JPS6335390B2 - - Google Patents
Info
- Publication number
- JPS6335390B2 JPS6335390B2 JP55057873A JP5787380A JPS6335390B2 JP S6335390 B2 JPS6335390 B2 JP S6335390B2 JP 55057873 A JP55057873 A JP 55057873A JP 5787380 A JP5787380 A JP 5787380A JP S6335390 B2 JPS6335390 B2 JP S6335390B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- surface plate
- cooling water
- polishing
- polishing cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 36
- 239000004744 fabric Substances 0.000 claims description 21
- 239000000498 cooling water Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000003082 abrasive agent Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 239000012670 alkaline solution Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
この発明は研磨装置の改良に関し、とくに、研
磨布上の温度を一定に保つことにより、研磨能率
を向上させるとともに、異常温度になつたときに
は研磨装置を停止させることを目的とするもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvement of polishing equipment, and in particular, improves polishing efficiency by keeping the temperature on the polishing cloth constant, and also prevents the polishing equipment from stopping when the temperature becomes abnormal. This is the purpose.
研磨の対象となる被加工物には、ガラス、半導
体等があるが、特に半導体の発展には近年著るし
いものがあり、同時に広範囲な分野での使用がな
され、また超集積度回路（VLSI）等、さらに進
んだ回路への適用も示唆されており、それに伴つ
てデイバイス前の半導体ウエハーに対する研磨精
度の要求も厳しくなつている。とくにウエハーの
厚さ精度、平行度、平面度あるいは面状態等の管
理が不可欠で、これがウエハーの品質を左右する
大きな要素となつている。 Workpieces that can be polished include glass, semiconductors, etc., but the development of semiconductors in particular has been remarkable in recent years, and at the same time they are used in a wide range of fields, and ultra-integrated circuits (VLSI) ), etc., and the application to more advanced circuits has been suggested, and along with this, the requirements for polishing accuracy for semiconductor wafers before devices are becoming stricter. In particular, it is essential to control wafer thickness accuracy, parallelism, flatness, surface condition, etc., and these are major factors that affect wafer quality.
一方、これらの被加工物特にウエハー研磨作業
をその加工手段から見ると、アルカリ性溶液と研
磨材の混合液を研磨布上に供給し、加工されるウ
エハーを加圧することにより発生する熱を利用
し、アルカリ溶液によるエツチング速度、さらに
反応熱の発生によるエツチング速度の増加を研磨
に応用している。また、ウエハーは接着定盤上に
熱可塑性のワツクスを使用し固定しているが、ワ
ツクスの軟化点はさ程高くなく、通常40〜42〔℃〕
であり、この温度を越えると、前記定盤はウエハ
ーを保持する力を失うおそれがある。そこで、高
温に耐えるワツクスの使用が考えられるが、この
ようなワツクスを使用すると、接着精度に影響を
与え、良好な研磨結果が得られなくなるので、止
むを得ず上述の低温ワツクスを使用する場合が多
い。 On the other hand, when looking at processing methods for polishing these workpieces, especially wafers, a mixture of an alkaline solution and an abrasive material is supplied onto the polishing cloth, and the heat generated by applying pressure to the wafer being processed is utilized. , the etching rate by alkaline solution and the increase in etching rate by the generation of reaction heat are applied to polishing. In addition, the wafer is fixed on the adhesive surface plate using thermoplastic wax, but the softening point of wax is not very high, usually 40 to 42 [℃].
If this temperature is exceeded, the surface plate may lose its ability to hold the wafer. Therefore, it is possible to use a wax that can withstand high temperatures, but using such wax will affect the adhesion accuracy and make it impossible to obtain good polishing results, so if you have no choice but to use the above-mentioned low-temperature wax, There are many.
