronic component according to another embodiment of the present invention applied to a chip resistor.
本図に示すように、本実施の形態のチップ抵抗体は、セラミックス等の絶縁性材料からなる基板11と、基板1 As shown in the figure, the chip resistor of the present embodiment includes a substrate 11 made of an insulating material such as ceramics, the substrate 1
1の表面の両端に導電性ペーストを用いて形成された一対の表面電極15a,15aと、基板11の裏面に一対の表面電極15a,15aと対向するように導電性ペーストを用いて形成された一対の裏面電極15b,15b A pair of surface electrodes 15a formed by using a conductive paste to both ends of the first surface, and 15a, which is formed by using a pair of surface electrodes 15a on the rear surface of the substrate 11, a conductive paste to 15a facing a pair of back electrode 15b, 15b
と、基板11を間にして対向する表面電極15aと裏面電極15bとに跨がってそれぞれ導電性ペーストを用いて形成された一対の端面電極15c,15cと、一対の表面電極15a,15a間に跨がるように形成された抵抗体12と、絶縁性ペースト材料を用いて形成され、ガラスコートとレジンコートとからなり抵抗体12を覆うオーバコート17と、表面電極15a、裏面電極15b When the pair of end surface electrodes 15c formed respectively using a conductive paste straddling the surface electrode 15a and the back electrode 15b facing to between the substrate 11, 15c, a pair of surface electrodes 15a, between 15a to the resistor 12 formed astride, is formed using an insulating paste material, the overcoat 17 covering the resistor 12 consists of a glass coating and the resin coating, the surface electrodes 15a, the back electrode 15b
及び端面電極15cを覆う2層のメッキ層16,16を具備している。 And it is provided with a plated layer 16, 16 of the two-layer covering the end surface electrodes 15c. そして、基板11の裏面部には一対の裏面電極15b,15b間を通って裏面部を完全に横切る3本の溝部18A〜18Cが形成されている。 Then, the back surface of the substrate 11 are formed three grooves 18A~18C crossing completely back surface through a pair of back electrode 15b, 15b. 溝部18 The groove 18
A〜18Cは、図1及び図2に示す多連状チップ抵抗体と同様に断面がV字の形状を有している。 A~18C similarly cross the multiple-shaped chip resistor shown in FIGS. 1 and 2 has a V-shape. そして、隣接する溝部18A,18B間及び18B,18C間に位置する基板11の裏面部の上には絶縁層19,19が形成されている。 Then, the adjacent grooves 18A, 18B and between 18B, on top of the bottom of the substrate 11 located between 18C are formed insulating layers 19, 19. 絶縁層19は、グレーズ系ポリイミド樹脂からなる絶縁ペースト材料により形成されており、チップ抵抗体を回路基板に取り付けられるように裏面電極1 Insulating layer 19, glaze made of a polyimide resin is formed by an insulating paste material, the back electrode 1 to be attached to the chip resistor on a circuit board
5bとほぼ等しい厚みを有している。 It has substantially the same thickness as 5b. 本実施の形態によれば、溝部18A〜18C及び絶縁層19,19により、一方の裏面電極15bと他方の裏面電極15bとの間の沿面距離を延ばすことができる。 According to this embodiment, the groove 18A~18C and the insulating layer 19, it is possible to extend the creepage distance between one of the back electrode 15b and the other of the back electrode 15b. そのため、一方の裏面電極15bを覆うメッキ層16を形成するメッキと、他方の裏面電極15bを覆うメッキ層16を形成するメッキとが相互に接触するのを防ぐことができる。 Therefore, the plating to form a plating layer 16 covering the one of the back electrode 15b, and a plating to form a plating layer 16 covering the other of the back electrode 15b can be prevented from contacting each other.

