JP2587462B2 - Enamel substrate and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for applying enamel frit to a metal core, sintering and cutting, or sintering and forming a circuit, or mounting and cutting parts after forming a circuit. Thus, the present invention relates to an enamel substrate suitable for obtaining a large number of enamel substrates and a method for manufacturing the enamel substrate.

[Prior art] Conventionally, when making a hybrid integrated circuit using an alumina substrate, for example, a groove of a finally required size is previously formed in a 100 mm × 100 mm substrate, and circuit formation, component mounting, wire Perform bonding etc. After completion, this is cut (chocolate break) to obtain the final product. For this cutting, a method of cutting by hand, cutting with a CO ₂ laser, cutting with a press or the like is used. A dedicated device for cutting for this purpose is also commercially available.

Since tens of ordinary hybrid integrated circuits are manufactured from a 100 mm x 100 mm substrate, this method is an indispensable technology for simultaneously manufacturing a large number of substrates on which circuits are formed and components are mounted.

On the other hand, cutting the enamel substrate after circuit formation or component mounting is troublesome. Therefore, conventionally, cutting by a press or the like or mechanical cutting by a dry or wet grindstone has been performed before circuit formation.

However, such a method requires equipment for cutting, and the method using a press has a problem that enamel powder is generated at the time of cutting, and washing and drying must be performed later. Furthermore, there were problems that the enamel layer around the cut portion was damaged and that the life of the press mold was short because the enamel was hard.

Further, in the case of mechanical cutting with a grindstone, there is also a problem that cleaning after cutting is necessary because the cutting powder and a liquid material of the cutting powder adhere thereto.

Thus, unlike the alumina substrate, when trying to obtain an enameled substrate that can be cut into many pieces with an enameled substrate, there is a problem of dirt at the time of cutting and a problem such as damage to the enameled coating layer near the cut portion, Furthermore, there is a problem that it is difficult to cut after forming a circuit or mounting components.

[Problems to be Solved by the Invention] The object of the present invention is to eliminate the problem of dirt at the time of cutting and the problem of causing damage to the enamel coating layer near the cut portion,
In addition, an object of the present invention is to provide an enamel substrate that can be cut into many pieces and that can be cut even after circuit formation or component mounting, and a method of manufacturing the same.

[Means for Solving the Problems] The present inventors have conducted intensive research to solve the above problems. As a result, an enameled enameled substrate is formed by bending at least one or both surfaces of the metal core before enameling, and the enameled metal is exposed so that the groove or the groove and the metal core in the vicinity thereof are exposed. Have achieved the object and completed the present invention.

That is, the present invention is a hollow substrate formed by forming crystallized glass on a metal core, has a groove portion that can be cut by bending at least one or both surfaces of the substrate, and the groove portion or the groove portion to be cut and the An enamel substrate wherein a nearby metal core is exposed.

To manufacture the enamel substrate, the enamel is not attached to the groove portion or the metal portion near the groove portion and the groove portion,
A method of baking after glazing by a printing method or a masking method may be adopted.However, the present inventors further devised the shape of the groove, so that even after enameling by a general glaze method, It has been found that the groove portion or the metal in the vicinity of the groove portion can be exposed.

That is, in the second invention, the metal core of the part to be finally cut for the enamel substrate has a depth of 0.2 mm or more in advance,
A groove having a radius of curvature at the bottom (depth expressed in mm -0.1) mm or less and an angle of 120 ° or less is provided, and this core is pre-treated, glazed and fired, and the groove or the groove is formed. The method for manufacturing an enameled substrate according to the above, wherein a metal core in the vicinity thereof is exposed.

Since the enamel substrate of the present invention can be easily cut by bending by hand, there is a problem of contamination at the time of cutting such as when a conventional enamel substrate is cut by a press or the like or mechanically cut by a dry or wet grindstone. Also, there is no risk of causing damage to the enamel coating layer near the cut portion, and even after the circuit is formed, the circuit can be easily cut without affecting the circuit.

