JP2883427B2 - Manufacturing method of circuit board with micro probe - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a circuit board having a small probe represented by a probe card.

[Prior Art] Conventionally, a circuit board having a micro probe typified by a probe card has conventionally used an insulating or semiconductor substrate provided with an electric circuit pattern and a plurality of conductive metals serving as micro probes separately. After being manufactured as a member, the conductive metal is fixed to a predetermined position on the substrate by hand so that the microtips have a predetermined arrangement, and the conductive metal and the electric circuit pattern are electrically connected. It is manufactured by connecting.

In a circuit board having such a minute probe, when a substrate to be inspected (such as an IC chip) is inspected, a foreign matter enters between the substrate to be inspected and the circuit board, so that the minute probe and the substrate to be inspected become inconsistent. In order to prevent the occurrence of poor contact, the micro probe is projected from the substrate surface by a desired length so that a predetermined gap is formed between the substrate to be inspected and the circuit board during use. I have. Further, when inspecting a substrate to be inspected using a circuit board having such a minute probe, for example, one minute probe is used so that a contact failure does not occur between the minute probe and the substrate to be inspected. The load is about 700g.

By the way, in the above-mentioned conventional method of manufacturing a circuit board having a micro probe, the manufacturing process becomes complicated, or it is very difficult to cope with high density (high integration) of a substrate to be inspected. The inventors of the present application have made an attempt to solve these problems with Japanese Patent Application No. Hei.
As disclosed in the specification No. 87, a columnar conductor is provided in a fine hole or microgroove provided in a substrate, and the surface of the substrate on one end surface side of the columnar conductor is removed by etching to form a columnar conductor. Has proposed a method of protruding a part of the conductor to form a micro probe.

[Problems to be Solved by the Invention] However, in the method in which a part of the columnar conductor is projected to form a micro probe by etching away the surface of the substrate on one end surface side of the columnar conductor, When a resin layer is provided on the outer periphery of the columnar conductor, the etchant penetrates between the resin layer and the substrate, and as shown in FIG. A groove 53 having a V-shaped cross section is formed between the resin layer 51 and the substrate 52 provided in the above. Further, even when the resin layer is not provided on the outer periphery of the columnar conductor, if the etchant permeates between the columnar conductor and the substrate, the above-described V-shaped groove is generated.

For this reason, the following problems may still occur in the above-described invention of the present inventor.

That is, it is particularly preferable to use a thin chemically cut photosensitive glass as a substrate for forming a fine through hole for providing a micro probe, but such a thin substrate is used as a substrate, and a columnar conductor is used. By simply etching away the surface portion of the substrate on one end surface side, a portion of the columnar conductor is projected from the substrate surface by a desired length to form a small probe, and the substrate is thin. Since the above-described V-shaped groove is generated by the etching process, a sufficient contact area between the substrate and the resin layer provided on the outer periphery of the columnar conductor or the columnar conductor cannot be secured, The support of the microprobe may be uncertain. If the support of the microprobe is uncertain, the microprobe may be bent, broken, dropped, etc., and it is possible to obtain a circuit board having a microprobe that is excellent in durability and reliability. A problem arises that it is not possible.

Accordingly, an object of the present invention is to further improve the prior invention of the present inventor, and to provide a circuit board having a fine probe in which a fine probe is firmly supported by this substrate even when a thin substrate is used. An object of the present invention is to provide a method for manufacturing a circuit board having a microprobe, which can be obtained.

Means for Solving the Problems The present invention has been made to achieve the above-mentioned object, and a method of manufacturing a circuit board having a microtip according to the present invention includes the steps of: Providing a plurality of fine through-holes, and having, on one surface of the substrate provided with the plurality of fine through-holes, a plurality of fine through-holes respectively corresponding to the plurality of fine through-holes, and the substrate An auxiliary substrate made of a chemically-cuttable photosensitive glass having a higher etching rate than the above, and the plurality of fine through holes provided in the auxiliary substrate and the plurality of fine through holes provided in the substrate communicate with each other in a one-to-one correspondence. Fixing the columnar conductor, providing a columnar conductor in the plurality of communicated fine through holes, and etching and removing the auxiliary substrate after providing the columnar conductor, thereby forming the columnar conductor. body And a step of providing, on the surface of the substrate, an electric circuit pattern that is electrically connected to the columnar conductor.

