JP2829547B2 - 高集積度電気相互接続システム - Google Patents
高集積度電気相互接続システムInfo
- Publication number
- JP2829547B2 JP2829547B2 JP6513205A JP51320594A JP2829547B2 JP 2829547 B2 JP2829547 B2 JP 2829547B2 JP 6513205 A JP6513205 A JP 6513205A JP 51320594 A JP51320594 A JP 51320594A JP 2829547 B2 JP2829547 B2 JP 2829547B2
- Authority
- JP
- Japan
- Prior art keywords
- interconnect
- interconnect element
- array
- contacts
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 230000000087 stabilizing effect Effects 0.000 claims description 48
- 238000003780 insertion Methods 0.000 claims description 31
- 230000037431 insertion Effects 0.000 claims description 31
- 238000010168 coupling process Methods 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 19
- 238000005859 coupling reaction Methods 0.000 claims description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 238000002955 isolation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 230000000052 comparative effect Effects 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910001369 Brass Inorganic materials 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000010951 brass Substances 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 230000010354 integration Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920013683 Celanese Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/26—Pin or blade contacts for sliding co-operation on one side only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
- H01R12/675—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals with contacts having at least a slotted plate for penetration of cable insulation, e.g. insulation displacement contacts for round conductor flat cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
- H01R4/2425—Flat plates, e.g. multi-layered flat plates
- H01R4/2429—Flat plates, e.g. multi-layered flat plates mounted in an insulating base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/931—Conductive coating
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98308392A | 1992-12-01 | 1992-12-01 | |
US983,083 | 1992-12-01 | ||
US07/983,083 | 1992-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08505980A JPH08505980A (ja) | 1996-06-25 |
JP2829547B2 true JP2829547B2 (ja) | 1998-11-25 |
Family
ID=25529785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6513205A Expired - Fee Related JP2829547B2 (ja) | 1992-12-01 | 1993-11-18 | 高集積度電気相互接続システム |
Country Status (10)
Country | Link |
---|---|
US (5) | US5575688A (en, 2012) |
EP (2) | EP0672309B1 (en, 2012) |
JP (1) | JP2829547B2 (en, 2012) |
KR (1) | KR100326283B1 (en, 2012) |
AT (2) | ATE225571T1 (en, 2012) |
AU (1) | AU5606894A (en, 2012) |
BR (1) | BR9307567A (en, 2012) |
DE (2) | DE69332360T2 (en, 2012) |
TW (1) | TW238431B (en, 2012) |
WO (1) | WO1994013034A1 (en, 2012) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5634821A (en) * | 1992-12-01 | 1997-06-03 | Crane, Jr.; Stanford W. | High-density electrical interconnect system |
TW238431B (en, 2012) | 1992-12-01 | 1995-01-11 | Stanford W Crane Jr | |
US5391082A (en) * | 1993-10-26 | 1995-02-21 | Airhart; Durwood | Conductive wedges for interdigitating with adjacent legs of an IC or the like |
KR970701885A (ko) | 1994-03-11 | 1997-04-12 | 크레인, 스탠포드 더블유 | 고대역폭 컴퓨터를 위한 모듈 구조(modular architecture for high bandwidth computers) |
TW247376B (en) * | 1994-03-11 | 1995-05-11 | W Crane Stanford Jr | High-density electrical interconnect system |
US5541449A (en) | 1994-03-11 | 1996-07-30 | The Panda Project | Semiconductor chip carrier affording a high-density external interface |
US5816841A (en) * | 1995-04-11 | 1998-10-06 | Acs Wireless, Inc. | Electrical disconnect for telephone headset |
US5791947A (en) * | 1995-06-07 | 1998-08-11 | The Panda Project | Contact beam for electrical interconnect component |
US5743751A (en) * | 1996-05-14 | 1998-04-28 | Davis; Philip E. | Straddle adapter for mounting edge connectors to a printed circuit board |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
