JP2527910Y2 - 研磨装置 - Google Patents
研磨装置Info
- Publication number
- JP2527910Y2 JP2527910Y2 JP1990069706U JP6970690U JP2527910Y2 JP 2527910 Y2 JP2527910 Y2 JP 2527910Y2 JP 1990069706 U JP1990069706 U JP 1990069706U JP 6970690 U JP6970690 U JP 6970690U JP 2527910 Y2 JP2527910 Y2 JP 2527910Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing liquid
- temperature
- surface plate
- polishing
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 71
- 239000007788 liquid Substances 0.000 claims description 52
- 239000000523 sample Substances 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 12
- 239000000110 cooling liquid Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 description 8
- 239000000498 cooling water Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069706U JP2527910Y2 (ja) | 1990-06-30 | 1990-06-30 | 研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069706U JP2527910Y2 (ja) | 1990-06-30 | 1990-06-30 | 研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0429358U JPH0429358U (enrdf_load_stackoverflow) | 1992-03-09 |
| JP2527910Y2 true JP2527910Y2 (ja) | 1997-03-05 |
Family
ID=31605243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069706U Expired - Lifetime JP2527910Y2 (ja) | 1990-06-30 | 1990-06-30 | 研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527910Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11311978B2 (en) | 2020-01-09 | 2022-04-26 | Xtr Technologies Inc. | LCD glass lapping apparatus |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2759403B2 (ja) * | 1993-02-25 | 1998-05-28 | 株式会社キャットシステム | 表面処理用ブラシロールの制御方法及びその装置 |
| JP2013142591A (ja) * | 2012-01-10 | 2013-07-22 | Disco Abrasive Syst Ltd | 混合液供給装置 |
| JP5829560B2 (ja) * | 2012-03-21 | 2015-12-09 | 三菱重工業株式会社 | 冷却装置、加工装置、および、冷却油流量決定方法 |
| CN118514006B (zh) * | 2024-07-23 | 2024-09-17 | 鲁冉光电(微山)有限公司 | 一种光学镜片加工清洁装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0659624B2 (ja) * | 1985-05-17 | 1994-08-10 | 株式会社日立製作所 | 研磨装置 |
| JPS6315008U (enrdf_load_stackoverflow) * | 1986-07-14 | 1988-02-01 |
-
1990
- 1990-06-30 JP JP1990069706U patent/JP2527910Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11311978B2 (en) | 2020-01-09 | 2022-04-26 | Xtr Technologies Inc. | LCD glass lapping apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429358U (enrdf_load_stackoverflow) | 1992-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100606578B1 (ko) | 화학기계식평탄화시스템과그방법 | |
| JP2527910Y2 (ja) | 研磨装置 | |
| CA2047735A1 (en) | Flowmeter | |
| KR20070061425A (ko) | 폴리싱장치 및 폴리싱방법 | |
| US6363968B1 (en) | System for conserving a resource by flow interruption | |
| JPH1142551A (ja) | 研磨装置及び研磨方法 | |
| TW202332534A (zh) | 化學機械研磨系統和用於溫度及漿體流動速率控制的電腦程式產品 | |
| JPH05278256A (ja) | 定エンタルピー制御付サーマルプリント装置及び方法 | |
| WO2022224508A1 (ja) | 研磨方法、および研磨装置 | |
| US20230219187A1 (en) | Polishing method and polishing apparatus | |
| TW201206634A (en) | Closed-loop control of CMP slurry flow | |
| US20200246935A1 (en) | Chemical mechanical polishing system with platen temperature control | |
| JPH0899265A (ja) | 研磨装置 | |
| US6402597B1 (en) | Polishing apparatus and method | |
| JPH0252742A (ja) | スクリーンレスパターン描画装置 | |
| JP2007335733A (ja) | ステージの平面度計測方法とそれを用いた部品装着装置 | |
| JP2692691B2 (ja) | 流量検出器付電磁弁 | |
| JPH0659623B2 (ja) | ウェハのメカノケミカルポリシング加工方法および装置 | |
| US11642751B2 (en) | Polishing method and polishing apparatus | |
| JP2000061838A (ja) | ドレッシング装置および方法 | |
| JPH0557415A (ja) | 連続鋳造装置の２次冷却状態を制御するセンサーと、このセンサーを備えたダミーバーと、連続鋳造装置の制御方法 | |
| JP2747469B2 (ja) | 半導体ウェーハの研磨方法とその装置 | |
| US20050014373A1 (en) | Method for managing polishing apparatus | |
| JPS6335390B2 (enrdf_load_stackoverflow) | ||
| CN215825098U (zh) | 厚度传感装置及双面研磨设备 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |