USRE37323E1 - Method for sticking an insulating film to a lead frame - Google Patents

Method for sticking an insulating film to a lead frame Download PDF

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Publication number
USRE37323E1
USRE37323E1 US09/326,898 US32689899A USRE37323E US RE37323 E1 USRE37323 E1 US RE37323E1 US 32689899 A US32689899 A US 32689899A US RE37323 E USRE37323 E US RE37323E
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United States
Prior art keywords
lead frame
insulating film
punch
heater
punched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/326,898
Inventor
Toshio Kawamura
Takashi Suzumura
Makoto Aida
Hiroshi Sugimoto
Shigeharu Takahagi
Yuju Endo
Toshi Sasaki
Hiroyuki Takasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
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Hitachi Cable Ltd
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Filing date
Publication date
Priority claimed from JP11314093A external-priority patent/JP2757741B2/en
Priority claimed from JP5114421A external-priority patent/JP2720753B2/en
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to US09/326,898 priority Critical patent/USRE37323E1/en
Application granted granted Critical
Publication of USRE37323E1 publication Critical patent/USRE37323E1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1326—Severing means or member secured thereto also bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/06—Blanking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool

Definitions

  • the invention relates to a method and an apparatus for sticking an insulating film to a lead frame, and more particularly, to insulating film sticking method and apparatus by which an insulating film is adhesively attached on an inner lead portion of a lead frame by stable sticking characteristics.
  • the number of input and output pins is increased relative to an area of semiconductor chips, so that the number of the semiconductor chips mounted on a circuit board is decreased, and the size of the circuit board is made small.
  • the high density mounting of LSIs is realized by using a mounting method of, for instance, the lead type or the surface mounting type.
  • a conventional semiconductor package using a method of “LOC(Lead On Chip)” fabricated by the high density mounting technology comprises a semiconductor chip having electrodes thereon, and a lead frame having leads adhesively attached on the semiconductor chip, wherein the leads are bonded to the electrodes by bonding wires, and the semiconductor chip and the bonded leads are sealed to expose an outer portion of the leads by a packaging resin.
  • the attaching of the leads to the semiconductor chip is conducted by using a punched insulating film having thermally activating adhesive layers on the both surfaces thereof.
  • the punched insulating film is sticked to the leads of the lead frame in advance of a fabrication process for the semiconductor package.
  • an insulating film is punched to provide a punched insulating film by using a punch and a die cooperating with each other.
  • the punched insulating film is applied on a lead frame which is heated on a heater in accordance with the lowering motion of the punch.
  • the punched insulating film is adhesively attached on an inner lead portion of the lead frame.
  • the punched insulating film is subject to thermal steps such as the wire bonding, the resin sealing, etc. For this reason, the punched insulating film and adhesive layers on the both surfaces must be heat-proof at a temperature ranging 250° to 400° C.
  • a punched insulating film In addition to the application of a punched insulating film to the LOC type semiconductor package, it is also used for suppressing the difference of position levels at a tip portion of leads of a lead frame and the position shift of the leads.
  • the same method as the above described method for sticking an insulating film to a lead frame is used, wherein a punched insulating film is not required to be heat-proof at a temperature of 250° to 400° C., but only to have a heat-proof resistance of approximately 150° C., because the punched insulating film is not used for insulating the lead frame from the semiconductor chip.
  • a method for sticking an insulating film to a lead frame comprises the steps of:
  • step is carried out together with a step of absorbing thermal expansion of the punch resulted from receiving a heat of the heater.
  • an apparatus for sticking an insulating film to a lead frame comprises:
  • the punch is composed of divided punches having a clearance between each two of the divided punches, and the punched film is pressed to be sticked to the lead frame on the heater by the divided punches, while the clearance absorbs thermal expansion of the divided punches resulted from receiving a heat of the heater.
  • FIG. 1 is an explanatory view showing a conventional apparatus for sticking an insulating film to a lead frame
  • FIG. 2A is a perspective view showing a semiconductor chip package
  • FIG. 2B is a cross-sectional view cut along the line 2 B— 2 B in FIG. 2A,
  • FIG. 2C is an explanatory diagram explaining punching burrs which interrupt a bonding wire to be bonded to a lead frame
  • FIGS. 3 and 4 are plan views showing lead frames to which punched insulating films are sticked
  • FIGS. 5A and 5B are explanatory views showing an apparatus for sticking an insulating film to a lead frame in a first preferred embodiment according to the invention
  • FIGS. 6A to 6 D are explanatory views showing punches to be used in the first preferred embodiment.