[Operation] In the method for producing a circuit board having a micro-tip according to the present invention, a plurality of fine through-holes provided in a substrate made of chemically-cuttable photosensitive glass are provided with an etching rate lower than that of the chemically-cuttable photosensitive glass. After providing a columnar conductor in a fine through-hole in which a plurality of fine through-holes provided in an auxiliary substrate made of high chemically-cuttable photosensitive glass communicate with each other in a one-to-one relationship, the auxiliary substrate is etched away. Thereby, one end side of the columnar conductor is projected from the surface of the substrate. That is, in the method of manufacturing a circuit board having a micro probe according to the present invention, one end side of the columnar conductor is projected from the substrate surface without substantially removing the surface of the substrate by etching.

Therefore, according to the method for manufacturing a circuit board having a micro probe of the present invention, even when a thin substrate is used, between the substrate and the resin layer provided on the outer periphery of the columnar conductor or the columnar conductor, The microprobe can be formed while ensuring a sufficient contact area for securely supporting the columnar conductor, that is, the microprobe, and thereby, the microprobe that is firmly held by the substrate can be formed. It is possible to obtain a circuit board having a needle.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

Example As a chemically cut photosensitive glass used as a substrate, 100 × 100
A 0.5 mm LiO ₂ —Al ₂ O ₃ —SiO ₂ (Au, Ce) -based chemically cut photosensitive glass (trade name: PEG3, manufactured by HOYA Corporation) is used. In the process of providing a plurality of fine through holes in a chemically cut photosensitive glass substrate), an exposure process (using an Hg-Xe lamp using a predetermined mask) is performed on the chemically cut photosensitive glass substrate. 20
Second), a development treatment (heat treatment) at about 520 ° C. for 1 hour, an etching treatment (acid treatment) with 5% hydrofluoric acid, and a rinsing treatment with pure water.

By performing these treatments, as shown in FIG. 1 (a), fine through-holes 1 having an opening diameter of 50 μm are formed in a square shape (one side) at an interval of 80 μm near the center of the chemically-cuttable photosensitive glass substrate 2. Is about 9mm in length). At the same time,
At a position 5 mm from the edge of the chemically cuttable photosensitive glass substrate 2, a plurality of terminal forming through-holes 3 having an opening diameter of 500 μm were provided at regular intervals. These terminal forming through-holes 3 correspond one-to-one with the respective fine through-holes 1.

An auxiliary substrate to be fixed to the substrate was obtained in the following manner.

First, as a material for the auxiliary substrate, 20 mm x 20 mm x 30 μm
Using Li ₂ O-Al ₂ O ₃ -SiO ₂ (Au, Ce) -based chemically-cuttable photosensitive glass (trade name: PEG3, manufactured by HOYA Corporation), near the center of the chemically-cuttable photosensitive glass In the same manner as in the case of the chemically-cuttable photosensitive glass substrate 2 described above, fine through-holes having an opening diameter of 50 μm are formed in a square shape at intervals of 80 μm (each side has a length of about 9 m).
m).

Next, an exposure process and a development process (heat treatment) were performed on the entire surface of the chemically cut photosensitive glass after providing the fine through holes under the same conditions as in the case where the fine through holes were provided. By performing these treatments, the etching rate of the chemically-cuttable photosensitive glass by hydrofluoric acid was about 50 times the etching rate of the chemically-cuttable photosensitive glass substrate 2 as a substrate. Hereinafter, this chemically-cuttable photosensitive glass is referred to as a chemically-cuttable photosensitive glass auxiliary substrate.

Next, on one surface of the chemically cuttable photosensitive glass substrate 2, each fine through hole 1 provided in the chemically cuttable photosensitive glass substrate 2 and each fine through hole provided in the chemically cuttable photosensitive glass auxiliary substrate. As a step of allowing the chemical-cuttable photosensitive glass auxiliary substrate to adhere to each other in a one-to-one manner, first, an epoxy resin-based adhesive was applied to a part of one surface of the chemical-cuttable photosensitive glass auxiliary substrate.

Next, as shown in FIG. 1 (b), each fine through-hole 1 provided in the chemically-cuttable photosensitive glass substrate 2 and each fine through-hole 5 provided in the chemically-cuttable photosensitive glass auxiliary substrate 4 are respectively formed. One surface in the thickness direction of the chemically-cuttable photosensitive glass substrate 2 and the surface of the chemically-cuttable photosensitive glass auxiliary substrate 4 coated with an epoxy resin-based adhesive (not shown) are so contacted as to be in one-to-one communication. Then, the chemically cuttable photosensitive glass auxiliary substrate 4 was fixed to one surface of the chemically cuttable photosensitive glass substrate 2 with an epoxy adhesive. Fine through hole 1 at this time
The alignment between the fine through-holes 5 and the marks (not shown) having a predetermined positional relationship with the fine through-holes 1 previously attached to the chemically-cuttable photosensitive glass substrate 2 is performed. This was performed by matching the fine through-holes 5 previously provided on the glass auxiliary substrate 4 with marks (not shown) having a predetermined positional relationship. In addition, the fixed substance of the chemically-cuttable photosensitive glass substrate 2 and the chemically-cuttable photosensitive glass auxiliary substrate 4 after the fine through-holes 1 are provided, hereinafter referred to as a base material 6.

Next, as a step of providing a columnar conductor in the plurality of communicating fine through holes, first, an inner wall of the fine through hole in which the fine through hole 1 and the fine through hole 5 communicate with each other is bonded with an epoxy resin adhesive. Solution obtained by dissolving the agent in IPA (isopropyl alcohol) (by volume, epoxy resin adhesive / IPA = 1 /
After wetting in step 30), the resin is dried and solidified, and as shown in FIG. 1 (c), an epoxy resin layer 7a is applied to the inner wall of the fine through hole in which the fine through hole 1 and the fine through hole 5 communicate. Provided. At the same time, an epoxy resin layer 7b was similarly provided on the inner wall of each terminal forming through hole 3 provided in the chemically cut photosensitive glass substrate 2. These epoxy resin layers 7a and 7b
This is for improving the adhesion of the metal deposited by the electroless plating described later on the chemically cuttable photosensitive glass substrate 2 and the chemically cuttable photosensitive glass auxiliary substrate 4.

Next, the substrate 6 after the provision of the epoxy resin layer 7a is subjected to an electroless Ni-P plating (partial plating) treatment, and a fine pattern is formed on each epoxy resin layer 7a as shown in FIG. 1 (d). Ni-P8a, which closes each fine through-hole formed by communication between the through-hole 1 and the fine through-hole 4, was deposited. At the same time, Ni-P 8b was deposited on each epoxy resin layer 7b without closing each through hole 3 for forming a terminal.

The electroless Ni-P plating process at this time is activated,
The steps were as follows in the order of catalyst application, catalyst activation, and electroless plating.

Activation As an activator, a solution was prepared by adding hydrochloric acid to an ITO reducer (trade name, manufactured by Okuno Pharmaceutical Co., Ltd.) to a pH of 8.8, and the solution was diluted with pure water to a concentration of 200 ml /. Liquid temperature 45
After being immersed in an aqueous solution of 2 ° C. for 2 minutes, the substrate was washed with pure water.

Hydrochloride solution of vanadium chloride and tin chloride (trade name: I
TO Catalyst, manufactured by Okuno Pharmaceutical Co., Ltd.), buffer (trade name: ITO-SAL, manufactured by Okuno Pharmaceutical Co., Ltd.) and 35% hydrochloric acid at a ratio of 60 ml /, 50 g /, 150 ml /, respectively. After being immersed in an aqueous solution at a liquid temperature of 35 ° C. obtained by adding to water for 6 minutes, it was washed with pure water.

Catalyst activation A catalyst activator, an ITO accelerator (trade name, manufactured by Okuno Pharmaceutical Co., Ltd.) was immersed in an aqueous solution at a liquid temperature of 25 ° C. obtained by diluting with 200 ml / pure water with pure water for 2 minutes. Thereafter, the substrate was washed with pure water.

Electroless plating ITO-90-M (trade name, Okuno Pharmaceutical Co., Ltd.) as a reducing agent
Manufactured by ITO-90-1 (trade name, manufactured by Okuno Pharmaceutical Co., Ltd.) as a nickel salt aqueous solution containing Ni ²⁺ ion and pyrophosphate ion (reducing agent).
It was immersed in an aqueous solution at a liquid temperature of 80 ° C. obtained by adding to pure water at a ratio of / for 6 hours, and then washed with pure water. The deposition rate is about 1 μm / 10 minutes.

Thereafter, the portion of the Ni-P 8a protruding from the surface of the substrate 6 is polished and removed using an abrasive made of cerium oxide, and is washed, and as shown in FIG. In each of the fine through-holes in which the hole 1 and the fine through-hole 5 communicate with each other, one end face is provided on the substantially same plane as one surface in the thickness direction of the chemically-cuttable photosensitive glass substrate 2. A Ni-P columnar body 8c having the other end surface on the substantially same plane as one surface in the thickness direction of the chemically-cuttable photosensitive glass auxiliary substrate 4 was provided. Similarly, a portion of the Ni-P 8b protruding from the surface of the chemically cuttable photosensitive glass substrate 2 is polished and removed, followed by cleaning, and as shown in FIG. In the through hole 3, one end surface is substantially on the same plane as one surface in the thickness direction of the chemically-cuttable photosensitive glass substrate 2, and has one end surface in the thickness direction of the chemically-cuttable photosensitive glass substrate 2. A Ni-P hollow cylindrical body 8d having the other end surface on the substantially same plane as the other surface was provided.

