JP2539807Y2 - ワイヤーボンダにおけるリードフレーム押さえ機構 - Google Patents

ワイヤーボンダにおけるリードフレーム押さえ機構

Info

Publication number
JP2539807Y2
JP2539807Y2 JP1991003992U JP399291U JP2539807Y2 JP 2539807 Y2 JP2539807 Y2 JP 2539807Y2 JP 1991003992 U JP1991003992 U JP 1991003992U JP 399291 U JP399291 U JP 399291U JP 2539807 Y2 JP2539807 Y2 JP 2539807Y2
Authority
JP
Japan
Prior art keywords
lead frame
holder
holding
plate
wire bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991003992U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0499833U (enrdf_load_stackoverflow
Inventor
勉 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1991003992U priority Critical patent/JP2539807Y2/ja
Publication of JPH0499833U publication Critical patent/JPH0499833U/ja
Application granted granted Critical
Publication of JP2539807Y2 publication Critical patent/JP2539807Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1991003992U 1991-02-06 1991-02-06 ワイヤーボンダにおけるリードフレーム押さえ機構 Expired - Lifetime JP2539807Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991003992U JP2539807Y2 (ja) 1991-02-06 1991-02-06 ワイヤーボンダにおけるリードフレーム押さえ機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991003992U JP2539807Y2 (ja) 1991-02-06 1991-02-06 ワイヤーボンダにおけるリードフレーム押さえ機構

Publications (2)

Publication Number Publication Date
JPH0499833U JPH0499833U (enrdf_load_stackoverflow) 1992-08-28
JP2539807Y2 true JP2539807Y2 (ja) 1997-07-02

Family

ID=31733406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991003992U Expired - Lifetime JP2539807Y2 (ja) 1991-02-06 1991-02-06 ワイヤーボンダにおけるリードフレーム押さえ機構

Country Status (1)

Country Link
JP (1) JP2539807Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241933A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体製造装置
JP2524364B2 (ja) * 1987-08-24 1996-08-14 株式会社日立製作所 ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0499833U (enrdf_load_stackoverflow) 1992-08-28

Similar Documents

Publication Publication Date Title
US5890644A (en) Apparatus and method of clamping semiconductor devices using sliding finger supports
US6047468A (en) Lead finger clamp assembly and method of stabilizing lead frame elements
US6921017B2 (en) Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
JP2539807Y2 (ja) ワイヤーボンダにおけるリードフレーム押さえ機構
USRE37323E1 (en) Method for sticking an insulating film to a lead frame
US5634586A (en) Single point bonding method
US5917237A (en) Semiconductor integrated circuit device and lead frame therefor
JP3688760B2 (ja) 樹脂パッケージ型半導体装置およびその製造方法
JPH05129509A (ja) 非接触型リードとそのパツケージ
JP4604384B2 (ja) 回路基板実装体の実装方法
JPH03225842A (ja) ボンディングツール
JP3375759B2 (ja) ボンディング装置
JPH0642347Y2 (ja) リードフレーム
JP5658802B2 (ja) 半導体装置の製造方法
JPS6136378B2 (enrdf_load_stackoverflow)
JP4686893B2 (ja) ワイヤボンダ及びボンディング方法
JPH025537Y2 (enrdf_load_stackoverflow)
JPH01166544A (ja) マルチチップモジュールの冷却構造
JP2519829B2 (ja) 加熱装置およびそれを用いた実装方法
CN118231326A (zh) 一种通过减小应力改善分层的压焊夹具
JPH0747868Y2 (ja) チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ
JPH05121478A (ja) ワイヤボンデイング装置のリードフレーム押え治具
JP2676231B2 (ja) 半導体装置の樹脂封止装置
JPH0642346Y2 (ja) リードフレーム
JP2001053104A (ja) ワイヤボンディング装置

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970218