【0016】 [0016]

【発明の効果】本発明によれば、隣接する電極部間の沿面距離を延ばすことができる。 According to the present invention, it is possible to extend the creepage distance between adjacent electrode portions. そのため、電極部を回路基板に半田付けする際またはメッキされた電極部を形成する際に隣接する電極部にそれぞれ用いた半田またはメッキが相互に接触するのを防ぐことができる。 Therefore, solder or plating using the respective electrode portions adjacent in forming or plated electrode portion when soldering the electrode portions on the circuit board can be prevented from contacting each other. 特に本発明では、基板の表面部分を完全に横切るように溝部を形成するので、隣接する電極部間の沿面距離を延ばす溝部を簡単に形成することができる。 In particular, in this invention, because it forms a groove across the complete surface portion of the substrate, it is possible to easily form a groove extending the creepage distance between adjacent electrode portions.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本実施の形態の多連状チップ抵抗体の概略平面図である。 1 is a schematic plan view of a multiple-shaped chip resistor of the present embodiment.

【図2】 本実施の形態の多連状チップ抵抗体の概略部分断面図である。 2 is a schematic partial cross-sectional view of the multiple-shaped chip resistor of the present embodiment.

【図3】 本発明の他の実施の形態のチップ電子部品の概略断面図である。 3 is a schematic cross-sectional view of the chip electronic component according to another embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

1,11 基板 2 抵抗体構成部 3,12 抵抗体 4A,4B 接続用電極体 5a,15a 表面電極 5b,15b 裏面電極 5c,15c 端面電極 6,16 メッキ層 7,17 オーバコート 8…,18A〜18C 溝部 19 絶縁層 1,11 substrate 2 resistor component 3,12 resistor 4A, 4B connection electrode body 5a, 15a surface electrode 5b, 15b back electrode 5c, 15c end surface electrode 6 and 16 plating layer 7, 17 overcoat 8 ..., 18A ~18C groove 19 insulating layer