それで、もし、ワツクスが被加工物を保持する
力を失うと、ウエハーは接着定盤から剥離し破損
する結果となるとともに、温度上昇によつても研
磨精度が変化することが知られている。反面、生
産性を上げるには、高温で研磨作業を行う必要も
あり、したがつて両者の交差した点の温度を各サ
イクル毎に一定に保つ必要にせまられている。 Therefore, it is known that if the wax loses its ability to hold the workpiece, the wafer will peel off from the adhesive surface plate and be damaged, and the polishing accuracy will also change due to temperature rise. On the other hand, in order to increase productivity, it is necessary to perform the polishing work at a high temperature, and it is therefore necessary to maintain the temperature at the intersection of the two constant in each cycle.
この発明はこのような問題点を解決しようとす
るもので、研磨作業中、研磨布上の温度を温度セ
ンサーによつて連続的に検出し、この値を表示機
能を持つた温度制御装置によつて表示し、かつ、
その出力によつて回転定盤と加圧盤に接続される
冷却水回路および加圧装置の空気圧回路を制御
し、研磨布の温度を所定の値に維持するととも
に、研磨布上の温度が異常に上昇したときには研
磨装置を停止させるようにするものである。 This invention aims to solve these problems.During polishing work, the temperature on the polishing cloth is continuously detected by a temperature sensor, and this value is displayed by a temperature control device with a display function. and
The output controls the cooling water circuit connected to the rotating surface plate and the pressure plate, as well as the air pressure circuit of the pressurizing device, to maintain the temperature of the polishing cloth at a predetermined value, and to prevent abnormal temperatures on the polishing cloth. When it rises, the polishing device is stopped.
以下、図面によつてこの発明の一実施例を説明
する。 An embodiment of the present invention will be described below with reference to the drawings.
回転定盤１はその面が水平に支持され、減速機
２およびベルト４を介してモータに連結され、こ
のモータにより回転されるようにされている。こ
の回転定盤１は内部に冷却機構（図に示してな
い）を有し、その下部に設けたウオータージヨイ
ント５には冷却機構に接続された冷給水管６およ
び冷排水管７が設けられている。回転定盤１の水
平面上には研磨布８が接着され、また該定盤上に
はこの定盤に比し、小径な接着定盤２５が対向し
て設けられている。 The rotating surface plate 1 has its surface supported horizontally, is connected to a motor via a speed reducer 2 and a belt 4, and is rotated by the motor. This rotary surface plate 1 has a cooling mechanism (not shown) inside, and a water joint 5 provided at the bottom thereof is provided with a cold water supply pipe 6 and a cold drain pipe 7 connected to the cooling mechanism. ing. A polishing cloth 8 is bonded onto the horizontal surface of the rotary surface plate 1, and an adhesive surface plate 25 having a smaller diameter than the surface plate is provided opposite to the surface plate.
この接着定盤２５は、通常複数個設けられてい
る。この接着定盤２５を保持する加圧盤９の内部
には回転定盤１と同様に冷却機構（図示しない）
が設けられている。加圧盤９の上方に設けられた
ウオータージヨイント１０には冷給水管１１およ
び冷排水管１２が設けられ、これらは加圧盤９の
冷却機構に接続されている。加圧盤９の下面には
ワツクスにより被加工物１３が接着された接着定
盤２５が保持されるようになつている。また、加
圧盤９の上方には加圧装置１４が設けられ、この
加圧装置によつて加圧盤９は回転定盤１との間に
おいて被加工物１３に所定の圧力を与える。そし
て、この加圧装置には加圧用の空気を通す給排気
管１５，１６が設けられている。 A plurality of adhesive surface plates 25 are usually provided. The inside of the pressure plate 9 that holds this adhesive surface plate 25 has a cooling mechanism (not shown) like the rotary surface plate 1.
is provided. A water joint 10 provided above the pressure plate 9 is provided with a cold water supply pipe 11 and a cold drain pipe 12, which are connected to the cooling mechanism of the pressure plate 9. An adhesive surface plate 25 to which a workpiece 13 is adhered with wax is held on the lower surface of the pressure plate 9. Further, a pressure device 14 is provided above the pressure plate 9, and this pressure device applies a predetermined pressure to the workpiece 13 between the pressure plate 9 and the rotary surface plate 1. This pressurizing device is provided with supply and exhaust pipes 15 and 16 through which pressurized air passes.