Next, the chemically-cuttable photosensitive glass auxiliary substrate 4 provided with the Ni-P columnar bodies 8c is removed by etching.
As a step of projecting one end of the P column 8c from the surface of the chemically cut photosensitive glass substrate 2, the substrate 6 provided with the Ni-P column 8c was immersed in 5% hydrofluoric acid for 2 minutes. .

As a result, the chemically-cuttable photosensitive glass auxiliary substrate 4 was completely removed by etching. At this time, the chemically cut photosensitive glass substrate 2 was also etched, but the etching rate of the chemically cut photosensitive glass substrate 2 with 5% hydrofluoric acid was about the same as the etching rate of the chemically cut photosensitive glass auxiliary substrate 4. Since it is 1/50, the thickness of the etched surface at this time is only about 0.6 μm, which is a range that can be ignored in practical use.

FIG. 1 (f) shows an end view of the base material 6 after the chemically-cuttable photosensitive glass auxiliary substrate 4 has been removed by etching.

As shown in FIG. 1 (f), the chemically-cuttable photosensitive glass auxiliary substrate 4 was etched away, and the Ni-P
One end of the columnar body 8c protrudes about 30 μm from the surface of the chemically cut photosensitive glass substrate 2. The Ni-P column 8c protruding at one end corresponds to a minute probe.

Next, as a step of providing an electric circuit pattern electrically connected to the Ni-P columnar body 8c on the surface of the chemically-cuttable photosensitive glass substrate 2, first, the chemically-cuttable photosensitive glass substrate 2 is used. As shown in FIG. 1 (g), an ITO (indium tin oxide) film 9a (sheet resistance 30 to 40Ω / □) having a thickness of about 1000 に is formed on the surface opposite to the surface on which the glass auxiliary substrate 4 is fixed. Was formed. The ITO film 9a is formed by DC
This was performed by a sputtering method. At this time, on the opening of the Ni-P hollow cylindrical body 8d provided in each terminal forming through hole 3,
No ITO film was formed.

After forming the ITO film 9a, as shown in FIG.
A photoresist (trade name: Hoechst AZ1) is formed on the ITO film 9a.
350, manufactured by Hoechst Japan Co., Ltd.) and spin-coated to a thickness of about 10,000 mm to form a photoresist layer 10a,
Bake at ℃ for 30 minutes.

Next, a contact exposure process and a development process using a photomask having a predetermined pattern
As shown in FIG. 1I, a resist pattern 1 is formed on the ITO film 9a.
0b was formed, and the resist pattern 10b was post-baked at 120 ° C. for 30 minutes.

After post-baking, the chemically cut photosensitive glass substrate 2 on which the resist pattern 10b is formed is placed in a 1: 1 mixed solution (solution temperature: 50 ° C.) of a 40 baume FeCl ₃ aqueous solution and a 36% HCl aqueous solution for about 1 hour.
By immersing for 1 minute, as shown in FIG.
The ITO film 9a was removed by etching using the resist pattern 10b as a mask.

Next, after performing a rinsing process using pure water, the resist pattern 10b is peeled off using an organic solvent (isopropyl alcohol), and as shown in FIG.
A plurality of electric circuit patterns 9b composed of an ITO film electrically connected to one end of the P pillar 8c were formed on the surface of the chemically cut photosensitive glass substrate 2. In addition, each electric circuit pattern 9b is
While being electrically connected to one end of the Ni-P column 8c, the Ni-P column 8c and the Ni-P hollow column 8d provided in the terminal forming through-hole 3 corresponding to the Ni-P column 8c one-to-one. Electrically connected.

Thereafter, for the purpose of reducing the electric resistance of the electric circuit pattern 9b, the electric circuit pattern 9b
An Ni-P layer was provided thereon.

First, as shown in FIG. 1 (l), a protective transparent adhesive tape 11 was stuck on the surface of the chemically cut photosensitive glass substrate 2 on the side where the Ni-P columnar body 8c protrudes. Then
Electroless Ni-P plating is performed in the same manner as in the case of depositing Ni-Ps 8a and 8b described above, and as shown in FIG. 1 (m), Ni-P of 2 μm thickness is formed on the electric circuit pattern 9b. P layer 12
Was precipitated. The processing time of the electroless plating at this time is
Approximately 20 minutes.

