JP2568103Y2 - 通信用保安素子 - Google Patents
通信用保安素子Info
- Publication number
- JP2568103Y2 JP2568103Y2 JP1989136060U JP13606089U JP2568103Y2 JP 2568103 Y2 JP2568103 Y2 JP 2568103Y2 JP 1989136060 U JP1989136060 U JP 1989136060U JP 13606089 U JP13606089 U JP 13606089U JP 2568103 Y2 JP2568103 Y2 JP 2568103Y2
- Authority
- JP
- Japan
- Prior art keywords
- security element
- flexible printed
- communication security
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004891 communication Methods 0.000 title claims description 41
- 239000004020 conductor Substances 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000001012 protector Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Emergency Protection Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989136060U JP2568103Y2 (ja) | 1989-11-27 | 1989-11-27 | 通信用保安素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989136060U JP2568103Y2 (ja) | 1989-11-27 | 1989-11-27 | 通信用保安素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377238U JPH0377238U (enrdf_load_stackoverflow) | 1991-08-02 |
| JP2568103Y2 true JP2568103Y2 (ja) | 1998-04-08 |
Family
ID=31683290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989136060U Expired - Lifetime JP2568103Y2 (ja) | 1989-11-27 | 1989-11-27 | 通信用保安素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2568103Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6507574B2 (ja) * | 2014-11-04 | 2019-05-08 | セイコーエプソン株式会社 | 超音波デバイスユニット並びにプローブおよび電子機器 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62224783A (ja) * | 1986-03-26 | 1987-10-02 | Aisin Seiki Co Ltd | ソレノイド制御回路 |
| JPH0613587Y2 (ja) * | 1987-12-22 | 1994-04-06 | 株式会社村田製作所 | 通信線保安用正特性サーミスタ |
-
1989
- 1989-11-27 JP JP1989136060U patent/JP2568103Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0377238U (enrdf_load_stackoverflow) | 1991-08-02 |
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