回転定盤１の中央に突設したコーン１７上には
アルカリ性溶液と研磨材の混合液を供給する装置
１８が設けられている。そして、冷水管６，７，
１１および１２はそれぞれ冷却水供給源（図に示
してない）に接続されて冷却水回路を構成し、ま
た空気管１５，１６は圧搾空気供給源（図示して
ない）に接続されて空気圧回路を構成している。 A device 18 for supplying a mixed solution of an alkaline solution and an abrasive material is provided on a cone 17 protruding from the center of the rotary surface plate 1. And cold water pipes 6, 7,
11 and 12 are each connected to a cooling water supply source (not shown) to form a cooling water circuit, and air pipes 15 and 16 are connected to a compressed air supply source (not shown) to form a pneumatic circuit. It consists of
一方、回転定盤１の上方にはこの研磨布上の温
度を連続的に非接触で検出する温度センサー２０
が設けられている。この温度センサー２０は第１
図に示すように、ホトトランジスタ２３と増巾器
２４とからなるもので、高温になればなるほど赤
外線の発散が増加することが知られているよう
に、熱発生源から発する赤外線の量をホトトラン
ジスタで検出し、かつこの赤外線を電圧に変換す
る作用をもち、増巾器で増巾しメーターに指示す
るものである。そして、このセンサー２０の出力
端は、温度表示機能を有している温度制御装置２
１に接続されている。この温度制御装置の出力端
には機械制御装置２２が接続され、温度制御装置
２１によつて設定された設定温度と温度センサー
２０からの出力信号によつて冷却水回路および加
圧空気回路を制御するとともに異常温度上昇時に
は研磨装置を停止させる。 On the other hand, above the rotating surface plate 1 is a temperature sensor 20 that continuously detects the temperature on the polishing cloth without contact.
is provided. This temperature sensor 20 is the first
As shown in the figure, the phototransistor 23 and the amplifier 24 are used to reduce the amount of infrared rays emitted from heat generating sources, as it is known that the higher the temperature, the more infrared rays are emitted. It has the function of detecting it with a transistor and converting this infrared rays into voltage, which is then amplified with an amplifier and sent to the meter. The output end of this sensor 20 is connected to a temperature control device 2 having a temperature display function.
Connected to 1. A mechanical control device 22 is connected to the output end of this temperature control device, and controls a cooling water circuit and a pressurized air circuit based on the set temperature set by the temperature control device 21 and the output signal from the temperature sensor 20. At the same time, the polishing equipment is stopped when the temperature rises abnormally.
次に上記構成による作用について説明する。
今、温度制御装置２１により第２図に示すように
２つの温度すなわち設定温度と設定温度が設
定され、かつ設定温度は設定温度よりも低く
設定されている。この状態で被加工物１３を所定
の回転数をもつて回転させるとともに加圧装置１
４によつて、加圧盤９に所定の圧力を与える。同
時に研磨剤供給装置ノズル１８からアルカリ性溶
液と研磨材の混合液をコーン１７上に注ぐとこの
混合液は研磨布８上に広がり、これによつて被加
工物１３は研磨される。 Next, the effect of the above configuration will be explained.
Now, as shown in FIG. 2, two temperatures are set by the temperature control device 21, namely, a set temperature and a set temperature, and the set temperature is set lower than the set temperature. In this state, the workpiece 13 is rotated at a predetermined rotation speed, and the pressurizing device 1
4, a predetermined pressure is applied to the pressure plate 9. At the same time, when a mixture of an alkaline solution and an abrasive is poured onto the cone 17 from the abrasive supply device nozzle 18, this mixture spreads over the polishing cloth 8, thereby polishing the workpiece 13.