After depositing the Ni-P layer 12, the transparent adhesive tape 11 is peeled off, and as shown in FIG. 1 (n), as an electric circuit pattern electrically connected to one end of the Ni-P columnar body 8c, A chemically-cuttable photosensitive glass substrate 2 having a plurality of electric circuit patterns 13 in which a Ni-P layer 12 is provided on an electric circuit pattern 9b made of an ITO film, that is, a circuit substrate 14 having a fine probe was obtained.

The circuit board 14 having the fine probe thus formed
FIG. 2 (a) shows a top view of FIG. 2 as viewed from the side where the electric circuit pattern 13 is provided. FIG. 2 (b) is an enlarged view of the central portion (portion where the fine through hole 1 is provided) in FIG. 2 (a).
Shown in 2 (a) and 2 (b).
The same reference numerals as those in FIG. 1 denote the same members as those in FIG. 1, and a description thereof will be omitted.

Thereafter, in the present embodiment, for the purpose of reinforcing the mechanical strength of the circuit board 14 having the fine probe (hereinafter, simply referred to as the circuit board 14), the reinforcement is provided on the surface of the circuit board 14 in the following manner. The substrate was fixed.

First, 100 × 100 × 2mm Li ₂ O
-Al ₂ O ₃ -SiO ₂ (Au, Ce) -based chemically cut photosensitive glass (trade name: PEG3, manufactured by HOYA Corporation) Similarly to the step of providing the fine through-holes 1 and the through-holes 3 for forming terminals, exposure processing using a predetermined mask, development processing (heat treatment), etching processing (acid processing), and rinsing processing are performed. As shown in FIG. 5A, a plurality of through holes 21 having an opening diameter of 500 μm were provided at a constant interval at 5 mm from the edge of the chemically cut photosensitive glass plate 20. These through holes 21 correspond one-to-one with the terminal forming through holes 3 provided in the chemically cut photosensitive glass substrate 2.

After the through holes 21 are provided, the Ni-P columnar bodies 8a and 8b are provided in the plurality of fine through holes 1 and the terminal forming through holes 3 provided in the chemically-cuttable photosensitive glass substrate 2 as described above. Similarly, first, as shown in FIG. 3 (b), an epoxy resin layer 22 was provided on the inner wall of each through hole 21 provided in the chemically cut photosensitive glass plate 20, and this epoxy resin layer 22 was provided. An electroless Ni-P plating (partial plating) treatment is applied to the chemically cut photosensitive glass plate 20 for 11 hours, and as shown in FIG. Through hole
On the surface of the chemically cut photosensitive glass plate 20 near the opening of 21,
Ni-P 23a was deposited without closing each through hole 21. Next, the Ni-P attached to the surface of the chemically cut photosensitive glass plate 20 near the opening of each through hole 21 is polished and removed using an abrasive made of cerium oxide, and washed, and FIG. As shown in d), each of the through-holes 21 has one end surface on a plane substantially flush with one surface in the thickness direction of the chemically-cuttable photosensitive glass plate 20, and A Ni-P hollow cylindrical body 23b having the other end face was provided on a plane substantially the same as the other surface in the thickness direction.

Next, the chemically-cuttable photosensitive glass plate 20 provided with the Ni-P hollow cylindrical body 23b in each through hole 21 and the circuit board 14,
As shown in FIG. 3 (e), they were laminated and fixed via a hot melt type sheet adhesive 24. At this time, the lamination and fixing are performed by a plurality of electric circuit patterns provided on the circuit board 14.
13 is located inside the laminate, and the positions of the through holes 21 provided in the chemically cuttable photosensitive glass plate 20 and the terminal forming through holes 3 provided in the photosensitive glass substrate 2 match. Went like so.

Next, a load of about 400 g was applied to the laminate from above, and the laminate was heated to 120 to 140 ° C. in a vacuum oven.
As shown in Fig. (F), hot melt type sheet adhesive
24, the chemically-cuttable photosensitive glass plate 20 provided with the Ni-P hollow cylindrical body 23b in each through hole 21 and the circuit board 14 were fixed.

After fixing, a wire having a sharp tip is inserted from each through-hole 21 provided in the chemically-cuttable photosensitive glass plate 20 so that each of the through-holes 21 provided in the chemically-cuttable photosensitive glass plate 20 and the chemically-cuttable photosensitive glass plate 20 are connected. The hot-melt type sheet adhesive 24 interposed between each terminal forming through hole 3 provided in the functional glass substrate 2 is perforated to form a circuit board as shown in FIG. 3 (g). 14, a plurality of Ni-P hollow cylindrical bodies 23 in a plurality of through holes 21.
A reinforcing substrate made of the chemically cut photosensitive glass plate 20 provided with b was provided.

