JP2599890C - - Google Patents
Info
- Publication number
- JP2599890C JP2599890C JP2599890C JP 2599890 C JP2599890 C JP 2599890C JP 2599890 C JP2599890 C JP 2599890C
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- solder
- solder material
- addition
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 27
- 229910052725 zinc Inorganic materials 0.000 claims description 23
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 description 49
- 229910045601 alloy Inorganic materials 0.000 description 43
- 239000000956 alloy Substances 0.000 description 43
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 37
- 238000002844 melting Methods 0.000 description 17
- 229910020836 Sn-Ag Inorganic materials 0.000 description 12
- 229910020988 Sn—Ag Inorganic materials 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000012071 phase Substances 0.000 description 8
- 229910001297 Zn alloy Inorganic materials 0.000 description 6
- 229910002056 binary alloy Inorganic materials 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000006023 eutectic alloy Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 4
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- -1 Tin-silver Chemical compound 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052904 quartz Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 210000001503 Joints Anatomy 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atoms Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
Family
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