このとき、まさつ熱によつて研磨布上の温度が
第２図の時間t0−t1間に示すように上昇するが、
その温度上昇は温度センサー２０によつて検出さ
れ、その値は温度制御装置２１によつて連続的に
制御表示される。そして、その温度が第２図の時
点t1（Ａ点）において設定温度にに達すると温
度制御装置２１は機械制御装置２２に信号を与
え、これによつて該制御装置２２は第４図の時点
t1に示すように冷却水回路を開き、冷給排水管
６，７を通して回転定盤１の冷却機構に、同時に
冷給排水管１１，１２を通して加圧盤９の冷却機
構に、それぞれ冷却水供給源から冷却水が供給さ
れ、回転定盤１と加圧盤９は冷却されるととも
に、研磨布上の温度も冷却され始める。そして、
第２図の時点t2（Ｂ点）において検出温度が設定
温度を越えると、温度制御装置２１は機械制御
装置２２に指令を与え、これによつて該制御装置
は第３図の時点t2に示すように加圧装置１４の空
気圧を減圧させるように、空気圧回路を制御す
る。やがて検出温度が第２図の時点t3（Ｃ点）に
おいて設定温度に降下すると、機械制御装置２
２は第３図の時点t3（Ｃ点）に示すように空気圧
回路を開き、これによつて給気管１５を通して加
圧装置１４に空気供給源より空気が送り込まれ、
加圧盤９はふたたび所定の圧力を与えられる。そ
して、温度がさらに降下し、時点t4（Ｄ点）にお
いて設定温度に達すると、機械制御装置２２に
よつて冷却水回路が閉じ、これによつて冷給排水
管６，７，１１および１２に流れる冷却水の供給
は停止する。 At this time, the temperature on the polishing cloth rises as shown in FIG. 2 between time t 0 and t 1 due to heat, but
The temperature rise is detected by a temperature sensor 20, and its value is continuously controlled and displayed by a temperature control device 21. When the temperature reaches the set temperature at time t 1 (point A) in FIG. 2, the temperature control device 21 gives a signal to the machine control device 22, which causes the control device 22 to point in time
As shown in t 1 , the cooling water circuit is opened, and the cooling water is supplied from the cooling water supply source to the cooling mechanism of the rotating surface plate 1 through the cold supply and drainage pipes 6 and 7, and at the same time to the cooling mechanism of the pressure plate 9 through the cold supply and drainage pipes 11 and 12. Cooling water is supplied, and the rotary surface plate 1 and pressure plate 9 are cooled, and the temperature on the polishing cloth also begins to cool down. and,
When the detected temperature exceeds the set temperature at time t 2 (point B) in FIG. 2, the temperature control device 21 gives a command to the machine control device 22, which causes the controller to return to the time t 2 in FIG. 3. The pneumatic circuit is controlled to reduce the air pressure of the pressurizing device 14 as shown in FIG. When the detected temperature eventually falls to the set temperature at time t 3 (point C) in FIG.
2 opens the pneumatic circuit as shown at time t 3 (point C) in FIG.
The pressure platen 9 is again given a predetermined pressure. When the temperature further decreases and reaches the set temperature at time t 4 (point D), the mechanical control device 22 closes the cooling water circuit, thereby causing the cold water supply and drainage pipes 6, 7, 11, and 12 to The supply of flowing cooling water is stopped.
以下、同様な動作を繰り返し、被加工物の温度
は設定温度との間においてほぼ一定に制御さ
れる。また、何らかの原因で検出温度が第２図の
時点t15（Ｆ点）−t16（Ｇ点）に示すように、異常に
上昇したときには機械制御装置２２は第５図の時
点t16において装置全体の動作を停止させ、これ
によつて研磨布上の温度上昇による被加工物１３
の損傷を防止する。 Thereafter, similar operations are repeated, and the temperature of the workpiece is controlled to be approximately constant between the set temperature and the set temperature. Furthermore, if the detected temperature rises abnormally for some reason as shown at time t 15 (point F) - t 16 (point G) in FIG. The entire operation is stopped, and the workpiece 13 due to the temperature increase on the polishing cloth is thereby stopped.
prevent damage.