Further, in this embodiment, connection terminals are provided in the following manner.

First, as shown in FIG. 4 (a), a stainless steel wire 30 having a diameter of 300 μm is inserted from each through hole 21 provided in the chemically cuttable photosensitive glass plate 20, and the tip of the stainless steel wire 30 is It reached each terminal forming through hole 3 provided in the cuttable photosensitive glass substrate 2 and was kept in a state where it did not protrude from the terminal forming through hole 3.

Next, a molten solder is poured between the stainless wire 30 and the through hole 21 and the through hole 3 for forming a terminal, and then hardened, and as shown in FIG.
Is fixed by the solder 31 and the stainless steel wire
A circuit board 32 having a micro-tip according to the present invention having a connection terminal formed of 30 and having a connection terminal and a reinforcing substrate attached thereto
I got

The present invention is not limited to the embodiments described above, but includes the following modifications and application examples.

First, in the example, a square chemically cut photosensitive glass was used as a substrate. However, in the method of manufacturing a circuit board having a micro probe according to the present invention, the shape of the chemically cut photosensitive glass as the substrate is particularly limited. However, the shape can be appropriately changed to a disk shape or the like.

In the examples, the chemically cut photosensitive glass of the same quality as the substrate was used as the material of the auxiliary substrate.However, the chemically cut photosensitive glass used as the auxiliary substrate in the method of manufacturing a circuit board having a micro probe of the present invention is: There is no particular limitation as long as it is a chemically cut photosensitive glass having a higher etching rate than the chemically cut photosensitive glass used as the substrate.
As is clear from the examples, even the chemically cut photosensitive glass having the same composition (same quality as the substrate) has an etching rate higher than that of the substrate by performing exposure processing and development processing, that is, by crystallization. Can be higher. The etching rate at this time can be changed within a certain range by changing the exposure time, the development processing temperature, the development processing time, and the like. When PEG3 (manufactured by HOYA Corporation) used in the examples is used as the auxiliary substrate, the optimal exposure time is 15 to 20 seconds. Table 1 shows the compositions of various chemically-cuttable photosensitive glasses.

The thickness of the auxiliary substrate is appropriately selected according to the length of projection of the minute probe from the substrate.

In the embodiment, the epoxy resin-based adhesive is used for fixing the auxiliary substrate to the substrate. However, the auxiliary substrate may be fixed to another type of adhesive such as a silanol-based adhesive.
Further, by pressing at least one of the auxiliary substrate and the substrate to the other, the auxiliary substrate and the substrate may be brought into close contact with each other,
In this specification, the term “fixation” also includes adhesion by pressing.

The diameter of the fine through-hole provided in the auxiliary substrate may not be the same as the diameter of the fine through-hole provided in the substrate, and may be smaller than the diameter of the fine through-hole provided in the substrate. If the diameter of the fine through-hole provided in the auxiliary substrate is too large, there is a possibility that the tips of adjacent fine probes may come into contact with each other in a plurality of finally obtained fine probes.

In the embodiment, the base material after the columnar Ni-P is
The auxiliary substrate was removed by etching by immersion in hydrofluoric acid.
The auxiliary substrate can also be removed by dry etching such as (reactive etching) or plasma etching. At this time, in addition to 5% hydrofluoric acid, various concentrations of hydrofluoric acid, hydrosilicofluoric acid, an aqueous solution of ammonium fluoride, and the like can be used. When hydrofluoric acid is used as the etchant, the use of 2 to 6% hydrofluoric acid enables the auxiliary substrate to be etched away while suppressing the amount of etching of the substrate.

Fine through-holes, in addition to the photolithography method described in the examples, photolithography by other methods,
It may be provided by electric discharge machining, printing, printing, laser machining or the like. When ceramics are used as the substrate and / or the auxiliary substrate, a plurality of fine through holes may be provided at the stage of the green sheet and then sintered.

The material and shape of the substrate and the method of forming the fine through-holes in the substrate are based on the size and number of the microprobes required for the circuit board having the target microprobe, the placement accuracy of the microprobe, the circuit board Is appropriately selected in accordance with the use of the device and its use environment. A minute probe (for example, when the probe diameter is
When arranging a large number of microprobes (300 μm or less) with high precision, as described in the embodiment, it is necessary to form fine through holes by photolithography using a chemically cut photosensitive glass as a substrate. Is particularly preferred.

