JPS6281787A - Thick film circuit part - Google Patents
Thick film circuit partInfo
- Publication number
- JPS6281787A JPS6281787A JP22188985A JP22188985A JPS6281787A JP S6281787 A JPS6281787 A JP S6281787A JP 22188985 A JP22188985 A JP 22188985A JP 22188985 A JP22188985 A JP 22188985A JP S6281787 A JPS6281787 A JP S6281787A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- glass
- circuit part
- film circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気回路特に厚膜電気回路にして、高ｌＡ機械
的強度全必要とする部品の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention This invention relates to the construction of components in electrical circuits, particularly thick film electrical circuits, requiring high IA mechanical strength.
従来の技術およびその問題点
従来この種の厚膜回路の代表的な構造の一つは、セ
その強度全保持する友めに金属表面にほうるガラス層を
設け、その上に金属の厚膜導体ケプリントしたいわゆる
ほうろう基盤が知られている。Conventional technology and its problems Conventionally, one of the typical structures of this type of thick film circuit is to provide a glass layer on the metal surface to maintain all the strength of the circuit, and a thick film of metal on top of that. So-called enamel substrates printed with conductors are known.
このようなほうろう基盤に於ては金属とガラスという全
碍膨張係数、伸性、可撓性などの緒特性の全く異なる材
料ケ一体化している点で実用に当つて信頼性に問題なし
としないものであった。In this type of enamel base, there are no problems with reliability in practical use because metal and glass, materials with completely different properties such as total thermal expansion coefficient, elongation, and flexibility, are integrated. It was something.
このほうろう基盤に代るものとして、セラミック基体上
に厚膜導体回路を形収したセラミック回路も実用化され
ているが、セラミックは可撓性がないばかりでなく、衝
撃等でチッピング、亀裂等を発生し易く、機械的強度に
難点をかかえているものである。As an alternative to this enamel substrate, ceramic circuits in which thick-film conductor circuits are formed on ceramic substrates have been put into practical use, but ceramics are not only inflexible but also susceptible to chipping, cracking, etc. due to impact, etc. This easily occurs and poses a problem in terms of mechanical strength.
問題点全解決するための手段
本発明は上記の如き問題点を解決する之めに鋭に金属と
接合力の強いガラス層を設け、更シてその上に電気回路
を設は友ものである。Means for Solving All Problems In order to solve the above-mentioned problems, the present invention sharply provides a glass layer with strong bonding strength to metal, and after that, an electric circuit is installed on top of the glass layer. .
又、この電気回路は銅箔等の回路材料を焼付はフォトエ
ツチング法で回路化してもＬｒし、 ｃＶＤ法等により
薄膜技術で設けてもよいし導電性金属をペースト印刷し
てもよい。Further, this electric circuit may be formed by baking a circuit material such as a copper foil or by photo-etching, or may be formed by a thin film technique such as a cVD method, or by paste printing a conductive metal.
作 用
オキシナイト”ライトガラスはＥＥ Ｓ ｉ −０−Ｓ
ｉ壬？Ｎ″？ｌ−置換した
三Ｓ ｉ −Ｎ −Ｓ ｉ玉の構造含有するので密度が
高く、ｉ
ＩＩ＋
ヤング基も太きいため強度に優れ、これ？基盤材料とし
て用いているので従来のほうろう基盤、又はセラミック
基盤にない優れた信頼性のよい回路部品を提供すること
がてきる。Function: Oxinite light glass is EE Si-0-S
I? It has a high density because it contains a structure of N''?l-substituted tri-S i -N -S i beads, and the i II+ Young group is also thick, so it has excellent strength, and because it is used as a base material, it can be used as a conventional enamel base. Alternatively, it is possible to provide circuit components with excellent reliability that are not available on ceramic substrates.
いれが工いが例えば金属封着用のガラス組成物として知
られている結晶化ガラス等は耐熱性にも優れ好ましいも
のである。For example, crystallized glass, which is known as a glass composition for metal sealing, is preferable because it has excellent heat resistance.
実施例
実施例］ ８ｉ０２６０Ｘ量％、Ａ＃２０５３重量％
、１３２０６１４重量％、Ｎａ２Ｏ１６Ｍ １１％、ｎ
ａｏ ７重量％の組収のガラスフリット１重量部１’ｔ
： ８ ｒ ５Ｎ４０．１重量部？加えこれをＢＮ製坩
堝？用いてＮ２雰囲気中で８００℃で焼成しガラス化し
てシート状にし′ｆｃ。Examples] 8i0260X amount%, A#2053 weight%
, 1320614% by weight, Na2O16M 11%, n
ao 7% by weight glass frit 1 part by weight 1't
: 8 r 5N40.1 parts by weight? In addition, is this a BN crucible? It was fired at 800°C in a N2 atmosphere to vitrify it and form it into a sheet.'fc.
このシートの上ＮＩＶＣは８ ｒ ５Ｎａ Ｔｌ”混入
しないガラスフリット層を介して電解銅箔を同時焼付け
して回路部品を得た。銅箔は後にエツチングに工す回路
を形成せしめた。On this sheet, NIVC co-baked an electrolytic copper foil through a layer of 8r5NaTl''-free glass frit to obtain a circuit component.The copper foil was later etched to form a circuit.