なお、第２図〜第５図においては、オン、オフ
制御によつて研磨布上の温度を制御するようにし
たものについて説明したが、これはたとえば、比
例制御により行うことも可能で、さらに必要に応
じてPI制御その他必要な制御により行うことが
可能であることは云うまでもない。 In addition, in FIGS. 2 to 5, the temperature on the polishing cloth is controlled by on/off control, but this can also be done by proportional control, for example. It goes without saying that this can be done by PI control or other necessary controls as necessary.
この発明は、上述のように温度センサー２０に
よつて研磨布上に発生する赤外線を非接触で検出
することと、赤外線を連続的に検出するとともに
温度制御装置２１からの出力によつて機械制御装
置２２を作動させ、あらかじめ設定された温度に
もとづいて加圧盤９の空気圧回路と回転定盤１と
加圧盤９の冷却水回路とを制御し、これによつて
研磨布８上の温度を所定の値に管理し、かつ研磨
布８上の温度が異常に上昇したときに装置を停止
させるようにしているので、被加工物をほぼ一定
の温度のもとで研磨することができ、したがつ
て、とくに熱影響を受け易い半導体等の被加工物
の研磨には最適なものである。 As described above, the present invention includes non-contact detection of infrared rays generated on the polishing cloth by the temperature sensor 20, continuous detection of infrared rays, and mechanical control using the output from the temperature control device 21. The device 22 is operated to control the air pressure circuit of the pressure plate 9 and the cooling water circuit of the rotary surface plate 1 and the pressure plate 9 based on a preset temperature, thereby keeping the temperature on the polishing cloth 8 at a predetermined level. The workpiece can be polished at a nearly constant temperature, and the device is stopped when the temperature on the polishing cloth 8 rises abnormally. Therefore, it is particularly suitable for polishing workpieces such as semiconductors that are easily affected by heat.
第１図はこの発明の一実施例を示す研磨装置の
正面図、第２図は研磨布上の温度と時間との関係
を示すグラフ、第３図は加工装置の圧力と時間と
の関係を示すグラフ、第４図は冷却水量と時間と
の関係を示すグラフ、第５図は装置の稼動状態と
時間との関係を示すグラフである。
１……回転定盤、２……減速装置、３……モー
タ、４……ベルト、５……ウオータージヨイン
ト、６，７……給排水管、８……研磨布、９……
加圧盤、１０……ウオータージヨイント、１１，
１２……給排水管、１３……被加工物、１４……
加圧装置、１５，１６……空気管、１７……コー
ン、１８……研磨剤供給装置、２０……温度セン
サー、２１……温度制御装置、２２……機械制御
装置、２３……ホトトランジスタ、２４……増巾
器、２５……接着定盤。
FIG. 1 is a front view of a polishing device showing an embodiment of the present invention, FIG. 2 is a graph showing the relationship between the temperature on the polishing cloth and time, and FIG. 3 is a graph showing the relationship between the pressure of the processing device and time. 4 is a graph showing the relationship between the amount of cooling water and time, and FIG. 5 is a graph showing the relationship between the operating state of the device and time. 1... Rotating surface plate, 2... Speed reduction device, 3... Motor, 4... Belt, 5... Water joint, 6, 7... Water supply and drainage pipe, 8... Polishing cloth, 9...
Pressure plate, 10...Water joint, 11,
12... Water supply and drainage pipe, 13... Workpiece, 14...
Pressure device, 15, 16... Air pipe, 17... Cone, 18... Abrasive supply device, 20... Temperature sensor, 21... Temperature control device, 22... Machine control device, 23... Phototransistor , 24... Amplifier, 25... Adhesive surface plate.