The material of the auxiliary substrate and the method of forming the fine through-holes in the auxiliary substrate also include the size and number of the fine probes required for the circuit substrate having the target fine probes, the placement accuracy of the fine probes, and the like. Is appropriately selected according to the conditions.

In providing the columnar conductor in the fine through hole in which the fine through hole provided in the substrate and the fine through hole provided in the auxiliary substrate communicate with each other, in addition to the electroless Ni-P plating used in the examples, Conductive metals such as Co, Ni, Cu, Pd, Ag, Pt, and Au may be electrolessly treated, and these metals and B, N, P, V, Mn, Fe, Z
Those containing n, Mo, Sn, W, Re, Tl, etc. may be subjected to electroless plating. Further, the above-mentioned components may be subjected to electroless plating halfway, and after forming a suitable lead wire, Au, Ag, Pt, Cr, Cu, Ni, Co, etc. may be deposited by electrolytic plating.

Furthermore, a method of pouring molten solder into the fine through holes,
A method of pouring a conductive resin or the like can also be applied.
According to the method of pouring the molten solder or the conductive resin, the columnar fine conductor can be easily provided in the fine through hole provided in the substrate and / or the probe forming auxiliary layer.

In the embodiment, in order to improve the adhesion of the metal deposited by electroless plating on the substrate and the auxiliary substrate, the fine through-hole provided in the substrate and the fine through-hole provided in the auxiliary substrate communicate with each other. An epoxy resin layer was provided on the inner wall of the fine through hole, but instead of epoxy resin, a material having good adhesion to the substrate, such as a photoresist or an alkoxide,
The same effect can be obtained by using a material in which a catalytic metal powder such as Pd, Au, Pt or the like is dispersed and contained in these materials. Depending on the method of electroless plating and the material of the substrate and auxiliary substrate,
Even without providing a resin layer or the like, a columnar conductor can be provided in a fine through hole in which the fine through hole provided in the substrate and the fine through hole provided in the auxiliary substrate communicate with each other.

Further, in the example, the one end face connected to the electric circuit pattern in the columnar conductor is provided on substantially the same plane as one surface of the substrate, but the one end face connected to the electric circuit pattern in the columnar conductor is provided. Need not be provided on substantially the same plane as the substrate surface, and may protrude from the substantially same plane. That is, one end face of the columnar conductor connected to the electric circuit pattern may protrude from the substrate surface as long as the electric circuit pattern can be formed.

In providing the columnar conductor, one end of the obtained columnar conductor is substantially the same as one surface of the substrate by previously attaching tape or the like to the surface of the substrate on which the electric circuit pattern is provided. Can be formed on a plane.

Further, in the embodiment, the electric circuit pattern is formed by the ITO film and the N film.
Although it has a two-layer structure with an i-P layer, it may have a one-layer structure or a multi-layer structure of three or more layers.
The material is not limited to -P and can be appropriately selected from conductive materials such as Cr, Au, Ag, Cu, and Ni. The electric resistance between the electric circuit pattern formed by the ITO film and the columnar conductor is, as shown in the embodiment, a Ni-film having a thickness of 1 to 5 μm on the ITO film.
By providing the P layer, the size can be further reduced. Furthermore, in order to protect this Ni-P layer from oxidation,
The Ni-P layer may be coated with gold.
It can be performed by an ordinary method using an electroless plating method or an electrolytic plating method.

In this embodiment, such an electric circuit pattern is formed by a photolithography method, but may be formed by another method such as a screen printing method or an offset printing method.

In the examples, the auxiliary substrate made of a chemically-cuttable photosensitive glass plate is provided.However, in the method of manufacturing a circuit board having a micro probe of the present invention, the step of providing the reinforcing substrate is not necessarily required. Absent. The material of the reinforcing substrate when the reinforcing substrate is provided is not particularly limited as long as it is an insulating substance or a semiconductor having a desired mechanical strength, and may be an inorganic substance or an organic substance. The shape of the reinforcing substrate at this time is not particularly limited. For example, a cross shape may be used as long as the mechanical strength of the circuit board can be improved and the distortion generated on the board can be suppressed. And various other shapes. In fixing the substrate and the reinforcing substrate, in addition to the hot melt type sheet adhesive used in the examples, various insulating adhesives, solder glass, double-sided tape, etc. can be used,
In addition, it can be fixed by heat fusion, bolting, or the like.

