JP2529363Y2 - 光学素子 - Google Patents

光学素子

Info

Publication number
JP2529363Y2
JP2529363Y2 JP7046587U JP7046587U JP2529363Y2 JP 2529363 Y2 JP2529363 Y2 JP 2529363Y2 JP 7046587 U JP7046587 U JP 7046587U JP 7046587 U JP7046587 U JP 7046587U JP 2529363 Y2 JP2529363 Y2 JP 2529363Y2
Authority
JP
Japan
Prior art keywords
light receiving
light
laser
laser element
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7046587U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63178372U (US07902200-20110308-C00004.png
Inventor
泰弘 渡部
堅太郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP7046587U priority Critical patent/JP2529363Y2/ja
Publication of JPS63178372U publication Critical patent/JPS63178372U/ja
Application granted granted Critical
Publication of JP2529363Y2 publication Critical patent/JP2529363Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP7046587U 1987-05-12 1987-05-12 光学素子 Expired - Lifetime JP2529363Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7046587U JP2529363Y2 (ja) 1987-05-12 1987-05-12 光学素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7046587U JP2529363Y2 (ja) 1987-05-12 1987-05-12 光学素子

Publications (2)

Publication Number Publication Date
JPS63178372U JPS63178372U (US07902200-20110308-C00004.png) 1988-11-18
JP2529363Y2 true JP2529363Y2 (ja) 1997-03-19

Family

ID=30912125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7046587U Expired - Lifetime JP2529363Y2 (ja) 1987-05-12 1987-05-12 光学素子

Country Status (1)

Country Link
JP (1) JP2529363Y2 (US07902200-20110308-C00004.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665336B2 (ja) * 1987-07-22 1997-10-22 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933268U (ja) * 1982-08-26 1984-03-01 三洋電機株式会社 半導体レ−ザ

Also Published As

Publication number Publication date
JPS63178372U (US07902200-20110308-C00004.png) 1988-11-18

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