JPH0437967B2 - - Google Patents
Info
- Publication number
- JPH0437967B2 JPH0437967B2 JP57065691A JP6569182A JPH0437967B2 JP H0437967 B2 JPH0437967 B2 JP H0437967B2 JP 57065691 A JP57065691 A JP 57065691A JP 6569182 A JP6569182 A JP 6569182A JP H0437967 B2 JPH0437967 B2 JP H0437967B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- solder
- circuit board
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 30
- 238000007772 electroless plating Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 238000007747 plating Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 101150003085 Pdcl gene Proteins 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Description
【発明の詳細な説明】
本発明は回路基板等の被接合部材と表示体パネ
ルのハンダ等ろう接合材による実装方法に係り、
詳しくは、表示体パネルの端子部に無電解メツキ
によつて金属被膜を形成し、ハンダ等によつて回
路基板等の被接合部材と直接、接合することを可
能にした表示体パネルの実装方法に関している。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of mounting a member to be joined such as a circuit board and a display panel using a brazing material such as solder,
Specifically, there is a display panel mounting method in which a metal coating is formed on the terminal portion of the display panel by electroless plating, and the display panel can be directly bonded to a member to be bonded such as a circuit board by soldering or the like. It's about.
表示体パネルとしては液晶パネル、エレクトロ
クロミツクパネル等のものがあるが、現在大量に
使用されているのは液晶パネルであるため、液晶
パネルを中心として述べる。 Display panels include liquid crystal panels, electrochromic panels, etc., but since liquid crystal panels are currently being used in large quantities, the discussion will focus on liquid crystal panels.
従来、液晶パネルは低電圧駆動、低消費電流駆
動が可能な表示体として、時計、電卓等の表示体
に使用されてきた。液晶パネルが市場に出現した
当初は、駆動回路、駆動方式、製造技術、液晶製
造技術等がまだ発展途上にあり表示面積も小さ
く、表示容量も小さいものであつた。そのため液
晶パネルの端子数は少く、液晶駆動回路との接触
は導電ゴムを通し行なわれていた。ところが、液
晶パネルがパーソナルコンピュータ等に使用され
るに従つて、表示面積が大きくなり表示容量が大
きくなると、必然的に端子数が多くなつてきた。
このため、導電ゴムを通しての液晶駆動回路との
接触は困難になり、第１図のような方法が取られ
ていた。ａにおいて、１はフレキシブル回路基
板、２は液晶パネル、３はフレキシブル回路基板
の裏側にある金属（銅）、４は液晶パネルの端子
部である。従来の実装方法は、１と２を合わせ、
第１図ｂのようにしてから熱圧着により、回路基
板のプラスチツク部と液晶パネルのガラス部を融
着することによって液晶パネル端子部と銅層の接
触をとつていた。ところが、この接触は単に上下
の貼り合わせにすぎず、しばしば接触不良の原因
となつていた。また、自動車計器の表示体部に液
晶パネルを使用する場合、振動に対し接触部が弱
く、実装の信頼性に欠けていた。 Conventionally, liquid crystal panels have been used as displays for watches, calculators, etc., as they can be driven at low voltage and with low current consumption. When liquid crystal panels first appeared on the market, drive circuits, drive methods, manufacturing techniques, liquid crystal manufacturing techniques, etc. were still under development, and the display area and display capacity were small. Therefore, the number of terminals on the liquid crystal panel is small, and contact with the liquid crystal drive circuit is made through conductive rubber. However, as liquid crystal panels are used in personal computers and the like, the display area and display capacity become larger, and the number of terminals inevitably increases.
For this reason, contact with the liquid crystal drive circuit through the conductive rubber becomes difficult, and the method shown in FIG. 1 has been used. In a, 1 is a flexible circuit board, 2 is a liquid crystal panel, 3 is metal (copper) on the back side of the flexible circuit board, and 4 is a terminal part of the liquid crystal panel. The conventional mounting method is to combine 1 and 2,
After forming as shown in FIG. 1B, the plastic part of the circuit board and the glass part of the liquid crystal panel were fused together by thermocompression bonding, thereby making contact between the terminal part of the liquid crystal panel and the copper layer. However, this contact is simply a matter of pasting the top and bottom together, which often causes poor contact. Furthermore, when a liquid crystal panel is used as a display part of an automobile instrument, the contact part is weak against vibrations, resulting in a lack of reliability in mounting.
