JP2545674B2 - プリント基板の加工方法およびその装置 - Google Patents
プリント基板の加工方法およびその装置Info
- Publication number
- JP2545674B2 JP2545674B2 JP4205192A JP20519292A JP2545674B2 JP 2545674 B2 JP2545674 B2 JP 2545674B2 JP 4205192 A JP4205192 A JP 4205192A JP 20519292 A JP20519292 A JP 20519292A JP 2545674 B2 JP2545674 B2 JP 2545674B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- observation
- marks
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4205192A JP2545674B2 (ja) | 1992-07-31 | 1992-07-31 | プリント基板の加工方法およびその装置 |
TW082105308A TW280087B (enrdf_load_stackoverflow) | 1992-07-31 | 1993-07-03 | |
KR1019930014144A KR970008478B1 (ko) | 1992-07-31 | 1993-07-26 | 프린트기판의 가공 방법 및 그 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4205192A JP2545674B2 (ja) | 1992-07-31 | 1992-07-31 | プリント基板の加工方法およびその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06285749A JPH06285749A (ja) | 1994-10-11 |
JP2545674B2 true JP2545674B2 (ja) | 1996-10-23 |
Family
ID=16502932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4205192A Expired - Lifetime JP2545674B2 (ja) | 1992-07-31 | 1992-07-31 | プリント基板の加工方法およびその装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2545674B2 (enrdf_load_stackoverflow) |
KR (1) | KR970008478B1 (enrdf_load_stackoverflow) |
TW (1) | TW280087B (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004012903A (ja) * | 2002-06-07 | 2004-01-15 | Fuji Photo Film Co Ltd | 露光装置 |
JP4542046B2 (ja) * | 2006-01-30 | 2010-09-08 | セイコープレシジョン株式会社 | 穴開け方法及び穴開け装置 |
JP5022069B2 (ja) * | 2007-03-15 | 2012-09-12 | セイコープレシジョン株式会社 | 穴開け装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH074737B2 (ja) * | 1985-11-22 | 1995-01-25 | 株式会社アマダ | クランプずれ量補正装置 |
JP2707548B2 (ja) * | 1987-05-30 | 1998-01-28 | ソニー株式会社 | 視覚認識装置の座標補正方法 |
-
1992
- 1992-07-31 JP JP4205192A patent/JP2545674B2/ja not_active Expired - Lifetime
-
1993
- 1993-07-03 TW TW082105308A patent/TW280087B/zh not_active IP Right Cessation
- 1993-07-26 KR KR1019930014144A patent/KR970008478B1/ko not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW280087B (enrdf_load_stackoverflow) | 1996-07-01 |
KR940006431A (ko) | 1994-03-23 |
JPH06285749A (ja) | 1994-10-11 |
KR970008478B1 (ko) | 1997-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5318334B2 (ja) | 対象物の位置検出方法及び装置 | |
WO2009122529A1 (ja) | 面状体のアライメント装置、製造装置、面状体のアライメント方法及び製造方法 | |
CN1935480B (zh) | 晶片的对准方法 | |
TW201210725A (en) | Laser machining apparatus and method for detecting a substrate position | |
JP2007201349A (ja) | 穴開け方法及び穴開け装置 | |
JP2007335524A (ja) | 実装ライン | |
US6563530B1 (en) | Camera position-correcting method and system and dummy component for use in camera position correction | |
JP4494922B2 (ja) | 電子部品実装装置の搭載誤差検出方法及び装置 | |
JP2545674B2 (ja) | プリント基板の加工方法およびその装置 | |
JP4343391B2 (ja) | ワークの加工装置 | |
JP4237158B2 (ja) | 実装基板製造装置および製造方法 | |
JP6473172B2 (ja) | 対基板作業機 | |
JP6985901B2 (ja) | 部品実装機および実装ライン | |
JP4126503B2 (ja) | 位置決め装置 | |
JPH11121992A (ja) | 加工装置および電子回路素子の実装装置 | |
JP3755215B2 (ja) | 多層積層板位置決め装置 | |
JPH06244595A (ja) | 電子部品装着装置 | |
JP2018190848A (ja) | 基板作業機 | |
JP4185367B2 (ja) | 支持部材配置作業支援装置,それを備える対基板作業システムおよび支持部材配置方法 | |
WO2024190128A1 (ja) | 部品撮像装置 | |
JP7185761B2 (ja) | 演算装置 | |
CN113366935B (zh) | 基准标记确定装置、基准标记确定方法 | |
JP4187461B2 (ja) | 回路基板取外し検出方法および対基板作業システム | |
WO2024057415A1 (ja) | 検査装置及び検査方法 | |
JP3247925B2 (ja) | 電子部品実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080808 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090808 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090808 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100808 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100808 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110808 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110808 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120808 Year of fee payment: 16 |
|
EXPY | Cancellation because of completion of term |