Claims (5)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 絶縁性材料からなる基板に印刷技術とメッキ技術を用いて電極部が形成され、前記電極部に電気的に接続される抵抗体や誘電体等の電気素子体が前記基板の少なくとも一方の面に形成されているチップ電子部品であって、 前記基板の表面部分には間に前記電気素子体が存在せず且つ近接して配置される2つの前記電極部の間を通って前記基板の前記表面部分を完全に横切る1本以上の溝部が形成されていることを特徴とするチップ電子部品。 1. A electrode portions using printing technology and plating technology on a substrate made of an insulating material is formed, an electric element assembly such as a resistor or a dielectric that is electrically connected to the electrode portion of the substrate a chip electronic components formed on at least one side, passes between two of the electrode portion to which the electric element body is arranged close and absent between the surface portion of the substrate chip electronic component, characterized in that one or more grooves across the surface portion fully, the substrate is formed.
  2. 【請求項2】 セラミックス等の絶縁性材料からなる基板と、 前記基板の表面の両端に導電性ペーストを用いて形成された一対の表面電極と、前記基板の裏面に前記一対の表面電極と対向するように導電性ペーストを用いて形成された一対の裏面電極と、 前記基板を間にして対向する前記表面電極と前記裏面電極とに跨がってそれぞれ導電性ペーストを用いて形成された一対の端面電極と、 前記一対の表面電極間に跨がるように形成された抵抗体や誘電体等の電気素子体と、 絶縁性ペースト材料を用いて形成されて前記電気素子体を覆うオーバコートと、 前記表面電極、前記裏面電極及び前記端面電極を覆う少なくとも1層以上のメッキ層とからなるチップ電子部品であって、 前記基板の裏面部には前記一対の裏面電極間を通って前記裏面 Wherein a substrate made of an insulating material such as ceramics, and a pair of surface electrodes formed using a conductive paste to both ends of the surface of said substrate, said pair of surface electrodes and facing the back surface of the substrate a pair of back surface electrode formed using the conductive paste to, formed by using the respective conductive paste straddling and the surface electrode facing to between the substrate and the back surface electrode pair overcoat covering the end surface electrodes, and the electrical elements of the resistor or the dielectric or the like formed so as to extend over between said pair of surface electrodes, said electric element assembly is formed using an insulating paste material When the surface electrodes, wherein a back electrode and the chip electronic component comprising at least one or more layers of plating layer covering the end surface electrode, the back surface portion of the substrate the back through between the pair of back electrode 部を完全に横切る1本以上の溝部が形成されていることを特徴とするチップ電子部品。 Chip electronic component, characterized in that one or more grooves crossing completely part is formed.
  3. 【請求項3】 前記1本以上の溝部は2本以上形成され隣接する2本の溝部の間に位置する前記基板の裏面部の上には絶縁ペースト材料からなる絶縁層が形成されている請求項2に記載のチップ電子部品。 3. claims on the back surface of the substrate wherein one or more grooves located between the grooves of two adjacent formed two or more is formed an insulating layer made of an insulating paste material chip electronic component according to claim 2.
  4. 【請求項4】 セラミックス等の絶縁性材料からなる基板の一方の端部表面に該端部表面に沿って間隔をあけて複数の電極部が印刷技術とメッキ技術を用いて形成され、前記基板の他方の端部表面には前記一方の端部表面に形成された前記複数の電極部とそれぞれ対向するように複数の電極部が印刷技術とメッキ技術を用いて形成され、前記基板の表面には対向する一対の前記電極部間に跨がって抵抗体や誘電体等の電気素子体がそれぞれ形成されている多連状のチップ電子部品であって、 前記基板の表面部分には前記一方の端部に沿って並ぶ前記複数の電極部の隣接する2つの電極部間と前記他方の端部に沿って並び前記2つの電極部と対向する2つの電極部間をそれぞれ延びて前記表面部分を横切る溝部が形成されていることを特徴とす 4. A plurality of electrode portions at intervals on one end surface of the substrate made of an insulating material along the end portion surface such as ceramics is formed by using a printing technology and plating technology, the substrate of the other end surface formed with a portion plurality of electrodes printing technology and plating technology so as to face respectively the plurality of electrode parts formed on the end surface of the one, the surface of the substrate is a multiple-shaped chip electronic component electric element assembly such as a resistor or a dielectric are formed straddling between a pair of the electrode portions opposed, the one on the surface portion of the substrate said plurality of said surface portions adjacent two between electrode portions and the other along the end portion arrangement the two electrode portion and the two opposed electrode portion between the extending respective electrode portions arranged along the edge It is characterized in that the grooves across the is formed チップ電子部品。 Chip electronic components.
  5. 【請求項5】 前記電極部は、前記基板の表面に導電性ペーストを用いて形成された表面電極と、前記基板の裏面に導電性ペーストを用いて形成された裏面電極と、前記基板を間にして対向する前記表面電極と前記裏面電極とに跨がって形成された端面電極とからなり、 前記端面電極は、前記基板の側部に形成され基板の厚み方向に延びる凹部上を延びるように形成されていることを特徴とする請求項4に記載のチップ電子部品。 Wherein said electrode portion between the surface electrode formed using the conductive paste on the surface of the substrate, and a back surface electrode formed using the conductive paste on the back surface of the substrate, the substrate a manner consist with the opposing said surface electrode and the back electrode and the formed straddling the end surface electrode, the end face electrode is formed on a side of the substrate so as to extend over the recess extending in the thickness direction of the substrate chip electronic component according to claim 4, characterized in that it is formed.
JP9302707A 1997-11-05 1997-11-05 Chip electronic component Withdrawn JPH11144904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9302707A JPH11144904A (en) 1997-11-05 1997-11-05 Chip electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9302707A JPH11144904A (en) 1997-11-05 1997-11-05 Chip electronic component

Publications (1)

Publication Number Publication Date
JPH11144904A true JPH11144904A (en) 1999-05-28

Family

ID=17912227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9302707A Withdrawn JPH11144904A (en) 1997-11-05 1997-11-05 Chip electronic component

Country Status (1)

Country Link
JP (1) JPH11144904A (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and capacitor
JP2002100873A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100872A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100876A (en) * 2000-07-21 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100874A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100870A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100871A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118366A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118365A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118367A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002271033A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271029A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271030A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271032A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271031A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002270991A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271034A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
US7855894B2 (en) 1999-09-02 2010-12-21 Ibiden Co., Ltd. Printed circuit board
US7864542B2 (en) 1999-09-02 2011-01-04 Ibiden Co., Ltd. Printed circuit board
JP2012099861A (en) * 1999-09-02 2012-05-24 Ibiden Co Ltd Printed wiring board
WO2018123422A1 (en) * 2016-03-15 2018-07-05 ローム株式会社 Chip resistor and method of producing same