本発明はこれらの欠点を改良するために、液晶
パネル端子部に無電解メツキを行うことにより、
ハンダ等によつてパネル端子部とフレキシブル基
板との接合を強固したものである。無電解メツキ
被膜としてはニツケル、銅、コバルト、あるいは
それらを主成分とする合金が多く用いられる。 In order to improve these drawbacks, the present invention performs electroless plating on the terminals of the liquid crystal panel.
The connection between the panel terminal portion and the flexible substrate is strengthened using solder or the like. Nickel, copper, cobalt, or alloys containing these as main components are often used as electroless plating films.
次に本発明の実装を行うために必要な液晶パネ
ルの製造方法について述べる。 Next, a method for manufacturing a liquid crystal panel necessary for implementing the present invention will be described.
透明な無機ガラス、プラスチツク、セラミツク
等の基板にCVD、スパツタ、蒸着等によつて
SnO2，In2O3等の透明導伝膜を形成する。その
後、感光性樹脂をロールコータ法、デイピング
法、スピンナー法等により塗布し、所定のパター
ンを持つたマスクにより露光し、不要部除去後、
透明導伝膜を所定のエツチング液で溶解し、残り
のレジスト膜を除去することで液晶パネルの上下
基板ができ上がる。その上・下基板にアミノシラ
ン、ポリイミド等の配向剤を印刷法、デイビング
法、ロールコータ法、スピンナ法等により塗布し
焼成後、ラビング等の方法により配向処理を行
う。次に、上下基板の間隔を一定に保つためのギ
ヤツプ剤を分散させたエポキシ樹脂等よりなるシ
ール剤を上下基板に印刷し、はり合わせることに
より液晶セルが出来上がる。そして、予め作られ
ていた液晶封入口より、液晶組成物を封入し、封
入口を封止することにより通常の液晶パネルが出
来上がる。そして液晶パネルの端子部に無電解メ
ツキによつてニツケル等のメツキをすれば本発明
の実装を行うために必要な液晶パネルができあが
る。 By CVD, sputtering, vapor deposition, etc. on transparent inorganic glass, plastic, ceramic, etc. substrates.
A transparent conductive film of SnO 2 , In 2 O 3 or the like is formed. After that, a photosensitive resin is applied by a roll coater method, a dipping method, a spinner method, etc., and exposed using a mask with a predetermined pattern. After removing unnecessary parts,
By dissolving the transparent conductive film with a predetermined etching solution and removing the remaining resist film, the upper and lower substrates of the liquid crystal panel are completed. An alignment agent such as aminosilane or polyimide is applied to the upper and lower substrates by a printing method, a dabbing method, a roll coater method, a spinner method, etc., and after baking, an alignment treatment is performed by a method such as rubbing. Next, a sealing agent made of epoxy resin or the like in which a gapping agent is dispersed is printed on the upper and lower substrates in order to keep the distance between the upper and lower substrates constant, and the liquid crystal cell is completed by gluing them together. Then, a liquid crystal composition is sealed through a liquid crystal filling port that has been made in advance, and the filling port is sealed, thereby completing a normal liquid crystal panel. Then, by plating the terminal portions of the liquid crystal panel with nickel or the like by electroless plating, a liquid crystal panel necessary for mounting the present invention is completed.
ここで無電解メツキ工程について述べておく。 Here, we will discuss the electroless plating process.
通常、無電解メツキはSnCl2溶液に浸漬するセ
ンシタイジング、その後、PdCl2溶液に浸漬する
アクテイベイテインクの前処理が必要である。セ
ンシタイジングは基板上にスズの２価イオンを吸
着させる工程であり、アクテイベイテイングはス
ズの２価イオンとパラジウムの２価イオンを反応
させて金属パラジウムを基板上に析出させる工程
である。この金属パラジウムが無電解メツキの触
媒核となるわけである。 Typically, electroless plating requires sensitizing by immersion in SnCl 2 solution, followed by activating ink pretreatment by immersion in PdCl 2 solution. Sensitizing is a process in which divalent tin ions are adsorbed onto the substrate, and activating is a process in which divalent tin ions and palladium divalent ions are reacted to deposit metallic palladium on the substrate. This metal palladium becomes the catalyst nucleus for electroless plating.