実施例２ ８ｉ０２３１重量％、Ａ＃２０５２重量％、
Ｂ２０，５電蓄％、ｏａｏ３ｏｉ雪％、Ｚｎ０１０ ：
ｉｉ％、＋Ｆｏ０２ ｍ ｆｔ％、（＝ｒ２０５２０
ｉ！！： ｉｔ％？含むガラスフリット１重量部１ｃ
Ａ＃Ｎ ｆｌ、 １重量部を加え、ＢＮ坩堝を用い、Ｎ
２雰囲気中でガラス化しシート状にした。Example 2 8i0231% by weight, A#2052% by weight,
B20,5 electric storage%, oao3oi snow%, Zn010:
ii%, +Fo02 m ft%, (=r20520
i! ! : it%? Contains 1 part by weight of glass frit 1c
Add 1 part by weight of A#N fl, use a BN crucible, and
It was vitrified in a 2 atmosphere and made into a sheet.
この上に銅箔をのせて焼成し接合せしめて回路部品を得
几。銅箔は後にエツチングにエリ回路を形成せしめた。Copper foil is placed on top of this, fired, and bonded to obtain circuit components. The copper foil was later etched to form the edge circuit.
なお上記に於てオキシナイトライトガラス基材に結合用
のガラス層を用いた場合と用いない場合を含有せしめ定
組成のものが適用し得るが結晶化ガラスは耐熱性もあり
、結合用ガラスとしては最も好ましい。In addition, in the above, it is possible to apply a fixed-composition product in which the oxynitrite glass base material contains a bonding glass layer with or without a bonding glass layer, but crystallized glass is also heat resistant and can be used as a bonding glass. is most preferred.
比較例
０．７酬の鉄板上に５ｉ０２ ＋ ＡｊＤ２０３４９．
５％、８２０５１２％、Ｌｉ２Ｏ＋ Ｎａ２Ｏ＋ Ｋ２
Ｏ］ Ｚ ５％、Ｎａ３ＡｌＦ６＋ Ｎａ２ＳｉＦ６
６．０％、ＴｉＯ２２０％からなる（１うｂら材料ケ塗
布焼付けてガラス化せしめこのガラス層の中１ｃＮｉ５
％、 Ｔｉ ｌ ０％、 Ｆｅ ３５％からなる金属Ｗ
、濁液ケ所定のパターンにコーティングして１２００℃
で焼結して１ト〉ろ〉回路基盤全製作した。Comparative Example 5i02 + AjD20349 on the iron plate of 0.7.
5%, 820512%, Li2O+ Na2O+ K2
O] Z 5%, Na3AlF6+ Na2SiF6
6.0% TiO2 and 20% TiO2.
%, metal W consisting of 0% Ti, 35% Fe
, coat the cloudy liquid in a predetermined pattern and heat it at 1200°C.
I sintered it and made the entire circuit board.
発明の効果
上記実施例］、２及び比較例について次の工うな試験ケ
行なった。Effects of the Invention The following tests were conducted on the above Examples, 2 and Comparative Examples.
（１）耐熱試験 ２００℃、１００時間連結加熱後（２
）耐ハンダ試験 ２５０℃溶融ハンダ３分間浸漬後の表
面外観
（３）強度試験 ２０ ＋ａ Ｘ ５０鴎 厚さ１朗ｔ
のサンプルケ水平にしてその一端ケ接合支
持し、他の遊離端Ｖｃ訃もり？加え、
折れたときの１食
（４）ヒートサイクル −４０℃−２５℃ −１２０℃
／８ｈｒ試験 】サイクルで１００サイクル後の
表面外観
これに工っで判る工うに本発明に係る回路基盤は機械的
強度にも極めて優れているのみならず１よ′）ろう回路
基盤同様に耐熱性が優れていることが判る。(1) Heat resistance test After continuous heating at 200℃ for 100 hours (2
) Solder resistance test Surface appearance after immersion in 250°C molten solder for 3 minutes (3) Strength test 20 + a
Place the sample horizontally and support one end of the joint, while the other free end is connected to Vc. In addition, one serving when broken (4) Heat cycle -40℃-25℃ -120℃
/8hr test] Surface appearance after 100 cycles It can be seen from this that the circuit board according to the present invention not only has extremely excellent mechanical strength, but also has the same heat resistance as the soldered circuit board. is found to be superior.
Claims (1)
部を設けたことを特徴とする電気回路部品。An electric circuit component characterized in that an electric circuit portion is provided on oxynitrite glass as a base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22188985A JPS6281787A (en) | 1985-10-07 | 1985-10-07 | Thick film circuit part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22188985A JPS6281787A (en) | 1985-10-07 | 1985-10-07 | Thick film circuit part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6281787A true JPS6281787A (en) | 1987-04-15 |
Family
ID=16773761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22188985A Pending JPS6281787A (en) | 1985-10-07 | 1985-10-07 | Thick film circuit part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6281787A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489803A (en) * | 1987-09-30 | 1989-04-05 | Shimadzu Corp | Membrane member for radome |
-
1985
- 1985-10-07 JP JP22188985A patent/JPS6281787A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489803A (en) * | 1987-09-30 | 1989-04-05 | Shimadzu Corp | Membrane member for radome |
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