  • FIGS. 7A to 7 C are explanatory views showing an apparatus for sticking an insulating film to a lead frame in a second preferred embodiment according to the invention.
  • FIG. 1 shows an apparatus to be used for the conventional method for sticking an insulating film to a lead frame.
  • the apparatus comprises a die 2 for placing an insulating film 4 thereon, punches 5 for punching the insulating film 4 and adsorbing punched insulating films 4 on the tip plane by vacuum, a punch guide 3 for guiding the punches 5 through guide apertures thereof, a heater 6 for heating a lead frame 1 placed thereon to be a predetermined temperature, a punch holder 51 for holding the punches 5 , a shank 52 for vertically moving the punches 5 up and down, and a cylinder 53 for generating a moving force to be applied to the sank 52 .
  • a spacer 54 may be provided.
  • the insulating film 4 is transferred on the die 2 by an transfer apparatus (not shown), when the punches 5 take an upper position.
  • the lead frame 1 is also transferred on a predetermined position on the heater 6 .
  • the punches 5 are moved down to punch the insulating film 4 , so that the punched insulating films 4 adsorbed on the tip plane of the punches 5 by vacuum are lowered to be pressed on the heated lead frame 1 on the heater 6 .
  • the lead frame 1 which is sticked with the punched insulating films 4 are obtained.
  • the insulating film-sticked lead frame 1 is processed to adhesively attached to a semiconductor chip for fabricating a semiconductor chip package.
  • FIGS. 2A and 2B show the semiconductor chip package thus fabricated.
  • the semiconductor chip package comprises a semiconductor chip 7 having electrodes thereon, and a lead frame 1 sticked with punched insulating films 4 , wherein the lead frame 1 is adhesively attached to the semiconductor chip 7 by the sticked insulating films 4 , and a inner lead portion of the lead frame 1 is bonded to the electrodes by bonding wires 8 , such that a whole structure of the semiconductor chip 7 is sealed to expose only an outer lead portion of the lead frame ( 1 ) by molding resin 9 (not shown in FIG. 2A, but in FIG. 2 B).
  • the punched insulating films 4 are, for instance, polyimide films, on the both surfaces of which thermoplastic or thermosetting adhesives are layered to provide heat-proof characteristics of 250° to 400° C., as explained before.
  • the position precision of the lead frame 1 on the semiconductor chip 7 must be high, because the inner leads must be precisely and stably bonded to the electrodes by the bonding wires 8 .
  • the punched insulating films 4 must have the precision in dimension as high as possible. Therefore, the influence of thermal expansion of the punches 5 is required to be avoided in a method and an apparatus for sticking an insulating film to a lead frame.
  • FIG. 2C shows four kinds of punching burrs which occur in accordance with the influence of the thermal expansion of the punches, wherein the burr interrupts the bonding wire 8 to be bonded to an inner lead frame of the lead frame 1 .
  • FIGS. 3 and 4 show lead frames 1 , on inner leads of which punched insulating films 4 are sticked adhesively, as explained before.
  • the insulating films 4 as shown in FIG. 3 is only required to have heat-proof characteristics of approximately 150° C., because the films 4 are not used for adhesively attaching the lead frame 1 to a semiconductor chip, but for avoiding the position level difference of the inner leads and the position shift of the inner leads.
  • the insulating films 4 as shown in FIG. 4 are used for the aforementioned LOC package.
  • the lead frame 1 as shown in FIG. 3 is a lead frame of 42 Ni-Fe alloy having a thickness of 15 mm and 40 pins used for a DIP (Dual Inline Package), and the lead frame 1 as shown in FIG. 4 is a lead frame of 42 Ni—Fe alloy having a thickness of 0.25 mm and 40 pins used for a SOJ (Small Outline J-bend Package).
  • the spacer 54 is used to prevent the punch 5 from being lowered down to a predetermined level.