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099861A (en) * 1999-09-02 2012-05-24 Ibiden Co Ltd Printed wiring board
JP2002100873A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100872A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
US9060446B2 (en) 1999-09-02 2015-06-16 Ibiden Co., Ltd. Printed circuit board
JP2002100874A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100870A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002100871A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118366A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118365A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002118367A (en) * 1999-09-02 2002-04-19 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
US8842440B2 (en) 1999-09-02 2014-09-23 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
US8830691B2 (en) 1999-09-02 2014-09-09 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
US8780573B2 (en) 1999-09-02 2014-07-15 Ibiden Co., Ltd. Printed circuit board
US8763241B2 (en) 1999-09-02 2014-07-01 Ibiden Co., Ltd. Method of manufacturing printed wiring board
US8717772B2 (en) 1999-09-02 2014-05-06 Ibiden Co., Ltd. Printed circuit board
US8331102B2 (en) 1999-09-02 2012-12-11 Ibiden Co., Ltd. Printed circuit board
JP2012114457A (en) * 1999-09-02 2012-06-14 Ibiden Co Ltd Printed wiring board
JP4554790B2 (en) * 1999-09-02 2010-09-29 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
JP4554789B2 (en) * 1999-09-02 2010-09-29 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
US7855894B2 (en) 1999-09-02 2010-12-21 Ibiden Co., Ltd. Printed circuit board
US7864542B2 (en) 1999-09-02 2011-01-04 Ibiden Co., Ltd. Printed circuit board
US7881069B2 (en) 1999-09-02 2011-02-01 Ibiden Co., Ltd. Printed circuit board
JP4646371B2 (en) * 1999-09-02 2011-03-09 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
JP4646370B2 (en) * 1999-09-02 2011-03-09 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
US7978478B2 (en) 1999-09-02 2011-07-12 Ibiden Co., Ltd. Printed circuit board
JP4726285B2 (en) * 1999-09-02 2011-07-20 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
US7995352B2 (en) 1999-09-02 2011-08-09 Ibiden Co., Ltd. Printed circuit board
US8107253B2 (en) 1999-09-02 2012-01-31 Ibiden Co., Ltd. Printed circuit board
US8116091B2 (en) 1999-09-02 2012-02-14 Ibiden Co., Ltd. Printed circuit board
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and capacitor
JP2002100876A (en) * 2000-07-21 2002-04-05 Ibiden Co Ltd Printed wiring board and manufacturing method thereof
JP2002271034A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271031A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271032A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271030A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271029A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002271033A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
JP2002270991A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
WO2018123422A1 (en) * 2016-03-15 2018-07-05 ローム株式会社 Chip resistor and method of producing same

Similar Documents

Publication Publication Date Title
JP4996036B2 (en) Plating terminal
JP3176307B2 (en) Mounting structure and a manufacturing method thereof of an integrated circuit device
KR0175431B1 (en) Device for supporting magnetic head slider and magnetic head apparatus
JP2004342969A (en) Connection structure of electronic circuit, and method of connecting the same
KR0168466B1 (en) Thin film surface mount fuses
KR930010076B1 (en) Multilayer hybrid integrated circuit
KR100498876B1 (en) A chip-type resistor network and a method of manufacturing the same
US6040755A (en) Chip thermistors and methods of making same
US7782173B2 (en) Chip resistor
US4684916A (en) Chip resistor
JPH07282714A (en) Circuit protective device
US7495884B2 (en) Multilayer capacitor
WO2004023498A1 (en) Flip chip resistor and its manufacturing method
CN1930641A (en) Chip resistor and its manufacturing method
JP3297269B2 (en) Mounting structure of a positive characteristics thermistor
EP1255256B1 (en) Resistor and method for fabricating the same
WO1999001876A1 (en) Resistor and method of producing the same
US5170146A (en) Leadless resistor
KR20070114051A (en) Printed wiring board, method for forming the printed wiring board, and board interconnection structure
EP0508615B1 (en) Film-type resistor
WO2004093101A1 (en) Chip resistor and method for manufacturing same
KR100258677B1 (en) Thermistor elements
JP2007088161A (en) Chip resistor
US5757076A (en) Chip type electronic component
JPH08264842A (en) Side surface light emitting device

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20050201