JPS6335390B2 - - Google Patents

Info

Publication number
JPS6335390B2
JPS6335390B2 JP55057873A JP5787380A JPS6335390B2 JP S6335390 B2 JPS6335390 B2 JP S6335390B2 JP 55057873 A JP55057873 A JP 55057873A JP 5787380 A JP5787380 A JP 5787380A JP S6335390 B2 JPS6335390 B2 JP S6335390B2
Authority
JP
Japan
Prior art keywords
temperature
surface plate
cooling water
polishing
polishing cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55057873A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56157949A (en
Inventor
Hatsuyuki Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUPIIDO FUAMU KK
Original Assignee
SUPIIDO FUAMU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUPIIDO FUAMU KK filed Critical SUPIIDO FUAMU KK
Priority to JP5787380A priority Critical patent/JPS56157949A/ja
Publication of JPS56157949A publication Critical patent/JPS56157949A/ja
Publication of JPS6335390B2 publication Critical patent/JPS6335390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP5787380A 1980-05-02 1980-05-02 Grinder Granted JPS56157949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5787380A JPS56157949A (en) 1980-05-02 1980-05-02 Grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5787380A JPS56157949A (en) 1980-05-02 1980-05-02 Grinder

Publications (2)

Publication Number Publication Date
JPS56157949A JPS56157949A (en) 1981-12-05
JPS6335390B2 true JPS6335390B2 (enrdf_load_stackoverflow) 1988-07-14

Family

ID=13068095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5787380A Granted JPS56157949A (en) 1980-05-02 1980-05-02 Grinder

Country Status (1)

Country Link
JP (1) JPS56157949A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0659624B2 (ja) * 1985-05-17 1994-08-10 株式会社日立製作所 研磨装置
WO1997032690A1 (fr) * 1996-03-04 1997-09-12 Teikoku Denso Co., Ltd. Procede et appareil pour le polissage d'un disque de resine
JP2002231672A (ja) * 2001-01-31 2002-08-16 Mitsubishi Materials Silicon Corp ウェーハ研磨方法およびその装置
JP5791987B2 (ja) * 2011-07-19 2015-10-07 株式会社荏原製作所 研磨装置および方法
CN103273413A (zh) * 2013-04-09 2013-09-04 上海华力微电子有限公司 化学机械研磨装置
CN108818076B (zh) * 2018-07-13 2019-11-01 湖南文理学院 一种自定位式汽车零部件加工设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法
US9969046B2 (en) 2011-07-19 2018-05-15 Ebara Corporation Method and apparatus for polishing a substrate
US10259098B2 (en) 2011-07-19 2019-04-16 Ebara Corporation Method and apparatus for polishing a substrate

Also Published As

Publication number Publication date
JPS56157949A (en) 1981-12-05

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