EP1311030B1 (en) * | 1996-10-10 | 2006-09-20 | Fci | High density connector |
US6050850A (en) * | 1997-08-14 | 2000-04-18 | The Panda Project | Electrical connector having staggered hold-down tabs |
US6247972B1 (en) | 1997-08-14 | 2001-06-19 | Silicon Bandwidth, Inc. | Electrical connector assembly with a female electrical connector having internal flexible contact arm |
US6179663B1 (en) | 1998-04-29 | 2001-01-30 | Litton Systems, Inc. | High density electrical interconnect system having enhanced grounding and cross-talk reduction capability |
EP0982978B1 (de) * | 1998-08-25 | 2005-05-25 | Kiekert Aktiengesellschaft | Gehäuse, insbesondere Schlossgehäuse mit elektrischen Anschlusseinrichtungen |
US6402566B1 (en) * | 1998-09-15 | 2002-06-11 | Tvm Group, Inc. | Low profile connector assembly and pin and socket connectors for use therewith |
KR100284164B1 (ko) | 1998-10-14 | 2001-07-12 | 권문구 | 전기 상호접속 시스템 |
US6141869A (en) * | 1998-10-26 | 2000-11-07 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
US6305987B1 (en) | 1999-02-12 | 2001-10-23 | Silicon Bandwidth, Inc. | Integrated connector and semiconductor die package |
KR20020027555A (ko) | 1999-08-17 | 2002-04-13 | 추후제출 | 향상된 접지 및 혼신저감 성능을 가진 고밀도 전기인터커넥트 시스템 |
US6354885B1 (en) | 2000-06-05 | 2002-03-12 | Northrop Grumman Corporation | Guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems |
US7337522B2 (en) * | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
US6910897B2 (en) | 2001-01-12 | 2005-06-28 | Litton Systems, Inc. | Interconnection system |
US6843657B2 (en) | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
US6979202B2 (en) | 2001-01-12 | 2005-12-27 | Litton Systems, Inc. | High-speed electrical connector |
US6769923B2 (en) * | 2001-12-17 | 2004-08-03 | Lsi Logic Corporation | Fluted signal pin, cap, membrane, and stanchion for a ball grid array |
US7061342B2 (en) * | 2001-12-28 | 2006-06-13 | Molex Incorporated | Differential transmission channel link for delivering high frequency signals and power |
US6905367B2 (en) | 2002-07-16 | 2005-06-14 | Silicon Bandwidth, Inc. | Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same |
CN1774835B (zh) | 2003-03-14 | 2013-06-12 | 莫莱克斯公司 | 具有底座形状的基本传输通道链路组 |
US7114961B2 (en) | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US7244125B2 (en) | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US7628617B2 (en) | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US7758351B2 (en) | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US7597561B2 (en) | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
US7135764B2 (en) * | 2003-08-07 | 2006-11-14 | Aries Electronics, Inc. | Shielded semiconductor chip carrier having a high-density external interface |
US7347698B2 (en) | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
US20050205988A1 (en) * | 2004-03-19 | 2005-09-22 | Epic Technology Inc. | Die package with higher useable die contact pad area |
TWI309094B (en) | 2004-03-19 | 2009-04-21 | Neoconix Inc | Electrical connector in a flexible host and method for fabricating the same |
US7281950B2 (en) | 2004-09-29 | 2007-10-16 | Fci Americas Technology, Inc. | High speed connectors that minimize signal skew and crosstalk |
US20070050738A1 (en) * | 2005-08-31 | 2007-03-01 | Dittmann Larry E | Customer designed interposer |
US7344391B2 (en) * | 2006-03-03 | 2008-03-18 | Fci Americas Technology, Inc. | Edge and broadside coupled connector |
US7407413B2 (en) * | 2006-03-03 | 2008-08-05 | Fci Americas Technology, Inc. | Broadside-to-edge-coupling connector system |
US7431616B2 (en) * | 2006-03-03 | 2008-10-07 | Fci Americas Technology, Inc. | Orthogonal electrical connectors |
US7331830B2 (en) * | 2006-03-03 | 2008-02-19 | Fci Americas Technology, Inc. | High-density orthogonal connector |