Claims (1)
上に研磨材を供給する装置と、上記回転定盤と対
向して設けられた被加工物を保持する複数の接着
定盤と、この定盤を介して被加工物を上記回転定
盤に圧接させる加圧盤を包含する加圧装置と、こ
の加圧装置に加圧用の空気を供給する空気圧回路
と、上記の回転定盤と加圧盤に冷却水を供給する
冷却水回路と、上記研磨布上の温度を非接触で連
続的に検出する温度センサーと、２つの温度設定
値を持ち、温度センサーによつて検出された温度
に対応して、機械制御装置に対し、空気圧回路の
空気圧増減と冷却水回路の冷却水流量調節をする
ための信号および装置全体の動作を停止させるた
めの信号を与えることにより研磨布上の温度を一
定範囲内に保つよう制御する温度制御装置と、温
度制御装置からの信号により、空気圧回路の空気
圧増減と冷却水回路の冷却水流量調節および装置
全体の動作を停止させる機械制御装置とを備えた
ことを特徴とする研磨装置。1. A rotating surface plate having an abrasive cloth on its surface, a device for supplying an abrasive material onto this surface plate, a plurality of adhesive surface plates for holding workpieces provided opposite to the rotating surface plate, and this A pressurizing device including a pressure plate that presses a workpiece to the rotating surface plate via the surface plate, a pneumatic circuit that supplies pressurizing air to the pressurizing device, and the rotating surface plate and the pressure plate. It has two temperature setting values: a cooling water circuit that supplies cooling water to the polishing cloth, and a temperature sensor that continuously detects the temperature on the polishing cloth without contact. The temperature on the polishing cloth is controlled within a certain range by giving signals to the machine control device to increase or decrease the air pressure in the pneumatic circuit, to adjust the cooling water flow rate in the cooling water circuit, and to stop the operation of the entire device. A mechanical control device that adjusts the air pressure in the pneumatic circuit, adjusts the cooling water flow rate in the cooling water circuit, and stops the operation of the entire device based on signals from the temperature controller. Characteristic polishing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5787380A JPS56157949A (en) | 1980-05-02 | 1980-05-02 | Grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5787380A JPS56157949A (en) | 1980-05-02 | 1980-05-02 | Grinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56157949A JPS56157949A (en) | 1981-12-05 |
| JPS6335390B2 true JPS6335390B2 (en) | 1988-07-14 |
Family
ID=13068095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5787380A Granted JPS56157949A (en) | 1980-05-02 | 1980-05-02 | Grinder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56157949A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI613037B (en) * | 2011-07-19 | 2018-02-01 | 荏原製作所股份有限公司 | Polishing method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0659624B2 (en) * | 1985-05-17 | 1994-08-10 | 株式会社日立製作所 | Polishing equipment |
| EP0616362A3 (en) * | 1993-03-15 | 1995-06-21 | Tokyo Shibaura Electric Co | Method for polishing work piece and apparatus therefor. |
| AU4845396A (en) * | 1996-03-04 | 1997-09-22 | Teikoku Denso Co., Ltd. | Resin disk polishing method and apparatus |
| JP2002231672A (en) * | 2001-01-31 | 2002-08-16 | Mitsubishi Materials Silicon Corp | Wafer-polishing method and device |
| JP5791987B2 (en) * | 2011-07-19 | 2015-10-07 | 株式会社荏原製作所 | Polishing apparatus and method |
| CN103273413A (en) * | 2013-04-09 | 2013-09-04 | 上海华力微电子有限公司 | Chemical-mechanical polishing device |
| CN108818076B (en) * | 2018-07-13 | 2019-11-01 | 湖南文理学院 | A kind of self-localization-type auto parts and components process equipment |
-
1980
- 1980-05-02 JP JP5787380A patent/JPS56157949A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI613037B (en) * | 2011-07-19 | 2018-02-01 | 荏原製作所股份有限公司 | Polishing method |
| US9969046B2 (en) | 2011-07-19 | 2018-05-15 | Ebara Corporation | Method and apparatus for polishing a substrate |
| US10259098B2 (en) | 2011-07-19 | 2019-04-16 | Ebara Corporation | Method and apparatus for polishing a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56157949A (en) | 1981-12-05 |
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