  • FIGS. 5A and 5B wherein like parts are indicated by like reference numerals as used in FIG. 1 .
  • each of the punches 5 is composed of two divided punches 5 a which are assembled on side planes to have a clearance 5 c having a gap c and a length 1 for absorbing thermal expansion thereof, as shown in FIG. 6 A.
  • the divided punches 5 a having a total width s of 18.5 mm are heated at 400° C. for one and half seconds by the heater 6 and cooled for one second, and this heat cycle is repeated by twenty times, it is detected that the divided punches 5 a are increased in temperature at tip portions thereof to be approximately 100° C., but remain at a room temperature to be approximately 25° to 27° C. at a vertical point of 15 mm from the tip portions thereof.
  • the length 1 of the clearance 5 c is preferable to be 15 mm, so that the thermal expansion is effectively absorbed by the clearance 5 c.
  • the punch 5 as shown in FIG. 6A may be modified to be punches 5 as shown in FIGS. 6B to 6 D.
  • the punch 5 is composed of first and third divided punches 5 d of a ⁇ b in dimension and a second divided punch 5 b of d ⁇ b in dimension, wherein clearances 5 c of a gap c are provided between the first and second divided punches 5 d and 5 b and the second and third divided punches 5 b and 5 d.
  • this punch 5 it is confirmed in an experiment that “a” is equal to or greater than “b”, and “d” is greater than “b” to provide a predetermined mechanical strength. In practical, it is detected that, when “a” and “b” are 1.2 mm, and the gap c is 30 ⁇ m, the thermal expansion amount of the punch 5 is only approximately 3 ⁇ m. This means that the modified punch 5 is effective to absorb the thermal expansion.
  • the punch 5 is composed of four divided punches 5 e having clearances 5 c of a gap c between each two of the divided punches 5 e.
  • longitudinal and transversal thermal expansions are absorbed by the orthogonally arranged clearances 5 c. It is confirmed in an experiment that the thermal expansion absorbing effect is increased, as the number of divided punches is increased, although the mechanical strength thereof which is correspondingly reduced must be considered.
  • the punch 5 is composed of the four divided punches 5 e having the clearances 5 c of the gap c which are the same as those in FIG. 6C, while the divided punches 5 e have recesses 5 f on the tip planes on which punched insulating films 4 are adsorbed, as described before, by vacuum.
  • the punched insulating film 4 is not pressed on a lead frame 1 by the recesses 5 f, but by remaining portions other than the recesses 5 f of the divided punches 5 e.
  • the punch 5 is advantageously applied to QFC lead frames, especially, COT lead frames, etc.
  • the punch 5 is not composed of divided punches, but may be one integral body provided with apertured clearances, and other modification may be added thereto.
  • an insulating film 4 is transferred on the die 2 by a transfer apparatus (not shown), and a lead frame 1 is transferred on the heater 6 by a transfer apparatus (not shown), as shown in FIG. 5 A.
  • the punches 5 which are in the structure selected from those in FIG. 6A to 6 D are lowered to punch the insulating film 4 , so that the punched insulating films 4 adsorbed on the tip planes of the punches 5 are lowered on the lead frame 1 which is heated on the heater 6 to be a predetermined temperature, as shown in FIG. 5 B.
  • the punched insulating films 4 are sticked on an inner lead portion of the lead frame 1 by a predetermined pressing force appropriately generated by the punches 5 which are released from the influence of thermal expansion in accordance with the presence of the clearances 5 c. Consequently, the sticking position of the punched insulating films 4 are remarkably high in precision.
  • FIGS. 7A to 7 C An apparatus for sticking an insulating film to a lead frame in the second preferred embodiment according to the invention will be explained in FIGS. 7A to 7 C, wherein like parts are indicated by like reference numerals as used in FIGS. 5A and 5B.
  • the heater 6 is placed on a heater fixing plate 11 which is vertically moved by an air cylinder 12 .
  • an insulating film 4 having a width of 16.5 mm is transferred on the die 2 by a transfer apparatus (not shown), and a lead frame 1 is transferred above the heater 6 by a transfer apparatus (not shown), as shown in FIG. 7 A.
  • the insulating film 4 is composed of a polyimide film of 50 ⁇ m in thickness and acryle-based thermosetting adhesive layers each having a thickness of 20 ⁇ m coated on the both surfaces of the poliamide film, and a temperature at which the insulating films 4 are sticked to the lead frame 1 is 170° C.
  • the insulating film 4 is composed of a polyimide film of 50 ⁇ m in thickness and polyether amideimide adhesive layers each having a thickness of 20 ⁇ coated on the both surfaces of the polyimide films, and a temperature at which the insulating films 4 are sticked to the lead frame 1 is 340° C.
  • the heater 6 is moved up to contact with the lead frame 1 which is thereby heated to be the above described sticking temperature.
  • the punches 5 are moved down to punch the insulating film 1 , so that the punched insulating films 4 are sticked to the lead frame 1 .
  • a pressing force by which the insulating films 4 are sticked to the lead frame 1 is kept constant, because a position level of the heater 6 is changed by means of the air cylinder 12 .
  • the punches 5 may be one selected from the structures as shown in FIGS. 6A to 6 D.
  • polyether-amideimide adhesive may be replaced by polyether-amide or polyether-imide adhesive, and polyimide film may be replaced by other heat-proof films.
  • an insulating film composed of a heat-proof base film and adhesive layers may be replaced by an adhesive film composed of only one adhesive layer.

Abstract

A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.

Description

FIELD OF THE INVENTION
The invention relates to a method and an apparatus for sticking an insulating film to a lead frame, and more particularly, to insulating film sticking method and apparatus by which an insulating film is adhesively attached on an inner lead portion of a lead frame by stable sticking characteristics.
BACKGROUND OF THE INVENTION
In accordance with the development of high density mounting technology for LSIs, the number of input and output pins is increased relative to an area of semiconductor chips, so that the number of the semiconductor chips mounted on a circuit board is decreased, and the size of the circuit board is made small. Thus, the high density mounting of LSIs is realized by using a mounting method of, for instance, the lead type or the surface mounting type.
A conventional semiconductor package using a method of “LOC(Lead On Chip)” fabricated by the high density mounting technology comprises a semiconductor chip having electrodes thereon, and a lead frame having leads adhesively attached on the semiconductor chip, wherein the leads are bonded to the electrodes by bonding wires, and the semiconductor chip and the bonded leads are sealed to expose an outer portion of the leads by a packaging resin. In this semiconductor package, the attaching of the leads to the semiconductor chip is conducted by using a punched insulating film having thermally activating adhesive layers on the both surfaces thereof. For this purpose, the punched insulating film is sticked to the leads of the lead frame in advance of a fabrication process for the semiconductor package.
Here, a conventional method for sticking an insulating film to a lead frame will be explained.
In the sticking method, an insulating film is punched to provide a punched insulating film by using a punch and a die cooperating with each other. The punched insulating film is applied on a lead frame which is heated on a heater in accordance with the lowering motion of the punch. Thus, the punched insulating film is adhesively attached on an inner lead portion of the lead frame.
In the LOC type semiconductor package, the punched insulating film is subject to thermal steps such as the wire bonding, the resin sealing, etc. For this reason, the punched insulating film and adhesive layers on the both surfaces must be heat-proof at a temperature ranging 250° to 400° C.
In an experiment similar in condition to the conventional method for sticking an insulating film to a lead frame, when a heat cycle in which a punch having a length of 18.5 mm is heated at a temperature of 400° C. for one and half seconds, and is then cooled for one second is conducted, it is detected in the analysis result by FEM (Finite Element Method) that the punch is burnt with a die in accordance with the thermal expansion of the punch.
Therefore, a clearance is properly set between the punch and the die in the conventional method for sticking an insulating film to a lead frame to avoid the burning of the punch with the die.
In addition to the application of a punched insulating film to the LOC type semiconductor package, it is also used for suppressing the difference of position levels at a tip portion of leads of a lead frame and the position shift of the leads. For this purpose, the same method as the above described method for sticking an insulating film to a lead frame is used, wherein a punched insulating film is not required to be heat-proof at a temperature of 250° to 400° C., but only to have a heat-proof resistance of approximately 150° C., because the punched insulating film is not used for insulating the lead frame from the semiconductor chip.
In the conventional method for sticking an insulating film to a lead frame, however, there is a disadvantage in that an insulating film is not properly punched to result in deformed edges (burrs and chips) on a punched insulating film, when the punch has a length greater than 13 mm to arise the remarkable influence on a clearance between the punch and the die due to the thermal expansion of the punch. In order to overcome the disadvantage, the punch and the die must be designed to provide a proper clearance therebetween in the thermally expanded state, and the punch must be pre-heated prior to operation.
Further, there is a disadvantage in that a pressing force of the punch on the lead frame is large to deform the punched insulating film, and, in a rare case, the lead frame, as described in detail later.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the invention to provide a method and an apparatus for sticking an insulating film to a lead frame in which the influence of thermal expansion of a punch is eliminated.
It is a further object of the invention to provide a method and an apparatus for sticking an insulating film to a lead frame in which a punched insulating film having no deformed edge is obtained.
It is a still further object of the invention to provide a method and an apparatus for sticking an insulating film to a lead frame in which a pressing force of a punch on a lead frame is appropriately set not to be too large.
According to the invention, a method for sticking an insulating film to a lead frame, comprises the steps of:
punching a thermally adhesive insulating film to provide a punched film by a punch;
heating a lead frame to be a predetermined temperature by a heater; and
pressing the punched film on the lead frame on the heater by the punch, the punched film being sticked to the lead frame
wherein said punching;
step is carried out together with a step of absorbing thermal expansion of the punch resulted from receiving a heat of the heater.
According to another feature of the invention, an apparatus for sticking an insulating film to a lead frame, comprises:
a punch moving up and down to punch a thermally adhesive insulating film, thereby providing a punched film to be adsorbed on a tip plane of the punch;
a die for placing the thermally adhesive insulating film to be punched cooperatively with the punch; and
a heater for heating a lead frame;
wherein the punch is composed of divided punches having a clearance between each two of the divided punches, and the punched film is pressed to be sticked to the lead frame on the heater by the divided punches, while the clearance absorbs thermal expansion of the divided punches resulted from receiving a heat of the heater.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be explained in more detail in conjunction with appended drawings, wherein:
FIG. 1 is an explanatory view showing a conventional apparatus for sticking an insulating film to a lead frame,
FIG. 2A is a perspective view showing a semiconductor chip package,
FIG. 2B is a cross-sectional view cut along the line 2B—2B in FIG. 2A,
FIG. 2C is an explanatory diagram explaining punching burrs which interrupt a bonding wire to be bonded to a lead frame,
FIGS. 3 and 4 are plan views showing lead frames to which punched insulating films are sticked,
FIGS. 5A and 5B are explanatory views showing an apparatus for sticking an insulating film to a lead frame in a first preferred embodiment according to the invention,
FIGS. 6A to 6D are explanatory views showing punches to be used in the first preferred embodiment, and
FIGS. 7A to 7C are explanatory views showing an apparatus for sticking an insulating film to a lead frame in a second preferred embodiment according to the invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Before explaining a method and an apparatus for sticking an insulating film to a lead frame in the preferred embodiments according to the invention, the aforementioned conventional method for sticking an insulating film to a lead frame will be again explained.
FIG. 1 shows an apparatus to be used for the conventional method for sticking an insulating film to a lead frame. The apparatus comprises a die 2 for placing an insulating film 4 thereon, punches 5 for punching the insulating film 4 and adsorbing punched insulating films 4 on the tip plane by vacuum, a punch guide 3 for guiding the punches 5 through guide apertures thereof, a heater 6 for heating a lead frame 1 placed thereon to be a predetermined temperature, a punch holder 51 for holding the punches 5, a shank 52 for vertically moving the punches 5 up and down, and a cylinder 53 for generating a moving force to be applied to the sank 52. In some use, a spacer 54 may be provided.
In operation, the insulating film 4 is transferred on the die 2 by an transfer apparatus (not shown), when the punches 5 take an upper position. At the same time, the lead frame 1 is also transferred on a predetermined position on the heater 6. Then, the punches 5 are moved down to punch the insulating film 4, so that the punched insulating films 4 adsorbed on the tip plane of the punches 5 by vacuum are lowered to be pressed on the heated lead frame 1 on the heater 6. Thus, the lead frame 1 which is sticked with the punched insulating films 4 are obtained. Then, the insulating film-sticked lead frame 1 is processed to adhesively attached to a semiconductor chip for fabricating a semiconductor chip package.