また、SnCl2，PdCl2の各溶液を混合すること
によつて調整される触媒液も開発、実用化されて
いる。このタイプの触媒液を使用すると、ガラ
ス、石英、水晶等にはまつたく無電解メツキをす
ることができないが、ガラス、石英、水晶等上に
金属酸化物被膜を形成することで無電解メッキが
可能となる現象を本発明者は以前に発見してい
る。これによつて、ガラス、石英、水晶等上にパ
ターンをもつた金属酸化物被膜を形成し、
SnCl2，PdCl2の混合タイプの触媒液を使用する
ことによつて、ガラス、石英、水晶等への選択的
な無電解メツキが可能となつた。 In addition, a catalyst solution prepared by mixing SnCl 2 and PdCl 2 solutions has also been developed and put into practical use. When using this type of catalyst liquid, it is not possible to perform electroless plating on glass, quartz, crystal, etc., but electroless plating is possible by forming a metal oxide film on glass, quartz, crystal, etc. The inventors have previously discovered the phenomenon that makes this possible. This forms a patterned metal oxide film on glass, quartz, crystal, etc.
By using a mixed type catalyst liquid of SnCl 2 and PdCl 2 , selective electroless plating on glass, quartz, crystal, etc. has become possible.
本液晶パネルはこのメツキ方法を用いて、透明
電極（SnO2 あるいはIn2O3）上へのみ無電解メ
ツキを行つたものである。ただこの金属被膜は通
常500Å〜5μmの厚さの範囲内であることが望ま
しい。500Å以下であると、金属被膜がハンダ等
によつてくわれてしまい密着強度がでない。また
5μm以上になると、メツキ被膜の内部応力が大き
くなつて同様に密着強度がなくなつてしまう。メ
ツキ被膜形成後、メツキ被膜の密着性を更に向上
させるため大気中での焼成を行なう。焼成温度は
400℃までなら高い程良いのであるが、液晶パネ
ルの耐熱限界内でなければならない。また燃成時
間も液晶パネルの特性の劣化をきたさないために
も短い方が良い。そのため望ましくは、焼成温度
は80℃〜150℃の範囲であり、焼成時間も５時間
以内、５分間以上が良い。80℃以下であるとメツ
キ被膜の密着性が向上せず、焼成時間が５分間以
内だとやはり同様の結果となるからである。 This liquid crystal panel uses this plating method, and electroless plating is performed only on the transparent electrode (SnO 2 or In 2 O 3 ). However, the thickness of this metal coating is preferably within the range of 500 Å to 5 μm. If it is less than 500 Å, the metal coating will be held together by solder etc., resulting in a loss of adhesion strength. Also
When the thickness exceeds 5 μm, the internal stress of the plating film becomes large and the adhesion strength is similarly lost. After the plating film is formed, baking is performed in the atmosphere to further improve the adhesion of the plating film. The firing temperature is
The higher the temperature is, the better, up to 400℃, but it must be within the heat resistance limit of the liquid crystal panel. Furthermore, the shorter the combustion time, the better in order to prevent deterioration of the characteristics of the liquid crystal panel. Therefore, the firing temperature is preferably in the range of 80° C. to 150° C., and the firing time is preferably within 5 hours and preferably 5 minutes or more. This is because if the temperature is below 80°C, the adhesion of the plating film will not improve, and if the firing time is less than 5 minutes, the same result will still occur.
また、メツキ被膜上へのハンダ材等のコートの
方法はハンダフラツクス塗布後ハンダゴテあるい
はハンダ材等のデイツプ浴への浸漬によつて行な
われるのだが、その厚みは0.1μm〜300μmが好ま
しい。0.1μm以下であるとハンダの接合強度が不
足し、300μm以上であると回路基板と端子部は接
合した時、ハンダ材等の量が多すぎて隣の端子と
シヨートする恐れが大きくなるからである。但
し、これは端子電極間の間隔により多少異なるも
のであるので、その厚さは上記0.1μm〜300μmに
限定されるものではない。また、液晶パネル端子
上へ無電解メッキをした後、無電解金属メツキを
施こしておけば、ハンダのぬれ性が良くなり、フ
ラツクスは必要ない。貴金属被膜厚は50Å〜1μm
が望ましい。ハンダのぬれ性を良くするには50Å
程度の厚さで良く、貴金属は高価であるため1μm
以上となるとコストアツプにつながるからであ
る。 The method for coating the plating film with a solder material, etc. is carried out by applying a solder flux and then dipping the solder material into a dip bath using a soldering iron, and the thickness thereof is preferably 0.1 μm to 300 μm. If it is less than 0.1μm, the solder joint strength will be insufficient, and if it is more than 300μm, when the circuit board and the terminal are joined, there will be too much solder material, which increases the risk of it colliding with the neighboring terminal. be. However, since this varies somewhat depending on the spacing between the terminal electrodes, the thickness is not limited to the above-mentioned range of 0.1 μm to 300 μm. Furthermore, if electroless metal plating is applied after electroless plating on the liquid crystal panel terminals, solder wettability will be improved and flux will not be necessary. Precious metal coating thickness is 50Å to 1μm
is desirable. 50Å for better solder wettability
A thickness of about 1 μm is sufficient since precious metals are expensive.
