JP2556376Y2 - 赤外線受光装置 - Google Patents

赤外線受光装置

Info

Publication number
JP2556376Y2
JP2556376Y2 JP1990080929U JP8092990U JP2556376Y2 JP 2556376 Y2 JP2556376 Y2 JP 2556376Y2 JP 1990080929 U JP1990080929 U JP 1990080929U JP 8092990 U JP8092990 U JP 8092990U JP 2556376 Y2 JP2556376 Y2 JP 2556376Y2
Authority
JP
Japan
Prior art keywords
circuit board
light receiving
circuit
infrared
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990080929U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438066U (US20100223739A1-20100909-C00005.png
Inventor
辰也 沼沢
俊和 荻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP1990080929U priority Critical patent/JP2556376Y2/ja
Publication of JPH0438066U publication Critical patent/JPH0438066U/ja
Application granted granted Critical
Publication of JP2556376Y2 publication Critical patent/JP2556376Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Optical Communication System (AREA)
JP1990080929U 1990-07-30 1990-07-30 赤外線受光装置 Expired - Lifetime JP2556376Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990080929U JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990080929U JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Publications (2)

Publication Number Publication Date
JPH0438066U JPH0438066U (US20100223739A1-20100909-C00005.png) 1992-03-31
JP2556376Y2 true JP2556376Y2 (ja) 1997-12-03

Family

ID=31626410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990080929U Expired - Lifetime JP2556376Y2 (ja) 1990-07-30 1990-07-30 赤外線受光装置

Country Status (1)

Country Link
JP (1) JP2556376Y2 (US20100223739A1-20100909-C00005.png)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310573U (US20100223739A1-20100909-C00005.png) * 1986-07-09 1988-01-23
JPH0432544U (US20100223739A1-20100909-C00005.png) * 1990-07-13 1992-03-17
JP3013758U (ja) * 1995-01-19 1995-07-18 ゼネラルパッカー株式会社 真空包装装置

Also Published As

Publication number Publication date
JPH0438066U (US20100223739A1-20100909-C00005.png) 1992-03-31

Similar Documents

Publication Publication Date Title
JP3507251B2 (ja) 光センサｉｃパッケージおよびその組立方法
US7274094B2 (en) Leadless packaging for image sensor devices
US7250663B2 (en) Frame scale package using contact lines through the elements
JP2544978Y2 (ja) 光モジュール
KR100374959B1 (ko) 고체촬상소자및그실장방법
US8248514B1 (en) Camera module having image sensing module with passive components
JPH04254807A (ja) 光組立体
JPH05115435A (ja) 固体撮像装置
JP2556376Y2 (ja) 赤外線受光装置
JPS61123288A (ja) 固体撮像デバイス
US4341448A (en) Light receiving element assembly in a camera
JPH0728014B2 (ja) 固体撮像装置
JPH0813107B2 (ja) 固体撮像装置
JPH05267629A (ja) 固体撮像装置
JPH01251754A (ja) 固体撮像装置
JPH04333806A (ja) 受光モジュール
JPS61281559A (ja) 光検出装置
JPH0786544A (ja) Ｃｃｄ素子
JPH01191481A (ja) 受光素子
JPH07326779A (ja) センサーモジュール
JP2588043B2 (ja) 固体撮像装置
JPH0992805A (ja) 光集積回路装置
JPH01147853A (ja) 受光素子モジュール
JP2831689B2 (ja) 固体撮像装置
JPH05259483A (ja) 光電変換用半導体パッケージ