JPS58117877A - Manufacture of enameled metallic substrate - Google Patents

Abstract

PURPOSE:To improve the risen edge parts of an enameled metallic substrate by interposing the substrate between 2 sheets of a material having an inferior wetting property to enamel and by reheating them. CONSTITUTION:An enameled metallic substrate composed of an iron plate 2 and enamel 1 is interposed between substrates 5 of silicon carbide of other material having an inferior wetting property to enamel. They are reheated at the softening temp. of enamel in a furnace filled with a nitrogen atmosphere for a prescribed time. By this method the thickness of the dog bone 3 of the enameled metallic substrate can be reduced. When this substrate is used in the printing of a thick film circuit, a fine pattern can be printed and a high density printed circuit can be formed.

Description

[Detailed description of the invention] Technical field to which the invention pertains A method for manufacturing a metal enamel substrate in which the protrusion at the end of the #4μ metal enamel substrate is improved by an inexpensive method to obtain a good flat surface '(i1'') Related to VC.

Conventional technology and its problems The metal enamel board has good heat dissipation and can be loaded with a single heavy object.
It is possible to make large boards of 50c11 square or larger, and due to its low price, it is steadily beginning to be used for mounting electronic circuit components. Generally, to obtain a metal enamel substrate, a frit is applied to a flat iron plate by an electrodeposition method, a spray method, a printing method, etc., and then fired at around 850°. However, the Kinne enamel substrate rL% obtained in this manner generally has a raised enamel called a dog bone at its end. 1st
The outline is shown in the figure, 1 is enamel, 2 is iron plate, 3
ri dog horn is shown. The thickness of this raised area is 4μ compared to the previous model.
It has reached 30μm to 100μ+nK. This mounded portion, for example, becomes a hindrance to thick film printing during the formation of a thick film circuit, and has the disadvantage that a printed circuit with high density cannot be obtained.

Purpose of the Invention In order to solve the above-mentioned drawbacks, the present invention is made by sandwiching a gold-plated enamel substrate on both sides with a material that does not adhere well to the enamel (for example, silicon V ide, g, aluminum oxide, etc.).
To obtain a good metal enamel substrate by improving the protrusion at the end of the metal enamel base by reheating VC.To provide a method for manufacturing a enamel substrate for scratches that has been prepared as an image. The present invention will be explained in detail using one embodiment.

As shown in Fig. 2, a metal enamel board consisting of an iron plate 2 and an enamel 1, for example 2 x 3 with a thickness of 1 m, is placed on both sides, for example, 2.5 x 3, 5 inches thick with a thickness of 3 u and weighing 50 mm.
-60g (D silicon nitride with horizontal f (S's N4
) Insert by base IE 5, nitrogen zero atmosphere FK
Approximately 3 at the softening temperature of enamel from 680℃ to 720℃
Reheat for 0 minutes. By doing this, the dogbone of the metal enamel substrate taken out from the nitrogen closed-air furnace is improved to 10 μm or less.

Effects of the Invention As described above, according to the present invention, it is possible to reduce the dog bore thickness of the metal hollow substrate, and it is possible to reduce the dog bore thickness of the metal enamel substrate by 200 μm @! Good patterns can be printed and high-density printed circuits can be printed.

Other Embodiments of the Invention The above-mentioned invention is based on the case where the enamel substrate is a flat plate, but in the case of a curved enamel substrate, as shown in FIG. , just as in the case of a flat plate.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional metal hollow substrate, FIG. 2 is a diagram for explaining one implementation of the present invention, and FIG. 3 is a diagram for explaining another embodiment of the present invention. 1...Enamel 2...Iron plate 3...Dock bone 5...Kaikai silicon plate Agent Patent attorney Nori Chika Tsubo (1 person)

Claims (1)

[Claims] A metal enamel board that is made of a material that does not adhere well to enamel, and is made by soaking the metal enamel board from both sides and reheating it to reduce the swelling at the edges of the metal enamel board. manufacturing method.