This is because if it becomes more than that, it will lead to an increase in costs.
次に実施例を用いて詳細に説明する。 Next, a detailed explanation will be given using examples.
〔実施例 １〕
通常の工程で作られた液晶パネルを５％
NaOHで脱脂し、水洗、中和した。[Example 1] 5% of liquid crystal panels made by normal process
It was degreased with NaOH, washed with water, and neutralized.
所定の方法により建浴された増感剤（日立化成
社製HS−101B）に２分間浸漬し、 水洗後、
1N−NaOHに１分間浸漬し、水洗した。これに
よつて液晶パネルの端子部のみに触媒核が形成さ
れる。これを所定の方法により建浴された45℃の
無電解ニツケル浴（カニゼン社製Ｓ−680）に７
分間浸漬すると、液晶パネルの端子部のみに3600
Åのニツケルメツキ被膜が形成された。この液晶
パネルを120℃１時間焼成した後、ポリイミドテ
ープに形成されたフレキシブル回路基板の金属被
膜からなる導通部とハンダによつて接合した。こ
の方法は、端子上にニツケル用フラツクスを塗布
後、250℃のハンダバスに４秒間浸漬して、厚さ
25μmのハンダ層をコート後、液晶パネル端子部
と回路基板端子部（最上層に20μmのハンダ層が
形成されたものを購入した）を合わせ、300℃に
加熱された金属ツールにより２Kg／cm2の圧力で加
圧接合した。 Immerse for 2 minutes in a sensitizer (HS-101B manufactured by Hitachi Chemical Co., Ltd.) prepared by a prescribed method, and after washing with water,
It was immersed in 1N-NaOH for 1 minute and washed with water. As a result, catalyst nuclei are formed only at the terminal portions of the liquid crystal panel. This was placed in a 45℃ electroless nickel bath (S-680 manufactured by Kanigen Co., Ltd.) prepared by a prescribed method for 7 hours.
When immersed for a minute, 3600
A nickel-metallic coating of 1.5 Å was formed. After baking this liquid crystal panel at 120° C. for 1 hour, it was joined by solder to a conductive portion made of a metal coating of a flexible circuit board formed on a polyimide tape. This method involves applying nickel flux on the terminal, then dipping it in a 250°C solder bath for 4 seconds to reduce the thickness.
After coating with a 25μm solder layer, the LCD panel terminal part and the circuit board terminal part (I purchased one with a 20μm solder layer formed on the top layer) were combined and soldered to 2Kg/cm 2 using a metal tool heated to 300℃. Pressure bonding was carried out at a pressure of .
この実装方法によつて得られた液晶パネルと回
路基板の密着強度は1.5Kg／cm（接合部換算）と
なり実用上問題のないものとなつた。 The adhesion strength between the liquid crystal panel and the circuit board obtained by this mounting method was 1.5 kg/cm (converted to the joint area), which is not a problem in practical use.
〔実施例 ２〕
実施例１と同様の方法によつて得られた端子部
にニツケル被膜（500Å）のついた液晶パネルと、
ポリエステルテープに形成されたフレキシブル回
路基板の端子部（最上層にハンダ18μm層を有す
る）とをハンダによつて接合した。（ハンダデイ
ツプによつてつけられた液晶パネルの端子部上の
ハンダ層の厚は20μmであつた）この密着強度は
実施例１と同様のものとなつた。[Example 2] A liquid crystal panel with a nickel coating (500 Å) on the terminal portion obtained by the same method as in Example 1,
The terminal portion of the flexible circuit board formed on the polyester tape (having a 18 μm layer of solder on the top layer) was bonded with solder. (The thickness of the solder layer on the terminal portion of the liquid crystal panel attached by the solder dip was 20 μm) This adhesion strength was similar to that of Example 1.