In the manufacturing method in which the glaze is performed by a printing method so that enamel does not adhere to the groove portion or the vicinity of the groove portion of the metal core, or the groove portion is masked and glazed and fired, the shape of the groove is bent by hand. There is an advantage that the shape is arbitrary as long as it can be cut, but the glaze is extremely complicated, the method of glaze is limited to the printing method and the masking method, and the area around the groove is not widely taken To get
There is also a problem that the metal core is oxidized during firing.

Of course, if a metal having high oxidation resistance such as stainless steel is used as the metal core, this problem can be prevented, but there is a problem that the material is limited. The production method of the present invention
By specifying the shape of the groove to be formed as described above, it was found that when the core was pre-treated as usual, the entire surface was glazed, fired, and when the glass melted, it was possible to prevent the enamel from sticking to the groove portion. . Therefore, the enamel can be attached very close to the groove without damaging the enamel when it is bent and cut by hand. Therefore, the following describes this method in detail.

In FIG. 4 (A), 9 is an enamel substrate, and 8 is a tab, which is a hook portion for pretreatment, glaze, and firing. Also in FIG. 4 (B), 11 is a tab, 12, 13, 14, and 15 are enamel substrates. In this case, four substrates are shown. Glaze and bake.

After baking, the tabs need to be cut at positions 10, 16, and 17, and the enamel substrates need to be cut at connection positions 18, 19, 20, and 21. At the time of cutting, it is necessary to avoid damaging the enameled substrate and soiling it with cutting powder or the like.

FIG. 5 shows a case in which a groove is formed in the metal core in advance, and enamel is applied by a printing method or a masking method so that the enamel is not applied to the groove. 1 is a metal core, 3 and 4 are enamels, and 22 is a groove. A portion, such as 23, which does not cover the enamel is formed around the groove so that the enamel is not damaged at the time of bending and cutting. Glaze is by printing,
It is troublesome because masking is performed on the portion not covered with the enamel.

In the second aspect of the present invention, the groove to be formed on the metal core has a depth of
0.2 mm or more, the radius of curvature R at the bottom is (depth expressed in mm-
0.1) mm or less, and the angle is 120 ° or less.

When such a groove is formed, no matter what method such as normal doughing, spraying, and electrodeposition, the entire surface is glazed, when firing, when the glass is melted, sink occurs due to the surface tension of the glass, and the bottom of the groove or The enamel is not attached only to the vicinity, and the enamel can be attached to the boundary of the groove.
If the groove deviates from the above condition, the enamel groove cannot be formed.

The groove may be formed in a wedge shape only on one side of the core as shown in FIG. 1 (A), or may be formed in a wedge shape from both sides of the core as shown in FIG. 2 (A). As shown in the figure, it may be wedge-shaped from above and below and from the side.

The groove may be formed by pressing or cutting when punching the metal core.

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to these Examples.

Example 1 A case where grooves are formed on both surfaces of a metal core as shown in FIG. 2 will be described. For comparison, a groove was formed by changing the depth of the groove, the radius of curvature of the bottom, and the angle as shown in Table 1, and was subjected to a normal pretreatment, followed by glazing a crystallized enamel frit by electrodeposition and firing. . The thickness of the metal core was 1.0 mm, and the thickness of the enamel was 150 μm.

The results are shown in Table 1. As shown in Table 1, when the groove depth is 0.2 mm or more, the bottom radius of curvature is (depth expressed in mm -0.1) mm or less, and the angle is 120 ° or less, the enamel groove formation state. Was good.

That is, the enamel does not adhere only to the wedge-shaped grooves 2 and 6 of the metal core 1, but the enamel adheres to the edge of the cut enamel substrate as shown at 5.

The substrate thus obtained can be easily cut by bending it several times alternately on both sides, in which case the enamel layer is not damaged on either side.

If the shape of the groove previously inserted into the metal core deviates from the above-mentioned condition, the enamel is also applied to the groove, so that the enamel layer cannot be cut without being damaged.

(Example 2) When grooves are formed as shown in FIG. 1 (A), only the wedge-shaped grooves 2 of the metal core 1 are formed as shown in FIG. 1 (C).
The enamel does not adhere and the enamel does not adhere, and the enamel adheres to the edge of the enamel substrate after cutting, as shown at 5. Here, as shown in FIG. 1 (D), when the wedge portion is pressed and bent, a crack is formed in a very narrow portion of the enamel on the back surface, the enamel is cut, and the enamel is straightened and bent several times. By doing so, it can be cut. At this time, no damage occurs to the enamel layer on the upper surface.

(Example 3) When wedge-shaped grooves are formed not only on the upper and lower surfaces but also on both side surfaces as shown in FIG. It can be cut by hand without any damage to the surroundings.

[Effect of the Invention] When making a hybrid integrated circuit (HIC) using an alumina substrate, a groove is formed in a large-sized substrate in advance so as to have a required size, and circuit formation, component mounting, wire bonding, etc. are performed. After that, cutting by hand has been performed by a chocolate break, but it has been conventionally difficult to cut such a hand with an enamel substrate, which has been a disadvantage of the enamel substrate.

According to the present invention, by forming a groove in a metal core in advance and forming an enamel substrate in which a groove or a core in the vicinity of the groove is exposed, chocolate and chocolate can be easily formed just like an alumina substrate.
Break is now possible.

According to the method of the present invention, at least a circuit is formed by performing a pretreatment, an entire glaze, and firing all at once using a multi-core metal core provided with grooves that can be bent and cut by hand on one or both sides in advance. It is possible to obtain an enameled substrate that can be cut and cut without damaging the enameled coating layer on the side to be cut in such a way as to cause a practical problem.

Therefore, enamel powder is generated as in the case of cutting with a conventional press, and there is no disadvantage that post-cleaning is required or the periphery of the cut portion is damaged, and cutting powder is generated as in the case of mechanical cutting with a grindstone In addition, since there is no drawback that requires post-cleaning, it is extremely useful industrially.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface perpendicular to the groove of the enamel substrate when the cutting method of the present invention is performed by forming a groove on one surface of a metal core. (A) shows a metal core, (B) shows a process after enamelling, (C) shows a process after baking, and (D) shows a process of bending and cutting. FIG. 2 is a similar cross-sectional view when the groove of the present invention is formed on the upper and lower surfaces. (A) shows a metal core, (B) shows after enamelling, and (C) shows after enamelling and firing. FIG. 3 is a perspective view of a core in the case where grooves of the present invention are formed on two upper and lower surfaces and both side surfaces. FIG. 4 (A) is an explanatory view of cutting between an enamel substrate and a tab. FIG. 4 (B) is an explanatory view showing division of a multi-piece substrate. FIG. 5 is a cross-sectional view after glazing and firing by a printing method and a masking method.

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Takao Suzuki 1-5-1, Kiba, Koto-ku, Tokyo Fujikura Electric Wire Co., Ltd. (56) References JP-A-62-177948 (JP, A) JP-A-64 −31444 (JP, A)

Claims (2)

(57) [Claims] An enameled substrate having a crystallized glass formed on a metal core, wherein at least one or both surfaces of the substrate have a groove part which can be cut by bending, and the groove part or the groove part to be cut is provided. An enameled substrate having a core in the vicinity thereof exposed. 2. A metal core of a portion to be finally cut for an enamel substrate has a depth of 0.2 mm or more in advance, a radius of curvature of a bottom portion of (depth in mm-0.1) mm or less, and an angle of 120 mm or less. The manufacturing of the enameled substrate according to claim 1, wherein the following grooves are formed, and the core is pre-treated, glazed and fired to expose the grooves or the metal cores in the vicinity of the grooves. Method.