JPS5925976A - Production of enamel substrate - Google Patents

Abstract

PURPOSE:To obtain an enamel substrate having flat surfaces without edge working and deburring and any build-up, by dividing the calcination to be accomplished after deposition of an inorg. glass layer on the surface of a metallic plate to primary and secondary calcination, and performing the secondary calcination while pressing the glass layer. CONSTITUTION:A prescribed wall thickness of an inorg. glass layer 11 is formed on the surface of a metallic plate 10 by electrodeposition painting and is subjected to primary calcination. The plate 10 formed of the layer 11 is sandwiched from both sides with heat-resistant press plates 12 having flat surfaces. The assembly is installed in an electric furnace and is subjected to secondary calcination. The plates 12 have the prescribed weight corresponding to the outside dimension of the plate 10 so as to come into tight contact with the layer 11, for which carbon plates or the like having the heat resistance to the extent of prohibiting melt sticking to the layer 11 in the stage of secondary calcination are used. If the plates 12 are removed after the secondary calcination, an enamel substrate 15 which has smooth surfaces, permits easy printing of electric circuits and mounting of parts and can be stably mounted to other apparatus is obtd.

Description

[Detailed description of the invention] The present invention relates to a method for manufacturing a hollow substrate.

Conventionally, hollow substrates have been manufactured by applying inorganic glass to the surface of a metal plate by electrodeposition, electrostatic coating, or coating, and then baking it at a high temperature. . As shown in FIG. 1, the hollow substrate manufactured in this manner has a so-called raised area 3 formed around the periphery of the metal plate 1 due to the surface tension of the inorganic glass layer 20 adhered to the surface of the metal plate 1. It has a shape called dog bone. This excitement 3
Therefore, it is not possible to print an electric circuit on the hollow substrate 5 with high precision. Furthermore, electrical parts etc. cannot be reliably attached. Furthermore, it is not possible to stably attach the hollow substrate 5 that has been subjected to predetermined processing to other equipment.

In order to eliminate these drawbacks, it is necessary to perform edge processing and deburring in advance on the peripheral portion of the metal plate 1. Another disadvantage is that it is necessary to perform Q1 polishing and surface preparation processing to remove the raised scratches 3 on the baked edges of the inorganic glass layer 2.

The present invention has been made in view of the above points, and has a method that reduces the edge processing and deburring processing, and has a flat surface without any raised edges, which allows printing of electric circuits and the number of parts. To provide a method for manufacturing a hollow substrate, which can easily produce a hollow substrate that can be easily cut into pieces and can be stably attached to other equipment.

Embodiments of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 2 (4), an inorganic glass layer 11 of a predetermined thickness is formed on the surface of a metal plate 10 by electrodeposition coating,
This is then subjected to a second firing. - As the next firing temperature, a desired temperature such as 650°C or 850°C is set according to the specifications of the hollow substrate to be manufactured.

Next, as shown in the figure (B), the metal plate 10 on which the inorganic glass N11 has been formed is held between both sides by heat-resistant suppression plates 12 with a flat surface, and placed in an electric furnace to undergo secondary firing. give The heat-resistant suppression plate 12 has a predetermined thickness of 1 (usually 1
00 to 500P) and has heat resistance to the extent that it does not fuse with the inorganic glass layer 11 during secondary firing. The secondary firing temperature is set to a temperature close to the primary firing temperature at which the inorganic glass layer 11 becomes fluid.

The atmosphere during the secondary firing is a reducing atmosphere such as the atmosphere surrounding the crab.

Moreover, it is desirable to set the processing time to 2 to 10 minutes.

After that, after the secondary firing, the heat-resistant suppression plate 12 is removed and the same figure (
As shown in C), a hollow substrate 15 with a flat surface is obtained.

As described above, according to this hollow substrate manufacturing method, the inorganic glass layer 11 flows under the pressing force of the heat-resistant pressing plate 12 during secondary firing. As a result, after the secondary firing, the heat-resistant suppression plate 1
2 is removed, the surface of the inorganic glass layer 11 becomes an extremely flat surface. Therefore, the surface of the inorganic glass M11 can be made almost completely flat by a simple polishing process. Therefore, a desired electrical circuit can be printed on the surface of the hollow substrate 15 with high precision, and desired electrical components and the like can be reliably attached. Furthermore, since the surface is flat, the contact area when attached to a heat sink can be increased to improve heat dissipation characteristics, and it can be stably attached to other equipment. Furthermore, flattening the surface can be achieved by an extremely simple operation of pressing the heat-resistant suppression plate 12 onto the surface of the inorganic glass layer 11 and performing secondary firing, which eliminates the need for edge processing and deburring processing, which require a lot of effort. This can be made unnecessary and productivity can be increased by lj:.

Note that the shape of the heat-resistant suppression plate 12 is based on the hollow substrate 1 to be manufactured.
Set appropriately according to the specifications of 5, and inorganic glass layer 1 on one side.
The heat-resistant suppression plate 12 may be placed only on top of the heat-resistant suppression plate 12.

As explained above, according to the method of the present invention, edge machining and deburring machining are not required, and the deer has a flat surface without raised creases, making it easy to print electrical circuits and attach parts. It is possible to easily manufacture a hollow substrate that is easy and stable and can be attached to other equipment in a stable state.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a 2-Ro substrate manufactured by the conventional method, and FIGS. 2-2C are explanatory diagrams showing the method of the present invention in the order of steps. 10...Metal plate, 11...Inorganic glass layer, 12...
・Heat-resistant press plate, 15...Hollow board. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 (A) 1 Telephone (B) 2 (C)

Claims (1)

[Claims] After an inorganic glass layer is deposited on the surface of a metal plate, primary firing is performed at a predetermined temperature, and then secondary firing is performed while pressing the surface of the inorganic glass layer with a heat-resistant suppression plate. Substrate manufacturing method.