〔実施例 ３〕
実施例１と同様の方法によつて得られた端子部
にニツケル被膜（3600Å）のついた液晶パネル
を、置換型の60℃の無電解メツキ浴（日本エンゲ
ルハルド社製アトメツクス金メツキ浴）に10分間
浸漬することで、ニツケル被膜上に400Åの金メ
ッキ層を得た。その後120℃で焼成し、ポリイミ
ドテープに形成されたフレキシブル回路基板の端
子部（最上層にハンダ10μmの層を有する）とハ
ンダによつて接合したところ、この密着強度は
1.4Kg／cm（接合部換算）となり実用上問題のな
いものとなつた。液晶パネルの端子部上のハンダ
層の厚さは60μmであつた。[Example 3] A liquid crystal panel with a nickel coating (3600 Å) on the terminal portion obtained by the same method as in Example 1 was heated in a displacement-type electroless plating bath at 60°C (Atomex, manufactured by Nippon Engelhard Co., Ltd.). A 400 Å gold plating layer was obtained on the nickel film by immersion in a gold plating bath for 10 minutes. After that, it was baked at 120℃ and bonded to the terminal part of a flexible circuit board formed on polyimide tape (with a 10μm layer of solder on the top layer), and the adhesion strength was
The result was 1.4Kg/cm (converted to the joint area), which poses no practical problem. The thickness of the solder layer on the terminal portion of the liquid crystal panel was 60 μm.
〔実施例 ４〕
実施例１と同様の方法によつて無電解メツキの
前処理を施された液晶パネルを、所定の方法によ
つて建浴された無電解銅メツキ浴（室町化学社製
MK−430）中に６分間浸漬し、3000Åの銅メツ
キ層を端子上に得た。この液晶パネルを120℃で
１時間焼成した後、紙フエノールで作られた回路
基板の端子部（最上層に厚さ15μmのハンダ層を
有する）、液晶パネルの端子部にハンダフラツク
スを塗布後ハンダゴテにより厚さ50μmのハンダ
コートを行ない。それぞれの部分を貼り合わせた
後、高周波加熱装置によつてハンダを接合した。
この密着性は１Kg／cmの密着強度があつた。[Example 4] A liquid crystal panel that had been pretreated for electroless plating in the same manner as in Example 1 was placed in an electroless copper plating bath (manufactured by Muromachi Kagaku Co., Ltd.) prepared by a predetermined method.
MK-430) for 6 minutes to obtain a 3000 Å copper plating layer on the terminal. After baking this liquid crystal panel at 120℃ for 1 hour, solder flux was applied to the terminals of the circuit board made of paper phenol (with a 15 μm thick solder layer on the top layer) and the terminals of the liquid crystal panel. Apply solder coating to a thickness of 50 μm using a soldering iron. After bonding each part together, solder was applied using a high-frequency heating device.
This adhesion had an adhesion strength of 1 kg/cm.
〔実施例 ５〕
実施例１と同様にして得られた端子上に4000Å
の無解Ｎメツキのついた液晶パネルを120℃で
１時間焼成し、ニツケル用ハンダフラツクスを塗
布した後溶融した300℃のスズデイツプ浴の中に
５秒間浸漬し、厚さ40μmのろう材としてのスズ
層を得た。この液晶パネルを100℃で５時間焼成
した後、ポリイミドテープに形成されたフレキシ
ブル回路基板の端子部（最上層にハンダ15μmの
層を有する）と液晶パネル端子部を合わせた後、
350℃に加熱された金属ツールをその部分に３
Kg／cm2の圧力で２秒間加圧接合した。[Example 5] A 4000 Å film was placed on the terminal obtained in the same manner as in Example 1.
A liquid crystal panel with unresolved N plating was baked at 120℃ for 1 hour, and after applying solder flux for nickel, it was immersed in a molten tin dip bath at 300℃ for 5 seconds to form a 40μm thick brazing material. A tin layer was obtained. After baking this liquid crystal panel at 100°C for 5 hours, the terminal part of the flexible circuit board formed on the polyimide tape (with a 15 μm layer of solder on the top layer) and the terminal part of the liquid crystal panel were combined.
3. Place a metal tool heated to 350℃ on the area.
Pressure bonding was carried out for 2 seconds at a pressure of Kg/cm 2 .
この実装方法によって得られた液晶パネルをと
回路基板の密着強度は1.7Kg／cm（接合部換算）
となり実用上問題のないものとなつた。 The adhesion strength between the LCD panel and the circuit board obtained using this mounting method is 1.7Kg/cm (converted to the joint area)
Therefore, there was no problem in practical use.