US20070207632A1 (en) * | 2006-03-03 | 2007-09-06 | Fci Americas Technology, Inc. | Midplane with offset connectors |
WO2007124113A2 (en) * | 2006-04-21 | 2007-11-01 | Neoconix, Inc. | Clamping a flat flex cable and spring contacts to a circuit board |
US7500871B2 (en) | 2006-08-21 | 2009-03-10 | Fci Americas Technology, Inc. | Electrical connector system with jogged contact tails |
US7278854B1 (en) * | 2006-11-10 | 2007-10-09 | Tyco Electronics Corporation | Multi-signal single pin connector |
US7497736B2 (en) | 2006-12-19 | 2009-03-03 | Fci Americas Technology, Inc. | Shieldless, high-speed, low-cross-talk electrical connector |
US7422444B1 (en) | 2007-02-28 | 2008-09-09 | Fci Americas Technology, Inc. | Orthogonal header |
JP4967771B2 (ja) * | 2007-04-11 | 2012-07-04 | オムロン株式会社 | コンタクトおよびコネクタ |
US7811100B2 (en) | 2007-07-13 | 2010-10-12 | Fci Americas Technology, Inc. | Electrical connector system having a continuous ground at the mating interface thereof |
US8764464B2 (en) | 2008-02-29 | 2014-07-01 | Fci Americas Technology Llc | Cross talk reduction for high speed electrical connectors |
WO2010056935A1 (en) | 2008-11-14 | 2010-05-20 | Molex Incorporated | Resonance modifying connector |
CN102318143B (zh) | 2008-12-12 | 2015-03-11 | 莫列斯公司 | 谐振调整连接器 |
US9277649B2 (en) | 2009-02-26 | 2016-03-01 | Fci Americas Technology Llc | Cross talk reduction for high-speed electrical connectors |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US8006075B2 (en) | 2009-05-21 | 2011-08-23 | Oracle America, Inc. | Dynamically allocated store queue for a multithreaded processor |
JP5297326B2 (ja) * | 2009-10-08 | 2013-09-25 | 富士通コンポーネント株式会社 | 雄コネクタ、コネクタ及びバックプレーン |
US8267721B2 (en) | 2009-10-28 | 2012-09-18 | Fci Americas Technology Llc | Electrical connector having ground plates and ground coupling bar |
US8616919B2 (en) | 2009-11-13 | 2013-12-31 | Fci Americas Technology Llc | Attachment system for electrical connector |
JP4905542B2 (ja) * | 2009-11-30 | 2012-03-28 | 日立電線株式会社 | コネクタ |
JP2012074208A (ja) * | 2010-09-28 | 2012-04-12 | Hitachi Cable Ltd | コネクタ |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
EP2624034A1 (en) | 2012-01-31 | 2013-08-07 | Fci | Dismountable optical coupling device |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
EP3016116A1 (en) | 2014-11-03 | 2016-05-04 | Roche Diagniostics GmbH | Printed circuit board arrangement, coil for a laboratory sample distribution system, laboratory sample distribution system and laboratory automation system |
USD882653S1 (en) * | 2015-07-06 | 2020-04-28 | Sumitomo Electric Hardmetal Corp. | Drilling tool |
CN208522114U (zh) * | 2017-04-24 | 2019-02-19 | 连展科技(深圳)有限公司 | 板对板电连接器之微机电(mems)端子结构 |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2446232A (en) * | 1946-08-22 | 1948-08-03 | Gen Railway Signal Co | Plug board arrangement |
BE639646A (en, 2012) * | 1962-11-08 | |||
BE636073A (en, 2012) * | 1962-11-19 | |||
US3337838A (en) * | 1964-12-16 | 1967-08-22 | Burndy Corp | Wiping contact |
US3432801A (en) | 1966-10-31 | 1969-03-11 | Dynamics Corp America | Patchboard programming system |
NL137793B (en, 2012) * | 1967-06-05 | 1900-01-01 | ||
US3848221A (en) * | 1973-03-07 | 1974-11-12 | Int Prod Technology Corp | Contact assembly utilizing flexible contacts for pins of integrated circuits |
US3868162A (en) * | 1973-09-04 | 1975-02-25 | Elfab Corp | Electrical connector |
US3989331A (en) * | 1974-08-21 | 1976-11-02 | Augat, Inc. | Dual-in-line socket |
US4274700A (en) * | 1977-10-12 | 1981-06-23 | Bunker Ramo Corporation | Low cost electrical connector |
US4169646A (en) * | 1977-11-14 | 1979-10-02 | Amp Incorporated | Insulated contact |
EP0036933A3 (de) * | 1980-03-28 | 1981-12-02 | Bohdan Ulrich | Steckverbinder und Verwendung desselben zur Herstellung einer lösbaren elektrischen Verbindung |
US4392705A (en) * | 1981-09-08 | 1983-07-12 | Amp Incorporated | Zero insertion force connector system |
US4572604A (en) * | 1982-08-25 | 1986-02-25 | Elfab Corp. | Printed circuit board finger connector |
US4482937A (en) | 1982-09-30 | 1984-11-13 | Control Data Corporation | Board to board interconnect structure |
US4487463A (en) * | 1983-02-22 | 1984-12-11 | Gulf & Western Manufacturing Company | Multiple contact header assembly |
US4575167A (en) * | 1984-04-02 | 1986-03-11 | Minter Jerry B | Electrical connector for printed circuit boards and the like |
US4655526A (en) * | 1984-08-31 | 1987-04-07 | Amp Incorporated | Limited insertion force contact terminals and connectors |
US4616406A (en) * | 1984-09-27 | 1986-10-14 | Advanced Micro Devices, Inc. | Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein |
US4654472A (en) * | 1984-12-17 | 1987-03-31 | Samuel Goldfarb | Electronic component package with multiconductive base forms for multichannel mounting |
US4695106A (en) * | 1985-05-13 | 1987-09-22 | Amp Incorporated | Surface mount, miniature connector |
US4732565A (en) * | 1985-05-28 | 1988-03-22 | Mg Company, Ltd. | Electric connector |
JPH0777247B2 (ja) * | 1986-09-17 | 1995-08-16 | 富士通株式会社 | 半導体装置の製造方法 |
US4715829A (en) * | 1986-11-13 | 1987-12-29 | Amp Incorporated | High density electrical connector system |
US4722470A (en) * | 1986-12-01 | 1988-02-02 | International Business Machines Corporation | Method and transfer plate for applying solder to component leads |
US4734042A (en) * | 1987-02-09 | 1988-03-29 | Augat Inc. | Multi row high density connector |
DE3720925A1 (de) * | 1987-06-25 | 1989-01-05 | Wabco Westinghouse Fahrzeug | Leiterplatte |
US4820196A (en) * | 1987-10-01 | 1989-04-11 | Unisys Corporation | Sealing of contact openings for conformally coated connectors for printed circuit board assemblies |
KR890011145A (ko) * | 1987-12-15 | 1989-08-12 | 제이 엘.사이칙 | 핀 그리드 어레이용 소켓 |
US5117069A (en) * | 1988-03-28 | 1992-05-26 | Prime Computer, Inc. | Circuit board fabrication |
US4838800A (en) | 1988-05-23 | 1989-06-13 | Gte Products Corporation | High density interconnect system |
US4897055A (en) * | 1988-11-28 | 1990-01-30 | International Business Machines Corp. | Sequential Connecting device |
US5037311A (en) * | 1989-05-05 | 1991-08-06 | International Business Machines Corporation | High density interconnect strip |
US4975066A (en) * | 1989-06-27 | 1990-12-04 | Amp Incorporated | Coaxial contact element |
JP2890495B2 (ja) * | 1989-07-14 | 1999-05-17 | 日本電気株式会社 | 高密度電気コネクタ |
US4943846A (en) * | 1989-11-09 | 1990-07-24 | Amp Incorporated | Pin grid array having seperate posts and socket contacts |
US5123164A (en) * | 1989-12-08 | 1992-06-23 | Rockwell International Corporation | Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
US5015207A (en) * | 1989-12-28 | 1991-05-14 | Isotronics, Inc. | Multi-path feed-thru lead and method for formation thereof |
US4997376A (en) * | 1990-03-23 | 1991-03-05 | Amp Incorporated | Paired contact electrical connector system |
US5071363A (en) * | 1990-04-18 | 1991-12-10 | Minnesota Mining And Manufacturing Company | Miniature multiple conductor electrical connector |
US5081563A (en) * | 1990-04-27 | 1992-01-14 | International Business Machines Corporation | Multi-layer package incorporating a recessed cavity for a semiconductor chip |
CA2023361A1 (en) * | 1990-07-20 | 1992-01-21 | Robert L. Barnhouse | Printed circuit boards |
US5133669A (en) * | 1990-07-23 | 1992-07-28 | Northern Telecom Limited | Circuit board pins |
JPH0732042B2 (ja) * | 1990-10-11 | 1995-04-10 | 富士通株式会社 | スルーホール接続形電子デバイスとその実装方法 |
JP2876773B2 (ja) * | 1990-10-22 | 1999-03-31 | セイコーエプソン株式会社 | プログラム命令語長可変型計算装置及びデータ処理装置 |
US5080611A (en) * | 1990-12-21 | 1992-01-14 | Amp Incorporated | Boardlock for common-hole double-sided mounting |
US5140659A (en) * | 1991-01-28 | 1992-08-18 | Hughes Aircraft Company | Combination optical fiber and electrical connector |
US5088934A (en) | 1991-02-20 | 1992-02-18 | Chian Chyun Enterprise Co. Ltd. | Electrical terminal |