Although the connection terminal is provided in the embodiment, the step of providing the connection terminal is not always necessary in the method of manufacturing a circuit board having a micro probe according to the present invention. The structure of the connection terminal in the case where the connection terminal is provided is not particularly limited, and any structure that can electrically connect an electric circuit pattern provided on a circuit board having a microprobe and an external device can be used. Any structure connection terminal may be used.
The formation method can also be appropriately selected.

The order of the steps in the method for manufacturing a circuit board having a microprobe of the present invention is limited to the order of the steps exemplified in the examples as long as a circuit board having a microprobe in which the microprobe is securely supported is finally obtained. It is not something to be done. For example, in the embodiment, the step of providing the electric circuit pattern was performed after the step of projecting one end of the columnar conductor from the surface of the substrate, but the step of providing the electric circuit pattern was performed after the step of providing the columnar conductor, Thereafter, a step of projecting one end of the columnar conductor from the surface of the substrate may be performed. After the step of providing the columnar conductor, a step of providing an electric circuit pattern is performed, and then, a step of providing a reinforcing substrate and a step of providing connection terminals are performed. May be performed. Alternatively,
Performing the step of providing an electric circuit pattern after the step of providing a columnar conductor, and then performing the step of providing a reinforcing substrate, performing a step of projecting one end of the columnar conductor from the surface of the substrate, and thereafter, A step of providing connection terminals may be performed.

When a working opening is required in a circuit board having a fine probe, such as a probe card, in addition to using a chemically cut photosensitive glass provided with a working opening as a substrate, As a step, a step of providing a working opening in a substrate or a circuit board having the obtained microprobe may be added. When a reinforcing substrate is provided, in addition to using an insulating substance or a semiconductor having an opening for operation as a substrate for reinforcing, a step of providing an opening for operation on the substrate for reinforcement is added as a step. Is also good. In providing a working opening in a substrate, a reinforcing substrate, or a circuit board having a microprobe provided with the reinforcing substrate, known means such as etching, laser processing, and chemical drilling can be applied.

[Effects of the Invention] As described above, according to the method of manufacturing a circuit board having a micro probe of the present invention, a process of manually fixing a member to be a micro probe at a predetermined position on the substrate is performed. In addition, it is possible to obtain a circuit board having a minute probe in which the minute probe is securely supported. In other words, it is possible to obtain a circuit board having a micro probe, which is less likely to be bent, broken, dropped, or the like of the micro probe, and is less likely to cause poor contact with the substrate to be inspected.

Therefore, by carrying out the present invention, it is possible to provide a circuit board having a microprobe having excellent durability and, consequently, excellent reliability while easily coping with high density (high integration) of a substrate to be inspected. Becomes possible.

[Brief description of the drawings]

FIG. 1 is an end view for schematically explaining an example of each step in manufacturing a circuit board having a micro probe according to the present invention, and FIG. 2 is a micro probe obtained based on the present invention. FIG. 3 is a top view schematically illustrating an example of a circuit board having a needle, and FIG. 3 is a schematic view illustrating an example of a process in a case where a reinforcing substrate is attached to a circuit board having a microprobe obtained according to the present invention. FIG. 4 is an end view for schematically explaining an example of a process for attaching a connection terminal, and FIG. 5 is a resin layer and a substrate provided on the outer periphery of a columnar conductor. FIG. 4 is a partial end view schematically showing a V-shaped groove formed by the penetration of an etching solution between the grooves. 1 ... fine through-holes provided in the substrate, 2 ... chemically-cuttable photosensitive glass substrate, 4 ... auxiliary substrate, 5 ... fine through-holes provided in the auxiliary substrate, 8c ... columnar conductor, 13 ... ... A circuit board having an electric circuit pattern and a minute probe, 32... A circuit board having a minute probe provided with a reinforcing substrate and connection terminals.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/66 G01R 31/26 G01R 1/073

Claims (1)

(57) [Claims] A step of providing a plurality of fine through holes in a substrate made of chemically cut photosensitive glass; and forming a pair of the plurality of fine through holes on one surface of the substrate provided with the plurality of fine through holes. Having a plurality of fine through holes corresponding to one, and an auxiliary substrate made of chemically cut photosensitive glass having a higher etching rate than the substrate,
A step of connecting and fixing the plurality of fine through-holes provided in the auxiliary substrate and the plurality of fine through-holes provided in the substrate in a one-to-one correspondence, and forming a columnar shape in the plurality of connected fine through-holes. A step of providing one of the conductors; and a step of protruding one end of the columnar conductor from the surface of the substrate by etching and removing the auxiliary substrate after the provision of the columnar conductor. Providing a circuit pattern electrically connected to the body on the surface of the substrate, the method comprising the steps of: