JP2535529Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2535529Y2
JP2535529Y2 JP1988101261U JP10126188U JP2535529Y2 JP 2535529 Y2 JP2535529 Y2 JP 2535529Y2 JP 1988101261 U JP1988101261 U JP 1988101261U JP 10126188 U JP10126188 U JP 10126188U JP 2535529 Y2 JP2535529 Y2 JP 2535529Y2
Authority
JP
Japan
Prior art keywords
aluminum wiring
wiring
active element
connection
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988101261U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224540U (et
Inventor
武 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988101261U priority Critical patent/JP2535529Y2/ja
Publication of JPH0224540U publication Critical patent/JPH0224540U/ja
Application granted granted Critical
Publication of JP2535529Y2 publication Critical patent/JP2535529Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1988101261U 1988-07-29 1988-07-29 半導体装置 Expired - Lifetime JP2535529Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101261U JP2535529Y2 (ja) 1988-07-29 1988-07-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101261U JP2535529Y2 (ja) 1988-07-29 1988-07-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0224540U JPH0224540U (et) 1990-02-19
JP2535529Y2 true JP2535529Y2 (ja) 1997-05-14

Family

ID=31330096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101261U Expired - Lifetime JP2535529Y2 (ja) 1988-07-29 1988-07-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2535529Y2 (et)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928000B2 (ja) * 1991-09-27 1999-07-28 山形日本電気株式会社 半導体装置
JP2007027481A (ja) * 2005-07-19 2007-02-01 Seiko Epson Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444048A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Semiconductor integrated circuit device

Also Published As

Publication number Publication date
JPH0224540U (et) 1990-02-19

Similar Documents

Publication Publication Date Title
US5712507A (en) Semiconductor device mounted on die pad having central slit pattern and peripheral slit pattern for absorbing
JP2924840B2 (ja) Tape−BGAタイプの半導体装置
JP2535529Y2 (ja) 半導体装置
JPS6156608B2 (et)
JPH01298731A (ja) 半導体装置
JPH0249429A (ja) 半導体装置
US5402005A (en) Semiconductor device having a multilayered wiring structure
JPH03136332A (ja) 樹脂封止型半導体装置
US6204557B1 (en) Reduction of topside movement during temperature cycles
JP2542206Y2 (ja) 半導体素子
JPS62260352A (ja) 半導体装置
JP2562773Y2 (ja) 半導体集積回路素子
JPH06196478A (ja) 半導体装置
JPH0513016Y2 (et)
JPH0410429A (ja) 半導体装置
JPH03203363A (ja) 半導体装置
JPS6245150A (ja) 半導体装置
JPS61284930A (ja) 半導体装置
JPH0241865Y2 (et)
JPH01214126A (ja) 半導体装置
JP3098333B2 (ja) 半導体装置
JPH02278864A (ja) 半導体装置の入力保護回路
JP2502702B2 (ja) 半導体装置
JPH0268944A (ja) 半導体装置
JP2634942B2 (ja) 半導体装置