US5351393A (en) * | 1991-05-28 | 1994-10-04 | Dimensonal Circuits Corporation | Method of mounting a surface-mountable IC to a converter board |
JPH05160292A (ja) * | 1991-06-06 | 1993-06-25 | Toshiba Corp | 多層パッケージ |
JP2966972B2 (ja) * | 1991-07-05 | 1999-10-25 | 株式会社日立製作所 | 半導体チップキャリアとそれを実装したモジュール及びそれを組み込んだ電子機器 |
JP2583839B2 (ja) * | 1991-07-24 | 1997-02-19 | ヒロセ電機株式会社 | 高速伝送電気コネクタ |
US5137456A (en) * | 1991-11-04 | 1992-08-11 | International Business Machines Corporation | High density, separable connector and contact for use therein |
US5190460A (en) | 1991-11-27 | 1993-03-02 | At&T Bell Laboratories | Central office connector for a distributing frame system |
US5145400A (en) | 1991-12-30 | 1992-09-08 | Ag Communication Systems Corporation | Spring contacts for substrate connection |
TW238431B (en, 2012) * | 1992-12-01 | 1995-01-11 | Stanford W Crane Jr | |
US5634821A (en) | 1992-12-01 | 1997-06-03 | Crane, Jr.; Stanford W. | High-density electrical interconnect system |
US5342999A (en) * | 1992-12-21 | 1994-08-30 | Motorola, Inc. | Apparatus for adapting semiconductor die pads and method therefor |
US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
US5390412A (en) * | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
EP0701740A1 (en) * | 1993-05-07 | 1996-03-20 | Minnesota Mining And Manufacturing Company | Connector component contact system |
US5330372A (en) * | 1993-05-13 | 1994-07-19 | Minnesota Mining And Manufacturing Company | High-density connector |
US6030248A (en) * | 1998-10-29 | 2000-02-29 | Hewlett-Packard Company | Mechanical latch for mating printed circuit board connectors |
-
1992
- 1992-12-12 TW TW081109972A patent/TW238431B/zh active
-
1993
- 1993-11-18 AT AT97105375T patent/ATE225571T1/de not_active IP Right Cessation
- 1993-11-18 AT AT94901497T patent/ATE159618T1/de not_active IP Right Cessation
- 1993-11-18 EP EP94901497A patent/EP0672309B1/en not_active Expired - Lifetime
- 1993-11-18 AU AU56068/94A patent/AU5606894A/en not_active Abandoned
- 1993-11-18 DE DE69332360T patent/DE69332360T2/de not_active Expired - Fee Related
- 1993-11-18 WO PCT/US1993/011041 patent/WO1994013034A1/en active IP Right Grant
- 1993-11-18 DE DE69314809T patent/DE69314809T2/de not_active Expired - Fee Related
- 1993-11-18 KR KR1019950702208A patent/KR100326283B1/ko not_active Expired - Fee Related
- 1993-11-18 EP EP97105375A patent/EP0791981B1/en not_active Expired - Lifetime
- 1993-11-18 JP JP6513205A patent/JP2829547B2/ja not_active Expired - Fee Related
- 1993-11-18 BR BR9307567A patent/BR9307567A/pt not_active IP Right Cessation
-
1995
- 1995-01-31 US US08/381,142 patent/US5575688A/en not_active Expired - Fee Related
-
1996
- 1996-11-07 US US08/744,377 patent/US5967850A/en not_active Expired - Fee Related
-
1999
- 1999-09-28 US US09/407,955 patent/US6203347B1/en not_active Expired - Fee Related
-
2001
- 2001-01-22 US US09/765,305 patent/US6554651B2/en not_active Expired - Fee Related
-
2003
- 2003-03-25 US US10/395,259 patent/US20030194909A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0791981A2 (en) | 1997-08-27 |
US20020028589A1 (en) | 2002-03-07 |
WO1994013034A1 (en) | 1994-06-09 |
US6554651B2 (en) | 2003-04-29 |
EP0672309A1 (en) | 1995-09-20 |
KR950704832A (ko) | 1995-11-20 |
DE69314809T2 (de) | 1998-02-12 |
EP0791981B1 (en) | 2002-10-02 |
KR100326283B1 (ko) | 2002-07-27 |
US6203347B1 (en) | 2001-03-20 |
ATE159618T1 (de) | 1997-11-15 |
TW238431B (en, 2012) | 1995-01-11 |
ATE225571T1 (de) | 2002-10-15 |
EP0672309B1 (en) | 1997-10-22 |
JPH08505980A (ja) | 1996-06-25 |
DE69332360D1 (de) | 2002-11-07 |
US5575688A (en) | 1996-11-19 |
EP0791981A3 (en) | 1997-09-03 |
BR9307567A (pt) | 1999-06-15 |
US5967850A (en) | 1999-10-19 |
AU5606894A (en) | 1994-06-22 |
DE69332360T2 (de) | 2003-02-13 |
US20030194909A1 (en) | 2003-10-16 |
DE69314809D1 (de) | 1997-11-27 |
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