FIGS. 2A and 2B show the semiconductor chip package thus fabricated. The semiconductor chip package comprises a semiconductor chip 7 having electrodes thereon, and a lead frame 1 sticked with punched insulating films 4, wherein the lead frame 1 is adhesively attached to the semiconductor chip 7 by the sticked insulating films 4, and a inner lead portion of the lead frame 1 is bonded to the electrodes by bonding wires 8, such that a whole structure of the semiconductor chip 7 is sealed to expose only an outer lead portion of the lead frame (1) by molding resin 9 (not shown in FIG. 2A, but in FIG. 2B). In the semiconductor chip package, the punched insulating films 4 are, for instance, polyimide films, on the both surfaces of which thermoplastic or thermosetting adhesives are layered to provide heat-proof characteristics of 250° to 400° C., as explained before. As understood from the illustration in FIGS. 2A and 2B, the position precision of the lead frame 1 on the semiconductor chip 7 must be high, because the inner leads must be precisely and stably bonded to the electrodes by the bonding wires 8. For this reason, the punched insulating films 4 must have the precision in dimension as high as possible. Therefore, the influence of thermal expansion of the punches 5 is required to be avoided in a method and an apparatus for sticking an insulating film to a lead frame.
FIG. 2C shows four kinds of punching burrs which occur in accordance with the influence of the thermal expansion of the punches, wherein the burr interrupts the bonding wire 8 to be bonded to an inner lead frame of the lead frame 1.
FIGS. 3 and 4 show lead frames 1, on inner leads of which punched insulating films 4 are sticked adhesively, as explained before. The insulating films 4 as shown in FIG. 3 is only required to have heat-proof characteristics of approximately 150° C., because the films 4 are not used for adhesively attaching the lead frame 1 to a semiconductor chip, but for avoiding the position level difference of the inner leads and the position shift of the inner leads. On the other hand, the insulating films 4 as shown in FIG. 4 are used for the aforementioned LOC package.
The lead frame 1 as shown in FIG. 3 is a lead frame of 42 Ni-Fe alloy having a thickness of 15 mm and 40 pins used for a DIP (Dual Inline Package), and the lead frame 1 as shown in FIG. 4 is a lead frame of 42 Ni—Fe alloy having a thickness of 0.25 mm and 40 pins used for a SOJ (Small Outline J-bend Package).
In order to avoid the deformation of the punched insulating film 4 at the time of being pressed on a lead frame 1 due to the large pressing force by a punch 5, as explained in FIG. 1, the spacer 54 is used to prevent the punch 5 from being lowered down to a predetermined level. However, it is troublesome to provide a plurality of spacers having different spacer lengths in a practical apparatus.
Next, an apparatus for sticking an insulating film to a lead frame in the first preferred embodiment will be explained in FIGS. 5A and 5B, wherein like parts are indicated by like reference numerals as used in FIG. 1.
In the first preferred embodiment, each of the punches 5 is composed of two divided punches 5a which are assembled on side planes to have a clearance 5c having a gap c and a length 1 for absorbing thermal expansion thereof, as shown in FIG. 6A.
In one experiment in which the divided punches 5a having a total width s of 18.5 mm are heated at 400° C. for one and half seconds by the heater 6 and cooled for one second, and this heat cycle is repeated by twenty times, it is detected that the divided punches 5a are increased in temperature at tip portions thereof to be approximately 100° C., but remain at a room temperature to be approximately 25° to 27° C. at a vertical point of 15 mm from the tip portions thereof. In accordance with the result, the length 1 of the clearance 5c is preferable to be 15 mm, so that the thermal expansion is effectively absorbed by the clearance 5c.
In another experiment in which an insulating film 4 is placed on the die 2 to be punched by the punches 5, as shown in FIGS. 5A and 5B, wherein the gap c of the clearance 5C between the divided punches 5a is changed to check the effect of absorbing the thermal expansion of the divided punches 5a and punching the insulating film 4 without resulting in fine deformations at edges of punched insulating films. As a result, it is confirmed that the gap c of the clearance 5c which is equal to or greater than 10 μm effectively absorbs the thermal expansion of the divided punches 5a, and equal to or less than 30 μm effectively suppresses the generation of fine deformations at edges of the punched insulating films. When the gap c of the clearance 5C is 50 μm, fine deformations are clearly observed at edges of the punched insulating films.
In the first preferred embodiment, the punch 5 as shown in FIG. 6A may be modified to be punches 5 as shown in FIGS. 6B to 6D.
In FIG. 6B, the punch 5 is composed of first and third divided punches 5d of a×b in dimension and a second divided punch 5b of d×b in dimension, wherein clearances 5c of a gap c are provided between the first and second divided punches 5d and 5b and the second and third divided punches 5b and 5d. In this punch 5, it is confirmed in an experiment that “a” is equal to or greater than “b”, and “d” is greater than “b” to provide a predetermined mechanical strength. In practical, it is detected that, when “a” and “b” are 1.2 mm, and the gap c is 30 μm, the thermal expansion amount of the punch 5 is only approximately 3 μm. This means that the modified punch 5 is effective to absorb the thermal expansion.
In FIG. 6C, the punch 5 is composed of four divided punches 5e having clearances 5c of a gap c between each two of the divided punches 5e. In this structure, longitudinal and transversal thermal expansions are absorbed by the orthogonally arranged clearances 5c. It is confirmed in an experiment that the thermal expansion absorbing effect is increased, as the number of divided punches is increased, although the mechanical strength thereof which is correspondingly reduced must be considered.
In FIG. 6D, the punch 5 is composed of the four divided punches 5e having the clearances 5c of the gap c which are the same as those in FIG. 6C, while the divided punches 5e have recesses 5f on the tip planes on which punched insulating films 4 are adsorbed, as described before, by vacuum. In this structure, the punched insulating film 4 is not pressed on a lead frame 1 by the recesses 5f, but by remaining portions other than the recesses 5f of the divided punches 5e. For this structure, the punch 5 is advantageously applied to QFC lead frames, especially, COT lead frames, etc.
The punch 5 is not composed of divided punches, but may be one integral body provided with apertured clearances, and other modification may be added thereto.
In operation in the first preferred embodiment, an insulating film 4 is transferred on the die 2 by a transfer apparatus (not shown), and a lead frame 1 is transferred on the heater 6 by a transfer apparatus (not shown), as shown in FIG. 5A. Then, the punches 5 which are in the structure selected from those in FIG. 6A to 6D are lowered to punch the insulating film 4, so that the punched insulating films 4 adsorbed on the tip planes of the punches 5 are lowered on the lead frame 1 which is heated on the heater 6 to be a predetermined temperature, as shown in FIG. 5B. Thus, the punched insulating films 4 are sticked on an inner lead portion of the lead frame 1 by a predetermined pressing force appropriately generated by the punches 5 which are released from the influence of thermal expansion in accordance with the presence of the clearances 5c. Consequently, the sticking position of the punched insulating films 4 are remarkably high in precision.
An apparatus for sticking an insulating film to a lead frame in the second preferred embodiment according to the invention will be explained in FIGS. 7A to 7C, wherein like parts are indicated by like reference numerals as used in FIGS. 5A and 5B.
In the second preferred embodiment, the heater 6 is placed on a heater fixing plate 11 which is vertically moved by an air cylinder 12.
In operation, an insulating film 4 having a width of 16.5 mm is transferred on the die 2 by a transfer apparatus (not shown), and a lead frame 1 is transferred above the heater 6 by a transfer apparatus (not shown), as shown in FIG. 7A. In case of the lead frame 1 as shown in FIG. 3, the insulating film 4 is composed of a polyimide film of 50 μm in thickness and acryle-based thermosetting adhesive layers each having a thickness of 20 μm coated on the both surfaces of the poliamide film, and a temperature at which the insulating films 4 are sticked to the lead frame 1 is 170° C.
On the other hand, in case of the lead frame 1 as shown in FIG. 4, the insulating film 4 is composed of a polyimide film of 50 μm in thickness and polyether amideimide adhesive layers each having a thickness of 20μ coated on the both surfaces of the polyimide films, and a temperature at which the insulating films 4 are sticked to the lead frame 1 is 340° C.