以上述べた如く、本発明によれば、製造が容易
で、高密度化にも対応でき、信頼性の高い電気的
接合ができる。特にSnとPdとを含む混合触媒液
に浸漬したので、金属酸化物からなる透明電極上
のみに選択的に無電解メツキが可能となり、した
がつてますます高密度化する端子部にも容易に対
応できる。さらに、混合触媒液に浸漬し、水洗し
た後アルカリ溶液に浸漬したので、透明電極を損
傷することなく、過剰のPd，Snイオンを除去す
ることができる。したがつて、透明電極上に均一
な金属被膜が形成できる。 As described above, according to the present invention, manufacturing is easy, high density can be accommodated, and highly reliable electrical bonding can be achieved. In particular, since it is immersed in a mixed catalyst solution containing Sn and Pd, it is possible to perform electroless plating selectively only on transparent electrodes made of metal oxides. I can handle it. Furthermore, since the electrode was immersed in a mixed catalyst solution, washed with water, and then immersed in an alkaline solution, excess Pd and Sn ions could be removed without damaging the transparent electrode. Therefore, a uniform metal coating can be formed on the transparent electrode.
第１図、ａ…回路基板と液晶パネルを実装す
る．前の状態図、１……フレキシブル回路基板、
２……液晶パネル、３……回路基板の端子部、
（裏側）４……液晶パネル端子部。
ｂ…回路基板と液晶パネルを実装した状態図、
５……回路基板端子部と液晶パネル端子部のハン
ダによる接合部。
Figure 1, a... Mount the circuit board and liquid crystal panel. Previous state diagram, 1...Flexible circuit board,
2...Liquid crystal panel, 3...Terminal section of circuit board,
(Back side) 4...LCD panel terminal section. b... State diagram with circuit board and liquid crystal panel mounted,
5... Soldered joint between circuit board terminal and liquid crystal panel terminal.
Claims (1)
板上に形成された端子部を有する液晶パネル
を、SnとPdとを含む混合触媒液に浸漬し、水
洗した後アルカリ溶液に浸漬する工程と、 ｂ 前記液晶パネルを無電解メッキ浴に浸漬し、
前記端子部上のみに金属被膜を形成する工程
と、 ｃ 前記金属被膜と回路基板の端子部とをろう材
によつて接合する工程とを少なくとも具備する
ことを特徴とする液晶パネルの製造方法。[Claims] 1 a. A liquid crystal panel having a terminal portion in which a transparent electrode made of a metal oxide is formed on a glass substrate is immersed in a mixed catalyst solution containing Sn and Pd, washed with water, and then immersed in an alkaline solution. a step of immersing the liquid crystal panel in an electroless plating bath;
A method for manufacturing a liquid crystal panel, comprising at least the steps of: forming a metal film only on the terminal portion; c. bonding the metal film and the terminal portion of a circuit board with a brazing material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6569182A JPS58182684A (en) | 1982-04-20 | 1982-04-20 | Mounting of display body panel |
| US06/827,211 US4666078A (en) | 1982-04-20 | 1986-02-04 | Electroless plated terminals of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6569182A JPS58182684A (en) | 1982-04-20 | 1982-04-20 | Mounting of display body panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182684A JPS58182684A (en) | 1983-10-25 |
| JPH0437967B2 true JPH0437967B2 (en) | 1992-06-23 |
Family
ID=13294284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6569182A Granted JPS58182684A (en) | 1982-04-20 | 1982-04-20 | Mounting of display body panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182684A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6187918B2 (en) | 2015-04-23 | 2017-08-30 | パナソニックＩｐマネジメント株式会社 | Circuit member connection structure, connection method, and connection material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050946A (en) * | 1973-09-03 | 1975-05-07 | ||
| JPS5127794A (en) * | 1974-06-24 | 1976-03-08 | Philips Nv | |
| JPS5383598A (en) * | 1976-12-28 | 1978-07-24 | Sharp Corp | Glass substrate |
| JPS56123363A (en) * | 1980-03-04 | 1981-09-28 | Toshiba Corp | Pretreating liquid for chemical plating |
-
1982
- 1982-04-20 JP JP6569182A patent/JPS58182684A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050946A (en) * | 1973-09-03 | 1975-05-07 | ||
| JPS5127794A (en) * | 1974-06-24 | 1976-03-08 | Philips Nv | |
| JPS5383598A (en) * | 1976-12-28 | 1978-07-24 | Sharp Corp | Glass substrate |
| JPS56123363A (en) * | 1980-03-04 | 1981-09-28 | Toshiba Corp | Pretreating liquid for chemical plating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58182684A (en) | 1983-10-25 |
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