JP2591999Y2 - 集積回路のパッケージの構造 - Google Patents

集積回路のパッケージの構造

Info

Publication number
JP2591999Y2
JP2591999Y2 JP1990004698U JP469890U JP2591999Y2 JP 2591999 Y2 JP2591999 Y2 JP 2591999Y2 JP 1990004698 U JP1990004698 U JP 1990004698U JP 469890 U JP469890 U JP 469890U JP 2591999 Y2 JP2591999 Y2 JP 2591999Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit board
semiconductor element
package structure
multilayer circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990004698U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0396047U (US06649357-20031118-C00005.png
Inventor
亮一 長岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1990004698U priority Critical patent/JP2591999Y2/ja
Publication of JPH0396047U publication Critical patent/JPH0396047U/ja
Application granted granted Critical
Publication of JP2591999Y2 publication Critical patent/JP2591999Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)
JP1990004698U 1990-01-22 1990-01-22 集積回路のパッケージの構造 Expired - Lifetime JP2591999Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990004698U JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990004698U JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Publications (2)

Publication Number Publication Date
JPH0396047U JPH0396047U (US06649357-20031118-C00005.png) 1991-10-01
JP2591999Y2 true JP2591999Y2 (ja) 1999-03-10

Family

ID=31508432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990004698U Expired - Lifetime JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Country Status (1)

Country Link
JP (1) JP2591999Y2 (US06649357-20031118-C00005.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341475Y2 (US06649357-20031118-C00005.png) * 1985-12-16 1991-08-30
JPS6448039U (US06649357-20031118-C00005.png) * 1987-09-21 1989-03-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法

Also Published As

Publication number Publication date
JPH0396047U (US06649357-20031118-C00005.png) 1991-10-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term