In FIG. 7B, the heater 6 is moved up to contact with the lead frame 1 which is thereby heated to be the above described sticking temperature.
In FIG. 7C, the punches 5 are moved down to punch the insulating film 1, so that the punched insulating films 4 are sticked to the lead frame 1.
In the second preferred embodiment, even if thicknesses of the lead frame 1 and/or the insulating film 4 are changed and/or deviated, a pressing force by which the insulating films 4 are sticked to the lead frame 1 is kept constant, because a position level of the heater 6 is changed by means of the air cylinder 12.
In the second preferred embodiment, the punches 5 may be one selected from the structures as shown in FIGS. 6A to 6D.
In the second preferred embodiment, polyether-amideimide adhesive may be replaced by polyether-amide or polyether-imide adhesive, and polyimide film may be replaced by other heat-proof films.
In the first and second preferred embodiments, an insulating film composed of a heat-proof base film and adhesive layers may be replaced by an adhesive film composed of only one adhesive layer.
Although the invention has been described with respect to specific embodiment for complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modification and alternative constructions that may occur to one skilled in the art which fairly fall within the basic teaching herein set forth.

Claims (4)

What is claimed is:
1. A method for sticking an insulating film to a lead frame comprising the steps of:
providing a punch for punching a thermally adhesive insulating film, said punch having a clearance within it for absorbing thermal expansion thereof;
punching said thermally adhesive insulating film to provide a punched film by said punch;
heating a lead frame placed on a heater by said heater; and
pressing said punched film to said lead frame on said heater by said punch, thereby sticking said punched film to said lead frame
wherein thermal expansion of said punch occupying as a result of carrying out the step of heating said lead frame is absorbed by said clearance of said punch.
2. A method for sticking an insulating film to a lead frame according to claim 1, wherein:
said pressing step is carried out in a state where said heater is mounted on a heater fixing plate on an air cylinder.
3. A method for sticking an insulating film to a lead frame comprising the steps of:
providing a punch for punching thermally adhesive insulating film;
punching said thermally adhesive insulating film to provide a punched film by said punch;
providing a lead frame placed between a heater, for heating said lead frame, and said punch;
providing a means for maintaining a constant pressing force produced between said punched film and said lead frame, said means mounting said heater and functioning to move said heater up and down;
moving said heater up to a predetermined position level in accordance with the function of said means to contact and heat said lead frame; and
fixing said punched film on said heated lead frame in accordance with said pressing force.
4. The method as defined in claim 3, wherein the step of moving said heater up to said predetermined position level is carried out in a state where said heater is mounted on a heater fixing plate on an air cylinder which is said means for maintaining a constant pressing force.
US09/326,898 1993-05-14 1999-06-03 Method for sticking an insulating film to a lead frame Expired - Fee Related USRE37323E1 (en)

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JP11314093A JP2757741B2 (en) 1993-05-14 1993-05-14 Film pasting device
JP5-114421 1993-05-17
JP5114421A JP2720753B2 (en) 1993-05-17 1993-05-17 Film pasting method
US08/242,544 US5635009A (en) 1993-05-14 1994-05-13 Method for sticking an insulating film to a lead frame
US09/326,898 USRE37323E1 (en) 1993-05-14 1999-06-03 Method for sticking an insulating film to a lead frame

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US20050121226A1 (en) * 2003-10-21 2005-06-09 Park Electrochemical Corporation Laminates having a low dielectric constant, low disapation factor bond core and method of making same

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KR100426298B1 (en) 1994-12-26 2004-04-08 히다치 가세고교 가부시끼가이샤 Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US7012320B2 (en) * 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
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US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
JP3261987B2 (en) * 1996-07-24 2002-03-04 日立電線株式会社 LOC lead frame and semiconductor device using the same
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US20040154452A1 (en) * 2001-11-06 2004-08-12 Nanya Technology Corporation Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
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KR940027050A (en) 1994-12-10
GB2277894A (en) 1994-11-16
GB2277894B (en) 1996-04-03
GB9409535D0 (en) 1994-06-29
SG48170A1 (en) 1998-04-17
KR100187580B1 (en) 1999-06-01
US5635009A (en) 1997-06-03

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